TW200525004A - Adhesive films and method for manufacturing adhesive film - Google Patents

Abstract

An adhesive film (4) is provided, having a first resin layer (10), a second resin layer (20) formed on the front surface of the first resin layer (10), and a third resin layer (15) formed on the rear surface of the first resin layer (10), in which the lowest viscosity in the temperature range lower than the bonding temperature of the first resin layer (10) is higher than the lowest viscosity in the temperature range lower than the bonding temperature of the second and third resin layers (20, 25). When first and second bodies (40, 50) to be bonded are hot pressed while sandwiching the adhesive film (4), the second resin layer (20) flows out toward the outside of the body (50). However, since the first resin layer (10) containing conductive particles (12) does not flow out but stays between the first and second bodies (40, 50), the number of conductive particles (12) sandwiched between first and second connection terminals (42, 52) increases.

Description

200525004 IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates to an adhesive, and particularly to a drilling agent containing conductive particles. [Prior art] In the past, "connection of electrical components such as semiconductor wafers and wiring boards to each other" has widely used an anisotropic conductive adhesive (acf). ACF is an anisotropic conductive adhesive formed by dispersing conductive particles in a binder containing a thermosetting resin. It is formed into a film shape. If ACF is held between electrical parts and heated and pressed, the acf is caused by It is softened by heating. By pressing, the softened ACF will be pushed away by the connection terminals of the electrical parts, and the conductive particles will be sandwiched between the opposite connection terminals. ACF is a thermosetting resin with a binding agent. If the connection terminals are continuously heated and pressed while the conductive particles are held, the thermosetting resin will polymerize and harden the ACF. The conductive particles will electrically connect the electrical parts to each other and the electrical parts. The hardened ACF is fixed to each other. For example, 'Even if the heights of the connection terminals are not uniform, a gap is created between the connection terminals to be connected. Since the conductive particles fill the gap, the conductive terminals can be electrically connected by the conductive particles. 9 However, when heating and pressing through the adhesive film, the conductive particles will flow to the outside of the adherend together with the softened bonding agent, resulting in less conductive particles between the connection terminals to be connected, and The connection terminals may not be connected to each other by the conductive particles. If the density of the conductive particles in the ACF is increased, the connection reliability of the connection terminal 200525004 can be improved. However, when the wiring of electrical parts becomes denser, the distance between adjacent connection terminals may become smaller, and the connection may not be connected. The connection terminals are also electrically connected by the conductive particles, and short circuit occurs in the electrical components. As such, it is difficult to obtain electrical devices with high connection reliability using the conventional acf. Japanese Patent Publication No. 6-283225 θ Japanese Patent Publication No. 7_230840 Japanese Patent Publication No. 8-14821 Japanese Patent Publication No. 9-312176 Japanese Patent Publication No. 10-273629 Japanese Patent Publication No. 1 1 -87415 JP 2000-1785 1 [Patent Document 1] [Patent Document 2] [Patent Document 3] [Patent Document 4] [Patent Document 5] [Patent Document 6] [Patent Document 7] SUMMARY OF THE INVENTION The present invention is designed to solve the problems of the conventional techniques described above. The eighth system provides an adhesive film capable of manufacturing a highly reliable electrical device. In order to solve the above-mentioned problem, the adhesive film of the present invention is provided with a first resin layer, a second resin layer disposed on the first resin layer, and a second resin layer disposed on the first resin layer. A third resin layer on the side, the first resin layer has a bonding agent, a fluorene bonding agent, and conductive particles dispersed in the bonding agent, and the insulating bonding agent has a first thermosetting resin and a first curing agent ( By adding: it will react with the first thermosetting resin to harden the first thermosetting resin), the first resin layer has an insulating second thermosetting resin, and a second hardener (by heating it will react with the second thermosetting resin to make the first Two thermosetting resins are hardened), the third resin layer has an insulating third thermosetting resin, and a third hard 200525004 agent (the third thermosetting resin is hardened by reacting with the third thermosetting resin through heating), and the adhesive film is It is placed between the first adherend (having the first terminal) and the second dead body (having the second terminal) and heat-pressed to heat the first to third resin layers to a predetermined connection temperature or more. In a state in which conductive particles are held between the first and second connection terminals, the first to third thermosetting resins react with the first to third hardeners to harden, respectively, and the first and first dead bodies are cured. Be connected; the minimum viscosity of the first resin layer in a temperature range lower than the connection temperature is 1000 to 1000000 Pa · s or lower, and the minimum viscosity of the second resin layer in the temperature range lower than the connection temperature is lower than the first resin The layer is low, and the film thickness of the second resin layer is larger than that of the first and third resin layers. In the dead film of the present month, the lowest viscosity of the second resin layer in the temperature range lower than the connection temperature is 1/10 or less of that of the first resin layer. In the present adhesive film, the film thickness of the first resin layer is 1/2 to 2 times the average particle diameter of the conductive particles. In the adhesive film of the present invention, the density of the conductive particles of the first resin layer is greater than that of the second resin layer. In the drilling film of the present invention, the film thickness of the second resin layer is greater than the connection terminal film of the adherend (selected from the first and second adherends) closely connected to the second resin layer side. Thick is big. In the dead film of the present invention, the third resin layer has a lower dryness than the first resin layer at the lowest temperature in the temperature range lower than the connection temperature. In the adhesive film of the present invention, the third resin layer has the lowest + temperature in the temperature range below the connection temperature, and the degree of the third resin layer is less than 1 / i 0 of the first resin layer. 200525004 The film thickness of the third resin layer is thinner than the middle layer of the adhesive film of the present invention. The adhesive film of the present invention is manufactured by a method I, which is used to produce an adhesive film with a release film attached to at least one side, and it has a laminate, the laminate having: a first release film, a configuration Yu Chu a -... Gu Yudi—Peel the first resin layer on the surface of the first resin layer, and place the first-trembling on the surface of the first resin layer. ^ Di Yishuzhi layer, and the second resin layer surface The first resin layer of the release film is higher than the second resin layer in the lowest temperature range below the connection temperature; the second layer of the laminate is peeled from the first resin layer to make the first and second layers On the surface, "the surface of the exposed first resin layer is coated with a liquid adhesive d and dried," thereby forming a third resin layer and producing an adhesive film. ^ 本 ^ In the production method of the drilled film of Ming, the production of the laminated body is that the surface of the first film is coated with a liquid adhesive and dried to form a coating solution for the resin layer surface. After forming a second resin layer after drying it like a drying agent, the second resin layer is adhered to the surface of the second resin layer. In the method for manufacturing the spot film of the present invention, the laminated body is produced in the first step. After the surface of the second release film is coated with a liquid adhesive and dried to form the first and second resin layers, the surface of the first resin layer and the surface of the second resin layer are brought into close contact with each other. Figure 7 shows the relationship between viscosity change and temperature, which is for the case of heating a resin layer with a thermosetting resin and a hardener and increasing from the initial temperature & μ to the connection temperature L. The vertical axis represents the viscosity The horizontal axis represents temperature 200525004 t. If the resin layer is heated from room temperature (starting temperature τ0) by heating, the resin component in the tree month layer will soften, and when the resin layer heats up, At the same time: θ '; began to decline again. After the minimum value of the temperature Tl, which is determined by the softening of the polymerization reaction component of the resin, is increased by ^ and the proportion of the mixture. Extend 仃 鬈 5 to make the viscosity start. Even if the resin layer contains conductive particles, since the resin has reached the minimum viscosity at room temperature, if the dry film is held and heated at the third position, when: : Two, two ⑽-, the second resin layer forms the lowest dryness. The temperature at the first time is: Although the maximum degree of the layer flowing out near the withered body near the low dryness level is higher than that of the second resin layer, the conductive particles in the lipid layer will not flow. Between the bodies, the number of conductive particles held by one connection terminal increases. The minimum viscosity of the ur-like layer can be changed by the type of the thermosetting resin, the type of the hardener, and the blending amount of the thermosetting resin and the hardener to be higher than that of other resin layers. The branching layer 4 is: :: particles, as long as they are used on the surface of the conductive layer as an insulating coating, the resin layer contains conductive particles. Since the conductive layer of the conductive particles does not directly contact the short circuit between the connections. ++ & is composed of ± connection terminals: edge coating-generally made of insulating resin. When conductive particles are sandwiched between the first and second connection terminals, it is easy to break, so the conductive layer will The two connection terminals make direct contact, and the 200525004 first and first connection terminals are electrically connected by conductive particles. Since the film thickness of the first resin layer determines the number of conductive particles in the adhesive film 4 of the present invention, it is required to have high film thickness accuracy, but regardless of whether the second resin layer is formed on the second release film Or, when the second resin layer is directly formed on the surface of the first resin layer, since the first resin layer is formed on the surface of the release film, the first resin layer with good film thickness accuracy can be formed.

By using the dead film of the present invention, since the conductive filaments do not flow out during the heating tight step, they can remain between the first and second connection terminals, so the number of conductive particles held between the first and second connection terminals increasing. In addition, since the connection terminals adjacent to each other are filled with the second resin layer having a low density of conductive particles, the connection terminals of the dead bodies are unlikely to be short-circuited. I Therefore, by using the dry bump of the present invention, an electric device with high connection reliability can be manufactured. [Embodiment] Hereinafter, an example of the manufacturing process of the dry film of this invention is demonstrated. Disperse the insulating first thermosetting resin and the first hardener M (the first thermosetting resin is polymerized by heating) in an organic solvent, and make a binder solution, and then disperse the conductive particles in the binder solution. The middle J is mixed, and the liquid first adhesive is produced at night. In addition, the second and third thermosetting resins which are insulating are dispersed in an organic solvent together with the second and second hardeners, respectively, and second and third adhesives are produced in a liquid state without containing conductive particles. The symbol 31 in Fig. 1 (a) represents the first peeling film. The first peeling film 31 is slender, and one side of the first peeling film is applied in advance on the side of the surface after peeling 200525004. The first adhesive is applied (the thickness of the dry film is 1/2 of the average particle diameter of the conductive particles). 1 to 2 times), and a first resin layer 10 in which conductive particles 12 are dispersed in a binder 11 (having a thermosetting resin and a hardener) is formed as shown in FIG. 1 (a). The second adhesive is applied to the surface of the first resin layer in a manner such that the dry film thickness is greater than the first resin layer 10 and greater than the height of the terminal, and "dried" to make the extra organic in the second adhesive The solvent evaporates to form a second resin layer 20 (Fig. 邙) containing no conductive particles.... Then, the elongated second peeling film 32 is adhered to the second resin layer 20 to produce an elongated Laminated body 3 (Figure 1 (c)). It has the first thermosetting resin and Wei agent, the resin layer 20, which is in a temperature range lower than the connection temperature: two: degree, lower than the first resin layer. The lowest viscosity The lower resin layer: its viscosity is low at high temperature, so it has high adhesion. ::: Even if the first and second release films 31 and 32 are the same, brother :: Layer 1. For the first release 臈31 with a weak force, the moon and the sun layer 20 has a weak force on the second peeling of the Leyi hedgerow u, when it is on the first and the second degreasing layer! Peeling 3 away from 2 The peeling film 3 mesh # is separated (Fig. 1 (d)). Then, it is peeled from the second resin layer 20, and then the third desiccant is coated with a dry film thickness and a third desiccant on the first layer of the 1G film. Thick Way, the third tree of the conductive particles is expanded without containing 1 (e). 〇 In this way, a slender adhesive film 4 is prepared in this way (Fig. 2 ,: "The third peeling is prepared by surface treatment. 33 The absorbing force between the surface of 200525004 and the second resin layer 25 is weaker than the absorbing force between the release surface of the second release film M and the surface of the second resin layer 20, and the release film 33 is bonded together. On the surface of the third resin layer 25, a dead film 4 with a release film 32 and 33 bonded on both sides is prepared (Fig. _). The roll film * is wound into a roll shape to obtain a release film 32, 33 的 胶膜 4 卷卷 #Secondly, it is explained that the dead film 4 is used to connect the body of the victim with connection terminals. The symbol in FIG. 3 and the symbol in FIG. 4 represent the first victim. The circuit board that is attached to the body and the second semiconductor element that is dead.-The substrate 40 includes a glass substrate 41 and a first connection terminal 42 formed on the μ surface of the glass substrate. The first connection terminal 42 is formed on the glass substrate Γ. The conductive pads are formed by patterning *. In this patterning step, the thin pads are used to form a narrow connection connecting the first connection terminals 42 to each other. The semiconductor element 50 has an element body 51 and a second connection terminal 52 disposed on the surface of the element body 51. The second connection terminal 52 is in the shape of a bump, and an internal circuit (not shown) of the ordinary body 51 forms an electrical connection. In order to connect the semiconductor element 5g to the circuit substrate 40, the dead film 4 with peeling «32, 33 is rolled out from the drum of the dead film 4. As described above, the peeling surface of the peeling film 33 and the third The adhesive force between the surfaces of the resin layer 25 is weaker than the dry force between the peeling surface of the second release film 32 and the surface of the second resin layer 2G. The second and third release films 32 and 33 are electrostatically adsorbed to the right, and When the second and third peeling films 32 and 33 apply a peeling force, the third peeling film 33 will peel off the third resin layer 25, and the third resin layer 25 will be opposite to the first tree month: 10 The surface is exposed, but the second release film 32 is not peeled from the fat layer 20. 12 200525004 Cut the adhesive film 4 after the third peeling film 33 is peeled to a predetermined length, and arrange the exposed surface of the third resin layer 25 of the cut piece to the first connection terminal 42 of the circuit board 40. Side surface so that the surface of the third resin layer 25 is adhered to the surface of the first connection terminal 42 (FIG. 5 (a)). a The third resin layer having a thermosetting resin and a hardener has a lowest viscosity in a temperature range lower than the connection temperature, which is lower than that of the first resin layer 10, and a resin layer with a lowest lowest viscosity has higher adhesion. When the circuit substrate 40 and the second peeling film 32 are electrostatically adsorbed and a peeling force is applied, the second peeling film 32 is peeled from the adhesive film 4 and the adhesive film 4 remains on the circuit substrate * 5 (b) ) 〇Position the side of the second connection terminal 52 of the semiconductor element 50 toward the drilling film 4 attachment surface of the circuit board 40, and position the first and second connection terminals 42 and 52 so as to face each other. The element 40 is placed on the film 4 and the semiconductor element 50 is pressed with a not-shown pressing device (Fig. ⑼). The mounting stage on which the circuit board 40 is mounted and the semiconductor element 50 are pressed. After the fixture is heated to a predetermined temperature in advance, and the semiconductor element $ 0 is pressed against the circuit substrate 4G, the semiconductor element 5Q, the circuit substrate 40, and the dead film 4 are all heated from the heating start temperature (room temperature) due to heat conduction. The viscosity of the first to third resin layers 10, 20, and 25 begins to decrease. The temperature reaches the minimum viscosity during the set connection temperature. The minimum viscosity of the thermosetting resin used in the second resin layer 20 is below 100 ° and the range of the pulse range below the connection degree is 100 ρ & Below) 'Therefore, the second resin layer 20 will flow out to the outside of the semiconductor element 50 during the temperature rise to the connection temperature, but the thermosetting resin used in the first resin layer 10, 13 200525004 is in a temperature range lower than the connection temperature. The minimum viscosity is 1000 to 300 OPa. S (10,000 to 30,000 poises), so the first resin layer 10 does not flow out of the semiconductor element 50, and the conductive particles 12 in the first resin layer 10 remain. Between the semiconductor element 50 and the circuit board 40. Therefore, when the second connection terminal M is pushed away from the dead film 4 by the pressing of the semiconductor element 50, the tip of the second connection terminal 52 will be conductive. The particles 12 (the ones left between the + conductor element 50 # and the circuit board 40) are pushed toward the circuit board 40 side.

Since the film thickness of the third resin layer 25 is thinner than that of the first resin layer 10, when the conductive particles 12 are pushed to the circuit board 40 side, the conductive particles 12 will break through the third resin layer 25 and be tightly pressed at the _ The connection terminal 42 is in a state where the conductive two particles 12 are sandwiched between the first and second connection terminals 42 and 52. Since the film thickness of the second resin layer 20 is thicker than the connector 52 of the semiconductor element 50, the number is // 111 (〇_5 # 111〜 未到 1〇 # 爪), even if the second tree layer 20 is pushed toward the semiconductor On the outside of the piece 50, the remaining second resin 20 will still be filled between the second connection terminals 52, so that the second resin layer

The exposed portion between the side of the second connection terminal 52 and the second connector 52 of the component body 5 丨. During further heating, as the polymerization of the first to third thermosetting resins progresses, the dryness of the first to third resin layers 1G, 2G, and 25 will rise. When the temperature rises to the set connection temperature, The first to third thermosetting resins are polymerized to harden the adhesive film 4, and the semiconductor element 50 is fixed to the circuit board 40 by the cured adhesive sheet 4. The symbol i in FIG. 5 (d) represents an electrical device in which semiconductor elements 14 200525004 are fixed to the circuit board 40. In this electrical device, not only the circuit board 40 and the semiconductor element 50 are mechanically connected by the hardened adhesive film 4, but also the conductive particles 12 are held electrically between the first and second connection terminals 42, 52. . / As described above, when using the dry film 4 of the present invention for the heating and compacting step, the electrical particles 12 do not flow out of the semiconductor element 5 (), so the first and second connection ends + 42, 52 The number of held conductive particles 12 increases, which improves the conduction reliability. In addition, since the connection terminals 52 adjacent to each other are filled with the second resin layer 20 'containing no conductive particles, there is no short circuit between the connection terminals M and the dead body. In this manner, the electrical apparatus 1 with high reliability is manufactured using the dry layer 4 of the present invention. Although the above description is directed to the formation of the second bulking agent It on the first resin layer 10, the present invention is not limited to this. Hereinafter, other examples of the production example of the film of the present invention will be described.

^ = First, according to the above steps, prepare the first and second adhesives, and apply the equal adhesive to the elongated first and second peeling films 3, respectively, and then dry them, as shown in Figure i⑷ A first-resin layer 10 'is formed on the surface of the first release film as shown in FIG. 6 (a), and a resin layer 20 is formed on the surface of the second release film 32 as shown in FIG. Then, in a state where the first and second resin layers 10 and 20 are formed facing each other, the long-side end of each release film 31'32 passes between the two pressing rollers, while pressing the rollers (heating to a predetermined temperature) ) While pressing the opposite sides of the first and second resin layers 1G and 2G forming surfaces of the release films 31 and 32, the release films 31 and 32 15 200525004 travel in the long direction. When the release film 3 j second resin layer 1 0 ^ Press the space between the rollers. At this time, the first, 20, and 20 will be in close contact with each other, and the layers u) and 20 will be combined as shown in Fig. 6 (b): = Therefore, the laminated body 3 peels off the first peel, Two ^^ The same steps as in the above figure are used to form the third resin layer 25, that is to say, the hibiscus 1 is the same as the dry film 4 shown in FIG. 1 and is made of P ... 32 adhesive film 4. The shape of the body It is a slender attached release film 附 2 5 households, the situation is targeted, the first to third resin layers 10, 2 0, the type of thermosetting resin and hardener used to make the first -1 The minimum viscosity of 〇 is higher than the minimum viscosity of the first and second tree layers 20 and 25, but the present invention is not limited to this. The degree can be adjusted with materials other than resin, such as changing the type of filler added to the first resin layer, the average particle size, the type of conductive particles added in the blending or the second lipid layer, the average particle size, The blending amount can make the minimum dryness of the first resin layer 10 more than that of other resin layers. [Examples] _ < Example 1 > On the surface of stupid guanamine resin particles having a particle diameter of 4.0 # m, A nickel layer having a film thickness of 0_08 // m and a gold layer having a film thickness of 4,000 vm were sequentially laminated in this order, so that conductive particles were formed on the surface of the conductive particles 12 to form an insulating resin film with a thickness of 0 (from acrylate / benzene Made of ethylene / divinylbenzene copolymer resin) to produce conductive particles with an insulating coating 1 2. The first thermosetting resin (trade name "Abikot 1007", Japan Ring 16 200525004 oxygen resin (stock )) 80% by weight, combined with 20% by weight of imidazole-based hardener (trade name "2E4MZ", manufactured by Shikoku Chemical Industry Co., Ltd.), dissolved in toluene / ethyl acetate equivalent (weight Proportion) Blended > Cereals' Made Out A binder solution having a binder content of 30% by weight disperses the conductive particles 12 with an insulating film in the binder solution to form a predetermined particle density. Thus, conductive particles 12 with an insulating film are produced. Liquid first adhesive. This first adhesive was applied to a release film and dried to form a film. Using this film, a temperature measurement device (Rheometer _ RS150, manufactured by Hack Corporation) was used to measure the temperature rise at 100 c per minute. The viscosity during the heating up to the connection temperature (moc), and the lowest viscosity of the first resin layer 10 (the lowest viscosity in a temperature range lower than the connection temperature) was obtained, and the value was 2000 pa · s. In addition, the density of the conductive particles U per unit volume of the film with an insulating coating is about 3 million particles / mm3. Takeraku Ichikaku Thermoplastic Resin (trade name "Abikot 4.07p", manufactured by Japan Epoxy Resin Co., Ltd.) 80% by weight, ... series hardener (trade name / MZ), Shikoku Chemical Industry (Made by the company) 20% by weight of the binding agent: dissolved in the same mixed solvent as the first-withdraw agent to make a second agent with = wt% but without conductive particles of the second withered sword . S。 After drying the second dry: M film, determine the minimum viscosity of the second and third resin layers 20, 25 under the same conditions as the first adhesive, the value is 85Pa. S. First, the first and second resin layers 1 are formed using the first and second desiccants according to the steps in the above-mentioned figures. Then, a second resin is used (the same as the second adhesive) to form a third resin, so as to obtain 17 200525004 The adhesive film 4 with a release film of Example 1. The first to third adhesives are applied by rollers. The minimum viscosity, the film thickness, the density of the conductive particles with an insulating coating, and the particle diameters of the conductive particles with an insulating coating of each resin layer 10, 20, and 25 are described in Table 1 below. The density of conductive particles refers to the number of conductive particles per 1 mm3 of the resin layer. [Table 1] Adhesive film structure and evaluation test results (Examples) Evaluation test results Minimum viscosity Film thickness Conductive particles Conductivity Conductivity Conductive insulation (Pa-s) (// m) Particle density Particle size Reliability (thousands (/) / mm3) Real third resin layer 85 4 0-1 2 00 Apply the first resin layer 2000 5 300 4.22-4.62 Example 1 Second resin layer 85 15 0 — Real third resin layer 85 4 0 — 15 〇Apply the first resin layer 3000 5 300 4.22-4.62 Example 2 Second resin layer 85 15 0 A third resin layer 85 4 0 8 〇Apply the first resin layer 1000 5 300 4.22-4.62 Example 3 The second resin layer 85 15 0 _ solid third resin layer 85 4 0-18 1 0 Apply the first resin layer 2700 5 600 4.22-4.62 Example 4 The second resin layer 85 15 0 1 solid third resin layer 85 4 0 1 8 00 1st resin layer 1400 5 60 4.22-4.62 Example 5 2nd resin layer 85 15 0 3rd resin layer 85 4 0-19 〇

18 200525004 Example 6 First resin layer 2900 5 720 4.22-4.62 Second resin layer 85 15 0 — Example 7 Third resin layer 85 4 0 — 22 〇 First resin layer 300,000 5 300 4.22-4.62 Second resin Layer 85 15 0 — Example 8 Third resin layer 300 4 0 — 7 〇 First resin layer 3000 5 300 4.22-4.62 Second resin layer 300 15 0 — Actual third resin layer 300 4 0 — 21 〇〇 First resin layer 300000 5 300 4.22-4.62 Example 9 Second resin layer 300 15 0 —

[Table 2] Adhesive film composition and evaluation test results (comparative example) Evaluation test results Lowest viscosity Film thickness Conductive particles Conductivity Conductivity Conductive insulation (Pa-s) (^ m) Particle density Particle size Reliability Reliability (10,000 pieces (// m) / mm3) Compared with the third resin layer 85 4 0 — 12 〇X Compared with the first resin layer 2000 10 300 4.22-4.62 Example 1 The second resin layer 85 10 0 compared with the third resin Layer 85 10 0-4 X 〇 compared to the first resin layer 2000 5 300 4.22-4.62 Example 2 second resin layer 85 10 0 — than the third resin layer 85 15 0-5 X 〇 compared to the first resin layer 2000 5 300 4.22 -4.62 Example 3 The second resin layer 85 5 0 is one third than the third resin layer 300 4 0 — 1 X 〇 compared with the first resin layer 150 5 300 4.22-4.62 Example 4 The second resin layer 300 15 0-

19 200525004 Comparative Example 5 Third resin layer 300 4 0 1 X 〇 First resin layer 150 5 600 4.22-4.62 Second resin layer 300 15 0 Compared with third resin layer 85 4 0-η X Compared with first resin layer 30 5 300 4.22-4.62 Example 6 Second resin layer 85 15 0 In addition, since the particle diameter of the conductive particles with an insulating film is in the range of 4 22 to 4 62 # m, the average particle diameter is also in the range. < Example 2 > The first adhesive used was 80% by weight of a thermosetting resin (trade name "Abikot 4007P", manufactured by Japan Epoxy Resin Co., Ltd.) and an imidazole-based hardener ( The product with the brand name "2MZ" and Shikoku Chemical Industry Co., Ltd. 20% by weight and having the lowest viscosity higher than the first adhesive of Example 丨 was produced under the same conditions as Example 1 The adhesive film 4 of Example 2. < Example 3 > The first adhesive used was made of a thermosetting resin (trade name "Abikot 4007", manufactured by Japan Epoxy Resin Co., Ltd.) 8 (% by weight), and hardened with fluorene.

A chemical agent (brand name "2E4MZ", Shikoku Chemical Industry Co., Ltd.) of 20% by weight, and the lowest degree of __depleting agent is the same as in Example 1, except that The adhesive film 4 of Example 3 was prepared under the conditions. &lt; Example 4 &gt; An adhesive film of Example 4 was produced under the same conditions as those of Example 丨 except that the number of conductive particles of the insulating layer with an insulating film dispersed in the first resin layer T was increased. 4. 20 200525004 <Example 5> Except that the number of conductive particles of the insulating coating with Y dispersed in the first resin layer was reduced, the same conditions as those of Example 丨 were used to make the sample of Example 5. Film 4. &lt; Example 6 &gt; Conductive particles with insulation film The same conditions as in Example 4

An adhesive film 4 of Example 6 was produced except that the number of particles dispersed in the first resin layer was increased to be larger than that of Example 4. &lt; Example 7> An insulating filler of silica dioxide particles (flat particle diameter of 0.5ρ) was added to the diluent to form a first resin layer κ containing 4Q% by weight of the filler. In the same conditions as in Example 1, the dry heart 4 of Example 7 was produced. 0 & Example 8 &gt; The second and third adhesives used, Sheshan also η is made of thermosetting resin (commercially

"Abikot 1007", 80% by weight of Japan's epoxy resin (stock), saliva-based hardener (trade name "2MZ", Shikoku Chemical Industry (stock)) 2 &quot;% and the lowest The second and third deaf people with higher viscosities than in Example 2 were prepared under the same conditions as in Example 2 except that the second implant film 4 was produced. <Example 9> "" Second and Third Bulking Agents "are made of a thermosetting resin (trade name: Bicote 4007P), manufactured by Japan Epoxy Resin Co., Ltd.) 80% by weight, and azole Series hardener (commercial name "2ΜZ", Shikoku Chemical Industry Co., Ltd. made of ceramics 21 200525004%, and the lowest dryness is the same as the second one in Example 7 »^ ', the first one, except for the other The film 4 was formed under the same conditions as in Example 7. 1 The film of the adhesive of Example 8 was prepared. 0 &lt; Comparative Example 1> Except for the first-resin layer film thickness of 10 &quot; m and the second resin layer film thickness. In order to make an adhesive film of Comparative Example i 10 / zm under the same conditions as in Example! 0 except that the thickness of the second resin layer and the thickness of the third resin layer are at the center] 'It is the same as in Example 1 The same condition system "comparative example 2

&lt; Comparative Example 3 &gt; An adhesive of Comparative Example 3 was produced under the same conditions as in Example film 0 with a thickness of 5 / zm and a third resin layer with a thickness of 1 except for the second resin layer film. &lt; Comparative example 4 &gt; A dry film of Comparative Example 4 was produced under the same conditions as in Example 8 except that the first drilling agent was changed to the second dry agent used in Example 1. &lt; Comparative Example 5 &gt; The number of conductive particles of the spear and the insulating film with an insulating coating on the first resin layer was increased in proportion to Comparative Example 4 p. μ. The outside conditions were made under the same conditions as in Comparative Example 4 The adhesive film of Example 5. &lt; Comparative Example 6 &gt; An adhesive film of Comparative Example 6 was prepared under the same conditions as in Example 1 22 200525004 except that the hardener was removed from the second adhesive. Minimum viscosity, film thickness, conductive density with insulation coating, and particle size of conductive particles with insulation coating of the resin layers 20 and 25 in the adhesive films 4 of Examples 2 to 9 and Comparative Examples 1 to 6 The diameters are described in Tables 1 and 2 above.

In addition, the minimum viscosity of each resin layer is not the viscosity of the resin layer constituting material (such as a thermosetting resin), but the viscosity of the resin layer obtained. If the hardener is not only contained in the thermosetting resin, the hardness is measured. = Dryness of the resin layer in the state of additive binding 'and when conductive particles and fillers are added | It is the measurement of the viscosity of the resin layer in the state where the conductive particles and fillers are added. Using the adhesive film 4 of the above examples i-9 and comparative examples i-6, the semiconductor element 50 and the circuit board 40 were applied with tilting pieces having a continuous drawing temperature of 190 t, a compression load of 1960 kPa, and a heating compression time of 10 seconds. The electrical devices i of Examples 1 to 9 and Comparative Examples 1 to 6 were obtained by connection.

A semiconductor element 50 used here is a semiconductor element 50 on one side with a width of 8 mm, a length of 20 mm, and a gate of 0.4 mm, with gold bumps formed at intervals of 40 cm = terminals 52). The bonding area of the gold bump is 45 // mx30 # m, 咼 15 // m. The circuit board 40 used was a connection terminal 42 formed on a glass substrate 41 with an indium oxide film having a thickness of 0.7 / zm. The electrical devices 1 of Comparative Examples 1 to 6 were subjected to the following evaluation tests for Examples 1 to 9. [Number of conductive particles] ^ Observe the 40 side of the printed circuit board, observe the bumps at 2GG locations where each electrical wave is set with an optical microscope (340 times magnification), and calculate the number of conductive particles captured by the bumps 23 200525004 12 . Tables 1 and 2 show the number of the smallest parts of the 200-site protrusions.数 Number of particle traps [Continuity reliability] For each electrical device 1, use 懕 Λ 4 ^ system evening * "Pressure 1 and 4 testers (trade name" EHS_411 "made by Terbijspek)) J涮 疋 On-resistance between the opposite first and second linkers 42, 52. Tomb 4 resistance &quot; Evaluation when conducting

"X is 0", when the on-resistance exceeds 30 Ω, it is evaluated as [insulation reliability]

For each electrical device 1, measure the insulation resistance between adjacent connection terminals ^ 52 of the same victim body. It was evaluated as "0" when the insulation resistance was ΐχΐ〇8Ω or more, and was evaluated as "χ" when the insulation resistance was less than 1 &gt; &lt; 1 ^. The evaluation results are shown in Table 丨. It can be seen from Table 丨 that in the case of the first and third resin layers, the first resin = the maximum contact thickness of ~ 3 (K) _Pa.s, and the film thickness of the second resin layer is larger than that of the first and third resin layers. In the device ι, the number of conductive particles captured by the bumps is large, and good evaluation results are obtained in both the conduction reliability and the insulation reliability.

In contrast, Comparative Example i, in which the film thicknesses of the first and second resin layers were the same, had excellent conduction reliability but poor insulation reliability; and the third resin layer had the same film thickness or more than the second resin layer. For examples 2 and 3, the conduction reliability is deteriorated. Therefore, when the film thickness of the first resin layer is lower than the film thickness of the second resin layer, the electrical device has high conduction reliability, and when the film thickness of the third resin layer is lower than the film thickness of the second resin layer, the electrical device is insulated. High reliability. It can also be seen from Comparative Example 4 that when the minimum viscosity of the first resin layer is 150 Pa · s, and the minimum viscosity of the second and third resin layers is greater than the first 24 200525004 resin layer, the conduction reliability is low. Even if the density of the conductive particles is increased like in Comparative Example 5, the conduction reliability cannot be improved. From the results of Comparative Examples 4 and 5, it is known that in order to obtain an electrical device with high conduction reliability, the minimum viscosity of the first resin layer must be greater than the minimum viscosity of the second and third resin layers, and its value must be greater than 100. pa · s. In Comparative Example 6 in which the first resin layer was formed by using the first adhesive without a hardener, the evaluation result of the conduction reliability was not good. When the difference between the minimum viscosity of the first resin layer and the second resin layer, the first resin layer and the third resin layer, that is, the adjacent resin layers is large, the resin layers are difficult to mix with each other when heated and compacted. The adhesive film cannot form a continuous hardened product. Therefore, it can be inferred that, in the cured film of Comparative Example 6, the stress with which the electrical parts were brought closer to each other was small, resulting in a decrease in the reliability of the conduction. On the other hand, as in the case of the above-mentioned Examples 1 to 9, when a hardener is added to the first resin layer (to harden the thermosetting resin), the first adhesive will harden and shrink when heated around the conductive particles. In other words, it can be inferred that the conductive particles held by the connection terminals of the electrical parts will harden and shrink around, and the stress that brings the electrical parts close to each other will occur. Therefore, even if the minimum viscosity difference between adjacent resin layers is large, it can still Obtain high conduction reliability. The above description is directed to the case where the second and third resin layers 20 and 25 do not contain conductive particles, but the present invention is not limited to this, as long as the degree of bond of the conductive particles is smaller than that of the first resin layer i It is a matter of course that the conductive particle density of 0 can also contain conductive particles in the first and third resin layers M and 25. Also, when the film thickness of the first resin layer 10 is reduced to conductive particles. When the average particle diameter is 1/2 to 2 times, a part of the conductive particles 12 protrudes from the surface of the first 25 200525004 resin layer 10, and Embedded in the second and third resin layers 20 and 25, but as long as the second and third resin layers 20 and 25 do not contain conductive particles, the conductive particles of the second and third resin layers 20 and 25 can be made. The density is smaller than that of the first resin layer 10. The first and second adherends are not limited to the circuit board 40 and the semiconductor element 50. As for the adherend, a flexible wiring board, a resistance element, and a liquid crystal display element in which a wiring film is formed on a resin film can also be used. And other components. The types of the first to third thermosetting resins are not particularly limited, and may include, for example, Oxygen J3, melamine resin, acrylic resin, acrylic resin, urea resin, and the like. The types of the first to third hardeners are not particularly limited, and can be selected according to the types of the first to second thermosetting resins. For example, when an epoxy resin is used for the thermosetting resin, an imidazole-based hardener, a polyamine-based hardener, an acid anhydride, an isocyanate-based hardener, an organic acid, a tertiary amine, and the like can be used. In consideration of the storage stability of the adhesive film, it is preferable to use a latent type hardener, which does not harden the thermosetting resin at room temperature, but promotes the hardening reaction by heating. As the latent hardener, the above-mentioned hardener can be encapsulated, or a blocked isocyanate. , ... The case where a filler is added to the first resin layer 10 ', but the present invention is not limited to this, and fillers can be added to the second and third resin layers 20 and 25, as long as the second and third resins are changed. Layers 20 and 25 are used: ㈣, average particle size, and blending amount, so that the lowest viscosity of the second and third resins is lower than the lowest viscosity of the first resin layer 10. The filler added to the first to third resin layers is preferably an insulating material. 26 200525004 == There is no particular limitation on the type of material. In addition to dioxin, it can also be used for inorganic substances such as magnesium, lice, etc. Organic fillers such as filling materials or resin particles # 等 #. The average particle diameter of the filler is only required if the average particle diameter of the conductive particles is less than or equal to 1 / m), and it is: the reliability of the conduction between the connection terminals. χ, in addition to: in each resin layer, additives such as an anti-aging agent, a colorant, and a coin coupler can also be added.

For electro-generated particles, the surface of resin particles is covered with a conductive layer as described above. Nickel particles, silver powder-like metal particles, or carbon particles are also used. A mixture of two or more conductive particles is also used. 52: According to the present invention, since the conductive particles do not easily flow into the connection terminal, &gt; the electrical device 1 with high connection reliability can be obtained even by using conductive particles without an insulating coating. The description above is directed to the case where the third resin layer 25 is directly formed on the surface of the first tree moon: layer 10, but the present invention is not limited to this, and the first

After the layer 25 is formed on another release film, the third resin layer and the first resin layer 10 are bonded together. θ 二 上 所 明明 'is for the first resin layer 10 to form a film on the surface of the first layer of the first layer of the resin layer 10 thick resin layer (the case of the second resin layer, but this & month is not limited to In this way, it is also possible to form a resin layer (third resin layer 25) with a film thickness of $ 10 on the surface of the first resin layer 10, peel the first peeling / release film 31 from the first resin layer 10, and then The exposed surface of the first resin layer 10 forms a resin layer (second resin layer 20) having a film thickness greater than that of the first-correction layer # a—the second resin layer 20. The first to second peeling layers 31 to 33, preferably Using the surface treatment of the resin film surface (peeling 27 200525004 release film), the name of the product 浐 &gt;, surface treatment methods, such as the formation of adhesion on the surface of the tree pancreas ... 乂 Low Other resin films. The coating of the first to third adhesives can also use the dip coating method, until the knife is cold, and is not limited to the case of roller coating, ... aB, y soil method, offset printing Various methods, such as 5 brothers, are aimed at the adhesive film 4 on each side of the adhesive film with a peeling film with a peeling agent attached to the peeling film, please do not attach green kernels. The present invention is not limited to this For example, if you want to apply a surface treatment to the opposite side of the first-shake-mystery-mythical layer 20 of Leyi Peeling 21 to form the peeling surface, roll up the adhesive film 4 without attaching the peeling film. Winding, still does not make #, will not cause &amp; Cheng two resin layer 25 and the second peeling film 32 "Bai Zhe. [Simplified illustration of the figure] Figure 1 (a) ~ (e) illustrates the attached peel in July Sectional view of the first half of the first example of the method of the adhesive film of the control method. Fig. 2 (f) is a cross-section of the second half of the first example of the adhesive film of the present invention, which is made of π and I. Fig. 'Fig. 3 is a cross-section illustrating an example of a first adherend used in the present invention

Fig. 4 is a cross-sectional view illustrating an example of the first to-be-deposited body used in the present invention. Figs. 5 (a) to (dH) are cross-sectional views illustrating the steps for manufacturing an electrical device using the adhesive film of the present invention. 1 Fig. 6 (a), ( b) It is a wearing view illustrating the second example of the method for manufacturing the adhesive sheet with a release film of the present invention. ^ Figure 7 is the relationship between viscosity and temperature when the resin layer is not heated. 200525004 [Explanation of Symbols of Main Components] 1 ... Electrical device 3 ... Laminate 4 ... Adhesive film 10 ... First resin layer 11 ... Binder 12 ... Conductive particles 20 ... Second tree moon purpose layer 25 ... Third tree The purpose layer 3: the first release film 32 ... the second release film 40 ... the first adherend (circuit board) 42 ... the first connection terminal 50 ... the second adherend ( Semiconductor element) 52 ... Second connection terminal 29

Claims (1)

200525004 10. Scope of patent application: 1. A dry film is provided with a first resin layer, a second resin layer disposed on the first resin layer, and a second resin layer disposed on the opposite side of the second resin layer of the first resin layer. Three resin layers. The first resin layer has an insulating bonding agent and conductive particles dispersed in the bonding agent. The insulating bonding agent has a first thermosetting resin and a first curing agent (which is connected to the first thermosetting resin by heating). The resin reacts to harden the first thermosetting resin), the second resin layer has an insulating first thermosetting resin, and a first curing agent (the second thermosetting resin is hardened by reacting with the second thermosetting resin through heating). The three resin layer has an insulating second thermosetting resin and a third curing agent (the third thermosetting resin is hardened by reacting with the third thermosetting resin through heating), and the dead film is disposed on the first adherend (having The first terminal) and the second adherend (having the second terminal) are heated and pressed, so that the first to third resin layers are heated up to a connection temperature of Z to λ ' In a state where conductive particles are held between the first and second connection terminals, the first to third thermosetting resins react with the first to third hardeners to harden, respectively, and the first and second adherends are cured. The first resin layer of the first resin layer in the connection temperature range below the connection temperature is 1000 ~ 1000OOPa · s, which is the first resin layer like ntl &amp; The lowest viscosity in the temperature range is lower than that of the Zth tree, and the film thickness of the second resin layer is greater than the film thickness of the first and third resin layers. -2. If the dead film of item i of the patent application scope, wherein the lowest dryness of the temperature range of the second resin 22 and the lower connection temperature is the-resin layer 3, such as the patent application scope 丨 or 2 The film of the dead, where the 30th 200525004-the thickness of the resin layer is conductive 4, such as the scope of the patent application-the conductive particles of the resin layer are dense, the film is thin, where the 5th, such as the hit ratio is- The resin layer is large. For example, the film thickness of the first or second resin layer in the patent application range is closer than that of the close contact: ㈣, where the first body (selected from the first, the second—the drilled, and the younger—the tree side of the layer is stuck) The thickness of the connection terminal of the victim) is large. For example, the adhesive cavity of the first or second item of the patent application ㈠ The three resin layers' are at the lowest Μ resin layer at a temperature range lower than the connection temperature. The lowest viscosity ratio is the first 7. If the layer is in the range of patent application, it is below 1/10 of the connection temperature. The adhesive film of item 6, wherein the lowest viscosity of the third resin temperature range is the dry film of the first or second patent application range of the first resin layer. The film thickness ratio of the third resin layer is- Thin right ^, a method of manufacturing a dry film, which is used to produce an adhesive film with a peeling film at least on one side, which is ancient ^ ..... there is a laminate, the laminate is provided with a first peeling M, a first resin layer disposed on the surface, a first resin layer disposed on the surface, a second resin layer disposed on the surface of the layer, and a configuration On the surface of the second resin layer / release film, the helium-resin layer has a lower viscosity than the second resin layer at a temperature range lower than the connection temperature; the first-release film of the laminate is peeled from the first resin layer And the surface of the first :: lipid layer is exposed, and the exposed surface of the first resin layer is coated with dry liquid—and dried ', thereby forming a third resin layer and producing an adhesive film. The method for manufacturing an adhesive film according to the item, 31 200525004. The production of the laminated body is at the first stage, and is dried to form a first resin layer desiccant, and dried to form a first layer, and the second surface is adhered to the second stage. Release film. The surface of the release film is coated with a liquid adhesive, and the second resin layer is coated on the surface of the first resin layer. First, the "method", in which the liquid tincture is allowed to dry and form a first ion The work surface is coated separately-the surface of the resin layer and the surface of the second resin layer are closely adhered to each other. Eleven, style: as the next page. 32