WO2008149678A1 - 電子部品の接続方法及び接合体 - Google Patents

電子部品の接続方法及び接合体 Download PDF

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Publication number
WO2008149678A1
WO2008149678A1 PCT/JP2008/059388 JP2008059388W WO2008149678A1 WO 2008149678 A1 WO2008149678 A1 WO 2008149678A1 JP 2008059388 W JP2008059388 W JP 2008059388W WO 2008149678 A1 WO2008149678 A1 WO 2008149678A1
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WO
WIPO (PCT)
Prior art keywords
conductive particles
pressing
electronic component
force
substrate
Prior art date
Application number
PCT/JP2008/059388
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English (en)
French (fr)
Inventor
Tomoyuki Ishimatsu
Daisuke Sato
Hiroki Ozeki
Original Assignee
Sony Chemical & Information Device Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemical & Information Device Corporation filed Critical Sony Chemical & Information Device Corporation
Priority to CN2008800190225A priority Critical patent/CN101681858B/zh
Priority to KR1020097026916A priority patent/KR101130002B1/ko
Publication of WO2008149678A1 publication Critical patent/WO2008149678A1/ja
Priority to US12/631,210 priority patent/US8273207B2/en
Priority to HK10105568A priority patent/HK1139785A1/xx

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
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    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
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    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract

導電性粒子の捕捉数を正確に計測することができ、かつ、接続後の導通信頼性の高い電子部品の接続方法及び接合体を提供することを目的とする。 本発明の電子部品の接続方法は、分散溶剤と、前記分散溶剤に溶解する接着剤樹脂と、導電性粒子と、粒径が前記導電性粒子の粒径よりも小さい絶縁性粒子とを混合して、異方導電性接着剤を作製する混合工程と、基板の基板側端子と、電子部品の部品側端子とを、前記異方導電性接着剤を介して対向させ、前記基板と前記電子部品に熱及び押圧力を印加し、前記基板側端子及び前記部品側端子で前記導電性粒子を挟持することにより、前記導電性粒子を変形させる加熱押圧工程とを含み、前記加熱押圧工程における押圧力は、前記導電性粒子が破壊される破壊押圧力及び前記導電性粒子の粒径が前記絶縁性粒子の粒径と同じになる変形押圧力のいずれよりも小さい。
PCT/JP2008/059388 2007-06-06 2008-05-21 電子部品の接続方法及び接合体 WO2008149678A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2008800190225A CN101681858B (zh) 2007-06-06 2008-05-21 电子部件的连接方法及接合体
KR1020097026916A KR101130002B1 (ko) 2007-06-06 2008-05-21 전자 부품의 접속 방법 및 접합체
US12/631,210 US8273207B2 (en) 2007-06-06 2009-12-04 Method for connecting electronic part and joined structure
HK10105568A HK1139785A1 (en) 2007-06-06 2010-06-07 Method for connecting electronic part and jointed structure

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CN101681858A (zh) 2010-03-24
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JP5010990B2 (ja) 2012-08-29
CN102448255B (zh) 2015-04-22
JP2008305887A (ja) 2008-12-18
TW200848486A (en) 2008-12-16
CN101681858B (zh) 2012-01-11
US8273207B2 (en) 2012-09-25
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US20100080995A1 (en) 2010-04-01
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