WO2008123087A1 - 異方性導電ペースト - Google Patents
異方性導電ペースト Download PDFInfo
- Publication number
- WO2008123087A1 WO2008123087A1 PCT/JP2008/055042 JP2008055042W WO2008123087A1 WO 2008123087 A1 WO2008123087 A1 WO 2008123087A1 JP 2008055042 W JP2008055042 W JP 2008055042W WO 2008123087 A1 WO2008123087 A1 WO 2008123087A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- conductive paste
- anisotropic conductive
- inorganic filler
- solder particles
- insulating inorganic
- Prior art date
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
- C08K5/3445—Five-membered rings
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C08K7/18—Solid spheres inorganic
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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- H05K2203/04—Soldering or other types of metallurgic bonding
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Wire Bonding (AREA)
- Conductive Materials (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2009509040A JP5491856B2 (ja) | 2007-03-19 | 2008-03-19 | 異方性導電ペースト |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2007-071346 | 2007-03-19 | ||
JP2007071346 | 2007-03-19 |
Publications (1)
Publication Number | Publication Date |
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WO2008123087A1 true WO2008123087A1 (ja) | 2008-10-16 |
Family
ID=39830588
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2008/055042 WO2008123087A1 (ja) | 2007-03-19 | 2008-03-19 | 異方性導電ペースト |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5491856B2 (ja) |
KR (1) | KR20090129478A (ja) |
TW (1) | TWI476266B (ja) |
WO (1) | WO2008123087A1 (ja) |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010219507A (ja) * | 2009-02-20 | 2010-09-30 | Panasonic Corp | はんだバンプ、半導体チップ、半導体チップの製造方法、導電接続構造体、および導電接続構造体の製造方法 |
JP2012072211A (ja) * | 2010-09-27 | 2012-04-12 | Panasonic Corp | 熱硬化性樹脂組成物及び半導体部品実装基板 |
CN103666297A (zh) * | 2012-09-21 | 2014-03-26 | 第一毛织株式会社 | 各向异性导电膜和包括它的半导体装置 |
JP2014209624A (ja) * | 2014-04-18 | 2014-11-06 | パナソニック株式会社 | 回路基板と半導体部品との接合部構造 |
WO2015056754A1 (ja) * | 2013-10-17 | 2015-04-23 | デクセリアルズ株式会社 | 異方性導電接着剤及び接続構造体 |
WO2015133343A1 (ja) * | 2014-03-07 | 2015-09-11 | 積水化学工業株式会社 | 導電ペースト、接続構造体及び接続構造体の製造方法 |
WO2015178482A1 (ja) * | 2014-05-23 | 2015-11-26 | デクセリアルズ株式会社 | 接着剤及び接続構造体 |
JP2015221875A (ja) * | 2014-05-23 | 2015-12-10 | デクセリアルズ株式会社 | 接着剤及び接続構造体 |
JP2015221876A (ja) * | 2014-05-23 | 2015-12-10 | デクセリアルズ株式会社 | 接着剤及び接続構造体 |
JP2016054296A (ja) * | 2014-09-01 | 2016-04-14 | 積水化学工業株式会社 | 接続構造体の製造方法 |
CN106062119A (zh) * | 2014-03-19 | 2016-10-26 | 迪睿合株式会社 | 各向异性导电粘接剂 |
WO2017033934A1 (ja) * | 2015-08-24 | 2017-03-02 | 積水化学工業株式会社 | 導電材料及び接続構造体 |
CN108251030A (zh) * | 2016-12-28 | 2018-07-06 | 株式会社田村制作所 | 各向异性导电糊及电子基板的制造方法 |
JP2020152789A (ja) * | 2019-03-19 | 2020-09-24 | パナソニックIpマネジメント株式会社 | 樹脂組成物およびこれを含む異方性導電フィルム、並びに電子装置 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI499775B (zh) * | 2013-01-28 | 2015-09-11 | Tanaka Precious Metal Ind | 氣體感測電極形成用之金屬膏 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
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- 2008-03-19 KR KR1020097021634A patent/KR20090129478A/ko not_active Application Discontinuation
- 2008-03-19 WO PCT/JP2008/055042 patent/WO2008123087A1/ja active Application Filing
- 2008-03-19 JP JP2009509040A patent/JP5491856B2/ja active Active
- 2008-03-19 TW TW097109587A patent/TWI476266B/zh active
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JP2010219507A (ja) * | 2009-02-20 | 2010-09-30 | Panasonic Corp | はんだバンプ、半導体チップ、半導体チップの製造方法、導電接続構造体、および導電接続構造体の製造方法 |
JP2012072211A (ja) * | 2010-09-27 | 2012-04-12 | Panasonic Corp | 熱硬化性樹脂組成物及び半導体部品実装基板 |
CN103666297A (zh) * | 2012-09-21 | 2014-03-26 | 第一毛织株式会社 | 各向异性导电膜和包括它的半导体装置 |
WO2015056754A1 (ja) * | 2013-10-17 | 2015-04-23 | デクセリアルズ株式会社 | 異方性導電接着剤及び接続構造体 |
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JP5851071B1 (ja) * | 2014-03-07 | 2016-02-03 | 積水化学工業株式会社 | 導電ペースト、接続構造体及び接続構造体の製造方法 |
WO2015133343A1 (ja) * | 2014-03-07 | 2015-09-11 | 積水化学工業株式会社 | 導電ペースト、接続構造体及び接続構造体の製造方法 |
CN105684096A (zh) * | 2014-03-07 | 2016-06-15 | 积水化学工业株式会社 | 导电糊剂、连接结构体及连接结构体的制造方法 |
JP2016048691A (ja) * | 2014-03-07 | 2016-04-07 | 積水化学工業株式会社 | 導電ペースト、接続構造体及び接続構造体の製造方法 |
CN106062119A (zh) * | 2014-03-19 | 2016-10-26 | 迪睿合株式会社 | 各向异性导电粘接剂 |
KR20160135700A (ko) * | 2014-03-19 | 2016-11-28 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 접착제 |
KR102339440B1 (ko) | 2014-03-19 | 2021-12-14 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 접착제 |
EP3121237A4 (en) * | 2014-03-19 | 2017-10-18 | Dexerials Corporation | Anisotropic conductive adhesive |
JP2014209624A (ja) * | 2014-04-18 | 2014-11-06 | パナソニック株式会社 | 回路基板と半導体部品との接合部構造 |
US10435601B2 (en) | 2014-05-23 | 2019-10-08 | Dexerials Corporation | Adhesive agent and connection structure |
JP2015221875A (ja) * | 2014-05-23 | 2015-12-10 | デクセリアルズ株式会社 | 接着剤及び接続構造体 |
WO2015178482A1 (ja) * | 2014-05-23 | 2015-11-26 | デクセリアルズ株式会社 | 接着剤及び接続構造体 |
JP2015221876A (ja) * | 2014-05-23 | 2015-12-10 | デクセリアルズ株式会社 | 接着剤及び接続構造体 |
JP2016054296A (ja) * | 2014-09-01 | 2016-04-14 | 積水化学工業株式会社 | 接続構造体の製造方法 |
JPWO2017033934A1 (ja) * | 2015-08-24 | 2017-10-12 | 積水化学工業株式会社 | 導電材料及び接続構造体 |
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Also Published As
Publication number | Publication date |
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TW200902673A (en) | 2009-01-16 |
KR20090129478A (ko) | 2009-12-16 |
TWI476266B (zh) | 2015-03-11 |
JPWO2008123087A1 (ja) | 2010-07-15 |
JP5491856B2 (ja) | 2014-05-14 |
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