WO2008120513A1 - 積層基板の電極端子接続構造 - Google Patents
積層基板の電極端子接続構造 Download PDFInfo
- Publication number
- WO2008120513A1 WO2008120513A1 PCT/JP2008/053407 JP2008053407W WO2008120513A1 WO 2008120513 A1 WO2008120513 A1 WO 2008120513A1 JP 2008053407 W JP2008053407 W JP 2008053407W WO 2008120513 A1 WO2008120513 A1 WO 2008120513A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrode terminals
- circuit boards
- connecting structure
- electrode terminal
- terminal connecting
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/091—Locally and permanently deformed areas including dielectric material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
Abstract
電気接続する回路基板1,2,3,4の電極端子同士11:21,12:32,13:43が異方性導電フィルム(ACF)5を介して対向して加圧・加熱されて接続し、電気接続する回路基板以外の回路基板は電極端子の位置に回路基板を取り除いた切り欠き31,41,22,42,23,33を設けて電極端子同士の会合を妨げずかつ接続加工における電極端子への伝熱を妨げないようにして、積層回路基板相互間の電気接続加工が容易で接続部分のはみ出しが小さい電極端子接続構造を提供する。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-087075 | 2007-03-29 | ||
JP2007087075A JP2010140638A (ja) | 2007-03-29 | 2007-03-29 | 積層基板の電極端子接続構造 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008120513A1 true WO2008120513A1 (ja) | 2008-10-09 |
Family
ID=39808098
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/053407 WO2008120513A1 (ja) | 2007-03-29 | 2008-02-27 | 積層基板の電極端子接続構造 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2010140638A (ja) |
WO (1) | WO2008120513A1 (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2334157A3 (en) * | 2009-12-09 | 2012-08-08 | Hosiden Corporation | Flexible wiring substrate |
JPWO2010150648A1 (ja) * | 2009-06-25 | 2012-12-10 | コニカミノルタホールディングス株式会社 | 有機エレクトロニクスパネルおよびその製造方法 |
JP2013021029A (ja) * | 2011-07-07 | 2013-01-31 | Denso Corp | 電力変換装置 |
EP2825004A4 (en) * | 2012-03-06 | 2015-12-23 | Tyco Electronics Japan G K | LAMINATED THREE DIMENSIONAL WIRING SUBSTRATE |
WO2016200666A1 (en) * | 2015-06-11 | 2016-12-15 | Tyco Electronics Corporation | Electrical connector having wafers |
US9755341B2 (en) | 2015-06-11 | 2017-09-05 | Te Connectivity Corporation | Flexible printed circuit board connector |
EP4184722A1 (en) * | 2021-11-17 | 2023-05-24 | TE Connectivity Germany GmbH | Electrical connector for connecting a flexible printed circuit to a cable harness |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013206982A (ja) * | 2012-03-27 | 2013-10-07 | Dexerials Corp | 接続体の製造方法、電子部品の接続方法、接続部材、接続部材の製造方法 |
DE102014013565A1 (de) * | 2014-09-18 | 2016-03-24 | Plastic Electronic Gmbh | Schaltungsträgerfolie-Leiterplatten-Aufbau |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58194393A (ja) * | 1982-05-07 | 1983-11-12 | キヤノン株式会社 | プリント配線板の接続装置 |
JPH03176972A (ja) * | 1989-12-05 | 1991-07-31 | Teikoku Tsushin Kogyo Co Ltd | フレキシブル基板の端子接続構造 |
JPH0888471A (ja) * | 1994-09-14 | 1996-04-02 | Nec Corp | 多層印刷配線基板装置及びその製造方法 |
JP2000098350A (ja) * | 1998-09-17 | 2000-04-07 | Ricoh Microelectronics Co Ltd | 液晶表示装置 |
JP2003124256A (ja) * | 2001-10-12 | 2003-04-25 | Matsushita Electric Ind Co Ltd | フレキシブル基板の実装方法 |
-
2007
- 2007-03-29 JP JP2007087075A patent/JP2010140638A/ja active Pending
-
2008
- 2008-02-27 WO PCT/JP2008/053407 patent/WO2008120513A1/ja active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58194393A (ja) * | 1982-05-07 | 1983-11-12 | キヤノン株式会社 | プリント配線板の接続装置 |
JPH03176972A (ja) * | 1989-12-05 | 1991-07-31 | Teikoku Tsushin Kogyo Co Ltd | フレキシブル基板の端子接続構造 |
JPH0888471A (ja) * | 1994-09-14 | 1996-04-02 | Nec Corp | 多層印刷配線基板装置及びその製造方法 |
JP2000098350A (ja) * | 1998-09-17 | 2000-04-07 | Ricoh Microelectronics Co Ltd | 液晶表示装置 |
JP2003124256A (ja) * | 2001-10-12 | 2003-04-25 | Matsushita Electric Ind Co Ltd | フレキシブル基板の実装方法 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2010150648A1 (ja) * | 2009-06-25 | 2012-12-10 | コニカミノルタホールディングス株式会社 | 有機エレクトロニクスパネルおよびその製造方法 |
JP2015097208A (ja) * | 2009-06-25 | 2015-05-21 | コニカミノルタ株式会社 | 有機エレクトロニクスパネルおよびその製造方法 |
EP2334157A3 (en) * | 2009-12-09 | 2012-08-08 | Hosiden Corporation | Flexible wiring substrate |
JP2013021029A (ja) * | 2011-07-07 | 2013-01-31 | Denso Corp | 電力変換装置 |
EP2825004A4 (en) * | 2012-03-06 | 2015-12-23 | Tyco Electronics Japan G K | LAMINATED THREE DIMENSIONAL WIRING SUBSTRATE |
US9894758B2 (en) | 2012-03-06 | 2018-02-13 | Tyco Electronics Japan G.K. | Three-dimensional laminated wiring substrate |
WO2016200666A1 (en) * | 2015-06-11 | 2016-12-15 | Tyco Electronics Corporation | Electrical connector having wafers |
US9590337B2 (en) | 2015-06-11 | 2017-03-07 | Te Connectivity Corporation | Electrical connector having wafers |
US9755341B2 (en) | 2015-06-11 | 2017-09-05 | Te Connectivity Corporation | Flexible printed circuit board connector |
EP4184722A1 (en) * | 2021-11-17 | 2023-05-24 | TE Connectivity Germany GmbH | Electrical connector for connecting a flexible printed circuit to a cable harness |
Also Published As
Publication number | Publication date |
---|---|
JP2010140638A (ja) | 2010-06-24 |
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