JP2005243950A - 異方性導電接続方法及び異方性導電接着フィルム - Google Patents
異方性導電接続方法及び異方性導電接着フィルム Download PDFInfo
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- JP2005243950A JP2005243950A JP2004052260A JP2004052260A JP2005243950A JP 2005243950 A JP2005243950 A JP 2005243950A JP 2004052260 A JP2004052260 A JP 2004052260A JP 2004052260 A JP2004052260 A JP 2004052260A JP 2005243950 A JP2005243950 A JP 2005243950A
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- Prior art keywords
- anisotropic conductive
- adhesive film
- conductive adhesive
- circuit board
- connection
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Images
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Abstract
【解決手段】 回路基板1上に、導電粒子2を含有する光硬化型の異方性導電接着フィルム4を配置し、その異方性導電接着フィルム4上に、回路基板1の接続端子1bに対応した露光パターンを有する露光用マスク5を配置し、露光用マスク5を介してその異方性導電接着フィルム4に光を照射し、その異方性導電接着フィルム4の光が照射された露光部4aを光重合させ、その溶融粘度を増大させ、続いて露光用マスク5を取り去り、回路基板1の接続端子1bに対し、異方性導電接着フィルム4側から電子素子6の接続部6aを位置合わせして両者を密着させ、異方性導電接着フィルム4を光重合させることにより、回路基板1の接続端子1bと電子素子6の接続部6aとを接続する。
【選択図】 図1
Description
工程(a) 回路基板上に、導電粒子が光硬化型絶縁性接着剤に分散してなる異方性導電接着フィルムを配置する工程;
工程(b) 該異方性導電接着フィルム上に、回路基板の接続端子に対応した露光パターンを有する露光用マスクを配置する工程;
工程(c) 露光用マスクを介して該異方性導電接着フィルムに光を照射し、該異方性導電接着フィルムの光が照射された露光部を光重合させ、その溶融粘度を増大させる工程; 及び
工程(d) 露光用マスクを取り去り、回路基板の接続端子に対し、異方性導電接着フィルム側から電子素子の接続部を位置合わせして両者を密着させ、異方性導電接着フィルム全体に光を照射し、全体を光重合させることにより、回路基板の接続端子と電子素子の接続部とを接続する工程
を含む異方性導電接続方法を提供する。
工程(a′) 回路基板上に、導電粒子が光硬化型絶縁性接着剤に分散してなる異方性導電接着剤層とその少なくとも片面に熱硬化型接着剤層が設けられた積層型異方性導電接着フィルムを配置する工程;
工程(b′) 積層型異方性導電接着フィルム上に、回路基板の接続端子に対応した露光パターンを有する露光用マスクを配置する工程;
工程(c′) 露光用マスクを介して該積層型異方性導電接着フィルムに光を照射し、積層型異方性導電接着フィルムの光硬化型異方性導電接着剤層の光が照射された露光部を光重合させ、その溶融粘度を増大させる工程; 及び
工程(d′) 露光用マスクを取り去り、回路基板の接続端子に対し積層型異方性導電接着フィルム側から電子素子の接続部を位置合わせして両者を密着させ、少なくとも熱硬化型接着剤層を硬化させることにより、回路基板の接続端子と電子素子の接続部とを接続する工程
を含む異方性導電接続方法を提供する。
図1(a)に示すように、回路基板1上に、導電粒子2が光硬化型絶縁性接着剤3に分散してなる光硬化型の異方性導電接着フィルム4を配置する。
次に、図1(b1)または(b2)に示すように、異方性導電接着フィルム4の上に、回路基板1の接続端子1bに対応した露光パターンを有する露光用マスク5を配置する。この場合、露光用マスク5の露光パターンは、回路基板1の接続端子1b上の異方性導電接着フィルム4に光が照射されるようなパターン(図1(b1))、または回路基板1の接続端子1bの周囲の異方性導電接着フィルム4に光が照射されるようなパターン(図1(b2))である。ここで、接続端子1bの周囲とは、接続端子1bを円や正方形で囲った場合だけでなく、ライン状に挟んだ場合やL字型に囲った場合も含む。
次に、露光用マスク5を介して異方性導電接着フィルム4に光を照射し、異方性導電接着フィルム4の光が照射された露光部を光重合させ、その部分の溶融粘度を増大させる。ここで、図1(b1)の露光パターンの場合には、図1(c1)に示すように、回路基板1の接続端子1b上の異方性導電接着フィルムの露光部4aの溶融粘度が高まる。この結果、その露光部4aにおける導電粒子の捕捉性を高めることができる。しかも、異方性導電接着フィルム4の非露光部では光重合反応が進行していないので、回路基板1と電子素子とを互いに十分な強度で仮接着でき、しかも異方性導電接続の際に異方性導電接着フィルム4全体の流動性を確保でき、圧着時の圧力を過度に上げる必要性がなくなる。
次に、露光用マスク5を取り去り、回路基板1の接続端子1bに対し、異方性導電接着フィルム4側から電子素子6の接続部6aを位置合わせして両者を密着させ、異方性導電接着フィルム4全体に光を照射して全体を光重合させることにより、回路基板1の接続端子1bと電子素子の接続部とを、良好な接続信頼性で異方性導電接続することができる(図1(d))。ここで、電子素子6としては、回路基板1と同様な回路基板やフレキシブル配線基板、ICチップ、アンテナ素子、コンデンサ素子、抵抗素子等を挙げることができ、またその接続部6aとしては、公知のバンプや電極パッド構造を取ることができる。
まず、図2(A1)または図2(A2)に示すように、回路基板21上に、導電粒子22が光硬化型絶縁性接着剤23に分散してなる光硬化型の異方性導電接着剤層24とその少なくとも片面に熱硬化型接着剤層25が設けられた積層型異方性導電接着フィルム26を配置する。ここで、図2(A1)の場合には、片面に熱硬化型接着剤層25が設けられた積層型異方性導電接着フィルム26を、回路基板21側に異方性導電接着剤層24が位置するように配置されているが、回路基板21側に熱硬化型接着剤層25が位置するようにしてもよい。また、図2(A2)の場合のように、両面に熱硬化型接着剤層25が設けられた積層型異方性導電接着フィルム26を使用してもよい。
次に、図2(A1)に示した積層型異方性導電接着フィルム26上に、回路基板21の接続端子21bに対応した露光パターンを有する露光用マスク27を配置する。この工程は、図1の態様における工程(b)と同じ操作となる。ここで、露光用マスク27の露光パターンが、回路基板21の接続端子21b上の積層型異方性導電接着フィルム26に光が照射されるようなパターンの場合を図2(B1)に示し、露光用マスク5の露光パターンが、回路基板21の接続端子21bの周囲上の積層型異方性導電接着フィルム26に光が照射されるようなパターンの場合を図2(B2)に示す。
次に、露光用マスク27を介して積層型異方性導電接着フィルム26に光を照射し、積層型異方性導電接着フィルム26の異方性導電接着剤層24の光が照射された露光部24aを光重合させ、その部分の溶融粘度を増大させる。ここで、図2(B1)の露光パターンの場合には、図2(C1)に示すように、回路基板21の接続端子21b上の異方性導電接着フィルム26の異方性導電接着剤層24の露光部24aの溶融粘度が高まる。この結果、その露光部24aにおける導電粒子22の捕捉性を高めることができる。しかも、異方性導電接着フィルム26の異方性導電接着剤層24の非露光部24bでは光重合反応が進行していないので、回路基板21と電子素子とを互いに十分な強度で仮接着でき、しかも異方性導電接続の際に異方性導電接着フィルム26全体の流動性を確保できるので、圧着時の圧力を過度に挙げる必要性はない。
次に、露光用マスク27を取り去り、回路基板21の接続端子21bに対し積層型異方性導電接着フィルム26側から電子素子28の接続部28aを位置合わせして両者を密着させ、少なくとも熱硬化型接着剤層25を熱硬化させることにより、回路基板21の接続端子21bと電子素子28の接続部28aとを接続する。この場合、光硬化型の異方性導電接着剤層24に光を照射して硬化させてもよい。このようにして、回路基板21の接続端子21bと電子素子28の接続部28aとを、良好な接続信頼性で異方性導電接続することができる(図2(D))。ここで、電子素子28としては、図1(d)で説明した電子素子6と同様なものを使用できる。
表1に示す成分を、トルエンと酢酸エチルの混合溶剤(重量比1:1)に、固形分が60重量%となるように均一に混合することにより紫外線硬化型接着剤組成物を調製し、その紫外線硬化型接着剤組成物を剥離処理したポリエチレンテレフタレートフィルムに乾燥厚が20μmまたは40μmとなるように塗布し、80℃で5分間乾燥して光硬化型異方性導電接着フィルムを作製した。このフィルムの溶融粘度(レオメータRS150(ハーケ社)にて測定)は、紫外線照射前は6.0×106mPa・s(80℃)であり、紫外線照射(200mJ/cm2(320〜390nm))後は3.0×108mPa・s(80℃))であった。
ガラス板にACF(異方性導電接着フィルム)/剥離処理PET(ポリエチレンテレフタレート)を、ホットプレスを用いて、40℃×0.5MPa×2secという条件で熱圧着し、その後、剥離処理PETを引き剥がし、露出したACFの状態を観察した。
ランク 基準
○:ACFがガラス上に転着した場合
×:ACFがガラス上に転着しない場合
圧着したICのバンプ(バンプ一個当たりの表面積=2500μm2)上に存在する導電粒子数を顕微鏡にてカウントし、その平均値を粒子捕捉数とした。
1b,21b 接続端子
2,22 導電粒子
3,33 光硬化型絶縁性接着剤
4,26 異方性導電接着フィルム
24 光硬化型の異方性導電接着剤層
4a,24a 露光部
4b,24b 非露光部
Claims (8)
- 回路基板の接続端子と電子素子の接続部とを異方性導電接続する方法であって、以下の工程(a)〜(d):
工程(a) 回路基板上に、導電粒子が光硬化型絶縁性接着剤に分散してなる異方性導電接着フィルムを配置する工程;
工程(b) 該異方性導電接着フィルム上に、回路基板の接続端子に対応した露光パターンを有する露光用マスクを配置する工程;
工程(c) 露光用マスクを介して該異方性導電接着フィルムに光を照射し、該異方性導電接着フィルムの光が照射された露光部を光重合させ、その溶融粘度を増大させる工程; 及び
工程(d) 露光用マスクを取り去り、回路基板の接続端子に対し、異方性導電接着フィルム側から電子素子の接続部を位置合わせして両者を密着させ、異方性導電接着フィルム全体に光を照射し、全体を光重合させることにより、回路基板の接続端子と電子素子の接続部とを接続する工程
を含む異方性導電接続方法。 - 工程(c)において、回路基板の接続端子上の異方性導電接着フィルムに光を照射する請求項1記載の異方性導電接続方法。
- 工程(c)において、回路基板の接続端子の周囲上の異方性導電接着フィルムに光を照射する請求項1記載の異方性導電接続方法。
- 回路基板の接続端子と電子素子の接続部とを異方性導電接続する方法であって、以下の工程(a′)〜(d′):
工程(a′) 回路基板上に、導電粒子が光硬化型絶縁性接着剤に分散してなる異方性導電接着剤層とその少なくとも片面に熱硬化型接着剤層が設けられた積層型異方性導電接着フィルムを配置する工程;
工程(b′) 積層型異方性導電接着フィルム上に、回路基板の接続端子に対応した露光パターンを有する露光用マスクを配置する工程;
工程(c′) 露光用マスクを介して該積層型異方性導電接着フィルムに光を照射し、積層型異方性導電接着フィルムの光硬化型異方性導電接着剤層の光が照射された露光部を光重合させ、その溶融粘度を増大させる工程; 及び
工程(d′) 露光用マスクを取り去り、回路基板の接続端子に対し、積層型異方性導電接着フィルム側から電子素子の接続部を位置合わせして両者を密着させ、少なくとも熱硬化型接着剤層を硬化させることにより、回路基板の接続端子と電子素子の接続部とを接続する工程
を含む異方性導電接続方法。 - 工程(c′)において、回路基板の接続端子上の積層型異方性導電接着フィルムの異方性導電接着剤層に光を照射する請求項4記載の異方性導電接続方法。
- 工程(c′)において、回路基板の接続端子の周囲上の積層型異方性導電接着フィルムの異方性導電接着剤層に光を照射する請求項4記載の異方性導電接続方法。
- 導電粒子が光硬化型絶縁性接着剤に分散してなる異方性導電接着剤層からなる異方性導電接着フィルムであって、異方性導電接続パターンに応じて、異方性導電接着フィルムの異方性導電接着剤層中に溶融粘度が異なる領域が設けられていることを特徴とする異方性導電接着フィルム。
- 異方性導電接着層の少なくとも片面に熱硬化型接着剤層が形成されている請求項7記載の異方性導電接着フィルム。
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US10/557,883 US7655107B2 (en) | 2004-02-26 | 2004-09-30 | Method for establishing anisotropic conductive connection and anisotropic conductive adhesive film |
TW093130213A TWI274780B (en) | 2004-02-26 | 2004-10-06 | Anisotropic conduction connecting method and anisotropic conduction adhesive film |
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HK1103169A1 (en) | 2007-12-14 |
KR101086182B1 (ko) | 2011-11-25 |
TWI274780B (en) | 2007-03-01 |
CN1926675B (zh) | 2012-07-04 |
KR20060126574A (ko) | 2006-12-07 |
CN1926675A (zh) | 2007-03-07 |
TW200528531A (en) | 2005-09-01 |
US20070068622A1 (en) | 2007-03-29 |
WO2005083772A1 (ja) | 2005-09-09 |
US7655107B2 (en) | 2010-02-02 |
JP4385794B2 (ja) | 2009-12-16 |
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