CN1622304A - 倒装芯片接合方法和用于柱型凸起的衬底分层金属架构 - Google Patents

倒装芯片接合方法和用于柱型凸起的衬底分层金属架构 Download PDF

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CN1622304A
CN1622304A CNA2004100803660A CN200410080366A CN1622304A CN 1622304 A CN1622304 A CN 1622304A CN A2004100803660 A CNA2004100803660 A CN A2004100803660A CN 200410080366 A CN200410080366 A CN 200410080366A CN 1622304 A CN1622304 A CN 1622304A
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bumps
chip
substrate
bonding
ultrasonic waves
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具滋郁
金亨燦
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    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
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    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
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    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01221—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition
    • H10W72/01225—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition in solid form, e.g. by using a powder or by stud bumping
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    • H10W72/07231—Techniques
    • H10W72/07232—Compression bonding, e.g. thermocompression bonding
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    • H10W72/251—Materials
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    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
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    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
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    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
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    • H10W72/921—Structures or relative sizes of bond pads
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    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
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    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
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    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
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    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

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CNA2004100803660A 2003-11-25 2004-09-29 倒装芯片接合方法和用于柱型凸起的衬底分层金属架构 Pending CN1622304A (zh)

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KR20030083891 2003-11-25
KR1020030083891 2003-11-25

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CN1622304A true CN1622304A (zh) 2005-06-01

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Country Status (7)

Country Link
US (1) US7115446B2 (enExample)
JP (1) JP2005159356A (enExample)
KR (1) KR100604334B1 (enExample)
CN (1) CN1622304A (enExample)
SG (1) SG128468A1 (enExample)
TW (1) TWI255019B (enExample)
WO (1) WO2005053013A1 (enExample)

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CN101904230A (zh) * 2007-12-18 2010-12-01 美光科技公司 焊料球的无助熔剂微穿孔方法和所得的装置
CN101331681B (zh) * 2005-12-21 2012-04-18 株式会社大真空 压电谐振片和压电谐振器件

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KR20100053016A (ko) * 2008-11-12 2010-05-20 한국과학기술원 접착제의 발열 온도 조절을 통한 전자부품간 접속 방법 및 접착제의 발열 온도 조절을 통한 전자부품간 접속 장치
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