KR100604334B1 - 플립칩 패키징 공정에서 접합력이 향상된 플립칩 접합 방법 - Google Patents

플립칩 패키징 공정에서 접합력이 향상된 플립칩 접합 방법 Download PDF

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KR100604334B1
KR100604334B1 KR1020040038214A KR20040038214A KR100604334B1 KR 100604334 B1 KR100604334 B1 KR 100604334B1 KR 1020040038214 A KR1020040038214 A KR 1020040038214A KR 20040038214 A KR20040038214 A KR 20040038214A KR 100604334 B1 KR100604334 B1 KR 100604334B1
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chip
bonding
substrate
bump
flip chip
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KR20050050155A (ko
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구자욱
김형찬
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(주)케이나인
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KR1020040038214A 2003-11-25 2004-05-28 플립칩 패키징 공정에서 접합력이 향상된 플립칩 접합 방법 Expired - Fee Related KR100604334B1 (ko)

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