CN1423315A - 半导体模块及其生产方法以及用于ic卡等的模块 - Google Patents

半导体模块及其生产方法以及用于ic卡等的模块 Download PDF

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CN1423315A
CN1423315A CN02154002A CN02154002A CN1423315A CN 1423315 A CN1423315 A CN 1423315A CN 02154002 A CN02154002 A CN 02154002A CN 02154002 A CN02154002 A CN 02154002A CN 1423315 A CN1423315 A CN 1423315A
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circuit board
printed circuit
pcb
semiconductor chip
lead
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CN1266763C (zh
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西川昌孝
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Sharp Corp
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Sharp Corp
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Abstract

一种半导体模块,它包含:由其二面上制作有导体图形的绝缘体制成的印刷电路板。IC芯片被安装在印刷电路板上并用树脂密封。金属片或潮气渗透阻挡片被粘合在与面对印刷电路板一面相反的IC芯片表面上。

Description

半导体模块及其生产方法以及用于IC卡等的模块
技术领域
本发明涉及其上提供有IC芯片的模块及其装配的封装技术。详细地说，本发明涉及一种半导体模块，它能够被减小厚度却仍然能够提供周边元件抗环境条件的高可靠性，还涉及模块的生产方法以及用于IC卡等的模块。
背景技术
新近，其上提供有半导体集成电路器件的IC卡，已经被实际用于诸如公共汽车和火车之类的公交月票、包括银行卡在内的金融卡、或身份证。由于IC卡本身具有磁卡不提供的数据处理功能和高的安全性功能，故此优点使其应用更为广阔。
IC卡被分为3种类型，亦即接触型、非接触型、以及具有接触型和非接触型二种功能的组合型。对于第一种类型即接触型IC卡，它在提供IC芯片的反面上具有电极，这些电极与作为外部器件的读出/写入器件形成机械接触并起待要被电连接的端子的作用。相反，对于第二类型即非接触型IC卡，它具有诸如绕制型入口或腐蚀线圈型入口之类的天线，并由读出/写入器件利用天线接收的电磁波以非接触方式供电和交换数据。
由于IC卡在大多数情况下被放在衣服口袋、钱包、月票夹等中，故非常需要其轻便。为了获得轻便性，必须减薄IC卡模块，因为通常IC卡若为1.0mm或更薄，则容易携带。为了满足结构薄的要求，必须使IC卡模块的各个组成部分，具体地说是印刷电路板、IC芯片、键合引线(特别是引线环的高度)、以及密封树脂，尽可能薄。
但当试图使印刷电路板更薄时，在模块制造的封装工艺中，提供IC芯片之后的加工性能将变坏。因此，目前的生产极限是大约100μm。当IC芯片与诸如QFP(四列扁平封装件)、SOP(小外形封装件)、CSP(芯片尺寸封装件)之类的典型半导体封装件一起使用时，产品不得不至少成为200μm厚。引线环被制作在离IC芯片顶部大约150μm的高度处，这样，当IC芯片和引线用树脂密封时，需要形成离IC芯片表面大约200μm或更厚的树脂填料。
若试图使元件更薄，则IC芯片可能由于弯曲负载而破裂，并可能引起致命的缺陷，使IC芯片的电路不工作。在密封树脂厚度的减小过程中，若环氧树脂含有少量填充剂，则整个模块变得容易由于树脂中的应力而弯曲，接触型IC卡的电端子表面从而出现极差的平整性和平滑性，引起与读出/写入器件电连接端子的连接失效。另一方面，若环氧树脂含有大量填充剂，则流动性极差，产生未被填充的部分。
在日本专利申请公开Hei 11 No.296638(以下称为第一现有技术)和日本专利申请公开Hei 11 No.238744(以下称为第二现有技术)等中，已经公开了用来生产具有必要机械强度的薄IC模块的密封技术。具体地说，专利申请公开Hei 11 No.296638(第一现有技术)公开了一种技术，用来将IC芯片及其外围部分密封在凹陷的外壳中，并在其中留有空洞。
图1示出了此技术的模块的剖面结构。此图所示的模块在印刷电路板20上提供有IC芯片4，而IC芯片4的电极被引线5电连接到印刷电路板20的预定端子，然后用凹陷外壳17覆盖，以便隔离和保护IC芯片4和引线5免受外部空气的影响。在此技术中，弹性模量大于单晶硅的材料被用于凹陷外壳17，以便保护IC芯片4和加固模块。
但在此现有技术中，模块仅仅被印刷电路板20与凹陷外壳17之间的界面连接包封，而芯片4和引线5仍然在空洞中。当这种结构的模块被制作到IC卡模块卡中并承受变形、扭曲、和其它机械测试时，印刷电路板20与凹陷外壳17之间的界面可能破裂，水就能够容易地通过破裂处进入。而且，若采用诸如玻璃环氧树脂、聚酰亚胺之类的有机衬底时，由于有机衬底本身容易渗透潮气，故反复地吸收潮气、降低环境温度、内部气氛凝结，将引起水在IC芯片4及其空洞内的外围部分周围凝结。于是，为了改善抗弯曲、扭曲等的机械强度，必须提供一种具有足够高的机械强度的结构。
日本专利申请公开Hei 11 No.238744(第二现有技术)公开了一种密封技术，其中IC芯片4被未被固化的密封树脂包封，用称为顶部箔的圆盘18覆盖，圆盘18用冲压工具切自环氧树脂或聚酰亚胺树脂膜并固化。图2示出了此现有技术的模块的剖面结构。借助于在印刷电路板20上提供IC芯片4，将印刷电路板20的端子与IC芯片4的预定端子电连接，在芯片上涂敷液体树脂19，并放置薄片亦即顶部箔18以确保平滑表面，来构成此图所示的模块。
根据此技术，借助于在液体树脂19上放置顶部箔18，能够改善模块厚度的可控性。而且，顶部箔18还用作加固元件，从而改善抗冲击性。
在日本专利申请公开Hei 11 No.296638(第一现有技术)中，用倒装芯片安装工艺或COB(电路板上芯片)引线键合工艺在印刷电路板20上提供IC芯片4之后，印刷电路板上的IC芯片4及其外围部分沿凹陷外壳17的边沿被密封。
但即使凹陷外壳17由透气性非常低的材料制成，若在凹陷外壳17内部存在着空洞，则潮气也会通过粘合表面或通过一般由玻璃环氧树脂、聚酰亚胺、或其它有机化合物组成的印刷电路板20发生渗透，且空洞中的温度升高。例如，若模块用于30℃和相对湿度为70％的外部环境下，凹陷外壳17中的潮气很快就变成等于外部环境的潮气。当从这一条件冷却时，其中的潮气凝结，并引起IC芯片4表面上以及印刷电路板20内互连电路中的漏电，导致工作错误。
在日本专利申请公开Hei 11 No.238744(第二现有技术)中，利用冲压工具切割顶部箔18，并放置和固化以完成密封。此顶部箔18起调整IC卡模块树脂密封高度的作用，并提供加固功能，但对防止外部环境影响不提供任何贡献。
发明内容
根据上面所述提出了本发明，本发明的目的因而是提供一种半导体模块，当暴露于例如高温高湿度存储环境、施加有偏压的高温高湿度环境、气相增压环境之类的恶劣环境时，此模块能够防止出现伴随潮气渗透的缺陷，此恶劣环境与IC模块上的抗环境测试的条件可比拟，并能够减少实际抗环境测试中缺陷的出现，从而改善生产成品率以及改善实际使用环境下的可靠性。亦即，本发明的目的是提供这样一种半导体模块及其生产方法以及一种用于IC卡等的模块。
为了达到上述目的，本发明如下构成：
根据本发明的第一方面，半导体模块包含：由其二面上制作有导体图形的绝缘体制成的印刷电路板；以及安装在印刷电路板上并用树脂密封的半导体芯片，其特征在于，金属片或潮气渗透阻挡片被粘合在与面对印刷电路板一侧相反的半导体芯片表面上。
根据本发明的第二方面，具有上述第一特点的半导体模块还包含，提供在其上提供半导体芯片的印刷电路板表面上的天线连接端子和/或提供在与其上安装半导体芯片的表面相反的下侧上的电连接电极。
根据本发明的第三方面，具有上述第一特点的半导体模块的特征在于，金属片由不锈钢、42合金、铝或铜组成。
根据本发明的第四方面，具有上述第一特点的半导体模块的特征在于，潮气渗透阻挡片由氧化铝陶瓷组成。
根据本发明的第五方面，具有上述第一特点的半导体的特征在于，金属片或潮气渗透阻挡片的厚度为100μm或以下。
根据本发明的第六方面，具有上述第一特点的半导体模块的特征在于，粘合层被提供来键合半导体芯片与金属片或潮气渗透阻挡片，且粘合层的厚度为30μm或以下。
根据本发明的第七方面，具有上述第一特点的半导体模块的特征在于，金属片的非粘合表面被制作成具有凹槽和突出。
根据本发明的第八方面，一种半导体模块生产方法，从而使半导体芯片被安装在其二侧制作有导体图形的绝缘体制成的印刷电路板上，且其上安装有半导体芯片的印刷电路板被树脂密封，包含下列步骤：将半导体芯片安装在印刷电路板上；用引线在其间实现电连接；以及在印刷电路板的半导体芯片安装侧上用模压树脂进行密封之前，用其间的粘合层将金属片或潮气渗透阻挡片粘合在半导体芯片表面上。
根据本发明的第九方面，一种半导体模块生产方法，从而使半导体芯片被安装在其二侧制作有导体图形的绝缘体制成的印刷电路板上，且其上安装有半导体芯片的印刷电路板被树脂密封，包含下列步骤：在印刷电路板的半导体芯片安装侧上用模压树脂进行密封之前，在粘合到半导体芯片表面的金属片或潮气渗透阻挡片的一侧上制作凹槽和突出。
根据本发明的第十方面，具有上述第八特点的半导体模块生产方法，其特征在于，借助于正常引线键合，或借助于首先用球键合方法将引线连接到半导体芯片的电极，然后用针脚式键合方法将其连接到印刷电路板上的预定端子，来实现印刷电路板与半导体芯片之间的引线电连接。
根据本发明的第十一方面，具有上述第九特点的半导体模块生产方法，其特征在于，借助于正常引线键合，或借助于首先用球键合方法将引线连接到半导体芯片的电极，然后用针脚式键合方法将其连接到印刷电路板上的预定端子，来实现印刷电路板与半导体芯片之间的引线电连接。
根据本发明的第十二方面，具有上述第八特点的半导体模块生产方法，其特征在于，借助于相反的引线键合，或借助于首先用球键合方法将引线连接到印刷电路板上的预定端子，然后用针脚式键合方法将其连接到半导体芯片的电极，来实现印刷电路板与半导体芯片之间的引线电连接。
根据本发明的第十三方面，具有上述第九特点的半导体模块生产方法，其特征在于，借助于相反的引线键合，或借助于首先用球键合方法将引线连接到印刷电路板上的预定端子，然后用针脚式键合方法将其连接到半导体芯片的电极，来实现印刷电路板与半导体芯片之间的引线电连接。
根据本发明的第十四方面，用于IC卡等的模块包括半导体模块，它包含：由其二侧上制作有导体图形的绝缘体制成的印刷电路板；以及安装在印刷电路板上并用树脂密封的半导体芯片，其中，金属片或潮气渗透阻挡片被粘合在与面对印刷电路板一侧相反的半导体芯片表面上。
此处，用于IC卡等的模块可以是非接触型、接触型或具有接触型和非接触型功能二者的组合型。用于IC卡等的模块主要被用于IC卡模块，但应该不局限于此，而是能够被应用于其它目的。
附图说明
图1是剖面图，示出了第一现有技术公开的常规技术的结构；
图2是剖面图，示出了第二现有技术公开的另一常规技术的结构；
图3是剖面图，示出了本发明一个实施方案的半导体模块的结构；
图4是剖面图，示出了本发明另一个实施方案的半导体模块的结构；
图5是剖面图，示出了本发明另一个实施方案的半导体模块的结构；
图6是平面图，示出了本发明的半导体模块的一个实施方案；
图7是平面图，示出了本发明的半导体模块的一个实施方案的与IC芯片安装表面相反的表面上的电极部分；
图8是结构剖面图，示出了埋置在IC卡衬底中的本发明的半导体模块；而
图9是平面图，示出了图8所示的IC卡。
具体实施方式
下面参照图3和其它附图来描述根据本发明的半导体模块及其生产方法以及用于IC卡等的模块的优选实施方案。
双面印刷电路板20由厚度为50-100μm的环氧树脂浸渍的玻璃环氧树脂制成的聚酰亚胺双面互连的绝缘层8以及能够用腐蚀或其它工艺(形成模块的前述天线连接端子7和印刷电路板20的预定端子11)图形化的粘合在绝缘体二面上诸如铜箔等的导体组成。此导体被规定为具有8-20μm的厚度。
此处，在本实施方案中，在其二面上具有厚度为12μm的导体层的玻璃环氧树脂衬底被示为例子，但此导体应该没有特别的限制，只要在上述范围内即可。
印刷电路板20钻有通孔9，用于二面上导体层之间的电连接，并具有电镀制作在二面上的厚度为10μm的导体层。用腐蚀之类的方法对这样形成的导体层进行图形化，以完成印刷电路板20。
此处，本实施方案所示的印刷电路板20具有厚度为8-80μm的绝缘层。
在典型的晶片制造工艺中处置的IC芯片4的厚度为400-700μm，但对于图9所示的IC卡模块16，晶片的下表面被研磨，使得到的IC芯片4的厚度为50-200μm。此处的描述将以研磨到厚度为80μm的晶片为例。厚度为10-50μm的膜粘合剂10被预先涂敷在晶片下侧。用金刚石刀片之类将晶片切割成芯片，使带有粘合剂10的各个IC芯片4被安装到印刷电路板20。粘合剂10可以采用热固化树脂、热塑树脂、或热固化树脂与热塑树脂的混合物，并在必须的温度和压力下被涂敷。
可以预先在印刷电路板20的预定位置处涂敷IC芯片4的粘合剂10。此处的IC芯片4的粘合剂10的厚度被规定为30μm。
图8是结构剖面图，示出了埋置在IC卡衬底15中的本发明的半导体模块16，而图9是平面图，示出了图8所示的IC卡。
接着，用直径为20-30μm的超细铝丝或金丝，将IC芯片4的预定电极连接到印刷电路板上的预定端子11。图3示出了其中用通常称为正常键合的方法执行使用金丝5的引线键合的结构。在此工艺中，金丝5首先被连接到IC芯片4的预定电极处，然后引线5的另一端被连接到印刷电路板20上的相关端子11。当使用金丝5时，预先在IC芯片4的预定电极上形成金球。
当然能够达到相反的键合，从而引线5首先被金球连接到印刷电路板20上的预定端子11，然后用针脚式键合方法将引线5的另一端连接到IC芯片4的预定电极。在此情况下，金球被形成在引线要首先连接到其上的印刷电路板20的预定端子11上。如图4所示，采用这一相反键合工艺使得有可能减小引线5的键合高度(引线环高度)。如从图3与图4的比较可见，由于没有金球被提供在IC芯片4的电极侧，故有可能在IC芯片4的整个表面上提供稍后所述的片2，用来防止潮气渗透。
而且，为了达到本发明的主要目的，亦即防止外部潮气内部渗透，在用参考号1表示的模压树脂密封IC芯片4的安装表面之前，用厚度为50μm或更小的粘合剂3将厚度等于或小于100μm的片2涂敷在IC芯片4的表面上。此片2可以由不锈钢、42合金、铝、铜、或其它金属片制成，或可以是由提供禁止潮气渗透的氧化铝陶瓷制成的潮气渗透阻挡片。此处，片2的厚度被设定为80μm，而粘合剂的厚度被设定为30μm。
接着，参照图5来描述本发明的第二实施方案。在图5中，借助于腐蚀、机加工、或其它处理，树脂密封的片2表面被制作成具有凹陷和突出。其它的结构与上述实施方案相同，故不再赘述。
根据本发明，提供连续的凹陷和突出使得有可能明显地改善粘合强度。
根据上述结构，由于用来防止潮气渗透的片2被涂敷成与其上制作有源电路的IC芯片4的顶部表面紧密接触，故有可能明显有效地阻挡潮气通过作为密封树脂的环氧树脂1本体渗透。换言之，厚度为50μm或更小的由不锈钢、42合金、铝、铜、或氧化铝陶瓷制成的片2的应用，完全阻断了具有粘合剂3的IC芯片4上的潮气渗透，将IC芯片4隔离于环氧树脂1。从而不会在IC芯片4的界面上出现通过环氧树脂1渗透的潮气的凝结。
当模块被应用于IC卡模块16时，由于内部结构的原因，比之仅仅用环氧树脂1密封IC芯片4的表面的结构，本发明的模块具有能够提供改进的可靠性的更有效的结构，或即使环氧树脂被具有树脂溶解能力的化学物质例如热的浓缩硫酸、发烟硝酸之类拆开，也无法看到IC芯片4上的电路制作面。而且，由于IC芯片4的电路通常被制作在硅衬底上，故用来防止潮气从外界渗透的片2也可望提供改善被减薄了的IC芯片4的抗弯曲强度的加固功能。
图3-5所示的IC卡模块16配备有调谐电容器6。此调谐电容器6与经由天线端子7连接的天线一起构成非接触通信的调谐电路，并当模块被应用于非接触型IC卡时被使用。若模块被专门用于接触型IC卡，则可省略调谐电路。
如上所述，能够完成IC卡模块16，但对于非接触型IC卡或非接触型和接触型的组合型IC卡，必须形成具有连接端子的外部通信天线。
图6是平面图，示出了组合型IC卡模块16的结构，它具有安装在公共树脂密封区内的带外部端子的调谐芯片电容器6。亦即，图6所示的结构包括用来连接到非接触通信的天线和调谐电容器的端子，如图7所示，还具有形成在其底面上的用于接触通信的4组电极14。
详细地说，片2被粘合剂3涂敷在IC芯片4上，而IC芯片4的引线端子13和包括绝缘层8的印刷电路板20的引线端子12被引线5键合。整个结构用环氧树脂1密封，以便覆盖调谐电容器6。而且，发射/接收天线连接端子7被提供在印刷电路板20上。
如下获得本实施方案的成品IC卡模块16的各个部分的厚度。印刷电路板20的绝缘层8的厚度被设定为80μm。由于导体例如铜被预先涂敷在印刷电路板20的绝缘层8的二面上，然后实现通孔9的电镀，以便电连接印刷电路板20的二面，故前一导体和后一导体分别是12μm和10μm。这样，在通孔电镀之后，形成在印刷电路板20的绝缘层8二面上的导体的厚度就总共为(12+10)×2＝44μm。因此，印刷电路板20的厚度为124μm。IC芯片4的厚度为80μm。IC芯片4的粘合剂10的厚度为30μm，而片2的厚度为80μm。于是，各个厚度如下：
包括导体的印刷电路板20的厚度＝124μm
IC芯片4+粘合剂10＝110μm
片2+粘合剂3＝110μm
总厚度＝344μm。
如图3-6所示，对于借助于转移注模用环氧树脂密封上述结构的情况，需要另一个100μm，以便获得树脂改进的流动性，得到的IC模块16的总厚度为344μm+100μm＝444μm。
由于提供了片2来阻挡潮气渗透，故当被暴露于恶劣环境例如高温高湿度存储环境(60℃，相对湿度90％，或85℃，相对湿度85％)、施加偏压的高温高湿度存储环境(二倍于最大额定值的电压被施加，以便在60℃，相对湿度90％，或85℃，相对湿度85％下进行偏压测试)、或增压气相环境(121℃，2个大气压，100％相对湿度)时，这样得到的本发明的IC卡模块16能够避免潮气渗透造成的工作失效。因此，能够减少IC卡模块16上环境测试中的缺陷产生，并改善生产成品率，以及改善使用环境下的可靠性。
不言自明，成品IC卡模块16的IC芯片4的电学特性被测试。
如上所述，根据上述实施方案，用厚度小的粘合剂3涂敷阻挡潮气渗透到IC卡模块16的IC芯片4表面的片2，并用转移注模工艺将环氧树脂注入到装配件中。因此，能够产生牢固的模块结构并提供抗极端环境性能优良的IC卡模块16的结构。由于以上述规定的厚度制造各个组成部分，故能够进一步改善具有这种IC卡模块16的IC卡的轻便性，并能够提供超薄结构。
至于特定的抗环境性能，本发明的IC卡模块能够消除在与抗环境测试可比拟的恶劣环境，例如高温高湿度存储环境(60℃，相对湿度90％，或85℃，相对湿度85％)、施加偏压的高温高湿度存储环境(二倍于最大额定值的电压被施加，以便在60℃，相对湿度90％，或85℃，相对湿度85％下进行偏压测试)、或增压气相环境(121℃，2个大气压，100％相对湿度)时由潮气渗透造成的工作失效。这一高的抗环境性能使得有可能在发货之前减少抗环境测试中的缺陷的出现，因此改善生产成品率以及改善实际使用环境下的可靠性。
而且，由于片2提供了加固功能用来弥补伴随安装在模块上的IC芯片4减薄的抗弯强度下降，例如，即使模块变成薄的结构，此结构也能够明显有效地保持机械强度。
而且，作为IC卡模块16的结构的相应结果，即使密封环氧树脂1被例如热浓缩硫酸、发烟硝酸之类的化学品拆开，片2也不容易被溶解，并能够提供抗化学品的阻挡层的功能。因此，不容易看到模块的IC芯片4上的表面电路结构，致使这种结构可望提供显著的安全性保护。结果，即使本发明的模块被应用于安全性特别重要的IC卡，也可望提供无限的效果。
如上所述，根据本发明，有可能防止出现伴随潮气渗透的缺陷，即使在恶劣的环境下，例如高温高湿度存储环境、施加偏压的高温高湿度环境、增压气相环境等，这些是由IC卡模块的抗环境测试所施加的要求。而且，上述效果的达成使得有可能减少在根据上述条件的实际抗环境测试中缺陷的出现，因而改善生产成品率以及改善实际使用环境下的可靠性。

Claims (14)

1.一种半导体模块，它包含：
由其二面上制作有导体图形的绝缘体制成的印刷电路板；以及
安装在印刷电路板上并用树脂密封的半导体芯片，
其特征在于，金属片或潮气渗透阻挡片被粘合在与面对印刷电路板一侧相反的半导体芯片表面上。
2.根据权利要求1的半导体模块，还包含提供在其上提供半导体芯片的印刷电路板表面上的天线连接端子和/或提供在与其上安装半导体芯片的表面相反的下侧上的电连接电极。
3.根据权利要求1的半导体模块，其中，金属片由不锈钢、42合金、铝或铜形成。
4.根据权利要求1的半导体模块，其中，潮气渗透阻挡片由氧化铝陶瓷形成。
5.根据权利要求1的半导体模块，其中，金属片或潮气渗透阻挡片的厚度为100μm或以下。
6.根据权利要求1的半导体模块，其中，粘合层被提供来键合半导体芯片与金属片或潮气渗透阻挡片，且粘合层的厚度为30μm或以下。
7.根据权利要求1的半导体模块，其中，金属片的非粘合表面被制作成具有凹槽和突出。
8.一种半导体模块生产方法，从而使半导体芯片被安装在由其二面上制作有导体图形的绝缘体制成的印刷电路板上，且其上安装有半导体芯片的印刷电路板被树脂密封，此方法包含下列步骤：
将半导体芯片安装在印刷电路板上；
用引线在其间实现电连接；以及
在印刷电路板的半导体芯片安装侧上用模压树脂进行密封之前，用其间的粘合层将金属片或潮气渗透阻挡片粘合在半导体芯片表面上。
9.一种半导体模块生产方法，从而使半导体芯片被安装在由其二面上制作有导体图形的绝缘体制成的印刷电路板上，且其上安装有半导体芯片的印刷电路板被树脂密封，此方法包含下列步骤：
在印刷电路板的半导体芯片安装侧上用模压树脂进行密封之前，在粘合到半导体芯片表面的金属片或潮气渗透阻挡片的一侧上制作凹槽和突出。
10.根据权利要求8的半导体模块生产方法，其中，借助于正常引线键合，或借助于首先用球键合方法将引线连接到半导体芯片的电极，然后用针脚式键合方法将其连接到印刷电路板上的预定端子，来实现印刷电路板与半导体芯片之间的引线电连接。
11.根据权利要求9的半导体模块生产方法，其中，借助于正常引线键合，或借助于首先用球键合方法将引线连接到半导体芯片的电极，然后用针脚式键合方法将其连接到印刷电路板上的预定端子，来实现印刷电路板与半导体芯片之间的引线电连接。
12.根据权利要求8的半导体模块生产方法，其中，借助于相反的引线键合，或借助于首先用球键合方法将引线连接到印刷电路板上的预定端子，然后用针脚式键合方法将其连接到半导体芯片的电极，来实现印刷电路板与半导体芯片之间的引线电连接。
13.根据权利要求9的半导体模块生产方法，其中，借助于相反的引线键合，或借助于首先用球键合方法将引线连接到印刷电路板上的预定端子，然后用针脚式键合方法将其连接到半导体芯片的电极，来实现印刷电路板与半导体芯片之间的引线电连接。
14.一种用于IC卡等的模块，它包括半导体模块，此半导体模块包含：由其二面上制作有导体图形的绝缘体制成的印刷电路板；以及安装在印刷电路板上并用树脂密封的半导体芯片，其中，金属片或潮气渗透阻挡片被粘合在与面对印刷电路板一面相反的半导体芯片表面上。
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