JPS61159746A - Ｉｃモジユ−ルのワイヤボンデイング方法 - Google Patents

Ｉｃモジユ−ルのワイヤボンデイング方法

Info

Publication number
JPS61159746A
JPS61159746A JP60000365A JP36585A JPS61159746A JP S61159746 A JPS61159746 A JP S61159746A JP 60000365 A JP60000365 A JP 60000365A JP 36585 A JP36585 A JP 36585A JP S61159746 A JPS61159746 A JP S61159746A
Authority
JP
Japan
Prior art keywords
bonding
wire
module
pad
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60000365A
Other languages
English (en)
Inventor
Koichi Ueno
浩一 上野
Masao Muramatsu
村松　正男
Yoshihiko Nakahara
中原　義彦
Toshio Haga
芳賀　敏夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyodo Printing Co Ltd
Original Assignee
Kyodo Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyodo Printing Co Ltd filed Critical Kyodo Printing Co Ltd
Priority to JP60000365A priority Critical patent/JPS61159746A/ja
Publication of JPS61159746A publication Critical patent/JPS61159746A/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48471—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48475—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/85051—Forming additional members, e.g. for "wedge-on-ball", "ball-on-wedge", "ball-on-ball" connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、ＩＣモジュールを組立てる際の、ＩＣチップ
のパッドと基板上のリードとの間のワイヤボンディング
方法に関するものである。
〔従来技術〕
ＩＣチップと基板との間の配線接続で最も偉績性のある
のは、金線によるネールへラドボンディングである。
〔発明が解決しようとする問題点〕
ネールへラドボンディングに当たっては、先端のボール
をつぶしたネックの部分が塑性変形による歪みのために
断線し易いので、ワイヤを横に引っ張る前に先ず垂直に
立ち上げる必要がある０例えば第２図において、基板ｌ
上に装着されたＩＣチップ２のパッド３と、基板１上の
り一ド４とをワイヤ５によりワイヤボンドする場合、先
ずパッド３上にボールを圧着して第１ボンディング６を
行い、高さｈ＋の垂直な立ち上がり部７を形成した後、
ボンディングツールを横にも移動せしめ、次に下降して
リード４の上に第２ボンディング８を行い、その後ワイ
ヤ端を切断して一組の接続を行う。
このとき、立ち上がり部７の高さり、は１８０μｍ−１
０００μｍを要し、ワイヤ５の最高点までの高さｈ８が
大となり、カードの厚さに対する規格値０．７６ｍｍよ
りも全体の高さＨが高くなることがあり、ＩＣモジュー
ルをクレジットカードなどのＩＣカードに組み込むのが
困難な場合がある、という問題点を有するもめであった
。
本発明は、従来のものの上記のＭ８点を解決し、ネール
へラドボンディングを用いたＩＣモジュールのボンディ
ングワイヤを含めた総高さを小となし、携帯カードへの
組み込みを容易となし、信頼性の高いＩＣモジュールを
提供することを目的とするものである。
ｃ問題点を解決するための手段〕 本発明は、問題点を解決するための手段として、ＩＣモ
ジュールの、ＩＣチップ上のパッドと、基板上のリード
との間のネールヘッド式ワイヤボンドを行う方法におい
て、先ず前記リード上に第１ボンディングを行った後、
前記パッド上に第２ボンディングを行ってワイヤ接続を
行うことを特徴とするＩＣモジュールのワイヤボンディ
ング方法を提供せんとするものである。
〔実施例〕
本発明の実施例を第１図により説明する。
基板１、ＩＣチップ２、パッド３、リード４の配置は第
２図のものと同様であるが、ボンディング作業に当たっ
ては、第２図の場合とは逆に先ず、リード４上にボール
を圧着して第１ポンデイング６を行った後、所定の高さ
ｈｌの立ち上がり部７を形成し、その後横の方向にも移
動せしめ、次にパッド３の上に第２ボンディング８を行
う。
ネールへラドボンディングの場合は前述の如（はぼ垂直
な立ち上がり部７を形成する必要があるが、第２ボンデ
ィング８においてはキャピラリの先端によりボンド部分
の横方向の部分がつぶされるので、パッド３の表面のボ
ンディング点にキャピラリ先端を近づけるのに、垂直方
向の立ち下がり部は殆ど必要とせず、斜め方向から近づ
けることができる。
第１ボンディング６を行うリード４例のワイヤ５の立ち
上がり部７の高さｈｌ及びワイヤの最高点までの高さり
、は第２図の如き従来のものと同様であるが、通常リー
ド４の表面は、パッド３の表面よりもほぼＩＣチップ２
の厚さ分（通常３００〜５００μｍ）程度低くなってい
るので高さｈよは同様であっても全体の高さＨは、従来
のものに比べて３００〜５００μｍ程度低くすることが
でき、ＩＣモジュールの総厚への影響を最小限にするこ
とができる。従ってネールへラドボンディングを適用し
、なおかつＩＣカードの薄型化を極めて容易に行うこと
ができる０例えば従来１ｍｍ近くであった厚さを０．６
ｍｍ以下とすゐことが容易となった。
〔発明の効果〕
本発明により、薄さが要求されるＩＣカードのＩＣモジ
ュールのワイヤボンディングに対し、ネールへラドボン
ディングを適用することが可能となり、ＩＣモジュール
のボンディングの信頼性が大であり、かつ厚さが極めて
薄いｒＣカードの実現を可能とするＩＣモジュールのワ
イヤボンディング方法を提供することができ、実用上極
めて大なる効果を奏する。
【図面の簡単な説明】
第１図は本発明の実施例の断面図、第２図は従来例の断
面図である。 １−・一基板、２−Ｉ　Ｃチップ、３−・パッド、４−
リード、５〜・−ワイヤ、６−第１ボンディング、７−
・−立ち上がり部、８−・−第２ボンディング。 特許出願人　　　共同印刷株式会社 代理人弁理士　　高　木　　正　行 間　　　薬師　　稔

Claims (1)

    【特許請求の範囲】
  1. １、ＩＣモジュールの、ＩＣチップ上のパッドと、基板
    上のリードとの間のネールヘッド式ワイヤボンドを行う
    方法において、先ず前記リード上に第１ボンディングを
    行った後、前記パッド上に第２ボンディングを行ってワ
    イヤ接続を行うことを特徴とするＩＣモジュールのワイ
    ヤボンディング方法。
JP60000365A 1985-01-08 1985-01-08 Ｉｃモジユ−ルのワイヤボンデイング方法 Pending JPS61159746A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60000365A JPS61159746A (ja) 1985-01-08 1985-01-08 Ｉｃモジユ−ルのワイヤボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60000365A JPS61159746A (ja) 1985-01-08 1985-01-08 Ｉｃモジユ−ルのワイヤボンデイング方法

Publications (1)

Publication Number Publication Date
JPS61159746A true JPS61159746A (ja) 1986-07-19

Family

ID=11471764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60000365A Pending JPS61159746A (ja) 1985-01-08 1985-01-08 Ｉｃモジユ−ルのワイヤボンデイング方法

Country Status (1)

Country Link
JP (1) JPS61159746A (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63219131A (ja) * 1987-03-06 1988-09-12 Nec Yamagata Ltd 半導体装置の製造方法
JPS63197362U (ja) * 1987-06-08 1988-12-19
JPS6430834U (ja) * 1987-08-19 1989-02-27
JPH0462024U (ja) * 1990-10-02 1992-05-27
WO2004105133A1 (en) * 2003-05-26 2004-12-02 Axalto Sa Wire bonding on in-line connection pads
EP1321979A3 (en) * 2001-12-03 2005-10-12 Sharp Kabushiki Kaisha Semiconductor module with increased reliability against heavy environment conditions and production method therefor

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63219131A (ja) * 1987-03-06 1988-09-12 Nec Yamagata Ltd 半導体装置の製造方法
JPS63197362U (ja) * 1987-06-08 1988-12-19
JPH0651001Y2 (ja) * 1987-06-08 1994-12-21 日本電気株式会社 光結合素子
JPS6430834U (ja) * 1987-08-19 1989-02-27
JPH0462024U (ja) * 1990-10-02 1992-05-27
EP1321979A3 (en) * 2001-12-03 2005-10-12 Sharp Kabushiki Kaisha Semiconductor module with increased reliability against heavy environment conditions and production method therefor
WO2004105133A1 (en) * 2003-05-26 2004-12-02 Axalto Sa Wire bonding on in-line connection pads

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