CN1412831A - 板状物支撑部件及其使用方法 - Google Patents
板状物支撑部件及其使用方法 Download PDFInfo
- Publication number
- CN1412831A CN1412831A CN02129869A CN02129869A CN1412831A CN 1412831 A CN1412831 A CN 1412831A CN 02129869 A CN02129869 A CN 02129869A CN 02129869 A CN02129869 A CN 02129869A CN 1412831 A CN1412831 A CN 1412831A
- Authority
- CN
- China
- Prior art keywords
- supporting parts
- board supporting
- frame
- plate object
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 12
- 239000004065 semiconductor Substances 0.000 claims abstract description 112
- 238000000227 grinding Methods 0.000 claims abstract description 62
- 230000001681 protective effect Effects 0.000 claims description 67
- 230000007246 mechanism Effects 0.000 claims description 45
- 239000000463 material Substances 0.000 claims description 23
- 239000012528 membrane Substances 0.000 claims description 22
- 239000003292 glue Substances 0.000 claims description 18
- 238000010438 heat treatment Methods 0.000 claims description 14
- 238000005520 cutting process Methods 0.000 claims description 13
- 239000002390 adhesive tape Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 7
- 238000009826 distribution Methods 0.000 claims description 6
- 238000012423 maintenance Methods 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 230000004087 circulation Effects 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 93
- 230000015572 biosynthetic process Effects 0.000 description 10
- 239000000919 ceramic Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- SZVJSHCCFOBDDC-UHFFFAOYSA-N iron(II,III) oxide Inorganic materials O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
Abstract
Description
Claims (18)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001320575 | 2001-10-18 | ||
JP320575/2001 | 2001-10-18 | ||
JP2001366853A JP2003197581A (ja) | 2001-10-18 | 2001-11-30 | 板状物支持部材及びその使用方法 |
JP366853/2001 | 2001-11-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1412831A true CN1412831A (zh) | 2003-04-23 |
CN1284219C CN1284219C (zh) | 2006-11-08 |
Family
ID=26623966
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB021298696A Expired - Fee Related CN1284219C (zh) | 2001-10-18 | 2002-08-20 | 板状物支撑部件及其使用方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US6837776B2 (zh) |
JP (1) | JP2003197581A (zh) |
KR (1) | KR100882557B1 (zh) |
CN (1) | CN1284219C (zh) |
TW (1) | TW554464B (zh) |
Cited By (10)
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CN100385630C (zh) * | 2003-11-17 | 2008-04-30 | 株式会社迪思科 | 半导体晶片的制造方法 |
CN100536080C (zh) * | 2004-04-01 | 2009-09-02 | 株式会社迪思科 | 晶片的加工方法 |
CN101859722A (zh) * | 2009-04-10 | 2010-10-13 | 株式会社迪思科 | 加工装置 |
CN101890668A (zh) * | 2009-05-20 | 2010-11-24 | 株式会社迪思科 | 磨削装置 |
CN101911280B (zh) * | 2008-10-16 | 2012-07-04 | 日东电工株式会社 | 保护带粘贴方法和保护带粘贴装置 |
CN102528643A (zh) * | 2010-12-30 | 2012-07-04 | 中芯国际集成电路制造(上海)有限公司 | 化学机械研磨设备及其研磨单元 |
CN102934217A (zh) * | 2009-12-23 | 2013-02-13 | 休斯微技术光刻有限公司 | 自动热滑动剥离机 |
CN104576486A (zh) * | 2013-10-16 | 2015-04-29 | 株式会社迪思科 | 框架夹紧装置 |
CN112108665A (zh) * | 2019-06-20 | 2020-12-22 | 株式会社迪思科 | 加工装置 |
CN114434242A (zh) * | 2022-02-21 | 2022-05-06 | 无锡芯坤电子科技有限公司 | 一种晶圆打磨设备及其使用方法 |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004363165A (ja) * | 2003-06-02 | 2004-12-24 | Tokyo Seimitsu Co Ltd | ウェーハ処理装置およびウェーハ処理方法 |
JP2005158770A (ja) * | 2003-11-20 | 2005-06-16 | Matsushita Electric Ind Co Ltd | 積層基板とその製造方法及び前記積層基板を用いたモジュールの製造方法とその製造装置 |
JP4817805B2 (ja) * | 2004-11-25 | 2011-11-16 | 株式会社東京精密 | フィルム剥離方法およびフィルム剥離装置 |
JP4705450B2 (ja) * | 2005-03-11 | 2011-06-22 | 株式会社ディスコ | ウェーハの保持機構 |
JP4589201B2 (ja) * | 2005-08-23 | 2010-12-01 | 株式会社ディスコ | 基板の切削装置 |
KR100670762B1 (ko) * | 2005-10-27 | 2007-01-17 | 삼성전자주식회사 | 웨이퍼 후면 연마 및 테이프 부착 장치 및 방법 |
JP4767122B2 (ja) * | 2005-11-24 | 2011-09-07 | 株式会社東京精密 | テープの貼り替え方法及び該テープの貼り替え方法を使用した基板の分割方法 |
US20090053983A1 (en) * | 2006-01-25 | 2009-02-26 | Jsr Corporation | Chemical mechanical polishing pad and method for manufacturing same |
JP2007214502A (ja) * | 2006-02-13 | 2007-08-23 | Oki Electric Ind Co Ltd | 半導体装置およびその製造方法 |
JP2007243112A (ja) * | 2006-03-13 | 2007-09-20 | Disco Abrasive Syst Ltd | ウェーハの凹状加工方法及び凹凸吸収パッド |
JP4798441B2 (ja) * | 2006-07-03 | 2011-10-19 | 株式会社東京精密 | ウェーハ搬送方法及びウェーハ搬送ユニット |
US20080051017A1 (en) * | 2006-08-22 | 2008-02-28 | Essilor International (Compagnie Generale D'optique) | Process for holding an optical lens on a holder of a lens machining equipment |
JP2008053432A (ja) * | 2006-08-24 | 2008-03-06 | Disco Abrasive Syst Ltd | ウエーハ加工装置 |
US7517767B2 (en) * | 2006-11-14 | 2009-04-14 | International Business Machines Corporation | Forming conductive stud for semiconductive devices |
SG148884A1 (en) * | 2007-06-15 | 2009-01-29 | Micron Technology Inc | Method and system for removing tape from substrates |
JP5138325B2 (ja) * | 2007-09-27 | 2013-02-06 | 株式会社ディスコ | ウェーハの加工方法 |
JP5131762B2 (ja) * | 2008-05-09 | 2013-01-30 | サムコ株式会社 | プラズマ処理方法及びプラズマ処理装置並びにプラズマ処理用トレイ |
JP5888051B2 (ja) * | 2012-03-27 | 2016-03-16 | 三菱電機株式会社 | ウエハ吸着方法、ウエハ吸着ステージ、ウエハ吸着システム |
JP5943742B2 (ja) | 2012-07-04 | 2016-07-05 | 三菱電機株式会社 | 半導体試験治具およびそれを用いた半導体試験方法 |
USD732094S1 (en) * | 2012-07-20 | 2015-06-16 | Ivoclar Vivadent Ag | Firing plate for a dental furnace |
JP5955410B2 (ja) * | 2012-12-04 | 2016-07-20 | ミライアル株式会社 | ウェーハハンドリングトレイ |
JP6138503B2 (ja) * | 2013-02-04 | 2017-05-31 | 株式会社ディスコ | チャックテーブル |
JP2014200888A (ja) * | 2013-04-05 | 2014-10-27 | ローム株式会社 | 吸引保持装置およびウエハ研磨装置 |
CN104626039A (zh) * | 2013-11-13 | 2015-05-20 | 旺宏电子股份有限公司 | 装卸治具 |
JP6239364B2 (ja) * | 2013-12-10 | 2017-11-29 | 東芝機械株式会社 | 真空チャック装置および同真空チャック装置を備えた立形精密加工機並びにダイシング装置 |
KR101530269B1 (ko) * | 2014-01-15 | 2015-06-23 | 주식회사 엘지실트론 | 웨이퍼 그라인딩 장치 |
WO2015195764A1 (en) * | 2014-06-19 | 2015-12-23 | E.Pak International, Inc. | Tensioning insert useful with wafer supports |
JP2016040810A (ja) * | 2014-08-13 | 2016-03-24 | 株式会社ディスコ | ブレーキング装置 |
JP2016111121A (ja) * | 2014-12-04 | 2016-06-20 | 株式会社ディスコ | ウェーハの加工方法 |
USD821658S1 (en) * | 2015-07-31 | 2018-06-26 | Purina Animal Nutrition Llc | Animal feed tub cover |
US10029836B2 (en) | 2015-07-31 | 2018-07-24 | Purina Animal Nutrition Llc | Animal feed covers and systems and methods for their production and use |
USD824602S1 (en) * | 2015-07-31 | 2018-07-31 | Purina Animal Nutrition Llc | Animal feed tub and cover |
US20180040513A1 (en) * | 2016-08-05 | 2018-02-08 | Disco Corporation | Processing method for wafer |
JP6710138B2 (ja) * | 2016-10-07 | 2020-06-17 | 株式会社ディスコ | フレーム固定治具 |
KR102143180B1 (ko) * | 2019-05-21 | 2020-08-12 | 주식회사 빅스턴 | 척 테이블 및 그 제조 방법 |
JP7250637B2 (ja) * | 2019-07-01 | 2023-04-03 | 株式会社ディスコ | 加工装置及びチャックテーブル |
JP2022135442A (ja) * | 2021-03-05 | 2022-09-15 | 株式会社ディスコ | 研削装置 |
CN115172229B (zh) * | 2022-09-07 | 2022-11-18 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | 一种从激光改质后的晶体上剥离晶片的全自动装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0878508A (ja) * | 1994-09-02 | 1996-03-22 | Fujitsu Ltd | ウェーハ保持プレート |
JPH08222530A (ja) * | 1995-02-09 | 1996-08-30 | Disco Abrasive Syst Ltd | 冷凍チャックテーブル |
JP3592018B2 (ja) * | 1996-01-22 | 2004-11-24 | 日本テキサス・インスツルメンツ株式会社 | ポリイミド接着シートおよびポリイミド用工程フィルム |
US5656552A (en) * | 1996-06-24 | 1997-08-12 | Hudak; John James | Method of making a thin conformal high-yielding multi-chip module |
JP2832184B2 (ja) * | 1996-08-08 | 1998-12-02 | 直江津電子工業株式会社 | シリコン半導体デスクリート用ウエハの製造方法 |
JPH1140520A (ja) * | 1997-07-23 | 1999-02-12 | Toshiba Corp | ウェーハの分割方法及び半導体装置の製造方法 |
US6257966B1 (en) * | 1998-04-27 | 2001-07-10 | Tokyo Seimitsu Co., Ltd. | Wafer surface machining apparatus |
JP2000195828A (ja) * | 1998-12-25 | 2000-07-14 | Denso Corp | ウエハの切断分離方法およびウエハの切断分離装置 |
JP3816253B2 (ja) * | 1999-01-19 | 2006-08-30 | 富士通株式会社 | 半導体装置の製造方法 |
US6153536A (en) * | 1999-03-04 | 2000-11-28 | International Business Machines Corporation | Method for mounting wafer frame at back side grinding (BSG) tool |
JP2000260738A (ja) * | 1999-03-10 | 2000-09-22 | Hitachi Ltd | 半導体基板の研削加工方法ならびに半導体装置および半導体装置の製造方法 |
KR100486333B1 (ko) * | 2000-07-21 | 2005-04-29 | 가부시끼가이샤 한도따이 프로세스 켄큐쇼 | 반도체 장치 및 그 제조 방법 |
-
2001
- 2001-11-30 JP JP2001366853A patent/JP2003197581A/ja active Pending
-
2002
- 2002-07-31 TW TW091117193A patent/TW554464B/zh not_active IP Right Cessation
- 2002-07-31 US US10/208,104 patent/US6837776B2/en not_active Expired - Lifetime
- 2002-08-02 KR KR1020020045859A patent/KR100882557B1/ko not_active IP Right Cessation
- 2002-08-20 CN CNB021298696A patent/CN1284219C/zh not_active Expired - Fee Related
-
2004
- 2004-11-12 US US10/985,949 patent/US20050085171A1/en not_active Abandoned
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100385630C (zh) * | 2003-11-17 | 2008-04-30 | 株式会社迪思科 | 半导体晶片的制造方法 |
CN100536080C (zh) * | 2004-04-01 | 2009-09-02 | 株式会社迪思科 | 晶片的加工方法 |
CN101911280B (zh) * | 2008-10-16 | 2012-07-04 | 日东电工株式会社 | 保护带粘贴方法和保护带粘贴装置 |
CN101859722A (zh) * | 2009-04-10 | 2010-10-13 | 株式会社迪思科 | 加工装置 |
CN101859722B (zh) * | 2009-04-10 | 2014-06-04 | 株式会社迪思科 | 加工装置 |
CN101890668A (zh) * | 2009-05-20 | 2010-11-24 | 株式会社迪思科 | 磨削装置 |
CN102934217A (zh) * | 2009-12-23 | 2013-02-13 | 休斯微技术光刻有限公司 | 自动热滑动剥离机 |
CN102528643A (zh) * | 2010-12-30 | 2012-07-04 | 中芯国际集成电路制造(上海)有限公司 | 化学机械研磨设备及其研磨单元 |
US8851959B2 (en) | 2010-12-30 | 2014-10-07 | Semiconductor Manufacturing International (Shanghai) Corporation | Chemical mechanical polishing device and polishing element |
CN104576486A (zh) * | 2013-10-16 | 2015-04-29 | 株式会社迪思科 | 框架夹紧装置 |
CN112108665A (zh) * | 2019-06-20 | 2020-12-22 | 株式会社迪思科 | 加工装置 |
CN112108665B (zh) * | 2019-06-20 | 2024-03-29 | 株式会社迪思科 | 加工装置 |
CN114434242A (zh) * | 2022-02-21 | 2022-05-06 | 无锡芯坤电子科技有限公司 | 一种晶圆打磨设备及其使用方法 |
CN114434242B (zh) * | 2022-02-21 | 2023-02-17 | 无锡芯坤电子科技有限公司 | 一种晶圆打磨设备及其使用方法 |
Also Published As
Publication number | Publication date |
---|---|
TW554464B (en) | 2003-09-21 |
KR100882557B1 (ko) | 2009-02-12 |
KR20030032829A (ko) | 2003-04-26 |
US6837776B2 (en) | 2005-01-04 |
CN1284219C (zh) | 2006-11-08 |
US20050085171A1 (en) | 2005-04-21 |
JP2003197581A (ja) | 2003-07-11 |
US20030077993A1 (en) | 2003-04-24 |
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Effective date of registration: 20090313 Address after: Tokyo Co-patentee after: DISCO Corp. Patentee after: FUJITSU MICROELECTRONICS Ltd. Address before: Kanagawa, Japan Co-patentee before: Disco Corp. Patentee before: FUJITSU Ltd. |
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Address after: Kanagawa Co-patentee after: DISCO Corp. Patentee after: FUJITSU MICROELECTRONICS Ltd. Address before: Kanagawa Co-patentee before: Disco Corp. Patentee before: Fujitsu Microelectronics Ltd. |
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CP02 | Change in the address of a patent holder |
Address after: Kanagawa Co-patentee after: Disco Corp. Patentee after: Fujitsu Microelectronics Ltd. Address before: Tokyo, Japan Co-patentee before: Disco Corp. Patentee before: Fujitsu Microelectronics Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20061108 Termination date: 20190820 |