CN1323505A - 一种具有嵌入电子装置的物件及其制作方法 - Google Patents

一种具有嵌入电子装置的物件及其制作方法 Download PDF

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Publication number
CN1323505A
CN1323505A CN99812227A CN99812227A CN1323505A CN 1323505 A CN1323505 A CN 1323505A CN 99812227 A CN99812227 A CN 99812227A CN 99812227 A CN99812227 A CN 99812227A CN 1323505 A CN1323505 A CN 1323505A
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China
Prior art keywords
electronic installation
substrate
binding agent
fusion
card
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CN99812227A
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English (en)
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凯文·K·T·钟
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Amerasia International Technology Inc
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Amerasia International Technology Inc
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Publication of CN1323505A publication Critical patent/CN1323505A/zh
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    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
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    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/20—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of continuous webs only
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    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
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    • H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
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Abstract

一种具有诸如集成电路或导电网络等电子装置的卡。这种有时称之为“智能卡”的卡通常通过由焊料、导电粘结剂或柔性导电粘结剂(206)形成的诸电连接点将该电子装置(212)安装在它的表面上。该卡基片用其厚度足以覆盖安装在其上的该电子装置(212)的一层熔融－流动粘结剂覆盖。该卡基片与一空白卡(202)连接,它是通过使该熔融－流动粘结剂熔融流动而与该空白卡(202)粘结的。在一个实施例中,该空白卡具有一空腔(204),该电子装置(212)和卡基片(224)置于该空腔中。在另一个实施例中,卡基片(402)的尺寸和形状与空白卡(420)相同,它们两者之间的空间填满熔融可流动粘结剂(424),以将它们粘结在一起,并在它们两者之间嵌入该电子装置(410)。此外,该卡基片具有沉积在其上的导电粘结剂图案,例如形成一环形天线(404),它也用来形成与该电子装置连接的诸电连接点。

Description

一种具有嵌入电子装置的 物件及其制作方法
本发明涉及一种物件，特别是一具有一嵌入电子装置的物件及一制作该物件的方法。
塑料“信用卡”现在似乎无处不在。该塑料卡不仅在世界范围使用来购买物品和服务，不管是通过信用卡，或是通过借方帐户，而且它们急速地进入很多其它使用领域，诸如会员卡、借书卡、身份卡、入场卡、驾驶执照、以及类似的卡。随着塑料卡越来越多的使用，它的滥用和错误也与日俱增，不管是由于盗窃或是企图不经授权而访问的个人，或者是由于假冒识别而产生的。
为使这些无处不在的塑料卡易于使用、防止滥用而更安全的第一发明是附加一磁性材料条，其内可编码信息，以便利于诸卡的使用，诸如帐号、期满日以及诸如个人识别信息和PIN号等安全信息。该磁性条具有易于生产和编码且成本低。通过使这些卡的尺寸和磁条特性符合ISO标准，辅助这些卡的推广。随之而来的是附加表面凸起的“全息光”或衍射光栅，当从不同的角度看诸卡时，可改变颜色和设计。这些光学装置具有优点，它们以相当低的成本制造，但这样做，需要复杂和昂贵的机器制造。
还有，由于伪造者的刁钻，使得他们也能复制磁性条塑料卡，甚至是表面浮雕的光路安全特性。为了获得更大的安全性，需要一种更复杂的信息储存装置，它也更难伪造，或者说，至少是一种更昂贵的卡，需要复杂的制造机器。嵌入的电子装置，特别是半导体芯片，到目前为止，提供了一种最好的解决方案。这种电子装置可包括存储器装置、微处理器、或者是它们的组合，并按常规嵌入一形成在空白塑料卡内的空腔中。诸电子信息耦合输入这种嵌入的电子装置中和从该电子装置输出，它们在“直接接触型”卡或标签的情况下，通过与该塑料卡的诸接触垫直接电接触来实现；或者在“无接触型”智能卡或标签的情况下，通过在一卡阅读器与一嵌入该卡中的接收/传输天线之间的射频(rf)信号传输来实现。包括一个或多个嵌入电子装置的塑料卡通常称之为“智能卡”。
按传统，诸智能卡通常用硬聚氯乙烯(PVC)制造，然而，PVC逐渐被聚脂热塑(PET)树脂所代替。这些热塑树脂的性能，特别是熔融温度，可获得的制造工艺技术的大部分过程具有合适的温度和时间暴露，所以可被采用。取决于用于PVC卡基片处理过程中的增塑剂量，PVC树脂通常在60°～80℃温度下软化而变形。通常，该电子装置通常通过用精细的金或铝线的诸线粘结连接点，安装到印制导线的小电子基片的一侧并与之电气连接。这种小基片是需要的，因为金线的粘结必须在大于热塑卡基片能够承受的温度即150°～250℃下进行。在用金钱或铝线将该电子装置的诸输入/输出连接点与该电子基片线粘结以后，用一滴树脂将该电子装置密封到该电子基片中，以实现机械和环境防护。这种具有与之线粘结电子装置的中间电子基片形成一模块，它随后粘结到该卡基片中机加工或其他方法成形的一空腔中，这种粘结在大约60℃的温度下完成。
图1为这种型式现有技术智能卡100的横截面侧视图。塑料空白卡(cardblank)或基片102具有形成在其内的一空腔104。一电子模块110包括一与一电子基片114一侧连接的电子装置112，它例如可以是FR4型印刷电路板材料。传统的导电环氧树脂，它在大约150℃的温度下固化，将电子装置模片112与基片114连接。电子装置112的诸输入/输出连接点通过诸粘结线116连接，以接触电子基片114上的诸垫片，该基片与其另一侧的诸外部触点118连接。电子装置112用密封剂118密封到电子基片114，该密封剂118通常在大约150℃的温度下在其上扩散或是模压。一定量的粘结剂扩散到卡基片102的空腔104中，模块110然后插入其内，成为成品智能卡100。与这一组装方法相关联的一个问题是需要对密封剂120和粘结剂的扩散进行精确的控制，以便当完全插入空腔104时，基片114的外表面大体上与卡基片102的一表面处于同一平面。在实践中，运是很难达到的。实际上，固化了的密封剂120的顶端通常是磨光，以获得可控厚度和平行面，以便合适地组装进卡中。另一个缺点是由各电子装置所要求的单个的处理和多重线粘结，以及由分开的单个滴状密封处理而产生的。所有这些操作增加了传统智能卡100的成本，单卡的成本用户购买时的成本高达每卡0.50～1.00美元。除了通过采用快速粘结和固化的粘结剂，减少模块110与卡基片102连接所需要的处理时间这种可能性以外，对传统的方法进行改进几乎没有可能。目前生产的粘结剂通常在相对较低例如小于60℃的温度下，经合理的时间例如30分钟或更长才能固化。
相类似的电子装置与智能卡的线粘结和组装可用于由PET树脂形成的卡基片中。PET树脂的特性不同于PVC的特性，主要在于较高的软化和变形的温度，大约110°～130℃。对于PET树脂卡的基片，电子装置模块的连接可在稍高的温度，例如大约120℃下进行，而不会引起主要的问题。如果可以获得具有合适性能的智能卡，这便打开了在较高的温度环境下使用智能卡的附加可能性的大门。但同样的问题和缺点如以上所述的PVC卡。
直接接触型智能卡也受智能卡与卡阅读器之间存在的触点数量的限制以及电子-机械触点寿命和可靠性的限制。一种避免智能卡这些限制的长期解决方案是采用无线通讯的方法，以与一无接触的智能卡通讯。因为这种卡不需要与卡阅读器进行物理上的接触，而只需“接近”阅读器，一种无接触的智能卡对于收费和通行、访问控制、按时出席、以及其它传统智能卡的应用特别合适。在智能卡与卡阅读器之间特殊的RF无线通讯链接的诸特性在特定应用场合确定了什么为“接近”，而不限于多少英寸，多少英尺或多少码，或更长的距离。
一种现有技术典型的无接触智能卡1，例如美国专利US5,880,934“具有分开提供的集成电路与感应线圈的数据载体”，其平面图和横截面侧视图表示在图2A和图2B中。现有技术无接触的卡1具有两个外基片10，在一个基片上沉积一具有线圈引线8的感应线圈7，它通过传统的丝网印制一导电粘结剂；或通过热压而施加一导电层，冲中出一金属箔或是具有导电涂层的塑料膜而形成。通过将一集成电路4与一模块6的一基片的诸接触元件5连接，然后通过用一滴密封材料粘结并覆盖集成电路4而制成一模块6，尽管集成电路4也可按传统的方式通过用导电粘结剂将诸接触垫与诸接触元件5粘结而与模块6的基片连接。模块6然后通过用导电粘结剂将模块6的诸接触元件5与感应线圈7的引线8连接而连接到顶层10。一其内具有一阶梯空腔3以容纳集成电路模块6的传统型空白卡通过两个叠加的内层，每一内层有从其穿过的不同尺寸的开口3一起形成一阶梯型开口3而制备。作为替换方案，可采用一其内具有阶梯开口3的内层11，它例如通过模压、机加工或经热成形而成形，或者两内层11可在模块6插入开口3以前，叠层到底部外层10上。最后，顶盖10和制备好的空白卡层11定位，从而模块6延伸进阶梯开口3中，以及盖10和内层11例如在两平板之间在某一温度下经历合适的时间而一起叠层，以形成永久粘和完成无接触成品卡1。
由于现有技术智能卡是分很多步骤制成的，所以，目前，用这些传统的方法制作的无接触的智能卡，其成本数倍于直接接触型智能卡，因而影响了广泛使用智能卡技术。而电子装置的成本由于需要发射和接收电路而稍有增加，该成本被包装和组装无接触卡的成本所遮盖。包装成本大于接触型卡的成本的原因主要是由于需要嵌入的天线以及需要对包括电子装置的模块，分开包装和试验。特别是，RF环形天线必须通过将环形导线或其它导体与基片连接，或者如上所述通过将传统的厚膜导电墨水环沉积在基片上而形成在基片上。通过传统的粘结剂扩散，固化和粘结剂叠层将基片叠层到卡的基片上而使沉积和连接到基片上的电子装置固化，所有这些增加了生产步骤、时间和成本。所有这些与现有技术直接接触型智能卡传统组装工艺过程相关的诸问题相类似。
因此，需要一种较简单、制作成本较低的卡，以及制作这些卡的方法，它避免单个处理、导线粘结和密封诸电子装置的要求。也希望它本身给出这样一种方法，可能适用于以高于以上所述的传统方法的速度和生产量进行自动加工处理。
为了这个目的，本发明的物件包括一具有相对的第一和第二表面的基片，一安装在该基片第一表面的电子装置，以及一层在所述基片的第一表面上覆盖所述电子装置的熔融-流动粘结剂，其中所述的电子装置用该层熔融-流动粘结剂密封。
根据本发明又一方面的内容，一种制作其内嵌有一电子装置的一物件的方法包括：
提供一具有相对的第一和第二表面的基片；
将一电子装置与该基片的第一表面连接；
提供一层邻接该基片第一表面的熔融-流动粘结剂，其厚度足以覆盖该电子装置；以及
使该熔融-流动粘结剂熔融流动，以将该电子装置密封到该基片。
当结合诸附图阅读时，本发明诸实施例的详细说明将更好地易于理解，其中：
图1为现有技术直接接触型智能卡的横截面侧视图；
图2A和图2B分别为现有技术无接触型智能卡的平面图和横截面侧视图；
图3为本发明具有诸电子基片和诸电子装置的一板的横截面侧视图；
图4为在图3的诸电子基片和诸电子装置的板上具有一粘结剂层的横截面侧视图；
图5为包括图4中一电子基片和电子装置的接触型智能卡实施例的横截面侧视图；
图6和图7分别为用于本发明某些材料的强度对暴露于潮湿环境中的温度范围和时间的特性曲线；
图8为图5中包括一替换的电子基片和电子装置的智能卡实施例的横截面侧视图；
图9和图10为包括一替换基片的接触型智能卡另二个替换实施例的横截面侧视图；
图11和图12分别为本发明作为实例的无接触型卡的基片平面图和侧视图；
图13和图14为本发明无接触型卡二个替换实施例的横截面侧视图；
图15和图16为本发明无接触型卡的基片替换实施例的平面图；
图17为用于制造前述诸电子基片和诸卡的布置图。
图3为用于本发明制作智能卡或其它物件方法中的电子基片板220的横截面视图。该板220意欲按切割虚线222切割分开或单体化，以产生多个单一的电子基片224。板220通常用传统的印刷电路板材料例如FR4制成，也可用其它合适的诸如聚酰亚胺柔性电路或其它塑料或铝、陶瓷，及类似的材料制成。板220具有在它的板的两面形成的接触垫图案。在基片板220一面的接触垫226图案包括一组接触垫226，各接触垫226与各个基片224相连接，并且，为了产生直接接触，它们相对于智能卡的卡阅读器而排列，该智能卡符合应用的标准，例如ISO标准。接触型卡的ISO标准尺寸为大约85.725mm×53.975mm×0.787mm[大约3.375英寸×2.125英尺×31密耳(1密耳=0.001英寸)]。在基片板220反面的接触垫228的对应图案包括一组接触垫228，每一个接触垫与各个基片224相连接，并用各自的导电通道227穿过基片板220，与相对应的接触垫226电气连接。电子装置212在各自的基片224上与一组接触垫228的各相应的接触垫连接。
此后，通过传统的拾取和就位设备或其它合适的放置机构将众多的电子装置212与基片板220连接，并通过用诸导电材料零件或即凸起形成的诸导电内连结点218与其结合，在结合以前，这些内连结点分别沉积在基片板220的诸接触垫228上，或分别沉积在电子装置212的诸接触垫214上。最佳地，这些导电凸起218分别沉积在已经形成在基片板220上的大量单个的基片224的接触垫228上。基片板220然后分隔成诸单个电路基片224。
作为替换方案，诸导电凸起218分别沉积在电子装置212的诸接触垫214上，而不是沉积在基片板220的接触垫228上。在这种布置中，最佳地，在这些电子装置212分隔成单个装置以前，也即，在这些电子装置212形成在半导体晶片上以后，但在该半导体晶片切割成各个半导体模片以前-半导体模片各含一个电子装置212-诸导电凸起218分别沉积在诸电子装置212的接触垫214上。
诸导电凸起218通过丝网印制法、模板印刷法、掩膜印制法、喷墨印制法或其它合适的方法沉积在诸基片板220上或沉积在诸电子装置212上，并允许干燥或经B-阶段处理。上述方法的优点在于，诸导电凸起可用单一操作而沉积在大量基片或电子装置上，借此，可节省粘结剂扩散以形成诸单个凸起或多组凸起的时间和费用。
诸电子装置212然后按以下步骤与基片板224连接：
在诸导电凸起218为焊料凸起的条件下，例如可以用传统的“C4”焊料凸起和连接工艺，基片板220加热到低于焊料回流温度的温度，也即低于大约220℃(对于锡-铅共晶焊料)，而诸电子装置212加热到高于焊料熔融温度的温度，并置于基片板220的适当位置中。由于接触，诸焊料凸起218熔融，然后固化，在诸电子装置212的诸接触垫214与基片板220的诸相应的接触垫228之间形成诸焊料内连结点218。类似的连接工艺可用于下述情况：诸导电凸起218由热塑导电粘结剂凸起218或快速固化的B-阶段处理，热固化导电粘结剂组成，基片板220加热到低于该导电粘结剂熔融流动温度的温度，而电子装置212加热到高于该导电粘结剂熔融流动温度的温度。诸如焊料的高温材料或高熔融温度粘结剂可用于这种生产阶段中，因为诸电子装置212和基片板220，通常为FR4或其它传统的印刷电路板材料或其它合适的电子介电基片，可以承受这种温度。
在图4中，具有与其连接的诸电子装置212的诸电子基片224的基片板220用密封诸电子装置212的均匀厚度粘结剂层206涂覆，该粘结剂层也用作诸基片224分别与诸智能卡组装的粘结剂。该粘结剂层206由绝缘热固粘结剂或热塑粘结剂形成，该粘结剂用滚动涂覆、丝网印制、模板印刷或者其它以液体或糊状的形式精细施加粘结剂的方法而施加到基片板220的表面，诸电子装置212连接到该基片板上，然后干燥(或即B-阶段处理)该粘结剂。该粘结剂层206也可用分层干燥或经B-阶段处理的绝缘热固化或热塑粘结剂形成在基片板220的表面，诸电子装置212在以附着粘结剂材料而不固化的合适的温度和压力下连接在基片板上。其结果是形成具有连接在一起的众多电子模块210的板，每一个电子模块210包括与电子基片224连接的并用大体上厚度均匀的绝缘粘结剂层206密封的一电子装置212。这种方法的优点包括，所有电子模块210在单一操作中被密封，这单一操作产生平行于电路基片的平面粘结剂表面，以及，所用的材料206用作电子装置212的密封剂和随后组装的粘结剂。基片板220然后切割或单体化成待组装进一智能卡中的诸多单个电子模块210。应该指出，不仅是粘结剂层206的厚度均匀，而且是可控、恒定地可重复，从而不会因为基片224突出或凹进在智能卡空白表面的情况下而被拒绝，这是在传统组装的方法下会经常发生的事情。此外，因为粘结剂层206与它所包围的电子装置212相适应，所以不需要补填满绝缘粘结剂，借此，避免了额外的处理。
图5为完成的直接接触智能卡200或类似物件的实施例横截面侧视图，该智能卡包括一具有图4所示基片224和电子装置212的电子模块210。空白卡202，其可以是PVC、PET、丙烯腈-丁二烯-苯乙烯(ABS)、高冲击聚苯乙烯(HIPS)、丁二烯、聚脂、或其它塑料、或其它合适材料。其内具有空腔或空穴204，它的尺寸适合于容纳电子模块210，并根据可应用的ISO或其它标准置于空白卡202上。电子模块210例如用自动化拾取和放置设备或其它合适的放置装置置于空腔204内，并用它的粘结剂206粘结就位。
当用具有变形温度大约为60°～80℃的硬PVC空白卡202时，最好用低于大约80℃的温度下粘结的粘结剂。一种合适的热塑粘结剂在对PVC以大约5psi(大约0.35kg/mm2)的压力、70℃的温度加压时熔融和粘结，它为MB7060型粘结剂，其由位于Princeton,New Jersey的AI技术公司生产，为片状，可从商店买到。当用具有变形温度大约120℃的PET空白卡202时，最好用低于120℃的温度下粘结的粘结剂。合适的热塑粘结剂在对PET以大约psi(大约0.35kg/mm2)的压力加压时即时熔融和粘结，它包括在大约65°～75℃的温度下粘结的MB7060型粘结剂、在大约70°～90℃的温度下粘结的MB7070型粘结剂、以及在大约110℃的温度下粘结的MB7100粘结剂。所有这些粘结剂由AI技术公司生产，为片状，可从商店买到。MB7060型粘结剂，如果采用较高压力，可在较低的温度下例如60℃粘结。对于MB7070型和MB7100型也然。此外，在要求高温高强度粘结的地方，可使用诸如ESP7450-SC型的热固化环氧树脂粘结剂的环氧树脂粘结剂，它可从AI技术公司获得。ESP7450-SC型粘结剂具有最高至大约125°～150℃的温度下的高粘结强度，并可在大约5psi(大约0.35kg/cm2)的压力下流动，以及在大约80℃的温度下，30分钟以内固化。这些粘结剂都具有在低于大约45℃的温度下大于500～1000psi(35～70kg/cm2)的模片剪切(die shear)强度，如图6模片剪切强度特性所示，而对于很多智能卡应用场合，在温度低于大约45℃的情况下，大约200psi(大约14kg/cm2)的粘结强度就足够了。此外，这些粘结剂对暴露在潮湿环境不敏感，这对于使用于热带气候的智能卡是需要的，或者对于洗衣行业或者其它处理情况也是需要的，如图7模片剪切强度-潮湿暴露特性所示。
在用导电粘结剂沉积的诸凸起218将诸电子装置212与基片板220连接或即粘结的地方，优选的粘结剂为热塑和热固化粘结剂，它们在固化时是“柔性的”，也即是这些粘结剂，在已粘结的电子装置工作所规定的大部分温度范围内，它们具有低于大约500,000～1,000,000psi(大约35,000～70,000kg/cm2)的弹性模量。合适的导电粘结剂包括PSS8090型和PSS8150热固化糊状粘结剂，它们分别在大约120℃和200℃的温度下，可进行熔融-流动粘结，可从AI技术公司获得。如果采用较高压力，PSS8090型可在例如100℃的较低温度下进行熔融-流动粘结结。对于PSS8150型也然。如果要求在电子装置212与基片224之间采用补填满粘结剂，应采用绝缘粘结剂，它扩散时流入电子装置212下，具有不大于用于导电连接点218的导电粘结剂弹性模量的弹性模量。例如可从AI技术公司获得的MEE-7650型柔性绝缘热固化环氧树脂粘结剂，它具有大约10,000psi(大约700kg/cm2)的弹性模量，适合用于PSS8090和PSS8150型导电粘结剂。而MEE7650-5型更具柔性。
图8为智能卡200′的替换实施例横截面侧视图，该卡200′包括一电子模块210′，在该电子模块中，电子装置212用导线与基片224粘结。电子装置212不是用离开基片224一侧的接触垫214安装到基片224上，而是用诸连接导线219使电子装置212的诸接触垫214分别与基片224的诸接触垫228电气连接。卡200′与上述卡200相类似，并用相同的方式生产。具体地讲，诸电子装置212用标准的导电环氧树脂连接安装到诸基片224的板220上，通常在150℃下固化，并用诸连接导线219分别与它的诸接触垫连接，例如用诸金线在150°～200℃的温度下连接。然后，施加粘结层206，以密封电子装置212，并按上述方式将用来粘结诸电子模块210′的厚度均匀的粘结剂提供到诸空白卡202中各个空腔204内，此后，基片板220单体化(即切割)成各单个的电子模块210′。粘结剂层206可按液体或糊状通过丝网印制、模板印刷、掩膜印制、喷墨印刷或其它合适的方法，或者用粘结剂片分层施加到基片板220上。
优选的是，可消除首先用一滴粘结剂密封诸电子装置，然后使粘结剂扩散以将它们粘结到空白卡这种分开操作的缺点。然而，即便诸电子装置212用一滴粘结剂密封，并在通常150℃的温度下固化，仍可采用根据本发明的方法以在其上面形成厚度均匀的粘结剂层206，在合适低温下粘结到空白卡202的空腔204内。
图9为包括一作为替换方案的分层基片301的接触型智能卡300实施例的横截面侧视图。它不如上述图5、图8有关卡200和200′所述的具有给定深度的空腔204的基片202，一电子模块210置于空腔204内，而卡300具有一基片302，该基片302具有预切割的通孔腔304进行，以容纳电子模块210。一用例如PVC、PET、聚酰亚胺或其它塑料等合适的卡材料制成的薄的基础基片308用相容的熔融可流动粘结剂306薄层涂覆，叠层到类似基片材料的基片302上。粘结剂层306与卡300的总厚度例如0.78mm(大约31密耳)相比，可以是较薄的例如大约50μm(大约2密耳)，或者可以是较厚的例如大约500μm(大约20密耳)。如果该电子模块210相对较薄，并具有平行的前面和背面，有如磨光的滴状顶部(ground glob-top)模块，则用相对较薄的粘结剂层306就足够了。如果该模块的电子装置较厚，大体上从被其连接的单个基片延伸，则需要较厚的粘结剂层306。基片302的厚度可稍大于模块210的电子装置212的厚度，特别是在电子装置212相对较薄的情况下，以及基础基片308和粘结层306的厚度可加以选择，以使卡300的总厚度与可应用卡的标准相容。电子模块210与上述有关图3～图5所述的电子模块相同。
如图9局部放大的所示，取决于形成卡300的卡基片302粘结层306和基片308的叠层，该模块210的电子装置212延伸到粘结剂层306的粘结剂中，使粘结剂流进卡基片302的空腔304中，借此，将电子模块210嵌入粘结剂层306中，使模块210相对于卡基片302和卡300在适当位置紧固。优选地，空腔304以大约75％的比例从粘结剂层306填充粘结剂。尽管可使用较厚或较薄的粘结剂层306以增加和减少空腔304的填充，然而不希望当模块210插入其内时，使粘结剂溢出空腔304，也不希望模块210不充分地嵌入粘结剂层306，以及应该控制粘结剂层306的厚度以避免这些情况的发生。
应该指出，可用于本发明卡中的粘结剂层306的实质性厚度减少了卡基片302的厚度，它用作卡和粘结剂结构的一部分，并简化了卡300的结构，具有较少，例如只有两个基片层302、308的基片层。这是与传统的卡相比较的实质性优点，传统卡要求至少三或四层，包括两层要求用来形成阶梯空腔或孔，传统的电子模块插入其内，以及该空腔为此必须作适当的定位。此外，在本发明中，不必使用规定的粘结剂，该粘结剂必须精细地扩散到现有技术所述空腔的凸肩上，以粘结与其接触的接触模块诸边缘。此外，本发明较低的叠层温度避免加热PVC基片至接近于它们的熔融流动温度的要求，在该温度下，很难维持它们成品表面的可印制质量。
卡300按如下步骤进行制作，一2～5密耳(0.05mm～0.13mm)厚可从AI技术公司获得的MB7060型粘结剂层通过这种粘结剂片的叠层，或通过滚动涂覆、丝网印制、模板印制或其它在其上沉积粘结剂的合适方法施加到2～10密耳(0.05mm～0.25mm)厚片PVC基础基片308材料上。具有从其通过的模片切割通孔腔304的12～18密耳(0.3～0.45mm)厚的PVC基片302材料片用基础基片308材料和粘结剂层306进行叠层，以形成具有例如符合可应用的ISO标准的一致厚度，也即大约0.78mm(大约31密耳)的分层基片301。基片302的厚度应符合于电子装置或模块的厚度而进行选择，电子装置或模块待置于通过基片的空腔304中。对于退火的PVC基片材料，叠层在大约65°～75℃的温度下进行。诸空腔304相互相对就位，从而，当诸叠层基片301切割成诸单个的卡基片时，诸空腔304将处于应用卡标准所规定的位置中。较为有利是，在诸叠层的基片301中按已知预定的对于诸空腔304的位置关系，采用诸导向孔或其它引导标记，以便利于诸电子模块210放进诸空腔304中，以及或者便利于诸叠层基片301单体化成诸单独的基片301或诸卡300。诸电子模块210例如借助于标准的拾取和放置设备而就位并粘结到各自的空腔304中，它们各自的诸接触垫226暴露在外。优选地，叠层的基片301加热到大约65°～75℃的温度，以及电子模块210用大约3～10psi(大约0.2～0.7kg/cm2)的压力压入空腔304中，以便使MB7060型的粘结剂流动。完成的诸卡片然后印制合适的用户信息，并切割或单体化成诸单个的卡300。作为替换方案，盖或诸外层可按带卷或板的形式预先印制，具有合适的为适当定位和对准的诸导向孔。
图10为又一个替换实施例接触型智能卡300′的横截面侧视图，除了如以上有关图8所述的一滴粘结剂密封、导线连结的模块210′粘结进卡基片302的空腔304中以外，其它均与卡300相同。卡300′用与上述卡300相同的工艺制作，并可用相同的材料和粘结剂。用与卡300相类似的方式，取决于形成卡300′的叠层，从粘结剂层306出来的粘结剂流进其内嵌入电子模块的卡基片302的空腔304中，以便将模块210′相对于卡基片302和卡300′紧固在合适的位置中。
作为替换方案，包括诸叠层基片301的片在电子模块210、210′于上述温度和压力下置于空腔304并粘结以前，单体化成为诸单个的叠层基片301。此外，基片302、粘结层306和基础基片308的厚度可以改变，以获得卡300、300′不同的厚度。然而，粘结剂层306的厚度应进行选择，以使当叠层基片301至要求的厚度时粘结剂有合适的流动。上述有关卡200、200′的材料，例如PET型和MB7100粘结剂也可以用来制作卡300、300′。
应该指出，其它诸接触模块可以用在这里所述的诸件和诸方法中。例如可以采用由Kevin K-T Chung在同一日期申请的题为“作为智能卡的接触模块及其制作方法”的申请序列号为09/ ___的美国专利所述的接触模块，该申请在此整体引入作为参考文献。
另一方面，采用无接触的卡是较为有利的，因为它们不需要与卡阅读器进行电子-机械接触，所以，它们不仅避免了由于污染、氧化和腐蚀引起的潜在的不良接触问题，而且，它们也可以与覆盖一定距离的RF链接的卡阅读器一起工作。图11和图12分别为其内嵌入一电子装置的无接触卡400的基片402的平面图和侧视图。基片402由诸如PVC、PET、ABC或HIPS、聚酰亚胺、聚合物膜或其它塑料或纸膜、或其它合适的材料的基片材料薄片制成。其上沉积长形导电体404，它用作RF环路天线404。天线404由热塑或热固化聚合物粘结剂制成，它通过其内掺杂诸导电微粒而使其导电。电子装置410通过诸电连接点406以倒装的方式而连接到基片402上，诸电连接点406将它的诸接触垫与用作RF环路天线404的导电粘合剂的长型导电图案404的诸端头粘结。当它的导电粘合剂处于湿态时，通过其上放置电子装置410来制作导电图案404的诸端头上的电子装置410的诸连接点406，或者，在电子装置410就位以通过导电粘合剂的熔融或固化而接触它的诸端头之前，使导电粘合剂图案404干燥或经B-阶段处理。其结果是有益的，基片以单一沉积的方式而制作，不需要按传统的方式形成天线的沉积厚膜，以及不需要为在天线与电子装置之间形成诸内连接点的诸导电凸起。
采用界定天线404图案的模板、丝网或掩膜将导电粘结剂按天线404的图案沉积在基片402上。基片402的厚度通常在大约0.25mm与1mm(大约10～40密耳)之间，以及形成天线404的导体大约250μm(大约10密耳)宽、大约25μm～125μm(大约0.5～5密耳)厚。在大多数情况，天线404的导体湿态时大约50～100μm(大约2～4密耳)厚，干燥或即经B-阶段处理后，大约25～75μm(大约1～3密耳)厚。合适的导电粘结剂包括例如可从位于Princeton,New Jersey的AI技术公司获得的填充诸银微粒的PSS8150型热固化导电粘结剂。沉积的导电粘结剂在炉内加热进行干燥或经B-阶段处理。诸电子装置410当粘结剂正处于被沉积的湿态或在干燥或经B-阶段处理后定位到基片402。
在天线402具有数圈以及电子装置410桥接一圈或多圈天线404或者由导电粘结剂形成的其它导体的地方，以及特别是这些导体的宽度或即间隔较小例如小于大约0.25～0.5mm(大约10～20密耳)的地方，在连接电子装置410以前，沉积的导电粘结剂最好干燥或即经B-阶段处理。相同导电粘结剂第二次沉积在诸凸起406上，以沉积第二层粘结剂，在第二层粘结剂处于湿态或在干燥或经B-阶段处理以后，电子装置410与诸凸起406连接。然而，在导体的宽度或即间隔较小的地方，最好使导电粘结剂在诸凸起406上第二次沉积干燥或经B-阶段处理以后，再连接电子装置410。
作为一种选择，在很多应用场合，液态补填满绝缘粘结剂最好沿着电子装置410的诸边缘而施加，通过毛细作用，它从那里流动，大体上填满电子装置410与基片402之间尚未用导电粘结剂填满的剩余容积。这种补填满的粘结剂对于电子装置410与基片402的连接提供了附加的机械强度和抗湿性以及其它潜在的抗污染性。在导电粘结剂为例如PSS8150型的柔性粘结剂的地方，这是粘结剂402具有某些柔性的地方所要求的，最好采用诸如MEE7650型或MEE7650-5型热塑环氧树脂粘结剂(也可从AI技术公司获得)的补填满柔性粘结剂。
图13为上述包括基片402的作为实例的卡400的横截面侧视图。制备对应于基片402材料的PVC或PET材料的空白卡420，其内具有容纳电子装置410的空腔422，通过对熔融可流动粘结剂片或层424的叠层，组装成一成品卡(而作为某些情况下的替换方案和优选方案，粘结剂片424可叠层到基片402上)。基片402和制备好的空白卡420对正，从而使电子装置410定位，以进入空白卡420的空腔422中。基片402和空白卡420一起叠层，例如，在两加热的平板之间，或者在诸加热的滚子之间，在一温度下经历合适的时间，为使粘结剂层424熔融流动并形成基片402与空白卡420的永久性粘结，形成无接触的成品卡400，电子装置410定位在空腔422中，并用熔融可流动的粘结剂424在基片402与空白卡420之间进行密封。
图14为本发明另一个替换实施例无接触的卡400′的横截面侧视图。卡400′与上述卡400相类似，包括一具有环形天线404、制备好的基片402和如有关图11和图12所述，安装在基片内的电子装置410。对应于基片402材料的PVC或PET材料空白卡420′，不具有容纳电子装置410的空腔，借此，较为有利地简化了卡400′的制作和简化了处理步骤的叠层。通过滚动涂覆一层424或粘结一片可熔融流动424的叠层，或者，作为替换，通过粘结剂片424对空白卡420′的叠层，制备基片402，以组装成一成品卡。粘结剂层424的厚度大于基片402上方电子装置410的高度(厚度)，从而，可充分覆盖和密封电子装置410。应该指出，形成层424的粘结剂最好选择为不同于环形天线402和诸触点406导电粘结剂类型的粘结剂，从而避免它的混杂污染。例如基于不同于它的分子化学和物理结构，例如一种可以是热固化粘结剂，另一种是热塑粘结剂，或两种粘接剂采用不同的溶剂，从而，一种粘结剂的溶剂不与另一种粘结剂作用或溶解。如果，层424是通过叠层已干燥或经B-阶段处理的，即无溶剂的粘结剂片到基片402而形成的，也可以避免混杂污染。基片402和空白卡420′在加热的平板之间，或在加热的滚子之间一起叠层，在一温度下，经历合适的时间，以使粘结剂层424熔融流动并在基片402和空白卡420′之间形成永久性粘结，借此，形成无接触的成品卡400′，通过熔融可流动粘结剂424使电子装置410定位，并在基片402与空白卡420之间进行密封。
图15为用于上述卡400、400′，而采用将一电子装置410′安装到基片402的一种替换排列的基片402平面图。电子装置410′例如一半导体模片，在图中它与基片402是分开的，具有两个接触垫412′，这两个接触垫412′例如沿着电子装置的两相对边缘隔开而定位。通过丝网印制、模板印刷或其它合适的沉积导电粘结剂的方法，将合适宽度和导电性的RF环路天线404′沉积到基片402上，并且，该RF环路天线404′在它的两个端部具有两个分开的触点406′，分开的距离等于电子装置410′为制作它的电连接的两接触垫412′的距离。此外，一支承408沉积到基片402上，用来支承电子装置410′中与两接触垫412′分开的部位。如果待与电子装置410′连接的电子装置410′表面被钝化过或涂覆过，以使电子装置410′的功能不至被与之连接的导电粘结剂有所减弱，支承可用与天线相同的材料同时沉积，或者，支承408也可用不同材料例如绝缘粘结剂分开沉积。作为替换方案，导电粘结剂可第二次沉积在两触点406′上，以增加它的高度，也可第二次沉积在支承408′上，以相类似地增它的高度。
电子装置410′翻转并安装到基片402上，如图16所示，两接触垫412′与天线的两触点406′相连接，以及，电子装置410′也由支承408支承。电子装置410′可在粘结剂沉积以形成两触点406′及支承408尚处于湿态的同时与基片402连接；或者在电子装置410′与基片402连接以前，形成两触点406′和支承的粘结剂进行干燥或即经B-阶段处理。在两触点406′和支承408采用热塑粘结剂的地方，通过将基片402和(或)电子装置410′加热到足以使热塑粘结剂熔融流动的升高的温度，当基片402和装置410′一起被加压时，(也即，在粘结和固化时使它处于湿态)，而使电子装置410′与基片402连接。在两触点406′和支承408采用热固化粘结剂的地方，通过将装置410′压进湿态的热固化粘结剂中，或者通过将基片402和(或)电子装置410′加热到足以使处于B-阶段的热固化粘结剂熔融流动的升高的温度，(也即，在粘结和固化时使它处于湿态)，并把基片402和装置410′压到一起而使电子装置410′与基片402连接。该热固化粘结剂然后可在合适的升高温度下加热足够的时间而固化。
卡400、400′的粘结剂优选为也可从AI技术公司获得的PSS8150型导电、柔性热固化粘结剂，它可按合适的宽度和厚度，例如大约1mm宽、0.1mm厚进行印制，以提供合适导电性和品质因数Q的天线404′。在电子装置410′通过两触点406′和支承408′与基片402连接以后，采用补填满粘结剂使两者更好地紧固。在电子装置410′尺寸较小，例如沿着它的边缘小于大约5mm的情况下，可采用补填满刚性材料或柔性材料，基片402为柔性的地方采用柔性补填满材料。如果电子装置410′尺寸较大，则采用沿着任何边缘大约5mm和诸如FR4基片的刚性基片，或者，如果基片402是柔性的，或者，如果两触点406′和(或)支承408采用的粘结剂是柔性粘结剂，则最好采用柔性的补填满粘结剂。该补填满粘结剂对于在装置410′与基片402之间的粘结提供了附加的强度，也提供了附加的绝缘和防污染物的侵入，包括防止银从诸导电微粒的迁移，导电微粒是用来使导电粘结剂产生导电性的。柔性补填满粘结剂最好为也可从AI技术公司获得的MEE 7650-5型电绝缘、柔性、热固化粘结剂，它可沿着电子装置410′的诸边缘，通过毛细作用在装置410′与基片402之间抽入而施加。此外，可采用相同的柔性绝缘粘结剂材料，作为基片402和卡400、400′的防护涂覆，以对抗RF环形天线404′的擦伤以及对抗各种污染物和其它环境与之接触。因为通常使用在这种类型卡中的电子装置的尺寸，如果要求附加的机械防护，可采用刚性补填满粘结剂。
制作这种作为实例卡400′的方法如下。获得一密耳(0.178mm)厚退火的高可印制性能的PVC片。该片最好有足够的尺寸，以便同时制作诸多基片402。例如：11英寸×11英寸(大约280mm×280mm)的PVC片便于制作一含有3×4阵列12个基片的板，或者11英寸×18英寸(大约280mm×460mm)的PVC片便于制作一含有3×8阵列24基片的板，每一个留有足够未使用的外缘区，用来设置诸导向孔或其它引导和对正的标记，它们便利于该PVC片例如相对于丝网、模板、拾取和放置设备、叠层设备、模片切割设备及类似物和设备的安置和对正。一种可从AI技术公司获得的诸如PSS 8090型热塑高导电(如：＜0.001欧姆-厘米的导电系数)的粘结剂以大约2密耳(大约0.05mm)的厚度丝网印制到PVC片上，以形成该导电环形天线404和诸触点406，诸电子装置410以单一步骤与触点连接，也可采用模板印制法、掩膜印制法、喷墨印制法或其它合适的沉积法。在导电粘结剂尚处于湿态期间，加热诸电子装置410至足以使该导电粘结剂熔融-流动的温度，并将它们置于PVC片基片上的合适位置上，以使其上的诸触点制成电接触，并借助拾取和放置设备使诸电子装置410在24个长形导电粘结剂环形天线的诸端头与该导电粘结剂粘结。其上具有诸电子装置410的诸基片402然后在大约60℃的炉内干燥或即经B-阶段处理，如果需要，可进行检查和进行电测试。10密耳厚(0.25mm)干燥型MB 7060-W熔融-流动的白色粘结剂片424在大约75℃温度下叠层到另一片7密耳厚(0.178mm)退火的高度可印制的PVC片上。该PVC片的尺寸最好与制作诸基片402的尺寸相同，也即11英寸×18英寸(大约280mm×460mm)，以制成3×8阵列的24个空白卡420′，留有足够的未用外缘区，以设置诸导向孔或对应于诸基片402的其它引导和对正标记，它们便利于这两片的设置和对正。依靠合适的引导标记和足够精确的尺寸，各单个基片板叠层，以易于随后的模切割和进一步处理。诸基片402的片和诸空白卡420′的片在所选择的温度和速度下一起叠层，以升高粘结剂424的温度至大约65°～75℃，它通过预热这两片至大约50°～60°，并采用分隔距离等于成品卡400′厚度的两加热夹持滚子来促成。这两个夹持滚子也趋于消除对基片、空白卡与粘结剂之间诸空穴中捕获的空气，这些空穴中的空气会减弱卡的强度。诸分层卡400′的集成片然后通过合适的旋转模切割器切割为各单个的卡，例如24张卡，每一张卡具有嵌入其内的一电子装置410。
以相类似的方式，可用前述方法制作PET和其它材料的卡400、卡400′，其中，采用PET片和诸如可从AI技术公司获得的MB 7100型合适的熔融-流动、的粘结剂，和均匀一致温度。例如，因为，随着PET加热至大约120℃，以及电子装置加热至大约200℃。粘结剂将熔融流动并即时粘结而不须将PET加热至120℃以上，所以，对于PET基片材料，诸电子装置410可分别在120℃或200℃的熔融-流动温度下以诸如PSS8090和PSS8150型粘结剂的导电粘结剂与之连接，均是适用的。此后，卡的叠层要求大约60°～120℃的温度范围，优选是80℃，这取决于所采用的特定熔融-流动粘结剂的类型，它不会干扰与嵌入其内的电子装置的连接。如果，要求在电子装置410与基片402之间进行粘结剂的补填满，则诸如可从AI技术公司获得的MEE7650型、MEE7650-5型以及MEE 7850型热固化环氧树脂粘结剂那些柔性粘结剂是合用的，其在小于80℃的温度下固化。在电子装置的尺寸较小的地方，可采用常规的刚性粘结剂进行补填满。
应该指出，采用图14的布置特别有利，因为不需要加工，或用其他方法在空白卡中形成空腔以在其内容纳电子装置。这不仅节约时间，降低成本，而且简化了处理，此外，允许采用薄的基片402和空白卡420′材料，例如大约各为5密耳(大约0.127mm)厚，而用相对较厚的粘结剂层424，例如大约10～15密耳(大约0.25mm～0.38mm)厚，以易于容纳标准厚度的诸电子装置。于是，诸如MB7070型热塑粘结剂的熔融可流动层，它在大约70°～90℃的低温下流动，用作卡400′的核心并围绕电子装置410流动，以精确的尺寸和位置“就地形成”它的空腔。其结果，无须在电子装置410下补填满绝缘粘结剂，借此避免了附加的处理。
实际上，上述方法优选地使其用于连续的处理中，以生产大量具有嵌入其内电子装置的卡。如图17所示，代替按片状的形式提供，制作基片402和空白卡420和420′的材料以长形卷带的形式提供，也即分别卷绕在滚子510和530上，而待与之叠层的熔融可流动粘结剂卷绕在滚子520上。诸导电环形404和触点406在印制站512滚动印制到移动着的带402上，当基片带404移动通过拾取-放置设备站515时，诸电子装置410置于其上，以及当移动着的带通过一干燥炉站518时被干燥。然后，制备好的基片带402、熔融-流动粘结剂带424以及空白卡带420被带到一起(最好在预热以后)并在一套夹持滚子535中滚动叠层在一起，该套夹持滚子535被加热到一合适的升高温度，并分开一固定的距离，该距离为最终成品卡的厚度，以形成一成品卡带。作为替换方案，具有诸合适链轮孔的诸板可末端对末端地邻接在一起，并通过链轮驱动而传动，以便与粘结剂带一起传动。最后，通过合适的旋转模切割器或其它切割器540将该带切割成各单个的卡400。
此外，图17的布置可与一提供诸电子基片224的带220的滚子510一起使用，诸电子装置212在站515连接到诸基片224上，以及诸基片224通过加热的夹持滚子225与一粘结剂带206一起叠层，以形成如图5所示的那种诸单个电子模块210。
通过比较的方法，来说明本发明诸卡的一个优点，常规PVC智能卡的材料和总装的成本，排除电子装置的成本，对于接触型智能卡估计在大约0.25～0.50美元范围内，而常规无接触型智能卡，由于附加线-环形天线，成本更高。另一方面，对于具有嵌入电子装置、利用较高温度、较高成本的PET材料，如以上有关图11、图12和图14所示的材料和总装成本，排除电子装置，当制成40张卡的板(例如大约500mm×500mm的板)，估计每张卡大约为0.15～0.25美元，于是，并没有从与连续型加工相联系的低成本中获益。
应该指出，其它物件也可用这里所述的方法制造。例如在题为“包括多圈天线的无线物件”、序列号为09/___的美国专利申请所述的无线物件就是这样制作的，该专利由Kevin K-T Chung在同一日中请，该申请的全部在此引入作为参考文献。
在所述方法中采用的合适的拾取和放置设备以及常规的表面安装技术是可广泛获得的，通常，具有定位不精确度为0.12mm或更低。合适的拾取和放置设备商业上可从位于Peabody,Massachusetts的Mydata自动化定位公司中买到，或者从位于Binghamton,New York的通用仪器公司中买到，或者从位于Morrisville,North Carolina的Zevatech公司以及Mann公司中买到，以及物件放置在基片上的定位不精确度为千分之一英寸或更低，速度大于每秒一个物件。
如人们已知的，在诸基片上诸接触垫和在诸电子装置上的诸接触垫最好用抗氧化导电材料进行钝化，以进一步降低电阻并使诸电连接点更可靠。例如，诸铜触点可用焊锡镀锡或电镀，对铝和其它半导体触点也然，或用镍、金、镍-金、钯、镍-钯、铂或其它贵金属、及其组合和含金镀覆。
尽管本发明已按以上作为实例的多项实施例的形式作了描述，在本发明的范围和精神内，如以下诸权利要求所界定的各种变形方案对于本领域的技术人员来说是显见的。例如，尽管在描述中诸电子装置单独用焊锡或粘结剂内连接点，可采用合适的粘结剂补填满材料填满电子装置与基片之间的薄隙。在用柔性导电粘结剂形成诸内连接点的地方，合适的补填满材料是其弹性模量不大于柔性导电粘结剂弹性模量的柔性绝缘粘结剂。可按预成形的形式或通过丝网印制、模板印制、掩膜覆盖、喷墨印制、或其它合适的方法施加补填满粘结；剂。在电子装置的尺寸沿着任何边缘小于大约5mm的地方，可采用常规的刚性补填满粘结剂。
此外，尽管，这里的诸电子装置描述为诸半导体装置，它们大多采用半导体集成电路、存储器、微处理器及类似的器件，但诸电子装置也可包括为在诸特殊触点之间连接和断开的诸导电体和(或)二极管的网络、诸电阻和(或)诸电容和(或)诸电感器的网络，这在本发明任何特殊应用的卡中是必要的或便利的。
此外，这里描述的无接触的卡在卡的基片上可采用蚀刻金属或导线环，以用作它的RF天线。尽管对于这里描述的某些实施例并不是有利的，诸导线环可便利于形成较高增益的多圈天线。然而，应该指出，具有较少圈数的环形天线可用于本发明的卡中，其中，电子装置具有分别与多圈环形天线两端头连接的分开的两触点，安装电子装置，以桥接或即跨接该天线的诸中间圈。
在任何情况下，所采用的诸电子装置与之电连接的诸天线触点，可沉积到基片上，以与其上的环形天线接触，或在单个半导体芯片水平面或在半导体晶片水平面沉积到诸电子装置上，以便当电子装置与基片连接时，与环形天线接触。
除了智能卡型的信用卡应用以外，根据本发明具有嵌入其内的电子装置的诸卡和其它物件使用于其它应用场合以及用于特别环境中，诸如远距标识装置用来对人员、动物、工具、设备、洗衣物和其它项目的跟踪，确认，识别和(或)帐户。在某些应用场合，诸卡及其内的诸电子装置可暴露到完全不同的环境，它要求材料不同于上述有关典型信用卡应用场合的基片。例如，在洗衣店用标签的场合，卡和嵌入的电子装置随着衣服或它携带的其它物品被清洗和清洁，而暴露至各种化学溶剂、肥皂、去污剂和水中以及高达大约250℃的温度。在这种场合中，基片和空白卡必须能承受较高温度和化学环境，所以要用诸如Kapton膜的聚酰亚胺膜，或者其它高温热塑和热固化材料。此外，为了保护电子装置，所连接的半导体模片用诸如MEE7650型树脂密封，该树脂对卡将暴露于预期的化学品和溶剂呈现满意的耐受性。诸粘结剂可采用不同的层面和厚度。例如，ESP7450-SC或TP7205-E型压敏粘结剂可预先施加，作为物件的外层，随后被用来将物件粘结到物件将识别的对象上。上述诸粘结剂也由AI技术公司生产，商店里可买到。

Claims (45)

1．一种其内嵌入一电子装置的物件包括：
一具有相对的第一和第二表面的基片；
一安装在所述基片第一表面的电子装置；以及
一层在所述基片的第一表面上覆盖所述电子装置的熔融-流动粘结剂，其中，所述的电子装置用所述的熔融-流动粘结剂层密封。
2．根据权利要求1所述的物件，其中，所述的基片包括在它的第二表面上至少两个电触点，以及其中所述的两个电触点与所述的电子装置电气连接。
3．根据权利要求2所述的物件，其中所述的基片包括在它的第一表面上至少两个电触点，所述电子装置的触点分别与第一表面上的触点电气连接，以及其中所述基片第一表面上的两电触点分别与它的第二表面的两电触点电气连接。
4．根据权利要求3所述的物件，其中所述基片第二表面上的两电触点通过从由焊料连接点、导电粘结剂连接点以及柔性导电粘结剂连接点组成的一组中选择出来的一内连接点与所述电子装置上对应的触点电气连接。
5．根据权利要求1所述的物件，其中所述的基片包括在它第一表面上具有与所述电子装置电气连接的第一和第二端子的长形导电体。
6．根据权利要求5所述的物件，其中所述的长形导电体通过在所述基片的第一表面上沉积导电粘结剂的图案而形成。
7．根据权利要求6所述的物件，其中所述沉积的图案包括至少一个提供与所述电子装置一导电粘结剂连接的触点。
8．根据权利要求6所述的物件，其中所述的沉积图案包括一环形天线。
9．根据权利要求1所述的物件，还包括一通过所述熔融-流动粘结剂层与所述基片粘结的空白卡，其中所述的电子装置设置在所述基片与所述空白卡之间，以及所述的电子装置通过所述的熔融-流动粘结剂密封。
10．根据权利要求9所述的物件，其中所述的空白卡其内具有一空腔，用来容纳所述的电子装置，以及至少一部分覆盖所述电子装置的所述熔融-流动粘结剂层。
11．根据权利要求9所述的物件还包括第二基片，其中将所述的熔融-流动粘结剂层施加到所述的第二基片上，其中所述的空白卡其内具有一容纳所述电子装置的空腔，以及其中所述的电子装置插入所述空白卡的所述空腔中，以及插入到所述第二基片上所述熔融-流动粘结剂中从而被覆盖。
12．根据权利要求9所述的物件，其中所述的基片和所述的空白卡具有大体上相同的尺寸和形状，以及，其中所述的熔融-流动粘结剂层大体上填满由基片和空白卡的尺寸和形状界定的所述基片与所述空白卡之间的容积。
13．根据权利要求9所述的物件，其中所述的空白卡通过用所述熔融-流动粘结剂使所述的电子装置与所述的基片粘结，以及使所述的电子装置与所述的空白卡粘结而与所述的基片粘结。
14．根据权利要求1所述的物件，其中所述的熔融-流动粘结剂层为一叠层片和一沉积层两者之一，其中所述沉积层通过滚动涂盖、丝网印制、模板印制、掩膜印制以及喷墨印制之一进行沉积。
15．根据权利要求1所述的物件，其中所述的熔融-流动粘结剂的粘结强度在小于大约45℃的温度下大于大约200psi(14kg/cm2)。
16．根据权利要求9所述的物件，其中所述的基片和空白卡至少其中之一为从一组由聚氯乙烯、丙烯腈-丁二烯-苯乙烯聚合物、高冲击聚苯乙烯、聚脂以及聚酰亚胺组成的材料中选择出来的材料。
17．根据权利要求1所述的物件，其中熔融-流动粘结剂层的粘结剂用来使所述的物件与使用对象连接。
18．根据权利要求1所述的物件还包括在所述基片的第二表面上的一层粘结剂，适用来将所述的物件与一使用对象连接。
19．一种物件包括：
一塑料空白卡；
一与所述塑料空白卡相对的基片；
一在所述的基片与所述的塑料空白卡之间与所述基片连接的电子装置；
一层连接所述塑料空白卡和所述基片的熔融-流动粘结剂，并大体上填满它们之间的空间，以大体上密封所述的电子装置。
20．根据权利要求19所述的物件，其中所述的塑料空白卡具有一空腔，所述的电子装置定位于所述空腔中，以接触所述的熔融-流动粘结剂。
21．根据权利要求20所述的物件，其中所述的熔融-流动粘结剂层的厚度足以覆盖所述的电子装置。
22．根据权利要求19所述的物件，其中所述的熔融-流动粘结剂的厚度足以覆盖所述的电子装置，而所述的塑料空白卡无须具备容纳所述电子装置的空腔。
23．根据权利要求19所述的物件，包括在所述基片一暴露表面上的多个电触点，其中所述的多个电触点与所述的电子装置电气连接。
24．根据权利要求19所述的物件包括在所述基片上一导电图案，具有与所述电子装置的至少一个的连接。
25．根据权利要求24所述的物件，其中所述包括所述至少一个连接的导电图案由沉积在所述基片上的一导电粘结剂形成。
26．一种制作其内嵌入有一电子装置的物件的方法包括：
提供一具有相对的第一和第二表面的基片；
将一电子装置与所述基片的第一表面连接；
提供一层邻接所述基片第一表面的熔融-流动粘结剂，其厚度足以覆盖所述电子装置；以及
使所述熔融-流动粘结剂熔融流动，以将所述电子装置密封到所述基片。
27．根据权利要求26所述的方法，其中，所述的连接一电子装置包括在所述基片上的诸接触垫与在所述电子装置上对应的诸接触垫之间形成诸电气连接。
28．根据权利要求27所述的方法，其中所述的形成诸电气连接包括形成一焊料连接、形成一导电粘结剂连接以及形成一柔性导电粘结剂连接诸连接中至少一种连接。
29．根据权利要求27所述的方法，其中所述形成诸电气连接包括沉积一种导电粘结剂接触特性点的图案，它对应于在所述基片第一表面上所述电子装置的诸接触垫的图案。
30．根据权利要求29所述的方法，其中所述的连接一电子装置包括将所述电子装置的诸接触垫在它的导电粘结剂处于湿态时置于对应的诸接触特性点上。
31．根据权利要求29所述的方法，其中所述的连接一电子装置包括将所述电子装置的诸接触垫在它的导电粘结剂干燥或经B-阶段处理以后置于对应的诸接触特性点上。
32．根据权利要求26所述的方法，还包括在所述基片的第一表面上形成一长形导电体。
33．根据权利要求32所述的方法，其中所述的形成一长形导电体包括在所述基片的第一表面上沉积一导电粘结剂图案。
34．根据权利要求33所述的方法，其中所述的连接一电子装置包括将所述电子装置上的至少一个触点连接到导电粘结剂图案上某一位置。
35．根据权利要求32所述的方法，其中所述的形成一长形导电体包括将一导电粘结剂的一环形天线图案沉积在所述基片的第一表面上，以及其中所述的连接一电子装置包括将所述电子装置上至少一个触点连接到导电粘结剂的所述环形天线图案的一端子。
36．根据权利要求26所述的方法，其中所述的提供一层熔融-流动粘结剂包括在所述电子装置与第一表面连接以后，在所述基片的第一表面上形成一层熔融-流动粘结剂。
37．根据权利要求36所述的方法，其中所述形成一层熔融-流动粘结剂包括片叠层，滚动涂覆、丝网印制、模板印制、掩膜印制、以及喷墨印制所述熔融-流动粘结剂等方法的一种。
38．根据权利要求26所述的方法，其中所述的使所述熔融-流动粘结剂熔融流动包括：
将一空白卡定位于一层熔融-流动粘结剂上；以及
使所述熔融-流动粘结剂熔融流动，以使所述空白卡与所述基片连接，而所述电子装置在它们之间。
39．根据权利要求38所述的方法，其中所述的将一空白卡定位包括将一具有适用来其内容纳一电子装置的一空腔的空白卡定位在一位置中，所述空腔与所述电子装置相对。
40．根据权利要求39所述的方法，其中所述的熔融流动包括一起压紧所述基片和所述空白卡，以便将所述电子装置定位进所述空白卡的所述空腔中。
41．根据权利要求26所述的方法，其中所述的熔融流动包括加热所述熔融-流动粘结剂至一熔融-流动温度，所述熔融-流动温度小于所述基片和所述空白卡的变形温度。
42．根据权利要求26所述的方法，其中提供一基片包括提供一具有众多基片的长带或板。
43．根据权利要求42所述的方法包括在所述熔融-流动粘结剂熔融流动以后，将一具有众多基片的长带和板分隔为众多分开的基片。
44．根据权利要求42所述的方法，其中所述的提供一层熔融-流动粘结剂包括在连接所述电子装置以后，在所述的已提供的基片的一长带或一板的第一表面上形成一层熔融-流动粘结剂，以及还包括在它的第一表面上所述熔融-流动粘结剂层形成以后，将已提供的具有众多基片的一长带或板分隔成众多分开的基片。
45．根据权利要求26所述的方法制造的物件。
CN99812227A 1998-10-15 1999-10-14 一种具有嵌入电子装置的物件及其制作方法 Pending CN1323505A (zh)

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