JP5009576B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- JP5009576B2 JP5009576B2 JP2006252999A JP2006252999A JP5009576B2 JP 5009576 B2 JP5009576 B2 JP 5009576B2 JP 2006252999 A JP2006252999 A JP 2006252999A JP 2006252999 A JP2006252999 A JP 2006252999A JP 5009576 B2 JP5009576 B2 JP 5009576B2
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- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
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- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
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- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- Microelectronics & Electronic Packaging (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
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Description
また、本発明は上記の課題を、導電層に起立するビアプラグを形成し、該ビアプラグを絶縁層で埋設して配線構造を形成する工程と、無線通信モジュールを構成する能動素子と受動素子が実装された配線基板に前記配線構造を貼り付ける工程と、前記導電層をパターニングして前記無線通信モジュールに接続されるアンテナを形成する工程と、を有することを特徴とする半導体装置の製造方法により、解決する。
101,102,103,104,105 絶縁層
106 ビアプラグ
107,108,109,110 パターン配線
111 バンプ
200 無線通信モジュール
201 能動素子
201A ボンディングワイヤ
202,203,204,205,206 受動素子
300 配線構造
301 ビアプラグ
302 パターン配線
302A シールド
302B アンテナ
303 接続層
304 絶縁層
Claims (4)
- 導電層に起立するビアプラグを形成し、該ビアプラグを絶縁層で埋設して配線構造を形成する工程と、
無線通信モジュールを構成する能動素子と受動素子が実装された配線基板に前記配線構造を貼り付ける工程と、を有し、
前記導電層は、前記無線通信モジュールを遮蔽するシールドを構成することを特徴とする半導体装置の製造方法。 - 導電層に起立するビアプラグを形成し、該ビアプラグを絶縁層で埋設して配線構造を形成する工程と、
無線通信モジュールを構成する能動素子と受動素子が実装された配線基板に前記配線構造を貼り付ける工程と、
前記導電層をパターニングして前記無線通信モジュールに接続されるアンテナを形成する工程と、を有することを特徴とする半導体装置の製造方法。 - 前記配線構造を形成する工程では、導電性の被エッチング層をパターンエッチングすることで前記導電層と前記ビアプラグが形成されることを特徴とする請求項1または2記載の半導体装置の製造方法。
- 前記配線構造を形成する工程では、前記導電層に突起状の導電体を接合することで、前記ビアプラグが形成されることを特徴とする請求項1または2記載の半導体装置の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006252999A JP5009576B2 (ja) | 2006-09-19 | 2006-09-19 | 半導体装置の製造方法 |
KR1020070086452A KR20080026028A (ko) | 2006-09-19 | 2007-08-28 | 반도체 장치의 제조방법 |
TW096133676A TWI409884B (zh) | 2006-09-19 | 2007-09-10 | 半導體裝置之製造方法 |
US11/898,973 US7678612B2 (en) | 2006-09-19 | 2007-09-18 | Method of manufacturing semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006252999A JP5009576B2 (ja) | 2006-09-19 | 2006-09-19 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
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JP2008078207A JP2008078207A (ja) | 2008-04-03 |
JP5009576B2 true JP5009576B2 (ja) | 2012-08-22 |
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JP2006252999A Active JP5009576B2 (ja) | 2006-09-19 | 2006-09-19 | 半導体装置の製造方法 |
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US (1) | US7678612B2 (ja) |
JP (1) | JP5009576B2 (ja) |
KR (1) | KR20080026028A (ja) |
TW (1) | TWI409884B (ja) |
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Publication number | Priority date | Publication date | Assignee | Title |
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WO2008065896A1 (fr) * | 2006-11-28 | 2008-06-05 | Kyushu Institute Of Technology | Procédé de fabrication d'un dispositif semi-conducteur ayant une structure d'électrode à double face et dispositif semi-conducteur fabriqué par le procédé |
US9142502B2 (en) * | 2011-08-31 | 2015-09-22 | Zhiwei Gong | Semiconductor device packaging having pre-encapsulation through via formation using drop-in signal conduits |
US8916421B2 (en) * | 2011-08-31 | 2014-12-23 | Freescale Semiconductor, Inc. | Semiconductor device packaging having pre-encapsulation through via formation using lead frames with attached signal conduits |
JP5831057B2 (ja) * | 2011-09-07 | 2015-12-09 | 株式会社村田製作所 | モジュールの製造方法 |
US8597983B2 (en) | 2011-11-18 | 2013-12-03 | Freescale Semiconductor, Inc. | Semiconductor device packaging having substrate with pre-encapsulation through via formation |
US10249579B2 (en) * | 2017-04-25 | 2019-04-02 | Nuvoton Technology Corporation | Active shield for protecting a device from backside attacks |
KR102059814B1 (ko) * | 2018-07-12 | 2019-12-27 | 삼성전기주식회사 | 안테나 모듈 |
KR102089285B1 (ko) | 2018-07-17 | 2020-03-16 | 삼성전자주식회사 | 안테나 모듈 |
KR102066904B1 (ko) | 2018-09-18 | 2020-01-16 | 삼성전자주식회사 | 안테나 모듈 |
JP7460764B2 (ja) * | 2019-09-30 | 2024-04-02 | デンタルイージー・インコーポレイテッド | 埋込無線通信デバイスを伴う歯科用ハンドピース |
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US6404643B1 (en) * | 1998-10-15 | 2002-06-11 | Amerasia International Technology, Inc. | Article having an embedded electronic device, and method of making same |
US6262692B1 (en) * | 1999-01-13 | 2001-07-17 | Brady Worldwide, Inc. | Laminate RFID label and method of manufacture |
JP3558595B2 (ja) * | 2000-12-22 | 2004-08-25 | 松下電器産業株式会社 | 半導体チップ,半導体チップ群及びマルチチップモジュール |
JP4072816B2 (ja) * | 2002-08-08 | 2008-04-09 | 太陽誘電株式会社 | 複合モジュール及びその製造方法 |
CN1723587A (zh) * | 2002-11-07 | 2006-01-18 | 碎云股份有限公司 | 含微型天线的集成电路封装 |
JP2004311788A (ja) * | 2003-04-08 | 2004-11-04 | Matsushita Electric Ind Co Ltd | シート状モジュールとその製造方法 |
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JP4055717B2 (ja) * | 2004-01-27 | 2008-03-05 | カシオ計算機株式会社 | 半導体装置およびその製造方法 |
JP2006108451A (ja) | 2004-10-06 | 2006-04-20 | Matsushita Electric Ind Co Ltd | 回路部品内蔵モジュールとその製造方法 |
CN101048863B (zh) * | 2004-10-28 | 2010-12-01 | 京瓷株式会社 | 电子部件模块以及无线通信设备 |
JP2006165252A (ja) * | 2004-12-07 | 2006-06-22 | Shinko Electric Ind Co Ltd | チップ内蔵基板の製造方法 |
JP4718192B2 (ja) | 2005-01-17 | 2011-07-06 | 新光電気工業株式会社 | リーダ/ライタ |
US7519328B2 (en) * | 2006-01-19 | 2009-04-14 | Murata Manufacturing Co., Ltd. | Wireless IC device and component for wireless IC device |
-
2006
- 2006-09-19 JP JP2006252999A patent/JP5009576B2/ja active Active
-
2007
- 2007-08-28 KR KR1020070086452A patent/KR20080026028A/ko not_active Application Discontinuation
- 2007-09-10 TW TW096133676A patent/TWI409884B/zh active
- 2007-09-18 US US11/898,973 patent/US7678612B2/en active Active
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US7678612B2 (en) | 2010-03-16 |
KR20080026028A (ko) | 2008-03-24 |
JP2008078207A (ja) | 2008-04-03 |
US20080076249A1 (en) | 2008-03-27 |
TW200818343A (en) | 2008-04-16 |
TWI409884B (zh) | 2013-09-21 |
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