CN1303677C - 电路基板、带凸块的半导体元件的安装结构和电光装置 - Google Patents
电路基板、带凸块的半导体元件的安装结构和电光装置 Download PDFInfo
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- CN1303677C CN1303677C CNB2003101002434A CN200310100243A CN1303677C CN 1303677 C CN1303677 C CN 1303677C CN B2003101002434 A CNB2003101002434 A CN B2003101002434A CN 200310100243 A CN200310100243 A CN 200310100243A CN 1303677 C CN1303677 C CN 1303677C
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Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
Claims (13)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP298981/2002 | 2002-10-11 | ||
JP2002298981A JP3780996B2 (ja) | 2002-10-11 | 2002-10-11 | 回路基板、バンプ付き半導体素子の実装構造、バンプ付き半導体素子の実装方法、電気光学装置、並びに電子機器 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006101265819A Division CN100514617C (zh) | 2002-10-11 | 2003-10-10 | 电路基板、带凸块的半导体元件的安装结构和电光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1497710A CN1497710A (zh) | 2004-05-19 |
CN1303677C true CN1303677C (zh) | 2007-03-07 |
Family
ID=32288249
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006101265819A Expired - Lifetime CN100514617C (zh) | 2002-10-11 | 2003-10-10 | 电路基板、带凸块的半导体元件的安装结构和电光装置 |
CNB2003101002434A Expired - Lifetime CN1303677C (zh) | 2002-10-11 | 2003-10-10 | 电路基板、带凸块的半导体元件的安装结构和电光装置 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006101265819A Expired - Lifetime CN100514617C (zh) | 2002-10-11 | 2003-10-10 | 电路基板、带凸块的半导体元件的安装结构和电光装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US6853092B2 (zh) |
JP (1) | JP3780996B2 (zh) |
KR (2) | KR100662964B1 (zh) |
CN (2) | CN100514617C (zh) |
TW (1) | TWI258049B (zh) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3736639B2 (ja) * | 2003-12-12 | 2006-01-18 | セイコーエプソン株式会社 | 半導体装置及び電子デバイス並びにそれらの製造方法 |
JP3722224B2 (ja) * | 2003-12-24 | 2005-11-30 | セイコーエプソン株式会社 | 半導体チップ及び半導体装置並びに半導体装置の製造方法 |
CN100531514C (zh) * | 2004-07-12 | 2009-08-19 | 鸿富锦精密工业(深圳)有限公司 | 防止短路的印刷电路板结构 |
JP4636850B2 (ja) | 2004-10-29 | 2011-02-23 | 富士通株式会社 | 電子部品の実装方法 |
DE102005021991A1 (de) * | 2005-05-09 | 2006-11-16 | Dr. Johannes Heidenhain Gmbh | Optoelektronische Anordnung und Verfahren zu deren Herstellung |
JP4719009B2 (ja) * | 2006-01-13 | 2011-07-06 | ルネサスエレクトロニクス株式会社 | 基板および半導体装置 |
US20070187821A1 (en) * | 2006-02-14 | 2007-08-16 | Ming-Ling Ho | Chip with bump structure |
US20080088016A1 (en) * | 2006-02-14 | 2008-04-17 | Ming-Ling Ho | Chip with bump structure |
JP2007273564A (ja) * | 2006-03-30 | 2007-10-18 | Toshiba Corp | プリント回路板、半導体パッケージ、および電子機器 |
KR100791265B1 (ko) * | 2006-11-03 | 2008-01-04 | (주)파트론 | 언더필 공정을 이용한 카메라모듈의 연성인쇄회로기판접합방법 |
US20080160751A1 (en) * | 2006-12-28 | 2008-07-03 | Mengzhi Pang | Microelectronic die including solder caps on bumping sites thereof and method of making same |
JP2008262989A (ja) * | 2007-04-10 | 2008-10-30 | Toshiba Corp | 高周波回路基板 |
US8178392B2 (en) | 2007-05-18 | 2012-05-15 | Stats Chippac Ltd. | Electronic system with expansion feature |
JP5085296B2 (ja) * | 2007-12-03 | 2012-11-28 | 新光電気工業株式会社 | 多層配線基板および半導体装置 |
JP2009194143A (ja) * | 2008-02-14 | 2009-08-27 | Elpida Memory Inc | 半導体装置 |
JP2010093109A (ja) | 2008-10-09 | 2010-04-22 | Renesas Technology Corp | 半導体装置、半導体装置の製造方法および半導体モジュールの製造方法 |
JP2011053496A (ja) | 2009-09-02 | 2011-03-17 | Sony Corp | 光学素子およびその製造方法、ならびに原盤の製造方法 |
CN102142411B (zh) * | 2010-02-01 | 2012-12-12 | 华为终端有限公司 | 一种印刷电路组装板芯片封装部件以及焊接部件 |
US20110278054A1 (en) * | 2010-05-14 | 2011-11-17 | I-Tseng Lee | Circuit board with notched conductor pads |
US9786622B2 (en) | 2011-10-20 | 2017-10-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor package |
KR20130071046A (ko) * | 2011-12-20 | 2013-06-28 | 삼성전기주식회사 | Bga 패키지 및 그 제조 방법 |
US9583425B2 (en) * | 2012-02-15 | 2017-02-28 | Maxim Integrated Products, Inc. | Solder fatigue arrest for wafer level package |
TWI566352B (zh) * | 2014-05-01 | 2017-01-11 | 矽品精密工業股份有限公司 | 封裝基板及封裝件 |
CN107251663A (zh) * | 2015-02-12 | 2017-10-13 | 古河电气工业株式会社 | 柔性基板及光模块 |
WO2017041221A1 (en) * | 2015-09-08 | 2017-03-16 | Shenzhen Xpectvision Technology Co., Ltd. | Methods for making an x-ray detector |
WO2017114653A1 (en) | 2015-12-30 | 2017-07-06 | Asml Netherlands B.V. | Method and apparatus for direct write maskless lithography |
US10823355B2 (en) * | 2016-01-27 | 2020-11-03 | Lite-On Electronics (Guangzhou) Limited | Light-emitting module for vehicle lamp |
TWM521008U (zh) * | 2016-01-27 | 2016-05-01 | Lite On Technology Corp | 車燈裝置及其發光模組 |
US10177107B2 (en) * | 2016-08-01 | 2019-01-08 | Xilinx, Inc. | Heterogeneous ball pattern package |
JP7272527B2 (ja) * | 2016-08-26 | 2023-05-12 | サムソン エレクトロ-メカニックス カンパニーリミテッド. | プリント回路基板 |
KR102571591B1 (ko) * | 2016-08-26 | 2023-08-29 | 삼성전기주식회사 | 인쇄회로기판 |
KR101923637B1 (ko) * | 2016-09-23 | 2018-11-30 | 스템코 주식회사 | 비아 패드를 갖는 연성 회로 기판 |
JP6555247B2 (ja) | 2016-12-28 | 2019-08-07 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
CN109950250B (zh) * | 2017-12-20 | 2022-03-01 | 晟碟信息科技(上海)有限公司 | 具有矩阵冷却的数据中心3d固态驱动 |
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- 2003-10-07 TW TW092127825A patent/TWI258049B/zh not_active IP Right Cessation
- 2003-10-09 US US10/682,357 patent/US6853092B2/en not_active Expired - Lifetime
- 2003-10-10 CN CNB2006101265819A patent/CN100514617C/zh not_active Expired - Lifetime
- 2003-10-10 KR KR1020030070657A patent/KR100662964B1/ko active IP Right Grant
- 2003-10-10 CN CNB2003101002434A patent/CN1303677C/zh not_active Expired - Lifetime
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Also Published As
Publication number | Publication date |
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CN100514617C (zh) | 2009-07-15 |
CN1497710A (zh) | 2004-05-19 |
TWI258049B (en) | 2006-07-11 |
KR20040033268A (ko) | 2004-04-21 |
CN1905182A (zh) | 2007-01-31 |
KR100688850B1 (ko) | 2007-03-02 |
US20040124007A1 (en) | 2004-07-01 |
JP3780996B2 (ja) | 2006-05-31 |
KR20060120519A (ko) | 2006-11-27 |
TW200419273A (en) | 2004-10-01 |
US6853092B2 (en) | 2005-02-08 |
KR100662964B1 (ko) | 2006-12-28 |
JP2004134649A (ja) | 2004-04-30 |
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