JP2008262989A - 高周波回路基板 - Google Patents
高周波回路基板 Download PDFInfo
- Publication number
- JP2008262989A JP2008262989A JP2007103125A JP2007103125A JP2008262989A JP 2008262989 A JP2008262989 A JP 2008262989A JP 2007103125 A JP2007103125 A JP 2007103125A JP 2007103125 A JP2007103125 A JP 2007103125A JP 2008262989 A JP2008262989 A JP 2008262989A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- signal line
- connection portion
- circuit board
- ground
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
- H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09454—Inner lands, i.e. lands around via or plated through-hole in internal layer of multilayer PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09618—Via fence, i.e. one-dimensional array of vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09718—Clearance holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09809—Coaxial layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
【解決手段】2層102及び4層104に対して、その信号ライン11に接続される信号ライン接続部12と、積層される1層101、3層103及び5層105の各グランド層にするスルーホール131を介して接続されるグランド接続部13とを正円形以外の楕円形状で同心状に形成した高周波基板10を備えて構成したものである。
【選択図】図2
Description
Claims (5)
- 信号ラインの形成された信号ライン層を挟んでグランド層が積層された高周波基板と、
前記信号ライン層に設けられ、グランド層に接続されるグランド接続部と前記信号ラインに接続される信号ライン接続部とが正円形以外の任意形状で同心状に形成された層変換回路と、
を具備することを特徴とする高周波回路基板。 - 前記信号ライン接続部は、中心導体を形成し、前記グランド接続部は、外導体を形成して、電磁界分布の非対称性の整合を採るためのパラメータが4個以上有することを特徴とする請求項1記載の高周波回路基板。
- 前記高周波基板は、グランド層に挟装された信号ライン層が複数積層されることを特徴とする請求項1又は2記載の高周波回路基板。
- 前記信号ラインの方向が90°方向転換されることを特徴とする請求項1乃至3のいずれか記載の高周波回路基板。
- 前記信号ライン接続部及び前記グランド接続部は、楕円形状に形成されることを特徴とする請求項1乃至4のいずれか記載の高周波回路基板。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007103125A JP2008262989A (ja) | 2007-04-10 | 2007-04-10 | 高周波回路基板 |
EP08251323A EP1981316A3 (en) | 2007-04-10 | 2008-04-04 | Multilayer high-frequency circuit board |
US12/099,875 US8164005B2 (en) | 2007-04-10 | 2008-04-09 | Multilayer high-frequency circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007103125A JP2008262989A (ja) | 2007-04-10 | 2007-04-10 | 高周波回路基板 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2008262989A true JP2008262989A (ja) | 2008-10-30 |
Family
ID=39596559
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007103125A Pending JP2008262989A (ja) | 2007-04-10 | 2007-04-10 | 高周波回路基板 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8164005B2 (ja) |
EP (1) | EP1981316A3 (ja) |
JP (1) | JP2008262989A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11924967B2 (en) | 2021-02-22 | 2024-03-05 | Kabushiki Kaisha Toshiba | Substrate, electronic circuit, antenna apparatus, electronic apparatus, and method for producing a substrate |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9831540B2 (en) | 2010-09-30 | 2017-11-28 | Aviat U.S., Inc. | Systems and methods for improved chip device performance |
US9860985B1 (en) * | 2012-12-17 | 2018-01-02 | Lockheed Martin Corporation | System and method for improving isolation in high-density laminated printed circuit boards |
US9781825B2 (en) * | 2013-02-18 | 2017-10-03 | Dell Products L.P. | Flex circuit, an information handling system, and a method of manufacturing a flexible circuit |
CN103200767B (zh) * | 2013-03-07 | 2018-05-29 | 深圳市福智软件技术有限公司 | 一种既适于rf测试又适于同轴线焊接的端口 |
FR3006547A1 (fr) * | 2013-06-04 | 2014-12-05 | Kontron Modular Computers S A S | Circuit imprime a vias oblongs |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03257996A (ja) * | 1990-03-08 | 1991-11-18 | Hitachi Chem Co Ltd | 多層印刷配線板 |
JP2001144511A (ja) * | 1999-11-17 | 2001-05-25 | Mitsubishi Electric Corp | 平面型導波路の接続用変換器 |
JP2001345525A (ja) * | 2000-05-30 | 2001-12-14 | Ngk Spark Plug Co Ltd | 配線基板 |
WO2004107830A1 (ja) * | 2003-06-02 | 2004-12-09 | Nec Corporation | プリント回路基板用コンパクトビア伝送路およびその設計方法 |
Family Cites Families (37)
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US4262265A (en) * | 1979-03-29 | 1981-04-14 | Ford Aerospace & Communications Corporation | Side-launch transition for air stripline conductors |
SE426894B (sv) * | 1981-06-30 | 1983-02-14 | Ericsson Telefon Ab L M | Impedansriktig koaxialovergang for mikrovagssignaler |
US4851794A (en) * | 1987-10-09 | 1989-07-25 | Ball Corporation | Microstrip to coplanar waveguide transitional device |
US4846696A (en) * | 1988-06-15 | 1989-07-11 | M/A-Com Omni Spectra, Inc. | Microwave stripline connector |
US5057798A (en) * | 1990-06-22 | 1991-10-15 | Hughes Aircraft Company | Space-saving two-sided microwave circuitry for hybrid circuits |
FR2671232B1 (fr) * | 1990-12-27 | 1993-07-30 | Thomson Csf | Charge pour ligne triplaque hyperfrequences a substrat dielectrique. |
SE9502326D0 (sv) * | 1995-06-27 | 1995-06-27 | Sivers Ima Ab | Mikrovågskrets, sådan krets av kapslat utförande, samt användning av mikrovågskretsen i ett kretsarrangemang |
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JPH10173410A (ja) * | 1996-12-12 | 1998-06-26 | Sharp Corp | ストリップ線路を用いた伝送回路 |
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-
2007
- 2007-04-10 JP JP2007103125A patent/JP2008262989A/ja active Pending
-
2008
- 2008-04-04 EP EP08251323A patent/EP1981316A3/en not_active Withdrawn
- 2008-04-09 US US12/099,875 patent/US8164005B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03257996A (ja) * | 1990-03-08 | 1991-11-18 | Hitachi Chem Co Ltd | 多層印刷配線板 |
JP2001144511A (ja) * | 1999-11-17 | 2001-05-25 | Mitsubishi Electric Corp | 平面型導波路の接続用変換器 |
JP2001345525A (ja) * | 2000-05-30 | 2001-12-14 | Ngk Spark Plug Co Ltd | 配線基板 |
WO2004107830A1 (ja) * | 2003-06-02 | 2004-12-09 | Nec Corporation | プリント回路基板用コンパクトビア伝送路およびその設計方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11924967B2 (en) | 2021-02-22 | 2024-03-05 | Kabushiki Kaisha Toshiba | Substrate, electronic circuit, antenna apparatus, electronic apparatus, and method for producing a substrate |
Also Published As
Publication number | Publication date |
---|---|
US20080251288A1 (en) | 2008-10-16 |
US8164005B2 (en) | 2012-04-24 |
EP1981316A3 (en) | 2009-11-04 |
EP1981316A2 (en) | 2008-10-15 |
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