SE9502326D0 - Mikrovågskrets, sådan krets av kapslat utförande, samt användning av mikrovågskretsen i ett kretsarrangemang - Google Patents

Mikrovågskrets, sådan krets av kapslat utförande, samt användning av mikrovågskretsen i ett kretsarrangemang

Info

Publication number
SE9502326D0
SE9502326D0 SE9502326A SE9502326A SE9502326D0 SE 9502326 D0 SE9502326 D0 SE 9502326D0 SE 9502326 A SE9502326 A SE 9502326A SE 9502326 A SE9502326 A SE 9502326A SE 9502326 D0 SE9502326 D0 SE 9502326D0
Authority
SE
Sweden
Prior art keywords
circuit
lead
microwave
pct
segments
Prior art date
Application number
SE9502326A
Other languages
English (en)
Inventor
Ronny Andersson
Original Assignee
Sivers Ima Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sivers Ima Ab filed Critical Sivers Ima Ab
Priority to SE9502326A priority Critical patent/SE9502326D0/sv
Publication of SE9502326D0 publication Critical patent/SE9502326D0/sv
Priority to PCT/SE1996/000834 priority patent/WO1997001872A1/en
Priority to US08/981,734 priority patent/US5994983A/en
Priority to EP96922334A priority patent/EP0835534A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
    • H01L2223/6633—Transition between different waveguide types
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1903—Structure including wave guides
    • H01L2924/19038—Structure including wave guides being a hybrid line type
    • H01L2924/19039—Structure including wave guides being a hybrid line type impedance transition between different types of wave guides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Waveguides (AREA)
  • Waveguide Connection Structure (AREA)
SE9502326A 1995-06-27 1995-06-27 Mikrovågskrets, sådan krets av kapslat utförande, samt användning av mikrovågskretsen i ett kretsarrangemang SE9502326D0 (sv)

Priority Applications (4)

Application Number Priority Date Filing Date Title
SE9502326A SE9502326D0 (sv) 1995-06-27 1995-06-27 Mikrovågskrets, sådan krets av kapslat utförande, samt användning av mikrovågskretsen i ett kretsarrangemang
PCT/SE1996/000834 WO1997001872A1 (en) 1995-06-27 1996-06-25 Microwave circuit, capped microwave circuit and use thereof in a circuit arrangement
US08/981,734 US5994983A (en) 1995-06-27 1996-06-25 Microwave circuit, capped microwave circuit and use thereof in a circuit arrangement
EP96922334A EP0835534A1 (en) 1995-06-27 1996-06-25 Microwave circuit, capped microwave circuit and use thereof in a circuit arrangement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9502326A SE9502326D0 (sv) 1995-06-27 1995-06-27 Mikrovågskrets, sådan krets av kapslat utförande, samt användning av mikrovågskretsen i ett kretsarrangemang

Publications (1)

Publication Number Publication Date
SE9502326D0 true SE9502326D0 (sv) 1995-06-27

Family

ID=20398761

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9502326A SE9502326D0 (sv) 1995-06-27 1995-06-27 Mikrovågskrets, sådan krets av kapslat utförande, samt användning av mikrovågskretsen i ett kretsarrangemang

Country Status (4)

Country Link
US (1) US5994983A (sv)
EP (1) EP0835534A1 (sv)
SE (1) SE9502326D0 (sv)
WO (1) WO1997001872A1 (sv)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6194669B1 (en) * 1999-02-05 2001-02-27 Trw Inc. Solder ball grid array for connecting multiple millimeter wave assemblies
SE514426C2 (sv) * 1999-06-17 2001-02-19 Ericsson Telefon Ab L M Anordning för chipmontering i kavitet i flerlagers mönsterkort
JP3710652B2 (ja) * 1999-08-03 2005-10-26 三菱電機株式会社 ストリップライン給電装置
US6617943B1 (en) * 2001-07-27 2003-09-09 Applied Micro Circuits Corporation Package substrate interconnect layout for providing bandpass/lowpass filtering
GB2383199B (en) * 2001-12-11 2005-11-16 Marconi Optical Components Ltd Transmission line structures
US7204648B2 (en) * 2002-03-19 2007-04-17 Finisar Corporation Apparatus for enhancing impedance-matching in a high-speed data communications system
DE10228851B4 (de) * 2002-06-27 2005-05-25 Kathrein-Werke Kg Richtkoppler
US7315223B2 (en) * 2004-06-30 2008-01-01 Emag Technologies, Inc. Microstrip-to-microstrip RF transition including co-planar waveguide connected by vias
US20080100394A1 (en) * 2004-06-30 2008-05-01 Emag Technologies, Inc. Microstrip to Coplanar Waveguide Transition
US20070251719A1 (en) * 2006-04-27 2007-11-01 Rick Sturdivant Selective, hermetically sealed microwave package apparatus and methods
KR100816810B1 (ko) * 2006-06-26 2008-03-26 주식회사 케이엠더블유 가변 위상 천이기
JP2008262989A (ja) * 2007-04-10 2008-10-30 Toshiba Corp 高周波回路基板
FR2916601A1 (fr) * 2007-05-21 2008-11-28 Thomson Licensing Sas Perfectionnement a l'empreinte de report d'un connecteur sur une carte imprimee.
JP5445134B2 (ja) * 2007-09-18 2014-03-19 日本電気株式会社 高周波基板および、これを用いた高周波モジュール
US20100254094A1 (en) * 2007-10-25 2010-10-07 Risato Ohhira High-Frequency Wiring Board and High-Frequency Module That Uses the High-Frequency Wiring Board
GB2461882B (en) * 2008-07-15 2012-07-25 Thales Holdings Uk Plc Integrated microwave circuit
US9002154B2 (en) 2010-07-31 2015-04-07 International Business Machines Corporation Semiconductor through-wafer electrical signal-carrying virtual waveguide
US10198045B1 (en) * 2016-07-22 2019-02-05 Google Llc Generating fringing field for wireless communication
WO2018137997A1 (en) * 2017-01-24 2018-08-02 Huber+Suhner Ag Waveguide assembly
CN107785640B (zh) * 2017-09-18 2020-04-10 西安空间无线电技术研究所 一种基于单层微波介质的超宽带微带垂直过渡
US20210408655A1 (en) * 2020-06-25 2021-12-30 Intel Corporation Components for millimeter-wave communication
CN114900947A (zh) * 2022-04-15 2022-08-12 深南电路股份有限公司 印制电路板

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4276558A (en) * 1979-06-15 1981-06-30 Ford Aerospace & Communications Corp. Hermetically sealed active microwave integrated circuit
US4626805A (en) * 1985-04-26 1986-12-02 Tektronix, Inc. Surface mountable microwave IC package
EP0444820A3 (en) * 1990-02-26 1992-07-08 Raytheon Company Mmic package and connection
US5057798A (en) * 1990-06-22 1991-10-15 Hughes Aircraft Company Space-saving two-sided microwave circuitry for hybrid circuits
US5229727A (en) * 1992-03-13 1993-07-20 General Electric Company Hermetically sealed microstrip to microstrip transition for printed circuit fabrication
US5424693A (en) * 1993-01-13 1995-06-13 Industrial Technology Research Institute Surface mountable microwave IC package
DE4417586A1 (de) * 1993-08-03 1995-02-09 Hewlett Packard Co Familie von demontierbaren Hybridanordnungen unterschiedlicher Größe mit Mikrowellenbandbreitenverbindern
US5428327A (en) * 1993-08-23 1995-06-27 Itt Corporation Microwave feedthrough apparatus
SE9303142L (sv) * 1993-09-27 1994-10-10 Sivers Ima Ab Mikrovågskrets med impedansanpassat gränssnittsorgan
WO1996027282A1 (en) * 1995-03-02 1996-09-06 Circuit Components Incorporated A low cost, high performance package for microwave circuits in the up to 90 ghz frequency range using bga i/o rf port format and ceramic substrate technology

Also Published As

Publication number Publication date
WO1997001872A1 (en) 1997-01-16
EP0835534A1 (en) 1998-04-15
US5994983A (en) 1999-11-30

Similar Documents

Publication Publication Date Title
SE9502326D0 (sv) Mikrovågskrets, sådan krets av kapslat utförande, samt användning av mikrovågskretsen i ett kretsarrangemang
DK0986838T3 (da) Kompakt spiralantenne
FR2708681B1 (fr) Plaque tripode d'assemblage pour ensemble segmenté de circuit d'écoulement de turbine et ensemble segmenté comportant une telle plaque.
ES2123342T3 (es) Tarjetas de chip sin contacto.
DE60038875D1 (de) Abstimmbare mirkowellenanordnungen
ES2170272T3 (es) Carcasa de matriz de protuberancias polimeras para sistemas de conexiones de microondas.
BR9905729A (pt) Misturador de faixas múltiplas com oscilador local comum.
FR2701168B1 (fr) Dispositif d'antenne microruban perfectionné notamment pour récepteur hyperfréquence.
KR900701037A (ko) 고주파 전력 분할회로
TW358993B (en) RF power package with a dual ground
SE9800709L (sv) Ledare
SE9801988L (sv) Integrerad mikrovåghybridkrets
EP0198960A3 (en) Microwave diode phase shifter
SE9902301D0 (sv) Övergång mellan asymmetrisk stripline och mikrostrip i kavitet
NO934093L (no) Kryss-slissmikrobölgeantenne
TW364192B (en) Semiconductor integrated circuit having efficient layout of wiring lines
CA2230420A1 (en) Planar dielectric integrated circuit
FR2664432B1 (fr) Module hyperfrequence triplaque.
TW346682B (en) Semiconductor device
SE9303142D0 (sv) Mikrovågskrets
ATE185023T1 (de) Planarer strahler
EP0389025A3 (en) Microwave frequency converter
KR970018844A (ko) 수직다이버시티안테나
TW329480B (en) Frequency converter for a Doppler radar module
NO996430D0 (no) Planar mikroboelge-VCO på substrat med høye dielektriske tap