SE9801988L - Integrerad mikrovåghybridkrets - Google Patents

Integrerad mikrovåghybridkrets

Info

Publication number
SE9801988L
SE9801988L SE9801988A SE9801988A SE9801988L SE 9801988 L SE9801988 L SE 9801988L SE 9801988 A SE9801988 A SE 9801988A SE 9801988 A SE9801988 A SE 9801988A SE 9801988 L SE9801988 L SE 9801988L
Authority
SE
Sweden
Prior art keywords
microwave hybrid
hybrid circuit
board
integrated microwave
chips
Prior art date
Application number
SE9801988A
Other languages
English (en)
Other versions
SE522105C2 (sv
SE9801988D0 (sv
Inventor
Viktor Anatolievich Iovdalsky
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of SE9801988L publication Critical patent/SE9801988L/sv
Publication of SE9801988D0 publication Critical patent/SE9801988D0/sv
Publication of SE522105C2 publication Critical patent/SE522105C2/sv

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Classifications

    • HELECTRICITY
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    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Waveguides (AREA)
  • Structure Of Printed Boards (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
SE9801988A 1996-10-10 1998-06-04 Integrerad mikrovåghybridkrets SE522105C2 (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/RU1996/000294 WO1998015981A1 (fr) 1996-10-10 1996-10-10 Circuit integre hybride et a frequence micro-ondes

Publications (3)

Publication Number Publication Date
SE9801988L true SE9801988L (sv) 1998-06-04
SE9801988D0 SE9801988D0 (sv) 1998-06-04
SE522105C2 SE522105C2 (sv) 2004-01-13

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Application Number Title Priority Date Filing Date
SE9801988A SE522105C2 (sv) 1996-10-10 1998-06-04 Integrerad mikrovåghybridkrets

Country Status (5)

Country Link
US (1) US6204555B1 (sv)
JP (1) JP2000516044A (sv)
KR (1) KR19990072029A (sv)
SE (1) SE522105C2 (sv)
WO (1) WO1998015981A1 (sv)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6259148B1 (en) * 1998-08-13 2001-07-10 International Business Machines Corporation Modular high frequency integrated circuit structure
WO2001062517A1 (fr) * 2000-02-22 2001-08-30 Toray Engineering Company,Limited Carte d'identification sans contact ou analogue et procede de fabrication correspondant
DE60110906T2 (de) * 2000-04-04 2006-04-27 Toray Engineering Co., Ltd. Verfahren zur herstellung eines cof-gehäuses
DE10122221A1 (de) * 2001-05-08 2002-11-21 Danfoss Silicon Power Gmbh Leistungselektronikmodul mit einer Bodenplatte und darauf gelötetem Substrat
US6707150B1 (en) * 2002-10-24 2004-03-16 Galaxy Pcb Co., Ltd. Package support member with high heat-removing ability
JP3844467B2 (ja) * 2003-01-08 2006-11-15 沖電気工業株式会社 半導体装置及びその製造方法
US7253735B2 (en) 2003-03-24 2007-08-07 Alien Technology Corporation RFID tags and processes for producing RFID tags
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JP2000516044A (ja) 2000-11-28
US6204555B1 (en) 2001-03-20
WO1998015981A1 (fr) 1998-04-16
SE522105C2 (sv) 2004-01-13
SE9801988D0 (sv) 1998-06-04

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