CN1230889C - 具有相同特性的存储单元的半导体存储器及其制造方法 - Google Patents
具有相同特性的存储单元的半导体存储器及其制造方法 Download PDFInfo
- Publication number
- CN1230889C CN1230889C CNB021197970A CN02119797A CN1230889C CN 1230889 C CN1230889 C CN 1230889C CN B021197970 A CNB021197970 A CN B021197970A CN 02119797 A CN02119797 A CN 02119797A CN 1230889 C CN1230889 C CN 1230889C
- Authority
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- Prior art keywords
- cell array
- memory cell
- film
- heat
- bonding pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 64
- 238000000034 method Methods 0.000 title claims description 33
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 238000004519 manufacturing process Methods 0.000 claims abstract description 17
- 238000010438 heat treatment Methods 0.000 claims abstract description 7
- 239000010408 film Substances 0.000 claims description 128
- 238000012546 transfer Methods 0.000 claims description 73
- 238000009413 insulation Methods 0.000 claims description 66
- 230000002093 peripheral effect Effects 0.000 claims description 63
- 239000010409 thin film Substances 0.000 claims description 35
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 19
- 230000015572 biosynthetic process Effects 0.000 claims description 11
- 229910052697 platinum Inorganic materials 0.000 claims description 7
- 229910052741 iridium Inorganic materials 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 4
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 4
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 claims description 4
- 229910052707 ruthenium Inorganic materials 0.000 claims description 4
- ROZSPJBPUVWBHW-UHFFFAOYSA-N [Ru]=O Chemical group [Ru]=O ROZSPJBPUVWBHW-UHFFFAOYSA-N 0.000 claims description 2
- 229910001925 ruthenium oxide Inorganic materials 0.000 claims description 2
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 claims description 2
- 239000010410 layer Substances 0.000 abstract description 107
- 239000003990 capacitor Substances 0.000 abstract description 22
- 239000011229 interlayer Substances 0.000 abstract description 2
- 210000004027 cell Anatomy 0.000 description 93
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 19
- 229910052710 silicon Inorganic materials 0.000 description 19
- 239000010703 silicon Substances 0.000 description 19
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 12
- 229910052721 tungsten Inorganic materials 0.000 description 12
- 239000010937 tungsten Substances 0.000 description 12
- 230000000694 effects Effects 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 229910052814 silicon oxide Inorganic materials 0.000 description 8
- 239000004411 aluminium Substances 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 238000003491 array Methods 0.000 description 5
- 210000000352 storage cell Anatomy 0.000 description 5
- 229910004121 SrRuO Inorganic materials 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000010287 polarization Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
- H01L27/105—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B10/00—Static random access memory [SRAM] devices
- H10B10/18—Peripheral circuit regions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
- H10B53/30—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors characterised by the memory core region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
- H10B53/40—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors characterised by the peripheral circuit region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
- H10B53/50—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors characterised by the boundary region between the core and peripheral circuit regions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B10/00—Static random access memory [SRAM] devices
- H10B10/12—Static random access memory [SRAM] devices comprising a MOSFET load element
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Memories (AREA)
Abstract
Description
Claims (16)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001146158A JP4688343B2 (ja) | 2001-05-16 | 2001-05-16 | 強誘電体メモリ装置 |
JP2001-146158 | 2001-05-16 | ||
JP2001146158 | 2001-05-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1385896A CN1385896A (zh) | 2002-12-18 |
CN1230889C true CN1230889C (zh) | 2005-12-07 |
Family
ID=18991851
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB021197970A Expired - Fee Related CN1230889C (zh) | 2001-05-16 | 2002-05-16 | 具有相同特性的存储单元的半导体存储器及其制造方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US20020173111A1 (zh) |
EP (1) | EP1258923A2 (zh) |
JP (1) | JP4688343B2 (zh) |
CN (1) | CN1230889C (zh) |
TW (1) | TW560053B (zh) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3800294B2 (ja) * | 1999-10-25 | 2006-07-26 | 日本電気株式会社 | 半導体装置およびその製造方法 |
US20040119105A1 (en) * | 2002-12-18 | 2004-06-24 | Wilson Dennis Robert | Ferroelectric memory |
CN1898747B (zh) * | 2003-12-22 | 2010-06-16 | 皇家飞利浦电子股份有限公司 | 利用有机双极半导体的非易失性铁电薄膜设备和所述设备的制备方法 |
EP1735350B1 (en) * | 2004-04-15 | 2010-08-25 | Genencor International, Inc. | Anti-cea scfv - beta-lactamase constructs (cab molecules) in adept |
JP4284228B2 (ja) | 2004-04-19 | 2009-06-24 | 株式会社東芝 | 半導体装置の製造方法 |
JP4787152B2 (ja) * | 2004-04-28 | 2011-10-05 | 富士通セミコンダクター株式会社 | 半導体装置及びその製造方法 |
US7443020B2 (en) * | 2005-02-28 | 2008-10-28 | Texas Instruments Incorporated | Minimizing number of masks to be changed when changing existing connectivity in an integrated circuit |
JP4609722B2 (ja) * | 2005-12-09 | 2011-01-12 | セイコーエプソン株式会社 | 強誘電体記憶装置および電子機器 |
US8901704B2 (en) * | 2006-04-21 | 2014-12-02 | SK Hynix Inc. | Integrated circuit and manufacturing method thereof |
US7427550B2 (en) * | 2006-06-29 | 2008-09-23 | International Business Machines Corporation | Methods of fabricating passive element without planarizing |
JP2008205165A (ja) * | 2007-02-20 | 2008-09-04 | Toshiba Corp | 半導体集積回路装置 |
JP2008218842A (ja) * | 2007-03-06 | 2008-09-18 | Toshiba Corp | 半導体記憶装置 |
JP5596260B2 (ja) * | 2007-07-27 | 2014-09-24 | ピーエスフォー ルクスコ エスエイアールエル | 半導体装置およびその製造方法 |
JP2009043307A (ja) * | 2007-08-06 | 2009-02-26 | Toshiba Corp | 半導体記憶装置 |
JP4649487B2 (ja) * | 2008-03-17 | 2011-03-09 | 株式会社東芝 | 不揮発性半導体記憶装置及びその製造方法 |
US8669597B2 (en) | 2008-05-06 | 2014-03-11 | Spansion Llc | Memory device interconnects and method of manufacturing |
US7951704B2 (en) * | 2008-05-06 | 2011-05-31 | Spansion Llc | Memory device peripheral interconnects and method of manufacturing |
JP2009290027A (ja) * | 2008-05-29 | 2009-12-10 | Rohm Co Ltd | 半導体装置およびその製造方法、および光変調装置およびその製造方法 |
KR20100002596A (ko) * | 2008-06-30 | 2010-01-07 | 삼성전자주식회사 | 반도체 장치 및 그 제조 방법 |
US20100041232A1 (en) * | 2008-08-12 | 2010-02-18 | Summerfelt Scott R | Adjustable dummy fill |
US9536822B2 (en) * | 2008-10-13 | 2017-01-03 | Texas Instruments Incorporated | Drawn dummy FeCAP, via and metal structures |
JP5711612B2 (ja) * | 2011-05-24 | 2015-05-07 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
CN102637641B (zh) * | 2012-03-20 | 2015-05-20 | 华中科技大学 | 一种相变随机存储器阵列与外围电路芯片的集成方法 |
JP5606479B2 (ja) * | 2012-03-22 | 2014-10-15 | 株式会社東芝 | 半導体記憶装置 |
JP5582166B2 (ja) * | 2012-05-18 | 2014-09-03 | 富士通セミコンダクター株式会社 | 半導体装置 |
JP6142710B2 (ja) * | 2013-07-24 | 2017-06-07 | 富士通セミコンダクター株式会社 | 半導体装置及びその設計方法 |
JP6402528B2 (ja) | 2014-08-07 | 2018-10-10 | 富士通セミコンダクター株式会社 | 半導体装置及びその製造方法 |
KR102307060B1 (ko) * | 2014-12-03 | 2021-10-01 | 삼성전자주식회사 | 반도체 소자 |
KR102376504B1 (ko) | 2015-07-02 | 2022-03-18 | 삼성전자주식회사 | 반도체 소자 |
JP6617394B2 (ja) * | 2015-12-18 | 2019-12-11 | ローム株式会社 | 半導体装置 |
KR20180006817A (ko) * | 2016-07-11 | 2018-01-19 | 삼성전자주식회사 | 수직형 메모리 장치 |
US10217794B2 (en) | 2017-05-24 | 2019-02-26 | Globalfoundries Singapore Pte. Ltd. | Integrated circuits with vertical capacitors and methods for producing the same |
JP7242210B2 (ja) * | 2018-08-01 | 2023-03-20 | ローム株式会社 | 半導体装置 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL9000602A (nl) * | 1990-03-16 | 1991-10-16 | Philips Nv | Werkwijze voor het vervaardigen van een halfgeleiderinrichting met geheugenelementen vormende condensatoren met een ferroelectrisch dielectricum. |
JP2528737B2 (ja) | 1990-11-01 | 1996-08-28 | 三菱電機株式会社 | 半導体記憶装置およびその製造方法 |
JP3181406B2 (ja) * | 1992-02-18 | 2001-07-03 | 松下電器産業株式会社 | 半導体記憶装置 |
JPH0917965A (ja) * | 1995-07-03 | 1997-01-17 | Hitachi Ltd | 半導体集積回路装置およびその製造方法 |
JP3853406B2 (ja) * | 1995-10-27 | 2006-12-06 | エルピーダメモリ株式会社 | 半導体集積回路装置及び当該装置の製造方法 |
US6004839A (en) * | 1996-01-17 | 1999-12-21 | Nec Corporation | Semiconductor device with conductive plugs |
JPH10135425A (ja) * | 1996-11-05 | 1998-05-22 | Hitachi Ltd | 半導体集積回路装置およびその製造方法 |
KR100219507B1 (ko) * | 1996-12-17 | 1999-09-01 | 윤종용 | 강유전체 커패시터의 하부전극용 물질층으로 된로컬 인터커넥션을 구비한 반도체장치의 금속배선구조체 및 그 제조방법 |
JPH10242284A (ja) * | 1997-02-26 | 1998-09-11 | Hitachi Ltd | 半導体集積回路装置 |
JP3164021B2 (ja) * | 1997-06-12 | 2001-05-08 | 日本電気株式会社 | 半導体記憶装置の製造方法 |
JP4363679B2 (ja) | 1997-06-27 | 2009-11-11 | 聯華電子股▲ふん▼有限公司 | 半導体装置の製造方法 |
JP3125922B2 (ja) * | 1998-01-20 | 2001-01-22 | ソニー株式会社 | 誘電体メモリおよびその製造方法 |
JP3269528B2 (ja) * | 1998-03-04 | 2002-03-25 | 日本電気株式会社 | 容量素子を有する半導体装置及びその製造方法 |
US6198652B1 (en) * | 1998-04-13 | 2001-03-06 | Kabushiki Kaisha Toshiba | Non-volatile semiconductor integrated memory device |
JP3169920B2 (ja) * | 1998-12-22 | 2001-05-28 | 日本電気アイシーマイコンシステム株式会社 | 半導体記憶装置、その装置製造方法 |
JP3276007B2 (ja) * | 1999-07-02 | 2002-04-22 | 日本電気株式会社 | 混載lsi半導体装置 |
JP3623427B2 (ja) * | 2000-04-21 | 2005-02-23 | Necエレクトロニクス株式会社 | 強誘電体容量を有する半導体装置の製造方法 |
JP3843708B2 (ja) * | 2000-07-14 | 2006-11-08 | 日本電気株式会社 | 半導体装置およびその製造方法ならびに薄膜コンデンサ |
-
2001
- 2001-05-16 JP JP2001146158A patent/JP4688343B2/ja not_active Expired - Fee Related
-
2002
- 2002-05-06 EP EP02010056A patent/EP1258923A2/en not_active Withdrawn
- 2002-05-07 US US10/139,510 patent/US20020173111A1/en not_active Abandoned
- 2002-05-15 TW TW091110307A patent/TW560053B/zh active
- 2002-05-16 CN CNB021197970A patent/CN1230889C/zh not_active Expired - Fee Related
-
2003
- 2003-01-17 US US10/346,071 patent/US6768151B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US20020173111A1 (en) | 2002-11-21 |
EP1258923A2 (en) | 2002-11-20 |
JP4688343B2 (ja) | 2011-05-25 |
CN1385896A (zh) | 2002-12-18 |
US6768151B2 (en) | 2004-07-27 |
TW560053B (en) | 2003-11-01 |
JP2002343942A (ja) | 2002-11-29 |
US20030104674A1 (en) | 2003-06-05 |
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