CN105405815B - 半导体装置及其制造方法 - Google Patents

半导体装置及其制造方法 Download PDF

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CN105405815B
CN105405815B CN201510575213.1A CN201510575213A CN105405815B CN 105405815 B CN105405815 B CN 105405815B CN 201510575213 A CN201510575213 A CN 201510575213A CN 105405815 B CN105405815 B CN 105405815B
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insulating substrate
insulated substrate
semiconductor device
resin
housing
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CN105405815A (zh
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大坪义贵
吉田博
藤野纯司
菊池正雄
村井淳
村井淳一
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Mitsubishi Electric Corp
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    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
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    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/095—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers of vias therein
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    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
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    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
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    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
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    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
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    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
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    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
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    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
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    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
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    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
CN201510575213.1A 2014-09-10 2015-09-10 半导体装置及其制造方法 Active CN105405815B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-183972 2014-09-10
JP2014183972A JP6356550B2 (ja) 2014-09-10 2014-09-10 半導体装置およびその製造方法

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CN105405815A CN105405815A (zh) 2016-03-16
CN105405815B true CN105405815B (zh) 2018-06-22

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US (1) US9443778B2 (https=)
JP (1) JP6356550B2 (https=)
CN (1) CN105405815B (https=)
DE (1) DE102015213495B4 (https=)

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