JP6768612B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP6768612B2 JP6768612B2 JP2017170854A JP2017170854A JP6768612B2 JP 6768612 B2 JP6768612 B2 JP 6768612B2 JP 2017170854 A JP2017170854 A JP 2017170854A JP 2017170854 A JP2017170854 A JP 2017170854A JP 6768612 B2 JP6768612 B2 JP 6768612B2
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- 239000004065 semiconductor Substances 0.000 title claims description 83
- 230000002093 peripheral effect Effects 0.000 claims description 49
- 239000000463 material Substances 0.000 claims description 4
- 238000005452 bending Methods 0.000 description 11
- 239000011347 resin Substances 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- 239000004020 conductor Substances 0.000 description 7
- 230000017525 heat dissipation Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000004519 grease Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4043—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to have chip
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
本発明の実施の形態1について、図面を用いて以下に説明する。図1は、実施の形態1に係る半導体装置の断面図である。図2は、ヒートシンク1を取り外した状態の半導体装置の断面図である。図3は、ヒートシンク1を取り外した状態の半導体装置の底面図である。図4は、突起部11bおよびその周辺部の底面斜視図である。
(M+W−T)/L=tan(A)
A=arctan((M+W−T)/L)
すなわち、角度Aは
0<A<arctan((M+W−T)/L)
を満たす。
次に、実施の形態2に係る半導体装置について説明する。図9は、実施の形態2に係る半導体装置においてねじ締めした状態を簡略化した断面図である。図10は、突起部31およびその周辺部の底面斜視図である。なお、実施の形態2において、実施の形態1で説明したものと同一の構成要素については同一符号を付して説明は省略する。
次に、実施の形態3に係る半導体装置について説明する。図11は、実施の形態3に係る半導体装置の突起部41およびその周辺部の底面斜視図である。図12は、突起部41およびその周辺部の断面図である。なお、実施の形態3において、実施の形態1,2で説明したものと同一の構成要素については同一符号を付して説明は省略する。
次に、実施の形態4に係る半導体装置について説明する。図13は、実施の形態4に係る半導体装置の突起部51およびその周辺部の底面斜視図である。図14は、突起部51およびその周辺部の断面図である。なお、実施の形態4において、実施の形態1〜3で説明したものと同一の構成要素については同一符号を付して説明は省略する。
次に、実施の形態5に係る半導体装置について説明する。図15は、実施の形態5に係る半導体装置の突起部61およびその周辺部の底面斜視図である。図16は、突起部61およびその周辺部の断面図である。なお、実施の形態5において、実施の形態1〜4で説明したものと同一の構成要素については同一符号を付して説明は省略する。
次に、実施の形態6に係る半導体装置について説明する。図17は、実施の形態6に係る半導体装置の突起部71およびその周辺部の底面斜視図である。図18は、突起部71およびその周辺部の断面図である。なお、実施の形態6において、実施の形態1〜5で説明したものと同一の構成要素については同一符号を付して説明は省略する。
次に、実施の形態7に係る半導体装置について説明する。図19は、実施の形態7に係る半導体装置の突起部81およびその周辺部の底面斜視図である。図20は、突起部81およびその周辺部の断面図である。なお、実施の形態7において、実施の形態1〜6で説明したものと同一の構成要素については同一符号を付して説明は省略する。
Claims (9)
- ヒートシンクと、
前記ヒートシンクの上側に配置された放熱板と、
前記放熱板の上側に配置された半導体素子と、
前記半導体素子を囲み、前記ヒートシンクに取り付けられるケースと、
を備え、
前記放熱板は、平板状の本体部と、断面視にて前記本体部の下端から円弧状に膨出する膨出部とを有し、
前記ケースは、下端部の外周部から外側に延びる取付部と、前記取付部における互いに対向する位置に設けられかつ前記ヒートシンクに取り付けるための2つの取付穴と、前記取付部における2つの前記取付穴よりも外周側に前記取付部の下面から下方にそれぞれ突出する2つの突起部とを有し、
一方の前記取付穴を介して前記ヒートシンクにネジを締め付けた状態で、2つの前記取付穴を結ぶ仮想線と、一方の前記取付穴の周辺部に位置する一方の前記突起部の最下点と、前記膨出部と前記ヒートシンクとの接点とを結ぶ仮想線とのなす角度Aは、前記本体部の下端と前記ケースの下端との垂直方向の距離をM、前記膨出部の膨出量をW、前記突起部の突起高さをT、前記ケースの外周端から前記放熱板の外周端までの水平方向の距離をLとしたとき、
0<A<arctan((M+W−T)/L)
を満たす、半導体装置。 - 前記突起部は、前記取付穴に対して1つまたは複数設けられた、請求項1記載の半導体装置。
- 前記突起部は、前記取付穴側に切り欠きを有する、請求項2記載の半導体装置。
- 前記突起部は、前記ケースと同じ材料で一体に設けられた、請求項2記載の半導体装置。
- 前記突起部は、基端部よりも先端部の方が幅が小さくなるように前記取付部の下面に対して前記取付穴側に傾斜する傾斜部を有する、請求項2記載の半導体装置。
- 前記突起部は、前記取付穴側に曲面状に凹む曲面部を有する、請求項2記載の半導体装置。
- 前記突起部は、垂直方向に延びる空孔部を有する、請求項2記載の半導体装置。
- 前記突起部は、水平方向に延びる空孔部を有する、請求項2記載の半導体装置。
- 前記突起部は、垂直方向に延びる複数の溝を有する、請求項2記載の半導体装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017170854A JP6768612B2 (ja) | 2017-09-06 | 2017-09-06 | 半導体装置 |
US16/004,769 US10504817B2 (en) | 2017-09-06 | 2018-06-11 | Semiconductor device |
DE102018214260.2A DE102018214260B4 (de) | 2017-09-06 | 2018-08-23 | Halbleitervorrichtung |
CN201811011322.0A CN109461710B (zh) | 2017-09-06 | 2018-08-31 | 半导体装置 |
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Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017170854A JP6768612B2 (ja) | 2017-09-06 | 2017-09-06 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019047049A JP2019047049A (ja) | 2019-03-22 |
JP6768612B2 true JP6768612B2 (ja) | 2020-10-14 |
Family
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JP2017170854A Active JP6768612B2 (ja) | 2017-09-06 | 2017-09-06 | 半導体装置 |
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US (1) | US10504817B2 (ja) |
JP (1) | JP6768612B2 (ja) |
CN (1) | CN109461710B (ja) |
DE (1) | DE102018214260B4 (ja) |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP7193730B2 (ja) | 2019-03-26 | 2022-12-21 | 三菱電機株式会社 | 半導体装置 |
JP7354605B2 (ja) * | 2019-06-17 | 2023-10-03 | 富士電機株式会社 | 半導体モジュールおよび半導体装置 |
JP7359647B2 (ja) * | 2019-10-30 | 2023-10-11 | 日立Astemo株式会社 | パワー半導体装置およびパワー半導体装置の製造方法 |
CN112786547B (zh) * | 2019-11-01 | 2023-10-13 | 神讯电脑(昆山)有限公司 | 散热架构 |
JP7325316B2 (ja) * | 2019-12-16 | 2023-08-14 | 三菱電機株式会社 | 半導体装置 |
JP7257977B2 (ja) * | 2020-01-17 | 2023-04-14 | 三菱電機株式会社 | 半導体装置および半導体モジュール |
EP3872854A1 (en) * | 2020-02-27 | 2021-09-01 | Littelfuse, Inc. | Power module housing with improved protrusion design |
JP2023000129A (ja) * | 2021-06-17 | 2023-01-04 | 株式会社 日立パワーデバイス | パワー半導体モジュール |
TWI831420B (zh) * | 2022-10-17 | 2024-02-01 | 鴻海精密工業股份有限公司 | 封裝結構 |
EP4432345A1 (en) * | 2023-03-16 | 2024-09-18 | Hitachi Energy Ltd | Insulated metal substrate and method for producing an insulated metal substrate |
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JPS6439646U (ja) * | 1987-09-02 | 1989-03-09 | ||
JP2505196Y2 (ja) * | 1990-08-21 | 1996-07-24 | 関西日本電気株式会社 | 樹脂モ―ルド型半導体装置 |
JPH04233752A (ja) * | 1990-12-28 | 1992-08-21 | Shinko Electric Ind Co Ltd | 電子部品用パッケージ |
DE4338107C1 (de) * | 1993-11-08 | 1995-03-09 | Eupec Gmbh & Co Kg | Halbleiter-Modul |
JP2005166868A (ja) * | 2003-12-02 | 2005-06-23 | Cmk Corp | 金属ベース基板及びその製造方法並びに実装構造 |
JP5061717B2 (ja) * | 2007-05-18 | 2012-10-31 | 富士電機株式会社 | 半導体モジュール及び半導体モジュールの製造方法 |
JP2012028552A (ja) | 2010-07-23 | 2012-02-09 | Nissan Motor Co Ltd | 半導体モジュールのケース構造 |
EP3573096B1 (en) * | 2011-06-27 | 2022-03-16 | Rohm Co., Ltd. | Semiconductor module |
JP5871076B2 (ja) | 2012-09-13 | 2016-03-01 | 富士電機株式会社 | 半導体装置、半導体装置に対する放熱部材の取り付け方法及び半導体装置の製造方法 |
JP6249829B2 (ja) * | 2014-03-10 | 2017-12-20 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
CN106796925B (zh) * | 2014-07-31 | 2019-09-24 | 电化株式会社 | 铝-碳化硅质复合体及其制造方法 |
JP6356550B2 (ja) * | 2014-09-10 | 2018-07-11 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
-
2017
- 2017-09-06 JP JP2017170854A patent/JP6768612B2/ja active Active
-
2018
- 2018-06-11 US US16/004,769 patent/US10504817B2/en active Active
- 2018-08-23 DE DE102018214260.2A patent/DE102018214260B4/de active Active
- 2018-08-31 CN CN201811011322.0A patent/CN109461710B/zh active Active
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Publication number | Publication date |
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US20190074238A1 (en) | 2019-03-07 |
DE102018214260B4 (de) | 2022-01-13 |
US10504817B2 (en) | 2019-12-10 |
DE102018214260A1 (de) | 2019-03-07 |
CN109461710A (zh) | 2019-03-12 |
JP2019047049A (ja) | 2019-03-22 |
CN109461710B (zh) | 2022-09-16 |
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