CN1047411C - 电解淀积铜箔及其制作方法 - Google Patents
电解淀积铜箔及其制作方法 Download PDFInfo
- Publication number
- CN1047411C CN1047411C CN94117570A CN94117570A CN1047411C CN 1047411 C CN1047411 C CN 1047411C CN 94117570 A CN94117570 A CN 94117570A CN 94117570 A CN94117570 A CN 94117570A CN 1047411 C CN1047411 C CN 1047411C
- Authority
- CN
- China
- Prior art keywords
- paper tinsel
- copper
- metal
- zinc
- metal level
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12431—Foil or filament smaller than 6 mils
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electrolytic Production Of Metals (AREA)
- Electroplating Methods And Accessories (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Cell Electrode Carriers And Collectors (AREA)
Abstract
Description
Claims (44)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US141,483 | 1993-10-22 | ||
US08/141,483 US5431803A (en) | 1990-05-30 | 1993-10-22 | Electrodeposited copper foil and process for making same |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1105398A CN1105398A (zh) | 1995-07-19 |
CN1047411C true CN1047411C (zh) | 1999-12-15 |
Family
ID=22495882
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN94117570A Expired - Lifetime CN1047411C (zh) | 1993-10-22 | 1994-10-20 | 电解淀积铜箔及其制作方法 |
Country Status (10)
Country | Link |
---|---|
US (1) | US5431803A (zh) |
EP (1) | EP0649917B1 (zh) |
JP (2) | JP3270637B2 (zh) |
KR (1) | KR100364685B1 (zh) |
CN (1) | CN1047411C (zh) |
AT (1) | ATE161901T1 (zh) |
DE (1) | DE69407726T2 (zh) |
MY (1) | MY111485A (zh) |
RU (1) | RU2122049C1 (zh) |
TW (1) | TW373037B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108505076A (zh) * | 2017-02-24 | 2018-09-07 | 南亚塑胶工业股份有限公司 | 电解液、电解铜箔及其制造方法 |
Families Citing this family (102)
Publication number | Priority date | Publication date | Assignee | Title |
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TW289900B (zh) * | 1994-04-22 | 1996-11-01 | Gould Electronics Inc | |
US6132887A (en) * | 1995-06-16 | 2000-10-17 | Gould Electronics Inc. | High fatigue ductility electrodeposited copper foil |
JP3313277B2 (ja) * | 1995-09-22 | 2002-08-12 | 古河サーキットフォイル株式会社 | ファインパターン用電解銅箔とその製造方法 |
MY138743A (en) * | 1996-05-13 | 2009-07-31 | Mitsui Mining & Smelting Co | High tensile strength electrodeposited copper foil and the production process of the same |
TW336325B (en) * | 1996-05-24 | 1998-07-11 | Electrocopper Products Ltd | Copper wire and process for making copper wire |
EP0857402B1 (en) * | 1996-08-23 | 2007-12-19 | Nikko Materials USA, Inc. | High performance flexible laminate |
US5863666A (en) * | 1997-08-07 | 1999-01-26 | Gould Electronics Inc. | High performance flexible laminate |
JPH10195689A (ja) * | 1996-12-27 | 1998-07-28 | Fukuda Metal Foil & Powder Co Ltd | 微細孔明き金属箔の製造方法 |
JPH10330983A (ja) | 1997-05-30 | 1998-12-15 | Fukuda Metal Foil & Powder Co Ltd | 電解銅箔及びその製造方法 |
US6179988B1 (en) | 1997-08-29 | 2001-01-30 | Electrocopper Products Limited | Process for making copper wire |
US7244677B2 (en) | 1998-02-04 | 2007-07-17 | Semitool. Inc. | Method for filling recessed micro-structures with metallization in the production of a microelectronic device |
WO1999040615A1 (en) | 1998-02-04 | 1999-08-12 | Semitool, Inc. | Method and apparatus for low-temperature annealing of metallization micro-structures in the production of a microelectronic device |
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JP2000017476A (ja) * | 1998-04-30 | 2000-01-18 | Mitsui Mining & Smelting Co Ltd | 分散強化型電解銅箔及びその製造方法 |
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ES2367838T3 (es) | 1998-09-10 | 2011-11-10 | JX Nippon Mining & Metals Corp. | Laminado que comprende una hoja de cobre tratada y procedimiento para su fabricación. |
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JP2000340911A (ja) | 1999-05-25 | 2000-12-08 | Mitsui Mining & Smelting Co Ltd | プリント配線板用銅箔 |
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JP3521074B2 (ja) * | 2000-01-06 | 2004-04-19 | 三井金属鉱業株式会社 | 電解銅箔の物性検査方法 |
DE10005680B4 (de) * | 2000-02-07 | 2005-03-31 | Cis Solartechnik Gmbh | Trägermaterial für eine flexible, bandförmige CIS-Solarzelle |
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- 1994-10-07 EP EP94307388A patent/EP0649917B1/en not_active Expired - Lifetime
- 1994-10-07 DE DE69407726T patent/DE69407726T2/de not_active Expired - Lifetime
- 1994-10-20 RU RU94037962A patent/RU2122049C1/ru not_active IP Right Cessation
- 1994-10-20 CN CN94117570A patent/CN1047411C/zh not_active Expired - Lifetime
- 1994-10-21 KR KR1019940027016A patent/KR100364685B1/ko not_active IP Right Cessation
- 1994-10-21 JP JP25721294A patent/JP3270637B2/ja not_active Expired - Lifetime
- 1994-11-17 TW TW083110761A patent/TW373037B/zh not_active IP Right Cessation
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CN108505076A (zh) * | 2017-02-24 | 2018-09-07 | 南亚塑胶工业股份有限公司 | 电解液、电解铜箔及其制造方法 |
CN108505076B (zh) * | 2017-02-24 | 2020-04-28 | 南亚塑胶工业股份有限公司 | 电解液、电解铜箔及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
TW373037B (en) | 1999-11-01 |
EP0649917B1 (en) | 1998-01-07 |
EP0649917A1 (en) | 1995-04-26 |
MY111485A (en) | 2000-06-30 |
DE69407726T2 (de) | 1998-04-16 |
CN1105398A (zh) | 1995-07-19 |
JP2002129373A (ja) | 2002-05-09 |
RU94037962A (ru) | 1997-02-27 |
RU2122049C1 (ru) | 1998-11-20 |
KR100364685B1 (ko) | 2003-04-16 |
JP3270637B2 (ja) | 2002-04-02 |
JPH07188969A (ja) | 1995-07-25 |
ATE161901T1 (de) | 1998-01-15 |
US5431803A (en) | 1995-07-11 |
KR950013331A (ko) | 1995-05-17 |
DE69407726D1 (de) | 1998-02-12 |
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