JPS5438053A - Safety device for elevator cage - Google Patents

Safety device for elevator cage

Info

Publication number
JPS5438053A
JPS5438053A JP10346677A JP10346677A JPS5438053A JP S5438053 A JPS5438053 A JP S5438053A JP 10346677 A JP10346677 A JP 10346677A JP 10346677 A JP10346677 A JP 10346677A JP S5438053 A JPS5438053 A JP S5438053A
Authority
JP
Japan
Prior art keywords
safety device
elevator cage
cage
elevator
mischief
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10346677A
Other languages
Japanese (ja)
Inventor
Terumi Hirabayashi
Hisao Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP10346677A priority Critical patent/JPS5438053A/en
Publication of JPS5438053A publication Critical patent/JPS5438053A/en
Pending legal-status Critical Current

Links

Landscapes

  • Indicating And Signalling Devices For Elevators (AREA)
  • Maintenance And Inspection Apparatuses For Elevators (AREA)
  • Elevator Door Apparatuses (AREA)

Abstract

PURPOSE: To prevent an anticipated accident in advance by detecting the opening of the hall door of an elevator due to mischief or the like and informing of it to a supervisor's room to stop the elevation of the cage.
COPYRIGHT: (C)1979,JPO&Japio
JP10346677A 1977-08-29 1977-08-29 Safety device for elevator cage Pending JPS5438053A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10346677A JPS5438053A (en) 1977-08-29 1977-08-29 Safety device for elevator cage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10346677A JPS5438053A (en) 1977-08-29 1977-08-29 Safety device for elevator cage

Publications (1)

Publication Number Publication Date
JPS5438053A true JPS5438053A (en) 1979-03-22

Family

ID=14354779

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10346677A Pending JPS5438053A (en) 1977-08-29 1977-08-29 Safety device for elevator cage

Country Status (1)

Country Link
JP (1) JPS5438053A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4540473A (en) * 1983-11-22 1985-09-10 International Business Machines Corporation Copper plating bath having increased plating rate, and method
JPS61113797A (en) * 1984-11-06 1986-05-31 Kobe Steel Ltd Treatment of roughening surface of cu or cu alloy
US5366814A (en) * 1992-11-19 1994-11-22 Nikko Gould Foil Co., Ltd. Copper foil for printed circuits and process for producing the same
US5403465A (en) * 1990-05-30 1995-04-04 Gould Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives
US5421985A (en) * 1990-05-30 1995-06-06 Gould Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having low chloride ion concentrations
US5431803A (en) * 1990-05-30 1995-07-11 Gould Electronics Inc. Electrodeposited copper foil and process for making same
US5958209A (en) * 1996-05-13 1999-09-28 Mitsui Mining & Smelting Co., Ltd. High tensile strength electrodeposited copper foil and process of electrodepositing thereof
JP2005206915A (en) * 2004-01-26 2005-08-04 Fukuda Metal Foil & Powder Co Ltd Copper foil for printed circuited board, and its production method
JP2009202999A (en) * 2008-02-27 2009-09-10 Hitachi Ltd Safety operation system of elevator
EP2590487A1 (en) 2011-11-03 2013-05-08 Nan-Ya Plastics Corporation Process to manufacture fine grain surface copper foil with high peeling strength and environmental protection for printed circuit boards
US9115441B2 (en) 2011-10-18 2015-08-25 Nan Ya Plastics Corporation Process to manufacture surface fine grain copper foil with high peeling strength and environmental protection for printed circuit boards

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4540473A (en) * 1983-11-22 1985-09-10 International Business Machines Corporation Copper plating bath having increased plating rate, and method
JPS61113797A (en) * 1984-11-06 1986-05-31 Kobe Steel Ltd Treatment of roughening surface of cu or cu alloy
US5454926A (en) * 1990-05-30 1995-10-03 Gould Electronics Inc. Electrodeposited copper foil
US5403465A (en) * 1990-05-30 1995-04-04 Gould Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives
US5421985A (en) * 1990-05-30 1995-06-06 Gould Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having low chloride ion concentrations
US5431803A (en) * 1990-05-30 1995-07-11 Gould Electronics Inc. Electrodeposited copper foil and process for making same
US5366814A (en) * 1992-11-19 1994-11-22 Nikko Gould Foil Co., Ltd. Copper foil for printed circuits and process for producing the same
US5958209A (en) * 1996-05-13 1999-09-28 Mitsui Mining & Smelting Co., Ltd. High tensile strength electrodeposited copper foil and process of electrodepositing thereof
US6194056B1 (en) 1996-05-13 2001-02-27 Mitsui Mining & Smelting Co., Ltd. High tensile strength electrodeposited copper foil
JP2005206915A (en) * 2004-01-26 2005-08-04 Fukuda Metal Foil & Powder Co Ltd Copper foil for printed circuited board, and its production method
JP2009202999A (en) * 2008-02-27 2009-09-10 Hitachi Ltd Safety operation system of elevator
US9115441B2 (en) 2011-10-18 2015-08-25 Nan Ya Plastics Corporation Process to manufacture surface fine grain copper foil with high peeling strength and environmental protection for printed circuit boards
EP2590487A1 (en) 2011-11-03 2013-05-08 Nan-Ya Plastics Corporation Process to manufacture fine grain surface copper foil with high peeling strength and environmental protection for printed circuit boards

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