MX355999B - Baño de electroplastia de aleación de cobre-níquel y método de galvanoplastia. - Google Patents

Baño de electroplastia de aleación de cobre-níquel y método de galvanoplastia.

Info

Publication number
MX355999B
MX355999B MX2014012027A MX2014012027A MX355999B MX 355999 B MX355999 B MX 355999B MX 2014012027 A MX2014012027 A MX 2014012027A MX 2014012027 A MX2014012027 A MX 2014012027A MX 355999 B MX355999 B MX 355999B
Authority
MX
Mexico
Prior art keywords
copper
compounds
electroplating bath
nickel alloy
alloy electroplating
Prior art date
Application number
MX2014012027A
Other languages
English (en)
Other versions
MX2014012027A (es
Inventor
Inoue Manabu
Yuasa Satoshi
Sakurai Hitoshi
Original Assignee
Dipsol Chem
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dipsol Chem filed Critical Dipsol Chem
Publication of MX2014012027A publication Critical patent/MX2014012027A/es
Publication of MX355999B publication Critical patent/MX355999B/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/013—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/03—Alloys based on nickel or cobalt based on nickel
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/03—Alloys based on nickel or cobalt based on nickel
    • C22C19/05—Alloys based on nickel or cobalt based on nickel with chromium
    • C22C19/058—Alloys based on nickel or cobalt based on nickel with chromium without Mo and W
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

La presente invención proporciona un baño de electroplastia de aleación de cobre-níquel que se caracteriza por contener (a) una sal de cobre y una sal de níquel, (b) un agente de formación de complejo de metal, (c) una pluralidad de sales que imparten conductividad que son diferentes entre sí, (d) un compuesto que se selecciona del grupo que consiste de compuestos de disulfuro, aminoácidos que contienen azufre y sales de estos compuestos, (e) un compuesto que se selecciona del grupo que consiste de compuestos de ácido sulfónico, compuestos de sulfimida, compuestos de ácido sulfámico, sulfonamidas y sales de estos compuestos y (f) un producto de reacción de un éter glicidílico y un alcohol polihídrico. Este baño de electroplastia de aleación de cobre-níquel también se caracteriza por tener un pH de 3-8.
MX2014012027A 2012-04-19 2013-04-19 Baño de electroplastia de aleación de cobre-níquel y método de galvanoplastia. MX355999B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012095956 2012-04-19
PCT/JP2013/061667 WO2013157639A1 (ja) 2012-04-19 2013-04-19 銅－ニッケル合金電気めっき浴及びめっき方法

Publications (2)

Publication Number Publication Date
MX2014012027A MX2014012027A (es) 2014-12-05
MX355999B true MX355999B (es) 2018-05-08

Family

ID=49383587

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2014012027A MX355999B (es) 2012-04-19 2013-04-19 Baño de electroplastia de aleación de cobre-níquel y método de galvanoplastia.

Country Status (15)

Country Link
US (1) US9828686B2 (es)
EP (1) EP2840169B1 (es)
JP (1) JP6119053B2 (es)
KR (1) KR101649435B1 (es)
CN (1) CN104321470B (es)
BR (1) BR112014026009A2 (es)
ES (1) ES2620115T3 (es)
IN (1) IN2014MN01920A (es)
MX (1) MX355999B (es)
MY (1) MY167239A (es)
PH (1) PH12014502330B1 (es)
RU (1) RU2588894C2 (es)
SG (1) SG11201406599RA (es)
TW (1) TWI580822B (es)
WO (1) WO2013157639A1 (es)

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Publication number Priority date Publication date Assignee Title
CN105247111B (zh) * 2013-10-25 2017-09-12 Om产业股份有限公司 镀品的制造方法
JP6439172B2 (ja) * 2014-08-08 2018-12-19 ディップソール株式会社 銅−ニッケル合金電気めっき浴
JP6435546B2 (ja) * 2014-10-17 2018-12-12 ディップソール株式会社 銅−ニッケル合金電気めっき装置
CN104911656A (zh) * 2015-06-13 2015-09-16 梁胜光 一种金属合金电镀液
CN105018986A (zh) * 2015-08-11 2015-11-04 江苏金曼科技有限责任公司 一种无氰无磷合金打底液
CN105506686A (zh) * 2015-12-23 2016-04-20 苏州市金星工艺镀饰有限公司 一种装饰性镍铜金三元合金电镀液的电镀方法
WO2017130866A1 (ja) * 2016-01-29 2017-08-03 住友金属鉱山株式会社 黒化めっき液、導電性基板の製造方法
CN108495749B (zh) * 2016-01-29 2021-02-26 住友金属矿山株式会社 导电性基板
JP6796243B2 (ja) * 2016-04-30 2020-12-09 日本製鉄株式会社 銅−ニッケル合金材料を被覆した機械部品
CN106283132B (zh) * 2016-08-26 2018-07-10 湖北吉和昌化工科技有限公司 一种微酸性体系电镀光亮铜的柔软分散剂
US10711360B2 (en) * 2017-07-14 2020-07-14 Rohm And Haas Electronic Materials Llc Nickel electroplating compositions with copolymers of arginine and bisepoxides and methods of electroplating nickel
JP2019044231A (ja) * 2017-09-01 2019-03-22 株式会社Ｊｃｕ 低熱膨張係数を有する鉄−ニッケル合金用電気メッキ液およびこれを用いた電気メッキ方法
US10205170B1 (en) * 2017-12-04 2019-02-12 Chang Chun Petrochemical Co., Ltd. Copper foil for current collector of lithium secondary battery
CN110607541B (zh) * 2019-08-17 2021-07-16 山东理工大学 一种电火花加工金刚石用铜镍复合电极及其制备方法
CN111321437B (zh) * 2020-03-31 2021-04-27 安徽铜冠铜箔集团股份有限公司 铜镍合金箔及其电沉积制备方法
CN114214677A (zh) * 2021-12-30 2022-03-22 佛山亚特表面技术材料有限公司 一种酸性镀铜深孔剂及其制备方法与电镀方法
CN115787053B (zh) * 2022-11-21 2024-11-12 南通赛可特电子有限公司 一种高稳定型电镀添加剂及其制备方法

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Also Published As

Publication number Publication date
RU2014146285A (ru) 2016-06-10
EP2840169B1 (en) 2017-03-01
EP2840169A1 (en) 2015-02-25
PH12014502330A1 (en) 2015-01-12
TW201402878A (zh) 2014-01-16
RU2588894C2 (ru) 2016-07-10
US9828686B2 (en) 2017-11-28
BR112014026009A2 (pt) 2017-06-27
EP2840169A4 (en) 2015-12-30
PH12014502330B1 (en) 2015-01-12
MY167239A (en) 2018-08-14
CN104321470B (zh) 2017-03-15
SG11201406599RA (en) 2014-11-27
JP6119053B2 (ja) 2017-04-26
US20150090600A1 (en) 2015-04-02
ES2620115T3 (es) 2017-06-27
TWI580822B (zh) 2017-05-01
CN104321470A (zh) 2015-01-28
WO2013157639A1 (ja) 2013-10-24
KR101649435B1 (ko) 2016-08-19
JPWO2013157639A1 (ja) 2015-12-21
MX2014012027A (es) 2014-12-05
KR20140130546A (ko) 2014-11-10
IN2014MN01920A (es) 2015-07-10

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