MX2014012027A - Baño de electroplastia de aleacion de cobre-niquel y metodo de galvanoplastia. - Google Patents
Baño de electroplastia de aleacion de cobre-niquel y metodo de galvanoplastia.Info
- Publication number
- MX2014012027A MX2014012027A MX2014012027A MX2014012027A MX2014012027A MX 2014012027 A MX2014012027 A MX 2014012027A MX 2014012027 A MX2014012027 A MX 2014012027A MX 2014012027 A MX2014012027 A MX 2014012027A MX 2014012027 A MX2014012027 A MX 2014012027A
- Authority
- MX
- Mexico
- Prior art keywords
- copper
- compounds
- electroplating bath
- nickel alloy
- alloy electroplating
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/013—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/03—Alloys based on nickel or cobalt based on nickel
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/03—Alloys based on nickel or cobalt based on nickel
- C22C19/05—Alloys based on nickel or cobalt based on nickel with chromium
- C22C19/058—Alloys based on nickel or cobalt based on nickel with chromium without Mo and W
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
Abstract
La presente invención proporciona un baño de electroplastia de aleación de cobre-níquel que se caracteriza por contener (a) una sal de cobre y una sal de níquel, (b) un agente de formación de complejo de metal, (c) una pluralidad de sales que imparten conductividad que son diferentes entre sí, (d) un compuesto que se selecciona del grupo que consiste de compuestos de disulfuro, aminoácidos que contienen azufre y sales de estos compuestos, (e) un compuesto que se selecciona del grupo que consiste de compuestos de ácido sulfónico, compuestos de sulfimida, compuestos de ácido sulfámico, sulfonamidas y sales de estos compuestos y (f) un producto de reacción de un éter glicidílico y un alcohol polihídrico. Este baño de electroplastia de aleación de cobre-níquel también se caracteriza por tener un pH de 3-8.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012095956 | 2012-04-19 | ||
PCT/JP2013/061667 WO2013157639A1 (ja) | 2012-04-19 | 2013-04-19 | 銅-ニッケル合金電気めっき浴及びめっき方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
MX2014012027A true MX2014012027A (es) | 2014-12-05 |
MX355999B MX355999B (es) | 2018-05-08 |
Family
ID=49383587
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2014012027A MX355999B (es) | 2012-04-19 | 2013-04-19 | Baño de electroplastia de aleación de cobre-níquel y método de galvanoplastia. |
Country Status (15)
Country | Link |
---|---|
US (1) | US9828686B2 (es) |
EP (1) | EP2840169B1 (es) |
JP (1) | JP6119053B2 (es) |
KR (1) | KR101649435B1 (es) |
CN (1) | CN104321470B (es) |
BR (1) | BR112014026009A2 (es) |
ES (1) | ES2620115T3 (es) |
IN (1) | IN2014MN01920A (es) |
MX (1) | MX355999B (es) |
MY (1) | MY167239A (es) |
PH (1) | PH12014502330B1 (es) |
RU (1) | RU2588894C2 (es) |
SG (1) | SG11201406599RA (es) |
TW (1) | TWI580822B (es) |
WO (1) | WO2013157639A1 (es) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5758557B1 (ja) * | 2013-10-25 | 2015-08-05 | オーエム産業株式会社 | めっき品の製造方法 |
JP6439172B2 (ja) * | 2014-08-08 | 2018-12-19 | ディップソール株式会社 | 銅−ニッケル合金電気めっき浴 |
JP6435546B2 (ja) * | 2014-10-17 | 2018-12-12 | ディップソール株式会社 | 銅−ニッケル合金電気めっき装置 |
CN104911656A (zh) * | 2015-06-13 | 2015-09-16 | 梁胜光 | 一种金属合金电镀液 |
CN105018986A (zh) * | 2015-08-11 | 2015-11-04 | 江苏金曼科技有限责任公司 | 一种无氰无磷合金打底液 |
CN105506686A (zh) * | 2015-12-23 | 2016-04-20 | 苏州市金星工艺镀饰有限公司 | 一种装饰性镍铜金三元合金电镀液的电镀方法 |
WO2017130866A1 (ja) * | 2016-01-29 | 2017-08-03 | 住友金属鉱山株式会社 | 黒化めっき液、導電性基板の製造方法 |
JP6796243B2 (ja) * | 2016-04-30 | 2020-12-09 | 日本製鉄株式会社 | 銅−ニッケル合金材料を被覆した機械部品 |
CN106283132B (zh) * | 2016-08-26 | 2018-07-10 | 湖北吉和昌化工科技有限公司 | 一种微酸性体系电镀光亮铜的柔软分散剂 |
US10711360B2 (en) | 2017-07-14 | 2020-07-14 | Rohm And Haas Electronic Materials Llc | Nickel electroplating compositions with copolymers of arginine and bisepoxides and methods of electroplating nickel |
JP2019044231A (ja) * | 2017-09-01 | 2019-03-22 | 株式会社Jcu | 低熱膨張係数を有する鉄−ニッケル合金用電気メッキ液およびこれを用いた電気メッキ方法 |
US10205170B1 (en) * | 2017-12-04 | 2019-02-12 | Chang Chun Petrochemical Co., Ltd. | Copper foil for current collector of lithium secondary battery |
CN110607541B (zh) * | 2019-08-17 | 2021-07-16 | 山东理工大学 | 一种电火花加工金刚石用铜镍复合电极及其制备方法 |
CN111321437B (zh) * | 2020-03-31 | 2021-04-27 | 安徽铜冠铜箔集团股份有限公司 | 铜镍合金箔及其电沉积制备方法 |
CN114214677A (zh) * | 2021-12-30 | 2022-03-22 | 佛山亚特表面技术材料有限公司 | 一种酸性镀铜深孔剂及其制备方法与电镀方法 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1750092A (en) * | 1921-11-26 | 1930-03-11 | Crawford Robert Brace Penn | Electroplating process |
BE518763A (es) * | 1952-03-29 | |||
GB957808A (en) * | 1962-02-09 | 1964-05-13 | Ass Elect Ind | Electrodeposition of copper-nickel alloy |
US3338804A (en) * | 1964-09-03 | 1967-08-29 | Kewanee Oil Co | Electrodeposition of stress-free metal deposits |
US3833481A (en) | 1972-12-18 | 1974-09-03 | Buckbel Mears Co | Electroforming nickel copper alloys |
US3833486A (en) * | 1973-03-26 | 1974-09-03 | Lea Ronal Inc | Cyanide-free electroplating |
JPS5224133A (en) | 1975-08-20 | 1977-02-23 | Nisshin Steel Co Ltd | Plating method of nickellcopper alloy |
US4036709A (en) * | 1975-09-22 | 1977-07-19 | M & T Chemicals Inc. | Electroplating nickel, cobalt, nickel-cobalt alloys and binary or ternary alloys of nickel, cobalt and iron |
JPS5426962A (en) | 1977-08-03 | 1979-02-28 | Nippon Kokan Kk <Nkk> | Temperature-detecting device for grate of heat treating apparatus of downward suction type and grate operation control unit using it |
US4134802A (en) | 1977-10-03 | 1979-01-16 | Oxy Metal Industries Corporation | Electrolyte and method for electrodepositing bright metal deposits |
JPS54155331A (en) * | 1978-05-26 | 1979-12-07 | Hitachi Ltd | Operation of water wheel or pump water wheel |
US4234802A (en) * | 1978-09-11 | 1980-11-18 | Kollmorgen Technologies Corporation | Current limiter |
US4167459A (en) * | 1979-01-08 | 1979-09-11 | The United States Of America As Represented By The Secretary Of The Interior | Electroplating with Ni-Cu alloy |
JPS58133391A (ja) | 1982-02-01 | 1983-08-09 | Oosakashi | 光沢銅−ニツケル合金電気めつき浴 |
JPH02285091A (ja) | 1989-04-26 | 1990-11-22 | Kobe Steel Ltd | ニッケル―銅合金めっき浴 |
US5431803A (en) * | 1990-05-30 | 1995-07-11 | Gould Electronics Inc. | Electrodeposited copper foil and process for making same |
JPH0598488A (ja) * | 1991-06-05 | 1993-04-20 | Daiwa Kasei Kenkyusho:Kk | 銅−ニツケル合金電気メツキ浴 |
JPH06173075A (ja) * | 1992-12-03 | 1994-06-21 | Daiwa Kasei Kenkyusho:Kk | 銅−ニッケル合金めっき浴 |
TW317575B (es) * | 1994-01-21 | 1997-10-11 | Olin Corp | |
RU2106436C1 (ru) * | 1996-07-22 | 1998-03-10 | Тюменский государственный нефтегазовый университет | Электролит для осаждения сплава медь - никель |
US6183619B1 (en) * | 1999-03-19 | 2001-02-06 | Technic, Inc. | Metal alloy sulfonic acid electroplating baths |
US6562220B2 (en) * | 1999-03-19 | 2003-05-13 | Technic, Inc. | Metal alloy sulfate electroplating baths |
KR100485808B1 (ko) * | 2002-01-30 | 2005-04-28 | 한현섭 | 동-니켈 합금의 박막 도금액 및 상기 용액을 이용한 박막제조 방법 |
JP4249438B2 (ja) * | 2002-07-05 | 2009-04-02 | 日本ニュークローム株式会社 | 銅―錫合金めっき用ピロリン酸浴 |
CN101054699B (zh) * | 2007-02-12 | 2010-05-19 | 伟业重工(安徽)有限公司 | 一种替代铜及铜合金化学氧化的电镀工艺 |
-
2013
- 2013-04-19 TW TW102114163A patent/TWI580822B/zh active
- 2013-04-19 WO PCT/JP2013/061667 patent/WO2013157639A1/ja active Application Filing
- 2013-04-19 KR KR1020147027765A patent/KR101649435B1/ko active IP Right Grant
- 2013-04-19 RU RU2014146285/02A patent/RU2588894C2/ru active
- 2013-04-19 IN IN1920MUN2014 patent/IN2014MN01920A/en unknown
- 2013-04-19 ES ES13779037.4T patent/ES2620115T3/es active Active
- 2013-04-19 MY MYPI2014002954A patent/MY167239A/en unknown
- 2013-04-19 BR BR112014026009A patent/BR112014026009A2/pt not_active Application Discontinuation
- 2013-04-19 CN CN201380020656.3A patent/CN104321470B/zh active Active
- 2013-04-19 JP JP2014511260A patent/JP6119053B2/ja active Active
- 2013-04-19 MX MX2014012027A patent/MX355999B/es active IP Right Grant
- 2013-04-19 SG SG11201406599RA patent/SG11201406599RA/en unknown
- 2013-04-19 US US14/395,776 patent/US9828686B2/en active Active
- 2013-04-19 EP EP13779037.4A patent/EP2840169B1/en active Active
-
2014
- 2014-10-17 PH PH12014502330A patent/PH12014502330B1/en unknown
Also Published As
Publication number | Publication date |
---|---|
MY167239A (en) | 2018-08-14 |
TWI580822B (zh) | 2017-05-01 |
PH12014502330A1 (en) | 2015-01-12 |
JPWO2013157639A1 (ja) | 2015-12-21 |
US20150090600A1 (en) | 2015-04-02 |
CN104321470A (zh) | 2015-01-28 |
EP2840169A1 (en) | 2015-02-25 |
KR20140130546A (ko) | 2014-11-10 |
EP2840169A4 (en) | 2015-12-30 |
MX355999B (es) | 2018-05-08 |
TW201402878A (zh) | 2014-01-16 |
WO2013157639A1 (ja) | 2013-10-24 |
SG11201406599RA (en) | 2014-11-27 |
RU2588894C2 (ru) | 2016-07-10 |
EP2840169B1 (en) | 2017-03-01 |
BR112014026009A2 (pt) | 2017-06-27 |
KR101649435B1 (ko) | 2016-08-19 |
IN2014MN01920A (es) | 2015-07-10 |
ES2620115T3 (es) | 2017-06-27 |
RU2014146285A (ru) | 2016-06-10 |
CN104321470B (zh) | 2017-03-15 |
US9828686B2 (en) | 2017-11-28 |
PH12014502330B1 (en) | 2015-01-12 |
JP6119053B2 (ja) | 2017-04-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
PH12014502330B1 (en) | Copper-nickel alloy electroplating bath and plating method | |
PL2852698T3 (pl) | Kąpiel galwaniczna do powlekania niklem lub stopem niklu w celu osadzania pół-błyszczącej warstwy niklu lub stopu niklu | |
EP2626449A3 (en) | Plating bath and method | |
MY187476A (en) | Levelers for copper deposition in microelectronics | |
AU2003237637A8 (en) | Pyrophosphoric acid bath for use in copper-tin alloy plating | |
DE502007002479D1 (de) | Kupfer-Zinn-Elektrolyt und Verfahren zur Abscheidung von Bronzeschichten | |
EP1892321A3 (en) | A Hard Gold Alloy Plating Bath | |
PH12017500218B1 (en) | Copper-nickel alloy electroplating bath | |
EP2458036A3 (en) | Gold plating solution | |
PT3356579T (pt) | Banho de galvanoplastia para deposição eletroquímica de uma camada de liga de cu-sn-zn-pd, método para a deposição eletroquímica da referida camada de liga, substrato que compreende a referida camada de liga e utilizações do substrato revestido | |
PH12016500567A1 (en) | Reductive electroless gold plating solution, and electroless gold plating method using said plating solution | |
MX362967B (es) | Composicion acida para baño de galvanizado de zinc y de aleacion de zinc-niquel y metodo de galvanoplastia. | |
EP2471977A3 (en) | Method for removing impurities from plating solution | |
JP2013534276A (ja) | 銅−錫合金層を沈着する電解質および方法 | |
JP2013534276A5 (es) | ||
WO2011036076A3 (en) | Copper electroplating composition | |
TW201614678A (en) | Silver-coated copper powder and method for producing same | |
RU2016148650A (ru) | Раствор для металлизации резьбового соединения трубопроводов или труб и способ производства резьбового соединения для трубопроводов или труб | |
PL2730682T3 (pl) | Alkaliczny, bezcyjankowy roztwór do galwanizacji stopami złota, sposób galwanizacji i podłoże zawierające błyszczący, wolny od korozji osad stopu złota | |
WO2013181592A3 (en) | Process for preparing dihalopyridines | |
MY167238A (en) | Liquid detergent composition | |
CL2019001232A1 (es) | Proceso de recubrimiento periférico de la barra conductora de cobre para la fabricación de ánodos, utilizado en los procesos de electro obtención o electro refinación de metales | |
TH147926A (th) | สารชุบเคลือบผิวด้วยไฟฟ้าที่ใช้อัลลอยของทองแดง-นิกเกิลและวิธีการเคลือบผิว | |
WO2012052832A8 (en) | Electroless nickel plating bath and electroless nickel plating method using same | |
TH175699A (th) | สารผสมอ่างการชุบ สังกะสีและสังกะสี-นิกเกิลอัลลอยที่เป็นกรด และวิธีการชุบด้วยไฟฟ้า |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG | Grant or registration |