JPS5224133A - Plating method of nickellcopper alloy - Google Patents
Plating method of nickellcopper alloyInfo
- Publication number
- JPS5224133A JPS5224133A JP10007075A JP10007075A JPS5224133A JP S5224133 A JPS5224133 A JP S5224133A JP 10007075 A JP10007075 A JP 10007075A JP 10007075 A JP10007075 A JP 10007075A JP S5224133 A JPS5224133 A JP S5224133A
- Authority
- JP
- Japan
- Prior art keywords
- nickellcopper
- alloy
- plating method
- plating
- nickellcopper alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10007075A JPS5224133A (en) | 1975-08-20 | 1975-08-20 | Plating method of nickellcopper alloy |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10007075A JPS5224133A (en) | 1975-08-20 | 1975-08-20 | Plating method of nickellcopper alloy |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5224133A true JPS5224133A (en) | 1977-02-23 |
JPS5710957B2 JPS5710957B2 (en) | 1982-03-01 |
Family
ID=14264190
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10007075A Granted JPS5224133A (en) | 1975-08-20 | 1975-08-20 | Plating method of nickellcopper alloy |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5224133A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5800930A (en) * | 1994-01-21 | 1998-09-01 | Olin Corporation | Nodular copper/nickel alloy treatment for copper foil |
WO2002022272A1 (en) * | 2000-09-13 | 2002-03-21 | Mintech Chemical Industries Pty Ltd | Aqueous copper composition |
AU2001287369B2 (en) * | 2000-09-13 | 2005-09-22 | Mintech Chemical Industries Pty Ltd | Aqueous copper composition |
US9828686B2 (en) | 2012-04-19 | 2017-11-28 | Dipsol Chemicals Co., Ltd. | Copper-nickel alloy electroplating bath and plating method |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103484904A (en) * | 2013-10-08 | 2014-01-01 | 昆山纯柏精密五金有限公司 | Copper plating process for iron-based hardware |
-
1975
- 1975-08-20 JP JP10007075A patent/JPS5224133A/en active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5800930A (en) * | 1994-01-21 | 1998-09-01 | Olin Corporation | Nodular copper/nickel alloy treatment for copper foil |
WO2002022272A1 (en) * | 2000-09-13 | 2002-03-21 | Mintech Chemical Industries Pty Ltd | Aqueous copper composition |
AU2001287369B2 (en) * | 2000-09-13 | 2005-09-22 | Mintech Chemical Industries Pty Ltd | Aqueous copper composition |
US9828686B2 (en) | 2012-04-19 | 2017-11-28 | Dipsol Chemicals Co., Ltd. | Copper-nickel alloy electroplating bath and plating method |
Also Published As
Publication number | Publication date |
---|---|
JPS5710957B2 (en) | 1982-03-01 |
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