JPS5224133A - Plating method of nickellcopper alloy - Google Patents

Plating method of nickellcopper alloy

Info

Publication number
JPS5224133A
JPS5224133A JP10007075A JP10007075A JPS5224133A JP S5224133 A JPS5224133 A JP S5224133A JP 10007075 A JP10007075 A JP 10007075A JP 10007075 A JP10007075 A JP 10007075A JP S5224133 A JPS5224133 A JP S5224133A
Authority
JP
Japan
Prior art keywords
nickellcopper
alloy
plating method
plating
nickellcopper alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10007075A
Other languages
Japanese (ja)
Other versions
JPS5710957B2 (en
Inventor
Takahiko Maekita
Ichiji Iwamoto
Tatsumi Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NITSUSHIN SEIKOU KK
Nippon Steel Nisshin Co Ltd
Original Assignee
NITSUSHIN SEIKOU KK
Nisshin Steel Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NITSUSHIN SEIKOU KK, Nisshin Steel Co Ltd filed Critical NITSUSHIN SEIKOU KK
Priority to JP10007075A priority Critical patent/JPS5224133A/en
Publication of JPS5224133A publication Critical patent/JPS5224133A/en
Publication of JPS5710957B2 publication Critical patent/JPS5710957B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating And Plating Baths Therefor (AREA)
JP10007075A 1975-08-20 1975-08-20 Plating method of nickellcopper alloy Granted JPS5224133A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10007075A JPS5224133A (en) 1975-08-20 1975-08-20 Plating method of nickellcopper alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10007075A JPS5224133A (en) 1975-08-20 1975-08-20 Plating method of nickellcopper alloy

Publications (2)

Publication Number Publication Date
JPS5224133A true JPS5224133A (en) 1977-02-23
JPS5710957B2 JPS5710957B2 (en) 1982-03-01

Family

ID=14264190

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10007075A Granted JPS5224133A (en) 1975-08-20 1975-08-20 Plating method of nickellcopper alloy

Country Status (1)

Country Link
JP (1) JPS5224133A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5800930A (en) * 1994-01-21 1998-09-01 Olin Corporation Nodular copper/nickel alloy treatment for copper foil
WO2002022272A1 (en) * 2000-09-13 2002-03-21 Mintech Chemical Industries Pty Ltd Aqueous copper composition
AU2001287369B2 (en) * 2000-09-13 2005-09-22 Mintech Chemical Industries Pty Ltd Aqueous copper composition
US9828686B2 (en) 2012-04-19 2017-11-28 Dipsol Chemicals Co., Ltd. Copper-nickel alloy electroplating bath and plating method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103484904A (en) * 2013-10-08 2014-01-01 昆山纯柏精密五金有限公司 Copper plating process for iron-based hardware

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5800930A (en) * 1994-01-21 1998-09-01 Olin Corporation Nodular copper/nickel alloy treatment for copper foil
WO2002022272A1 (en) * 2000-09-13 2002-03-21 Mintech Chemical Industries Pty Ltd Aqueous copper composition
AU2001287369B2 (en) * 2000-09-13 2005-09-22 Mintech Chemical Industries Pty Ltd Aqueous copper composition
US9828686B2 (en) 2012-04-19 2017-11-28 Dipsol Chemicals Co., Ltd. Copper-nickel alloy electroplating bath and plating method

Also Published As

Publication number Publication date
JPS5710957B2 (en) 1982-03-01

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