SG168473A1 - Electrolytic hard gold plating solution and plating method of using the same - Google Patents

Electrolytic hard gold plating solution and plating method of using the same

Info

Publication number
SG168473A1
SG168473A1 SG201004789-2A SG2010047892A SG168473A1 SG 168473 A1 SG168473 A1 SG 168473A1 SG 2010047892 A SG2010047892 A SG 2010047892A SG 168473 A1 SG168473 A1 SG 168473A1
Authority
SG
Singapore
Prior art keywords
gold plating
plating solution
same
electrolytic hard
hard gold
Prior art date
Application number
SG201004789-2A
Inventor
Furukawa Masato
Son Injoon
Original Assignee
N E Chemcat Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by N E Chemcat Corp filed Critical N E Chemcat Corp
Publication of SG168473A1 publication Critical patent/SG168473A1/en

Links

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

Electrolytic Hard Gold Plating Solution and Plating Method Using the Same [Task] To provide a gold plating solution which, in the partial plating for forming a Ni barrier layer in a connector material, can suppress the formation of gold plating film in the Ni barrier portion (an unintended portion) of the connector material.[Means for Achieving the Task] The formation of gold plating film in Ni barrier portion can be suppressed by conducting partial plating a connector material using an electrolytic hard gold plating solution containing a gold cyanide and/ or a salt thereof, a cobalt salt, a conductive organic acid salt, a nitro group-containing compound, and at least one kind of compound selected from the group consisting of a carboxylic acid, an oxycarboxylic acid, and salts thereof. [Selected Drawing]
SG201004789-2A 2009-07-14 2010-07-02 Electrolytic hard gold plating solution and plating method of using the same SG168473A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009165730A JP2011021217A (en) 2009-07-14 2009-07-14 Electrolytic hard-gold-plating liquid and plating method using the same

Publications (1)

Publication Number Publication Date
SG168473A1 true SG168473A1 (en) 2011-02-28

Family

ID=43483800

Family Applications (1)

Application Number Title Priority Date Filing Date
SG201004789-2A SG168473A1 (en) 2009-07-14 2010-07-02 Electrolytic hard gold plating solution and plating method of using the same

Country Status (4)

Country Link
JP (1) JP2011021217A (en)
KR (1) KR20110006589A (en)
CN (1) CN101956219A (en)
SG (1) SG168473A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5025815B1 (en) * 2011-08-10 2012-09-12 小島化学薬品株式会社 Hard gold plating solution
CN105862090B (en) * 2016-06-02 2017-05-03 深圳市联合蓝海科技开发有限公司 Cyanide-free sulfite gold plating solution and application thereof
JP7135880B2 (en) 2019-01-18 2022-09-13 株式会社オートネットワーク技術研究所 Connecting terminal
CN109913912A (en) * 2019-04-02 2019-06-21 深圳市昊扬电铸技术开发有限公司 A kind of electroforming solution for gold without cyanogen electroforming process

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5277790A (en) * 1992-07-10 1994-01-11 Technic Incorporated Non-cyanide electroplating solution for gold or alloys thereof
JP3124735B2 (en) * 1997-03-25 2001-01-15 メルテックス株式会社 Gold plating stripper
JP3692454B2 (en) * 1997-08-08 2005-09-07 日本エレクトロプレイテイング・エンジニヤース株式会社 Gold sulfite plating bath and gold salt replenisher for the plating bath
JP4945193B2 (en) * 2006-08-21 2012-06-06 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． Hard gold alloy plating solution
WO2009150915A1 (en) * 2008-06-11 2009-12-17 日本高純度化学株式会社 Electrolytic gold plating solution and gold film obtained using same
JP5513784B2 (en) * 2008-08-25 2014-06-04 日本エレクトロプレイテイング・エンジニヤース株式会社 Hard gold plating solution

Also Published As

Publication number Publication date
CN101956219A (en) 2011-01-26
KR20110006589A (en) 2011-01-20
JP2011021217A (en) 2011-02-03

Similar Documents

Publication Publication Date Title
IL217536A (en) Composition for copper electroplating comprising a source of copper ions and at least one additive, its use for electrodeposition and a process for depositing copper layer on a substrate
SG157311A1 (en) Printable compositions containing silver nanoparticles, processes for producing electrically conductive coatings using the same, and coatings prepared thereby
WO2013022635A3 (en) Method of controlling corrosion rate in downhole article, and downhole article having controlled corrosion rate
TW201129715A (en) Electroless plating solution for providing solar cell electrode
WO2009142848A3 (en) Electrochemical cell, and particularly a cell with electrodeposited fuel
PH12014502330A1 (en) Copper-nickel alloy electroplating bath and plating method
IN2014KN01179A (en)
TW201129714A (en) Method for improving plating on non-conductive substrates
EP1892321A3 (en) A Hard Gold Alloy Plating Bath
EP2067879A4 (en) Plated material having metal thin film formed by electroless plating, and method for production thereof
IL221243A (en) Heterocyclic inhibitors of glutaminyl cyclase (qc,ec 2.3.2.5)
MY163170A (en) Accelerator for curing resins
HRP20150178T1 (en) Magnetic coding system with deposit of magnetic areas produced by at least two magnetic ink types with different coercitive fields, deposited in an at least partial overlay
EP2067878A4 (en) Plated material having metal thin film formed by electroless plating, and method for production thereof
SG168473A1 (en) Electrolytic hard gold plating solution and plating method of using the same
WO2012076230A3 (en) Sodium ion conductor on sodium titanate basis
EP2458036A3 (en) Gold plating solution
TR201105083T1 (en) Process for producing an active cathode for electrolysis.
CL2012001300A1 (en) Process for preparing a compound of formula (i) in ionic salt form, comprising the steps of i) hydrogenating a compound of formula (ii) using a metallic catalyst with hydrogen and ii) filtering the catalyst followed by treatment with a solution acid or gas.
WO2012028416A3 (en) Gallium and indium electrodeposition processes
IT1397144B1 (en) PLATED SUBSTRATE NOT ELECTRICALLY COMPOSED OF NICKEL AND METHOD.
MX2011006157A (en) Trace elements.
WO2013181592A3 (en) Process for preparing dihalopyridines
WO2013072687A3 (en) Metal enhanced with conductive nanomaterial
PT2730682T (en) Alkaline, cyanide-free solution for electroplating of gold alloys, a method for electroplating and a substrate comprising a bright, corrosion-free deposit of a gold alloy