JPS5233074A - Surface treatment of printed circuit copper foil - Google Patents

Surface treatment of printed circuit copper foil

Info

Publication number
JPS5233074A
JPS5233074A JP10899775A JP10899775A JPS5233074A JP S5233074 A JPS5233074 A JP S5233074A JP 10899775 A JP10899775 A JP 10899775A JP 10899775 A JP10899775 A JP 10899775A JP S5233074 A JPS5233074 A JP S5233074A
Authority
JP
Japan
Prior art keywords
printed circuit
surface treatment
copper foil
circuit copper
foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10899775A
Other languages
Japanese (ja)
Inventor
Mitsuo Takahashi
Yoshio Kawasumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eneos Corp
Original Assignee
Nippon Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co Ltd filed Critical Nippon Mining Co Ltd
Priority to JP10899775A priority Critical patent/JPS5233074A/en
Publication of JPS5233074A publication Critical patent/JPS5233074A/en
Pending legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
JP10899775A 1975-09-10 1975-09-10 Surface treatment of printed circuit copper foil Pending JPS5233074A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10899775A JPS5233074A (en) 1975-09-10 1975-09-10 Surface treatment of printed circuit copper foil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10899775A JPS5233074A (en) 1975-09-10 1975-09-10 Surface treatment of printed circuit copper foil

Publications (1)

Publication Number Publication Date
JPS5233074A true JPS5233074A (en) 1977-03-12

Family

ID=14498951

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10899775A Pending JPS5233074A (en) 1975-09-10 1975-09-10 Surface treatment of printed circuit copper foil

Country Status (1)

Country Link
JP (1) JPS5233074A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5530818A (en) * 1978-08-25 1980-03-04 Mitsui Mining & Smelting Co Method of surface treating printed circuit copper foil
WO1991004358A1 (en) * 1989-09-13 1991-04-04 Gould, Inc. Electrodeposited foil with controlled properties for printed circuit board applications and procedures and electrolyte bath solutions for preparing the same
WO1991019024A1 (en) * 1990-05-30 1991-12-12 Gould, Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having low chloride ion concentrations
US5403465A (en) * 1990-05-30 1995-04-04 Gould Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives
US5431803A (en) * 1990-05-30 1995-07-11 Gould Electronics Inc. Electrodeposited copper foil and process for making same
US5958209A (en) * 1996-05-13 1999-09-28 Mitsui Mining & Smelting Co., Ltd. High tensile strength electrodeposited copper foil and process of electrodepositing thereof

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5530818A (en) * 1978-08-25 1980-03-04 Mitsui Mining & Smelting Co Method of surface treating printed circuit copper foil
JPS5641196B2 (en) * 1978-08-25 1981-09-26
WO1991004358A1 (en) * 1989-09-13 1991-04-04 Gould, Inc. Electrodeposited foil with controlled properties for printed circuit board applications and procedures and electrolyte bath solutions for preparing the same
US5215645A (en) * 1989-09-13 1993-06-01 Gould Inc. Electrodeposited foil with controlled properties for printed circuit board applications and procedures and electrolyte bath solutions for preparing the same
CN1093179C (en) * 1989-09-13 2002-10-23 古尔德有限公司 Electrodeposited foil with controlled properties for printed circuit board applications and procedures and electrolyte bath solutions for preparing same
WO1991019024A1 (en) * 1990-05-30 1991-12-12 Gould, Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having low chloride ion concentrations
US5403465A (en) * 1990-05-30 1995-04-04 Gould Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives
US5421985A (en) * 1990-05-30 1995-06-06 Gould Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having low chloride ion concentrations
US5431803A (en) * 1990-05-30 1995-07-11 Gould Electronics Inc. Electrodeposited copper foil and process for making same
US5454926A (en) * 1990-05-30 1995-10-03 Gould Electronics Inc. Electrodeposited copper foil
US5958209A (en) * 1996-05-13 1999-09-28 Mitsui Mining & Smelting Co., Ltd. High tensile strength electrodeposited copper foil and process of electrodepositing thereof
US6194056B1 (en) 1996-05-13 2001-02-27 Mitsui Mining & Smelting Co., Ltd. High tensile strength electrodeposited copper foil

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