JPS52145769A - Method of surface treating printed circuit copper foil - Google Patents

Method of surface treating printed circuit copper foil

Info

Publication number
JPS52145769A
JPS52145769A JP6238476A JP6238476A JPS52145769A JP S52145769 A JPS52145769 A JP S52145769A JP 6238476 A JP6238476 A JP 6238476A JP 6238476 A JP6238476 A JP 6238476A JP S52145769 A JPS52145769 A JP S52145769A
Authority
JP
Japan
Prior art keywords
printed circuit
copper foil
surface treating
circuit copper
treating printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6238476A
Other languages
Japanese (ja)
Other versions
JPS569028B2 (en
Inventor
Mitsuo Takahashi
Yoshio Kawasumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eneos Corp
Original Assignee
Nippon Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co Ltd filed Critical Nippon Mining Co Ltd
Priority to JP6238476A priority Critical patent/JPS52145769A/en
Priority to LU77436A priority patent/LU77436A1/xx
Priority to DE19772724074 priority patent/DE2724074C2/en
Priority to GB2292677A priority patent/GB1558919A/en
Publication of JPS52145769A publication Critical patent/JPS52145769A/en
Publication of JPS569028B2 publication Critical patent/JPS569028B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP6238476A 1976-05-31 1976-05-31 Method of surface treating printed circuit copper foil Granted JPS52145769A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP6238476A JPS52145769A (en) 1976-05-31 1976-05-31 Method of surface treating printed circuit copper foil
LU77436A LU77436A1 (en) 1976-05-31 1977-05-27
DE19772724074 DE2724074C2 (en) 1976-05-31 1977-05-27 Process for treating the surface of copper foils for printed circuits
GB2292677A GB1558919A (en) 1976-05-31 1977-05-31 Electrolytic surface treating process for copper foil for use in printed circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6238476A JPS52145769A (en) 1976-05-31 1976-05-31 Method of surface treating printed circuit copper foil

Publications (2)

Publication Number Publication Date
JPS52145769A true JPS52145769A (en) 1977-12-05
JPS569028B2 JPS569028B2 (en) 1981-02-26

Family

ID=13198566

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6238476A Granted JPS52145769A (en) 1976-05-31 1976-05-31 Method of surface treating printed circuit copper foil

Country Status (4)

Country Link
JP (1) JPS52145769A (en)
DE (1) DE2724074C2 (en)
GB (1) GB1558919A (en)
LU (1) LU77436A1 (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56155592A (en) * 1980-04-03 1981-12-01 Furukawa Circuit Foil Copper foil for printed circuit and method of manufacturing same
US5800930A (en) * 1994-01-21 1998-09-01 Olin Corporation Nodular copper/nickel alloy treatment for copper foil
US7108923B1 (en) 2005-05-16 2006-09-19 Hitachi Cable, Ltd. Copper foil for printed circuit board with taking environmental conservation into consideration
US7344785B2 (en) 2005-05-16 2008-03-18 Hitachi Cable, Ltd. Copper foil for printed circuit board, method for fabricating same, and trivalent chromium conversion treatment solution used for fabricating same
WO2009041292A1 (en) 2007-09-28 2009-04-02 Nippon Mining & Metals Co., Ltd. Copper foil for printed circuit and copper clad laminate
WO2010061736A1 (en) 2008-11-25 2010-06-03 日鉱金属株式会社 Copper foil for printed circuit
US7842397B2 (en) 2005-09-27 2010-11-30 Hitachi Cable, Ltd. Nickel plating solution and its preparation method, nickel plating method and printed wiring board copper foil
WO2011078077A1 (en) 2009-12-24 2011-06-30 Jx日鉱日石金属株式会社 Surface-treated copper foil
WO2011138876A1 (en) 2010-05-07 2011-11-10 Jx日鉱日石金属株式会社 Copper foil for printed circuit
EP2590487A1 (en) 2011-11-03 2013-05-08 Nan-Ya Plastics Corporation Process to manufacture fine grain surface copper foil with high peeling strength and environmental protection for printed circuit boards
US9115441B2 (en) 2011-10-18 2015-08-25 Nan Ya Plastics Corporation Process to manufacture surface fine grain copper foil with high peeling strength and environmental protection for printed circuit boards
JP2015161000A (en) * 2014-02-27 2015-09-07 新光電気工業株式会社 electroplating bath and electroplating method
KR20150119489A (en) 2011-03-30 2015-10-23 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 Copper foil for printed circuit
KR20170077280A (en) 2012-09-28 2017-07-05 제이엑스금속주식회사 Copper foil provided with carrier, and copper-clad laminate using said copper foil provided with carrier
WO2018193935A1 (en) * 2017-04-17 2018-10-25 住友金属鉱山株式会社 Conductive substrate and method for producing conductive substrate

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61194323A (en) * 1985-02-22 1986-08-28 Riide Denki Kk Radiation thermometer
JPS6249735U (en) * 1985-09-14 1987-03-27
JP5654416B2 (en) 2011-06-07 2015-01-14 Jx日鉱日石金属株式会社 Liquid crystal polymer copper clad laminate and copper foil used for the laminate

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3220897A (en) * 1961-02-13 1965-11-30 Esther S Conley Conducting element and method
US3585010A (en) * 1968-10-03 1971-06-15 Clevite Corp Printed circuit board and method of making same

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56155592A (en) * 1980-04-03 1981-12-01 Furukawa Circuit Foil Copper foil for printed circuit and method of manufacturing same
JPS6255713B2 (en) * 1980-04-03 1987-11-20 Furukawa Saakitsuto Fuoiru Kk
US5800930A (en) * 1994-01-21 1998-09-01 Olin Corporation Nodular copper/nickel alloy treatment for copper foil
US7108923B1 (en) 2005-05-16 2006-09-19 Hitachi Cable, Ltd. Copper foil for printed circuit board with taking environmental conservation into consideration
US7344785B2 (en) 2005-05-16 2008-03-18 Hitachi Cable, Ltd. Copper foil for printed circuit board, method for fabricating same, and trivalent chromium conversion treatment solution used for fabricating same
US7842397B2 (en) 2005-09-27 2010-11-30 Hitachi Cable, Ltd. Nickel plating solution and its preparation method, nickel plating method and printed wiring board copper foil
WO2009041292A1 (en) 2007-09-28 2009-04-02 Nippon Mining & Metals Co., Ltd. Copper foil for printed circuit and copper clad laminate
WO2010061736A1 (en) 2008-11-25 2010-06-03 日鉱金属株式会社 Copper foil for printed circuit
WO2011078077A1 (en) 2009-12-24 2011-06-30 Jx日鉱日石金属株式会社 Surface-treated copper foil
WO2011138876A1 (en) 2010-05-07 2011-11-10 Jx日鉱日石金属株式会社 Copper foil for printed circuit
KR20150119489A (en) 2011-03-30 2015-10-23 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 Copper foil for printed circuit
US9115441B2 (en) 2011-10-18 2015-08-25 Nan Ya Plastics Corporation Process to manufacture surface fine grain copper foil with high peeling strength and environmental protection for printed circuit boards
EP2590487A1 (en) 2011-11-03 2013-05-08 Nan-Ya Plastics Corporation Process to manufacture fine grain surface copper foil with high peeling strength and environmental protection for printed circuit boards
KR20170077280A (en) 2012-09-28 2017-07-05 제이엑스금속주식회사 Copper foil provided with carrier, and copper-clad laminate using said copper foil provided with carrier
JP2015161000A (en) * 2014-02-27 2015-09-07 新光電気工業株式会社 electroplating bath and electroplating method
WO2018193935A1 (en) * 2017-04-17 2018-10-25 住友金属鉱山株式会社 Conductive substrate and method for producing conductive substrate
JPWO2018193935A1 (en) * 2017-04-17 2020-03-05 住友金属鉱山株式会社 Conductive substrate, method of manufacturing conductive substrate

Also Published As

Publication number Publication date
DE2724074A1 (en) 1977-12-15
JPS569028B2 (en) 1981-02-26
GB1558919A (en) 1980-01-09
DE2724074C2 (en) 1982-05-13
LU77436A1 (en) 1977-09-09

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