LU77436A1 - - Google Patents

Info

Publication number
LU77436A1
LU77436A1 LU77436A LU77436A LU77436A1 LU 77436 A1 LU77436 A1 LU 77436A1 LU 77436 A LU77436 A LU 77436A LU 77436 A LU77436 A LU 77436A LU 77436 A1 LU77436 A1 LU 77436A1
Authority
LU
Luxembourg
Application number
LU77436A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of LU77436A1 publication Critical patent/LU77436A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
LU77436A 1976-05-31 1977-05-27 LU77436A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6238476A JPS52145769A (en) 1976-05-31 1976-05-31 Method of surface treating printed circuit copper foil

Publications (1)

Publication Number Publication Date
LU77436A1 true LU77436A1 (en) 1977-09-09

Family

ID=13198566

Family Applications (1)

Application Number Title Priority Date Filing Date
LU77436A LU77436A1 (en) 1976-05-31 1977-05-27

Country Status (4)

Country Link
JP (1) JPS52145769A (en)
DE (1) DE2724074C2 (en)
GB (1) GB1558919A (en)
LU (1) LU77436A1 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56155592A (en) * 1980-04-03 1981-12-01 Furukawa Circuit Foil Copper foil for printed circuit and method of manufacturing same
JPS61194323A (en) * 1985-02-22 1986-08-28 Riide Denki Kk Radiation thermometer
JPS6249735U (en) * 1985-09-14 1987-03-27
TW317575B (en) * 1994-01-21 1997-10-11 Olin Corp
JP4492434B2 (en) 2005-05-16 2010-06-30 日立電線株式会社 Copper foil for printed wiring board, method for producing the same, and trivalent chromium chemical conversion treatment solution used for the production
JP4626390B2 (en) 2005-05-16 2011-02-09 日立電線株式会社 Copper foil for printed wiring boards in consideration of environmental protection
JP4904933B2 (en) 2005-09-27 2012-03-28 日立電線株式会社 Nickel plating solution and manufacturing method thereof, nickel plating method and copper foil for printed wiring board
WO2009041292A1 (en) 2007-09-28 2009-04-02 Nippon Mining & Metals Co., Ltd. Copper foil for printed circuit and copper clad laminate
WO2010061736A1 (en) 2008-11-25 2010-06-03 日鉱金属株式会社 Copper foil for printed circuit
US20120276412A1 (en) 2009-12-24 2012-11-01 Jx Nippon Mining & Metals Corporation Surface-Treated Copper Foil
EP2557204A1 (en) 2010-05-07 2013-02-13 JX Nippon Mining & Metals Corp. Copper foil for printed circuit
MY165091A (en) 2011-03-30 2018-02-28 Jx Nippon Mining & Metals Corp Copper foil for printed circuit
JP5654416B2 (en) 2011-06-07 2015-01-14 Jx日鉱日石金属株式会社 Liquid crystal polymer copper clad laminate and copper foil used for the laminate
US9115441B2 (en) 2011-10-18 2015-08-25 Nan Ya Plastics Corporation Process to manufacture surface fine grain copper foil with high peeling strength and environmental protection for printed circuit boards
EP2590487B1 (en) 2011-11-03 2014-05-14 Nan-Ya Plastics Corporation Process to manufacture fine grain surface copper foil with high peeling strength and environmental protection for printed circuit boards
WO2014051123A1 (en) 2012-09-28 2014-04-03 Jx日鉱日石金属株式会社 Copper foil provided with carrier, and copper-clad laminate using said copper foil provided with carrier
JP6422658B2 (en) * 2014-02-27 2018-11-14 新光電気工業株式会社 Electroplating bath and electroplating method
WO2018193935A1 (en) * 2017-04-17 2018-10-25 住友金属鉱山株式会社 Conductive substrate and method for producing conductive substrate

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3220897A (en) * 1961-02-13 1965-11-30 Esther S Conley Conducting element and method
US3585010A (en) * 1968-10-03 1971-06-15 Clevite Corp Printed circuit board and method of making same

Also Published As

Publication number Publication date
DE2724074C2 (en) 1982-05-13
JPS569028B2 (en) 1981-02-26
DE2724074A1 (en) 1977-12-15
JPS52145769A (en) 1977-12-05
GB1558919A (en) 1980-01-09

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Legal Events

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