JPS5286160A - Method of producing printed circuit board - Google Patents

Method of producing printed circuit board

Info

Publication number
JPS5286160A
JPS5286160A JP243776A JP243776A JPS5286160A JP S5286160 A JPS5286160 A JP S5286160A JP 243776 A JP243776 A JP 243776A JP 243776 A JP243776 A JP 243776A JP S5286160 A JPS5286160 A JP S5286160A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
producing printed
producing
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP243776A
Other languages
Japanese (ja)
Inventor
Kanji Murakami
Mineo Kawamoto
Mototsugu Kazushima
Yasusada Morishita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP243776A priority Critical patent/JPS5286160A/en
Priority to DE19772700868 priority patent/DE2700868B2/en
Publication of JPS5286160A publication Critical patent/JPS5286160A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0344—Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
JP243776A 1976-01-13 1976-01-13 Method of producing printed circuit board Pending JPS5286160A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP243776A JPS5286160A (en) 1976-01-13 1976-01-13 Method of producing printed circuit board
DE19772700868 DE2700868B2 (en) 1976-01-13 1977-01-11 Process for the production of printed circuit boards with film resistors and conductor tracks

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP243776A JPS5286160A (en) 1976-01-13 1976-01-13 Method of producing printed circuit board

Publications (1)

Publication Number Publication Date
JPS5286160A true JPS5286160A (en) 1977-07-18

Family

ID=11529234

Family Applications (1)

Application Number Title Priority Date Filing Date
JP243776A Pending JPS5286160A (en) 1976-01-13 1976-01-13 Method of producing printed circuit board

Country Status (2)

Country Link
JP (1) JPS5286160A (en)
DE (1) DE2700868B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5388955A (en) * 1976-12-22 1978-08-04 Du Pont Method of forming plated hole in printed circuit element
JPS5388956A (en) * 1976-12-22 1978-08-04 Du Pont Method of producing printed circuit element
JPS59164156A (en) * 1983-03-09 1984-09-17 Oki Electric Ind Co Ltd Thermal head
WO2001037620A1 (en) * 1999-11-18 2001-05-25 Ibiden Co., Ltd. Resistor structure of wiring board

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2803762A1 (en) * 1978-01-28 1979-08-02 Licentia Gmbh Wet chemical mfr. of electronic circuit networks - using photolacquer and electroless plating to obtain resistors of different values
DE68916085T2 (en) * 1988-03-28 1994-09-22 Hitachi Chemical Co Ltd Process for the production of printed circuit boards.

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5388955A (en) * 1976-12-22 1978-08-04 Du Pont Method of forming plated hole in printed circuit element
JPS5388956A (en) * 1976-12-22 1978-08-04 Du Pont Method of producing printed circuit element
JPS5748878B2 (en) * 1976-12-22 1982-10-19
JPS5823957B2 (en) * 1976-12-22 1983-05-18 イ−・アイ・デュポン・ド・ネモア−ス・アンド・コンパニ− Method of forming plating holes in printed circuit elements
JPS59164156A (en) * 1983-03-09 1984-09-17 Oki Electric Ind Co Ltd Thermal head
JPH0254786B2 (en) * 1983-03-09 1990-11-22 Oki Electric Ind Co Ltd
WO2001037620A1 (en) * 1999-11-18 2001-05-25 Ibiden Co., Ltd. Resistor structure of wiring board

Also Published As

Publication number Publication date
DE2700868A1 (en) 1977-07-21
DE2700868B2 (en) 1979-08-16

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