DE2700868B2 - - Google Patents

Info

Publication number
DE2700868B2
DE2700868B2 DE19772700868 DE2700868A DE2700868B2 DE 2700868 B2 DE2700868 B2 DE 2700868B2 DE 19772700868 DE19772700868 DE 19772700868 DE 2700868 A DE2700868 A DE 2700868A DE 2700868 B2 DE2700868 B2 DE 2700868B2
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19772700868
Other versions
DE2700868A1 (en
Inventor
Hirosada Morishita
Motoyo Wajima
Mineo Kawamoto
Kanji Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP243776A priority Critical patent/JPS5286160A/en
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE2700868A1 publication Critical patent/DE2700868A1/en
Publication of DE2700868B2 publication Critical patent/DE2700868B2/de
Application status is Withdrawn legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0344Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0347Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • H05K3/425Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
DE19772700868 1976-01-13 1977-01-11 Withdrawn DE2700868B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP243776A JPS5286160A (en) 1976-01-13 1976-01-13 Method of producing printed circuit board

Publications (2)

Publication Number Publication Date
DE2700868A1 DE2700868A1 (en) 1977-07-21
DE2700868B2 true DE2700868B2 (en) 1979-08-16

Family

ID=11529234

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19772700868 Withdrawn DE2700868B2 (en) 1976-01-13 1977-01-11

Country Status (2)

Country Link
JP (1) JPS5286160A (en)
DE (1) DE2700868B2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4054479A (en) * 1976-12-22 1977-10-18 E. I. Du Pont De Nemours And Company Additive process for producing printed circuit elements using a self-supported photosensitive sheet
US4054483A (en) * 1976-12-22 1977-10-18 E. I. Du Pont De Nemours And Company Additives process for producing plated holes in printed circuit elements
DE2803762A1 (en) * 1978-01-28 1979-08-02 Licentia Gmbh Wet chemical mfr. of electronic circuit networks - using photolacquer and electroless plating to obtain resistors of different values
JPH0254786B2 (en) * 1983-03-09 1990-11-22 Oki Electric Ind Co Ltd
DE68916085T2 (en) * 1988-03-28 1994-09-22 Hitachi Chemical Co Ltd A process for the production of printed circuit boards.

Also Published As

Publication number Publication date
JPS5286160A (en) 1977-07-18
DE2700868A1 (en) 1977-07-21

Similar Documents

Publication Publication Date Title
DE2621370B2 (en)
DE2647404C2 (en)
CH594210A5 (en)
DE2634152B2 (en)
DE2700173C3 (en)
DE2700590C3 (en)
DE2721009C3 (en)
DE2722090C2 (en)
DE2610632C2 (en)
DE2614615C3 (en)
DE2620254C2 (en)
CH606993A5 (en)
DE2635156B2 (en)
DE2700721B2 (en)
CH594474A5 (en)
DE2708297C3 (en)
DE2715475C2 (en)
DE2713953C3 (en)
DE2611937C3 (en)
CH595249A5 (en)
DE2649797C2 (en)
DE2626459B2 (en)
CH610769A5 (en)
DE2646019C3 (en)
CS177740B1 (en)

Legal Events

Date Code Title Description
BHN Withdrawal