JPS5330777A - Method of producing printed circuit board - Google Patents
Method of producing printed circuit boardInfo
- Publication number
- JPS5330777A JPS5330777A JP10532876A JP10532876A JPS5330777A JP S5330777 A JPS5330777 A JP S5330777A JP 10532876 A JP10532876 A JP 10532876A JP 10532876 A JP10532876 A JP 10532876A JP S5330777 A JPS5330777 A JP S5330777A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- producing printed
- producing
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10532876A JPS59998B2 (en) | 1976-09-01 | 1976-09-01 | Printed wiring board manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10532876A JPS59998B2 (en) | 1976-09-01 | 1976-09-01 | Printed wiring board manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5330777A true JPS5330777A (en) | 1978-03-23 |
JPS59998B2 JPS59998B2 (en) | 1984-01-10 |
Family
ID=14404643
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10532876A Expired JPS59998B2 (en) | 1976-09-01 | 1976-09-01 | Printed wiring board manufacturing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59998B2 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54155472A (en) * | 1978-05-29 | 1979-12-07 | Tdk Electronics Co Ltd | Method of coating printed circuit board with adhesive |
JPS5880894A (en) * | 1981-11-10 | 1983-05-16 | パイオニア株式会社 | Method of producing printed board |
JPS58180090A (en) * | 1982-04-15 | 1983-10-21 | 松下電器産業株式会社 | Method of mounting electronic part |
JPS58180091A (en) * | 1982-04-15 | 1983-10-21 | 松下電器産業株式会社 | Method of bonding leadless electronic part |
JPS58222591A (en) * | 1982-06-18 | 1983-12-24 | 松下電器産業株式会社 | Method of mounting electronic part |
JPS59113691A (en) * | 1982-12-20 | 1984-06-30 | 松下電器産業株式会社 | Method of mounting electronic part |
JPS6077495A (en) * | 1983-10-05 | 1985-05-02 | 松下電器産業株式会社 | Method of mounting electronic part |
-
1976
- 1976-09-01 JP JP10532876A patent/JPS59998B2/en not_active Expired
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54155472A (en) * | 1978-05-29 | 1979-12-07 | Tdk Electronics Co Ltd | Method of coating printed circuit board with adhesive |
JPS5880894A (en) * | 1981-11-10 | 1983-05-16 | パイオニア株式会社 | Method of producing printed board |
JPS58180090A (en) * | 1982-04-15 | 1983-10-21 | 松下電器産業株式会社 | Method of mounting electronic part |
JPS58180091A (en) * | 1982-04-15 | 1983-10-21 | 松下電器産業株式会社 | Method of bonding leadless electronic part |
JPS6361795B2 (en) * | 1982-04-15 | 1988-11-30 | ||
JPS58222591A (en) * | 1982-06-18 | 1983-12-24 | 松下電器産業株式会社 | Method of mounting electronic part |
JPH0311118B2 (en) * | 1982-06-18 | 1991-02-15 | Matsushita Electric Ind Co Ltd | |
JPS59113691A (en) * | 1982-12-20 | 1984-06-30 | 松下電器産業株式会社 | Method of mounting electronic part |
JPS6077495A (en) * | 1983-10-05 | 1985-05-02 | 松下電器産業株式会社 | Method of mounting electronic part |
Also Published As
Publication number | Publication date |
---|---|
JPS59998B2 (en) | 1984-01-10 |
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