JPS5271348A - Surface treatment for copper foil of printed circuits - Google Patents

Surface treatment for copper foil of printed circuits

Info

Publication number
JPS5271348A
JPS5271348A JP14746075A JP14746075A JPS5271348A JP S5271348 A JPS5271348 A JP S5271348A JP 14746075 A JP14746075 A JP 14746075A JP 14746075 A JP14746075 A JP 14746075A JP S5271348 A JPS5271348 A JP S5271348A
Authority
JP
Japan
Prior art keywords
surface treatment
copper foil
printed circuits
printed
circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14746075A
Other languages
Japanese (ja)
Other versions
JPS586800B2 (en
Inventor
Mitsuo Takahashi
Yoshio Kawasumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eneos Corp
Original Assignee
Nippon Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co Ltd filed Critical Nippon Mining Co Ltd
Priority to JP50147460A priority Critical patent/JPS586800B2/en
Publication of JPS5271348A publication Critical patent/JPS5271348A/en
Publication of JPS586800B2 publication Critical patent/JPS586800B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Electrochemical Coating By Surface Reaction (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemical Treatment Of Metals (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP50147460A 1975-12-12 1975-12-12 Insatsu Kairo Youdou Hakuo Hiyou Menshiyo Risuru Hohou Expired JPS586800B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50147460A JPS586800B2 (en) 1975-12-12 1975-12-12 Insatsu Kairo Youdou Hakuo Hiyou Menshiyo Risuru Hohou

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50147460A JPS586800B2 (en) 1975-12-12 1975-12-12 Insatsu Kairo Youdou Hakuo Hiyou Menshiyo Risuru Hohou

Publications (2)

Publication Number Publication Date
JPS5271348A true JPS5271348A (en) 1977-06-14
JPS586800B2 JPS586800B2 (en) 1983-02-07

Family

ID=15430857

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50147460A Expired JPS586800B2 (en) 1975-12-12 1975-12-12 Insatsu Kairo Youdou Hakuo Hiyou Menshiyo Risuru Hohou

Country Status (1)

Country Link
JP (1) JPS586800B2 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02306697A (en) * 1989-05-22 1990-12-20 Matsushita Electric Works Ltd Multilayer interconnection substrate
WO2006124693A3 (en) * 2005-05-16 2006-12-28 3M Innovative Properties Co Method and composition for improving adhesion of organic polymer coatings with copper surface
WO2020226160A1 (en) * 2019-05-09 2020-11-12 ナミックス株式会社 Composite copper member
WO2020226161A1 (en) * 2019-05-09 2020-11-12 ナミックス株式会社 Composite copper member
WO2020226158A1 (en) * 2019-05-09 2020-11-12 ナミックス株式会社 Apparatus for processing copper surface
JP2020183572A (en) * 2019-05-09 2020-11-12 ナミックス株式会社 Production method of metallic component having metal layer
JP2020186464A (en) * 2019-05-09 2020-11-19 ナミックス株式会社 Composite copper member

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4826587A (en) * 1971-07-21 1973-04-07

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4826587A (en) * 1971-07-21 1973-04-07

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02306697A (en) * 1989-05-22 1990-12-20 Matsushita Electric Works Ltd Multilayer interconnection substrate
WO2006124693A3 (en) * 2005-05-16 2006-12-28 3M Innovative Properties Co Method and composition for improving adhesion of organic polymer coatings with copper surface
WO2020226160A1 (en) * 2019-05-09 2020-11-12 ナミックス株式会社 Composite copper member
WO2020226161A1 (en) * 2019-05-09 2020-11-12 ナミックス株式会社 Composite copper member
WO2020226158A1 (en) * 2019-05-09 2020-11-12 ナミックス株式会社 Apparatus for processing copper surface
JP2020183572A (en) * 2019-05-09 2020-11-12 ナミックス株式会社 Production method of metallic component having metal layer
JP2020183573A (en) * 2019-05-09 2020-11-12 ナミックス株式会社 Composite copper member
JP2020183571A (en) * 2019-05-09 2020-11-12 ナミックス株式会社 Processing device of copper surface
WO2020226159A1 (en) * 2019-05-09 2020-11-12 ナミックス株式会社 Method for manufacturing metal member having metal layer
JP2020186464A (en) * 2019-05-09 2020-11-19 ナミックス株式会社 Composite copper member
CN113412348A (en) * 2019-05-09 2021-09-17 纳美仕有限公司 Processing device for copper surface
CN113614284A (en) * 2019-05-09 2021-11-05 纳美仕有限公司 Method for producing metal material having metal layer
CN113661275A (en) * 2019-05-09 2021-11-16 纳美仕有限公司 Composite copper component
JP2023067878A (en) * 2019-05-09 2023-05-16 ナミックス株式会社 Composite copper member

Also Published As

Publication number Publication date
JPS586800B2 (en) 1983-02-07

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