JPS5641196B2 - - Google Patents
Info
- Publication number
- JPS5641196B2 JPS5641196B2 JP10291678A JP10291678A JPS5641196B2 JP S5641196 B2 JPS5641196 B2 JP S5641196B2 JP 10291678 A JP10291678 A JP 10291678A JP 10291678 A JP10291678 A JP 10291678A JP S5641196 B2 JPS5641196 B2 JP S5641196B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10291678A JPS5530818A (en) | 1978-08-25 | 1978-08-25 | Method of surface treating printed circuit copper foil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10291678A JPS5530818A (en) | 1978-08-25 | 1978-08-25 | Method of surface treating printed circuit copper foil |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5530818A JPS5530818A (en) | 1980-03-04 |
| JPS5641196B2 true JPS5641196B2 (en) | 1981-09-26 |
Family
ID=14340172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10291678A Granted JPS5530818A (en) | 1978-08-25 | 1978-08-25 | Method of surface treating printed circuit copper foil |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5530818A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6041699U (en) * | 1983-08-31 | 1985-03-23 | 日研化工株式会社 | Gas cylinder moving part support device |
| JPS6233117Y2 (en) * | 1981-07-07 | 1987-08-24 | ||
| EP0758840A4 (en) * | 1995-02-16 | 1998-09-23 | Mitsui Mining & Smelting Co | Copper foil and high-density multi-layered printed circuit board using the copper foil for inner layer circuit |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01246393A (en) * | 1988-03-25 | 1989-10-02 | Fukuda Metal Foil & Powder Co Ltd | Surface treatment of copper foil for inner layer or copper lined laminated sheet |
| JP4567360B2 (en) * | 2004-04-02 | 2010-10-20 | 三井金属鉱業株式会社 | Copper foil manufacturing method and copper foil obtained by the manufacturing method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5233074A (en) * | 1975-09-10 | 1977-03-12 | Nippon Mining Co | Surface treatment of printed circuit copper foil |
| JPS5269125A (en) * | 1975-12-05 | 1977-06-08 | Borg Warner | Case for automatic transmission of fourrwheel driving system |
-
1978
- 1978-08-25 JP JP10291678A patent/JPS5530818A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5233074A (en) * | 1975-09-10 | 1977-03-12 | Nippon Mining Co | Surface treatment of printed circuit copper foil |
| JPS5269125A (en) * | 1975-12-05 | 1977-06-08 | Borg Warner | Case for automatic transmission of fourrwheel driving system |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6233117Y2 (en) * | 1981-07-07 | 1987-08-24 | ||
| JPS6041699U (en) * | 1983-08-31 | 1985-03-23 | 日研化工株式会社 | Gas cylinder moving part support device |
| EP0758840A4 (en) * | 1995-02-16 | 1998-09-23 | Mitsui Mining & Smelting Co | Copper foil and high-density multi-layered printed circuit board using the copper foil for inner layer circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5530818A (en) | 1980-03-04 |