CN104332454B - 半导体装置 - Google Patents
半导体装置 Download PDFInfo
- Publication number
- CN104332454B CN104332454B CN201410486030.8A CN201410486030A CN104332454B CN 104332454 B CN104332454 B CN 104332454B CN 201410486030 A CN201410486030 A CN 201410486030A CN 104332454 B CN104332454 B CN 104332454B
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- CN
- China
- Prior art keywords
- pattern
- chip
- salient pole
- radiating
- semiconductor device
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
- H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8138—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/81385—Shape, e.g. interlocking features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Geometry (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (7)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009-166975 | 2009-07-15 | ||
JP2009166975A JP5325684B2 (ja) | 2009-07-15 | 2009-07-15 | 半導体装置 |
CN201010222675.2A CN101958295B (zh) | 2009-07-15 | 2010-06-30 | 半导体装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010222675.2A Division CN101958295B (zh) | 2009-07-15 | 2010-06-30 | 半导体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104332454A CN104332454A (zh) | 2015-02-04 |
CN104332454B true CN104332454B (zh) | 2017-04-12 |
Family
ID=43464699
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310356421.3A Active CN103500735B (zh) | 2009-07-15 | 2010-06-30 | 半导体装置 |
CN201410239237.5A Active CN104037156B (zh) | 2009-07-15 | 2010-06-30 | 半导体装置 |
CN201010222675.2A Active CN101958295B (zh) | 2009-07-15 | 2010-06-30 | 半导体装置 |
CN201410486030.8A Active CN104332454B (zh) | 2009-07-15 | 2010-06-30 | 半导体装置 |
Family Applications Before (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310356421.3A Active CN103500735B (zh) | 2009-07-15 | 2010-06-30 | 半导体装置 |
CN201410239237.5A Active CN104037156B (zh) | 2009-07-15 | 2010-06-30 | 半导体装置 |
CN201010222675.2A Active CN101958295B (zh) | 2009-07-15 | 2010-06-30 | 半导体装置 |
Country Status (4)
Country | Link |
---|---|
US (5) | US8384230B2 (zh) |
JP (1) | JP5325684B2 (zh) |
CN (4) | CN103500735B (zh) |
HK (2) | HK1199554A1 (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5325684B2 (ja) | 2009-07-15 | 2013-10-23 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP5405679B2 (ja) * | 2013-01-25 | 2014-02-05 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP2016115751A (ja) * | 2014-12-12 | 2016-06-23 | ラピスセミコンダクタ株式会社 | 半導体パッケージ |
JP6307697B1 (ja) * | 2016-05-10 | 2018-04-11 | オリンパス株式会社 | 電子回路ユニット、撮像ユニット、撮像モジュールおよび内視鏡 |
JP7025948B2 (ja) * | 2018-02-13 | 2022-02-25 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
KR102628847B1 (ko) * | 2019-06-12 | 2024-01-25 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
JP6973861B2 (ja) * | 2019-08-28 | 2021-12-01 | Necプラットフォームズ株式会社 | 半導体装置、電子機器及び半導体装置の製造方法 |
Citations (2)
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US4961107A (en) * | 1989-04-03 | 1990-10-02 | Motorola Inc. | Electrically isolated heatsink for single-in-line package |
CN1514422A (zh) * | 2002-08-30 | 2004-07-21 | ������������ʽ���� | 电子模块及其制造方法、驱动方法、电子仪器 |
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JPS6484625A (en) * | 1987-09-28 | 1989-03-29 | Toshiba Corp | Semiconductor integrated circuit device using film carrier |
JP2000174075A (ja) | 1991-09-20 | 2000-06-23 | Hitachi Ltd | 液晶ドライバ用テ―プキャリアパッケ―ジ及び液晶表示装置 |
JPH06252285A (ja) * | 1993-02-24 | 1994-09-09 | Fuji Xerox Co Ltd | 回路基板 |
US6683594B1 (en) * | 1995-04-20 | 2004-01-27 | Canon Kabushiki Kaisha | Display apparatus and assembly of its driving circuit |
DE69629982T2 (de) | 1995-06-30 | 2004-07-22 | Eastman Kodak Co. | Zoomobjektiv ### |
JP3524549B1 (ja) * | 1996-03-26 | 2004-05-10 | キヤノン株式会社 | 接続構造体及び表示装置 |
CN1172800C (zh) * | 1998-11-04 | 2004-10-27 | 松下电器产业株式会社 | 喷墨印头及其制造方法 |
US6744120B1 (en) * | 1999-03-11 | 2004-06-01 | Seiko Epson Corporation | Flexible interconnect substrate of a tape-shaped semiconductor device, semiconductor device and circuit board |
JP3666318B2 (ja) * | 1999-09-27 | 2005-06-29 | セイコーエプソン株式会社 | 電気光学装置及びそれを用いた電子機器並びに表示駆動ic |
JP2002093861A (ja) | 2000-09-12 | 2002-03-29 | Mitsui Mining & Smelting Co Ltd | 2メタルtab及び両面csp、bgaテープ、並びにその製造方法 |
JP3536023B2 (ja) * | 2000-10-13 | 2004-06-07 | シャープ株式会社 | Cof用テープキャリアおよびこれを用いて製造されるcof構造の半導体装置 |
JP2003068804A (ja) | 2001-08-22 | 2003-03-07 | Mitsui Mining & Smelting Co Ltd | 電子部品実装用基板 |
JP4176979B2 (ja) * | 2001-09-27 | 2008-11-05 | パイオニア株式会社 | フラットパネル型表示装置 |
JP4776861B2 (ja) * | 2002-09-26 | 2011-09-21 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
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JP5273333B2 (ja) * | 2006-12-28 | 2013-08-28 | 株式会社ジャパンディスプレイ | 表示装置 |
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JP4185954B2 (ja) | 2007-01-19 | 2008-11-26 | シャープ株式会社 | フレキシブル基板及び半導体装置 |
JP2008205142A (ja) * | 2007-02-20 | 2008-09-04 | Sumitomo Metal Mining Package Materials Co Ltd | Cof用配線基板とその製造方法、並びに半導体装置 |
JP4378387B2 (ja) | 2007-02-27 | 2009-12-02 | Okiセミコンダクタ株式会社 | 半導体パッケージ及びその製造方法 |
JP4983386B2 (ja) * | 2007-05-15 | 2012-07-25 | 住友金属鉱山株式会社 | Cof用配線基板 |
US20090020316A1 (en) * | 2007-07-19 | 2009-01-22 | Chia-Hui Wu | Method of manufacturing chip on film and structure thereof |
JP4975584B2 (ja) * | 2007-10-26 | 2012-07-11 | ルネサスエレクトロニクス株式会社 | 半導体装置及び半導体装置の製造方法。 |
JP4344766B2 (ja) * | 2007-11-30 | 2009-10-14 | シャープ株式会社 | ソースドライバ、ソースドライバの製造方法、および液晶モジュール |
JP5325684B2 (ja) | 2009-07-15 | 2013-10-23 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
-
2009
- 2009-07-15 JP JP2009166975A patent/JP5325684B2/ja active Active
-
2010
- 2010-06-02 US US12/801,303 patent/US8384230B2/en active Active
- 2010-06-30 CN CN201310356421.3A patent/CN103500735B/zh active Active
- 2010-06-30 CN CN201410239237.5A patent/CN104037156B/zh active Active
- 2010-06-30 CN CN201010222675.2A patent/CN101958295B/zh active Active
- 2010-06-30 CN CN201410486030.8A patent/CN104332454B/zh active Active
-
2013
- 2013-02-08 US US13/762,512 patent/US8686574B2/en active Active
-
2014
- 2014-02-21 US US14/186,592 patent/US8975762B2/en active Active
- 2014-12-29 HK HK14113041.6A patent/HK1199554A1/zh unknown
-
2015
- 2015-01-14 US US14/596,991 patent/US20150123274A1/en not_active Abandoned
- 2015-05-22 HK HK15104900.4A patent/HK1204507A1/zh unknown
-
2019
- 2019-10-31 US US16/670,725 patent/US11244883B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4961107A (en) * | 1989-04-03 | 1990-10-02 | Motorola Inc. | Electrically isolated heatsink for single-in-line package |
CN1514422A (zh) * | 2002-08-30 | 2004-07-21 | ������������ʽ���� | 电子模块及其制造方法、驱动方法、电子仪器 |
Also Published As
Publication number | Publication date |
---|---|
US8686574B2 (en) | 2014-04-01 |
JP2011023528A (ja) | 2011-02-03 |
US20130147039A1 (en) | 2013-06-13 |
US11244883B2 (en) | 2022-02-08 |
CN101958295A (zh) | 2011-01-26 |
CN103500735A (zh) | 2014-01-08 |
US8384230B2 (en) | 2013-02-26 |
CN101958295B (zh) | 2014-10-01 |
US20140167258A1 (en) | 2014-06-19 |
JP5325684B2 (ja) | 2013-10-23 |
US8975762B2 (en) | 2015-03-10 |
CN104037156B (zh) | 2019-01-11 |
CN104037156A (zh) | 2014-09-10 |
HK1199554A1 (zh) | 2015-07-03 |
HK1204507A1 (zh) | 2015-11-20 |
CN103500735B (zh) | 2015-05-06 |
CN104332454A (zh) | 2015-02-04 |
US20150123274A1 (en) | 2015-05-07 |
US20200066611A1 (en) | 2020-02-27 |
US20110012265A1 (en) | 2011-01-20 |
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CN115223981A (zh) | 半导体装置 |
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