CN104327758A - 柔性封装膜系统 - Google Patents
柔性封装膜系统 Download PDFInfo
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- CN104327758A CN104327758A CN201410505586.7A CN201410505586A CN104327758A CN 104327758 A CN104327758 A CN 104327758A CN 201410505586 A CN201410505586 A CN 201410505586A CN 104327758 A CN104327758 A CN 104327758A
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- encapsulating film
- systems according
- siccative
- barrier films
- film systems
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Classifications
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C09J11/02—Non-macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C09J2433/006—Presence of (meth)acrylic polymer in the substrate
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
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- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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- Y10T428/1303—Paper containing [e.g., paperboard, cardboard, fiberboard, etc.]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114539760A (zh) * | 2022-04-01 | 2022-05-27 | 太原科技大学 | 一种a/c型foled封装材料及制备方法 |
Families Citing this family (86)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102046841B (zh) | 2008-05-07 | 2014-05-28 | 普林斯顿大学理事会 | 用于电子器件或其他物品上的涂层中的混合层 |
| JP5270755B2 (ja) * | 2008-06-02 | 2013-08-21 | スリーエム イノベイティブ プロパティズ カンパニー | 接着剤封入組成物及びそれで作られた電子デバイス |
| KR20110003283A (ko) * | 2009-07-03 | 2011-01-11 | 닛토덴코 가부시키가이샤 | 적층 필름 및 점착 테이프 |
| WO2011016408A1 (ja) * | 2009-08-05 | 2011-02-10 | 味の素株式会社 | フィルム |
| US9581870B2 (en) * | 2009-08-13 | 2017-02-28 | 3M Innovative Properties Company | Conducting film or electrode with improved optical and electrical performance for display and lighting devices and solar cells |
| EP2363905A1 (en) | 2010-03-05 | 2011-09-07 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Opto-electrical device and method for manufacturing thereof |
| KR101155902B1 (ko) | 2010-03-11 | 2012-06-20 | 삼성모바일디스플레이주식회사 | 그라인더, 상기 그라인더를 사용한 연마 방법, 상기 연마 방법을 사용한 표시 장치의 제조 방법 및 이를 사용하여 제조한 표시 장치 |
| EP2586077B1 (en) | 2010-06-22 | 2016-12-14 | Koninklijke Philips N.V. | Organic electroluminescence device with separating foil |
| WO2012003416A1 (en) | 2010-07-02 | 2012-01-05 | 3M Innovative Properties Company | Barrier assembly |
| EP2606098A4 (en) | 2010-08-18 | 2014-04-02 | Henkel Corp | RADIATION-CURABLE TEMPERATURE LAYER ADHESIVE FOR USE IN HIGH TEMPERATURE APPLICATIONS |
| JP5864585B2 (ja) | 2010-09-27 | 2016-02-17 | コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． | 可撓性の被覆層を持つｏｌｅｄ |
| JP5899220B2 (ja) * | 2010-09-29 | 2016-04-06 | ポスコ | ロール状の母基板を利用したフレキシブル電子素子の製造方法、フレキシブル電子素子及びフレキシブル基板 |
| KR101293803B1 (ko) * | 2010-11-02 | 2013-08-06 | 주식회사 엘지화학 | 접착 필름 및 이를 이용한 유기전자장치의 봉지 방법 |
| KR101182449B1 (ko) * | 2010-12-24 | 2012-09-12 | 삼성디스플레이 주식회사 | 봉지시트와 그것을 사용한 평판 표시 장치 및 그 제조방법 |
| WO2012103390A2 (en) | 2011-01-27 | 2012-08-02 | Vitriflex, Inc. | An inorganic multilayer stack and methods and compositions relating thereto |
| CN103460123B (zh) | 2011-04-15 | 2016-02-10 | 3M创新有限公司 | 用于电子显示器的透明电极 |
| JP5659079B2 (ja) * | 2011-05-10 | 2015-01-28 | 株式会社アルバック | ＺｒＢＯ膜の形成装置 |
| DE102011052992A1 (de) * | 2011-05-31 | 2012-12-06 | Schott Solar Ag | Solarzellenmodul |
| US10061356B2 (en) * | 2011-06-30 | 2018-08-28 | Samsung Display Co., Ltd. | Flexible display panel and display apparatus including the flexible display panel |
| WO2013019695A2 (en) | 2011-08-04 | 2013-02-07 | 3M Innovative Properties Company | Edge protected barrier assemblies |
| CN103946018B (zh) * | 2011-08-08 | 2017-11-10 | 爱索尔包装有限公司 | 金属化的聚乙烯层压体 |
| FR2980907B1 (fr) * | 2011-09-30 | 2013-11-01 | Thales Sa | Procede d'encapsulation d'un dispositif electro-optique |
| DE102011085038A1 (de) * | 2011-10-21 | 2013-04-25 | Tesa Se | Verfahren zur Kapselung einer elektronischen Anordnung |
| CN103930503B (zh) * | 2011-11-14 | 2017-12-12 | Lg化学株式会社 | 粘合膜 |
| TWI528608B (zh) | 2011-11-21 | 2016-04-01 | 財團法人工業技術研究院 | 環境敏感電子元件之封裝體 |
| US8912020B2 (en) | 2011-11-23 | 2014-12-16 | International Business Machines Corporation | Integrating active matrix inorganic light emitting diodes for display devices |
| JP2013111874A (ja) * | 2011-11-29 | 2013-06-10 | Sony Corp | ガスバリア基材およびガスバリア積層体 |
| US9603242B2 (en) | 2011-12-21 | 2017-03-21 | 3M Innovative Properties Company | Laser patterning of silver nanowire-based transparent electrically conducting coatings |
| DE102011089566A1 (de) * | 2011-12-22 | 2013-06-27 | Tesa Se | Liner zum Schutz von Klebemassen |
| DE102011089565A1 (de) * | 2011-12-22 | 2013-06-27 | Tesa Se | Liner zum Schutz von Klebemassen |
| KR101474630B1 (ko) * | 2012-01-06 | 2014-12-19 | 주식회사 엘지화학 | 봉지용 필름 |
| EP2819555B1 (en) * | 2012-03-01 | 2017-05-03 | 3M Innovative Properties Company | Continuous edge protected barrier assemblies |
| DE102012203623A1 (de) | 2012-03-07 | 2013-09-12 | Tesa Se | Verbundsystem zur Verkapselung elektronischer Anordnungen |
| TWI610806B (zh) | 2012-08-08 | 2018-01-11 | ３Ｍ新設資產公司 | 障壁膜，製造該障壁膜之方法，及包含該障壁膜之物件 |
| US9709349B2 (en) | 2012-11-15 | 2017-07-18 | The Board Of Trustees Of The Leland Stanford Junior University | Structures for radiative cooling |
| DE102012224310A1 (de) * | 2012-12-21 | 2014-06-26 | Tesa Se | Gettermaterial enthaltendes Klebeband |
| US11673155B2 (en) | 2012-12-27 | 2023-06-13 | Kateeva, Inc. | Techniques for arrayed printing of a permanent layer with improved speed and accuracy |
| KR20190123811A (ko) * | 2012-12-27 | 2019-11-01 | 카티바, 인크. | 정밀 공차 내로 유체를 증착하기 위한 인쇄 잉크 부피 제어를 위한 기법 |
| US12330178B2 (en) | 2012-12-27 | 2025-06-17 | Kateeva, Inc. | Techniques for arrayed printing of a permanent layer with improved speed and accuracy |
| US11141752B2 (en) | 2012-12-27 | 2021-10-12 | Kateeva, Inc. | Techniques for arrayed printing of a permanent layer with improved speed and accuracy |
| CN104995716B (zh) * | 2012-12-31 | 2018-05-11 | 美国圣戈班性能塑料公司 | 柔性基材上的薄膜氮化硅阻挡层 |
| KR20170116232A (ko) * | 2013-03-27 | 2017-10-18 | 후루카와 덴키 고교 가부시키가이샤 | 유기 전자 디바이스용 소자 밀봉용 수지 조성물, 유기 전자 디바이스용 소자 밀봉용 수지 시트, 유기 일렉트로루미네센스 소자 및 화상 표시 장치 |
| JP6395704B2 (ja) * | 2013-03-29 | 2018-09-26 | 古河電気工業株式会社 | 有機電子デバイス用素子封止用樹脂組成物、有機電子デバイス用素子封止用樹脂シート、有機エレクトロルミネッセンス素子、及び画像表示装置 |
| KR20160012122A (ko) * | 2013-05-23 | 2016-02-02 | 헨켈 아이피 앤드 홀딩 게엠베하 | 다층 장벽 접착 필름 |
| CN103325951B (zh) * | 2013-06-21 | 2016-02-03 | 深圳市华星光电技术有限公司 | 一种电致发光二极管器件 |
| CN103337595B (zh) * | 2013-07-04 | 2016-04-06 | 上海和辉光电有限公司 | 柔性封装衬底及其制造方法和使用该衬底的oled封装方法 |
| TWI552881B (zh) * | 2013-09-30 | 2016-10-11 | Ｌｇ化學股份有限公司 | 用於有機電子裝置之基板及其製造方法 |
| CN104576970A (zh) * | 2013-10-12 | 2015-04-29 | 昆山工研院新型平板显示技术中心有限公司 | 一种柔性显示装置的制备方法及其制备的柔性显示装置 |
| KR102034420B1 (ko) | 2013-12-12 | 2019-11-08 | 카티바, 인크. | 두께를 제어하기 위해 하프토닝을 이용하는 잉크-기반 층 제조 |
| US9470399B1 (en) * | 2013-12-13 | 2016-10-18 | Amazon Technologies, Inc. | Light-emitting polymer films, articles containing same, and methods of making |
| JP2015133260A (ja) * | 2014-01-14 | 2015-07-23 | 日東電工株式会社 | 有機エレクトロルミネッセンス装置、及び有機エレクトロルミネッセンス装置の製造方法 |
| DE102014200948A1 (de) * | 2014-01-20 | 2015-07-23 | Tesa Se | Verfahren zum Entfernen von Permeaten aus Flächengebilden |
| DE102014207837A1 (de) * | 2014-04-25 | 2015-10-29 | Tesa Se | Dünnglasverbund und Verfahren zur Lagerung von Dünnglas |
| US10088251B2 (en) | 2014-05-21 | 2018-10-02 | The Board Of Trustees Of The Leland Stanford Junior University | Radiative cooling with solar spectrum reflection |
| US9331667B2 (en) | 2014-07-21 | 2016-05-03 | Triquint Semiconductor, Inc. | Methods, systems, and apparatuses for temperature compensated surface acoustic wave device |
| BR112017007730B1 (pt) | 2014-10-14 | 2022-06-14 | Sekisui Chemical Co., Ltd | Célula solar |
| WO2016084578A1 (ja) * | 2014-11-26 | 2016-06-02 | 京セラ株式会社 | 半導体封止用樹脂組成物および半導体装置 |
| ES2758546T3 (es) | 2014-11-27 | 2020-05-05 | Panasonic Ip Man Co Ltd | Unidad de panel de vidrio |
| JP6464854B2 (ja) * | 2015-03-20 | 2019-02-06 | コニカミノルタ株式会社 | 面発光モジュール |
| CN104953044B (zh) * | 2015-05-06 | 2017-11-07 | 深圳市华星光电技术有限公司 | 柔性oled及其制作方法 |
| CN107925010B (zh) * | 2015-08-17 | 2020-11-06 | 3M创新有限公司 | 阻挡膜构造 |
| CN107922657B (zh) * | 2015-08-19 | 2020-07-17 | 3M创新有限公司 | 包括多层阻隔组件的复合材料制品及其制造方法 |
| EP3337658B1 (en) * | 2015-08-19 | 2021-02-03 | 3M Innovative Properties Company | Composite article including a multilayer barrier assembly and methods of making the same |
| JP6507309B2 (ja) * | 2015-08-19 | 2019-04-24 | スリーエム イノベイティブ プロパティズ カンパニー | 複合材物品及その製造方法 |
| CN106711345A (zh) * | 2015-11-12 | 2017-05-24 | 宁波长阳科技股份有限公司 | 一种柔性透明阻隔膜及其制备方法 |
| WO2017171518A1 (ko) * | 2016-04-01 | 2017-10-05 | 주식회사 엘지화학 | 봉지 필름 |
| DE102016213840A1 (de) | 2016-07-27 | 2018-02-01 | Tesa Se | Klebeband zur Verkapselung elektronischer Aufbauten |
| CN106410063B (zh) * | 2016-11-21 | 2018-08-14 | 信利半导体有限公司 | 一种柔性基板的制造方法和柔性电子器件的制造方法 |
| JP2018083385A (ja) * | 2016-11-25 | 2018-05-31 | キヤノン株式会社 | 膜の形成方法 |
| CN118275398A (zh) * | 2017-01-30 | 2024-07-02 | 硕腾服务有限责任公司 | 基于溶液的等离子体振子特异性结合配偶体测定和金属纳米结构 |
| US9960389B1 (en) | 2017-05-05 | 2018-05-01 | 3M Innovative Properties Company | Polymeric films and display devices containing such films |
| WO2019012388A1 (en) * | 2017-07-11 | 2019-01-17 | 3M Innovative Properties Company | ABRASIVE ARTICLES COMPRISING CONFORMABLE COATINGS AND POLISHING SYSTEM COMPRISING THE SAME |
| DE102018203276A1 (de) | 2018-03-06 | 2019-09-12 | Tesa Se | Indikatortape |
| CN108511629A (zh) | 2018-05-31 | 2018-09-07 | 京东方科技集团股份有限公司 | Oled显示基板及其制作方法、显示装置 |
| CN110564334B (zh) * | 2018-06-05 | 2022-01-04 | 德莎欧洲股份公司 | 低温反应固化型粘合剂的耐湿热性和耐化学试剂腐蚀性的提高 |
| CN109273627B (zh) * | 2018-08-31 | 2021-06-11 | 渤海大学 | 一种高水氧分子阻隔性电化学储能器件用外壳的封口方法 |
| KR102145310B1 (ko) * | 2018-11-19 | 2020-08-18 | 삼성전기주식회사 | 커패시터 부품 및 그 제조 방법 |
| WO2020140082A1 (en) | 2018-12-27 | 2020-07-02 | SkyCool Systems, Inc. | Cooling panel system |
| US11380863B2 (en) * | 2019-03-19 | 2022-07-05 | Nanosys, Inc. | Flexible electroluminescent devices |
| CN113906261A (zh) | 2019-04-17 | 2022-01-07 | 天酷系统股份有限公司 | 辐射冷却系统 |
| CN110437748B (zh) * | 2019-08-16 | 2021-09-17 | 天津中环电子照明科技有限公司 | 封装胶及其制备方法、封装体及其制备方法 |
| CN111944619B (zh) * | 2020-08-17 | 2021-06-11 | 无锡卡仕精密科技有限公司 | 一种针对人工关节蜡模表面油污的清洗剂及处理方法 |
| CN112918142A (zh) * | 2021-01-19 | 2021-06-08 | 晋江市深沪键升印刷有限公司 | 一种可个性化定制图案热转印商标标识、商标标识制品及它们的制作工艺 |
| CN113725381A (zh) * | 2021-08-05 | 2021-11-30 | 广东志慧芯屏科技有限公司 | 一种显示模组及制备方法 |
| CN114561161A (zh) * | 2021-12-20 | 2022-05-31 | 苏州萍升源电子科技有限公司 | 一种高密封性复合型多功能胶带 |
| CN117673586A (zh) * | 2022-08-24 | 2024-03-08 | 深圳市中睿新材料技术有限公司 | 一种用于锂离子电池封装的多层复合结构及其制备方法和锂离子电池 |
Family Cites Families (134)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1771127A (en) | 1926-12-16 | 1930-07-22 | Atwater Kent Mfg Co | Telephone magnet system |
| US2621193A (en) | 1950-06-27 | 1952-12-09 | Du Pont | Polymeric titanium compounds |
| US3529074A (en) * | 1968-05-07 | 1970-09-15 | Sierracin Corp | External busbar system |
| US3601471A (en) * | 1969-03-03 | 1971-08-24 | Optical Coating Laboratory Inc | Durable first surface silver high reflector |
| US4486561A (en) | 1981-08-21 | 1984-12-04 | Ethyl Corporation | Injection-moldable thermoplastic polyester composition |
| JPS59138440A (ja) * | 1983-01-27 | 1984-08-08 | 豊田合成株式会社 | セラミツクス被膜層を有する樹脂成形体 |
| US5125138A (en) * | 1983-12-19 | 1992-06-30 | Spectrum Control, Inc. | Miniaturized monolithic multi-layer capacitor and apparatus and method for making same |
| US4842893A (en) * | 1983-12-19 | 1989-06-27 | Spectrum Control, Inc. | High speed process for coating substrates |
| US5032461A (en) * | 1983-12-19 | 1991-07-16 | Spectrum Control, Inc. | Method of making a multi-layered article |
| US5018048A (en) * | 1983-12-19 | 1991-05-21 | Spectrum Control, Inc. | Miniaturized monolithic multi-layer capacitor and apparatus and method for making |
| US5097800A (en) * | 1983-12-19 | 1992-03-24 | Spectrum Control, Inc. | High speed apparatus for forming capacitors |
| US4722515A (en) * | 1984-11-06 | 1988-02-02 | Spectrum Control, Inc. | Atomizing device for vaporization |
| US4645714A (en) * | 1984-12-24 | 1987-02-24 | Minnesota Mining And Manufacturing Company | Corrosion-resistant silver mirror |
| EP0242460A1 (en) * | 1985-01-18 | 1987-10-28 | SPECTRUM CONTROL, INC. (a Pennsylvania corporation) | Monomer atomizer for vaporization |
| US4629756A (en) | 1985-11-04 | 1986-12-16 | E. I. Du Pont De Nemours And Company | Heat reflective polymer blends |
| US4732879A (en) * | 1985-11-08 | 1988-03-22 | Owens-Corning Fiberglas Corporation | Method for applying porous, metal oxide coatings to relatively nonporous fibrous substrates |
| US4954371A (en) * | 1986-06-23 | 1990-09-04 | Spectrum Control, Inc. | Flash evaporation of monomer fluids |
| US5332888A (en) * | 1986-08-20 | 1994-07-26 | Libbey-Owens-Ford Co. | Sputtered multi-layer color compatible solar control coating |
| JPH0414440Y2 (https=) | 1987-06-08 | 1992-03-31 | ||
| US4782216A (en) * | 1987-08-11 | 1988-11-01 | Monsanto Company | Electrically heatable laminated window |
| US4786783A (en) * | 1987-08-11 | 1988-11-22 | Monsanto Company | Electrically heatable laminated window |
| US5104929A (en) * | 1988-04-11 | 1992-04-14 | Minnesota Mining And Manufacturing Company | Abrasion resistant coatings comprising silicon dioxide dispersions |
| JPH0825244B2 (ja) | 1988-05-10 | 1996-03-13 | 三菱化学株式会社 | ガスバリヤ性の優れた透明プラスチックフィルム |
| US5324374A (en) * | 1988-07-27 | 1994-06-28 | Saint Gobain Vitrage | Laminated glass with an electroconductive layer |
| CA2038117A1 (en) * | 1990-03-29 | 1991-09-30 | Mahfuza B. Ali | Controllable radiation curable photoiniferter prepared adhesives for attachment of microelectronic devices and a method of attaching microelectronic devices therewith |
| JPH0471560A (ja) * | 1990-07-10 | 1992-03-06 | Mect Corp | 包装体 |
| US5409683A (en) * | 1990-08-23 | 1995-04-25 | Regents Of The University Of California | Method for producing metal oxide aerogels |
| JP2793048B2 (ja) | 1991-02-22 | 1998-09-03 | 三井化学株式会社 | 有機発光素子の封止方法 |
| US5260095A (en) * | 1992-08-21 | 1993-11-09 | Battelle Memorial Institute | Vacuum deposition and curing of liquid monomers |
| JP3287496B2 (ja) | 1993-04-30 | 2002-06-04 | 新日本製鐵株式会社 | 耐表面損傷性に優れたベイナイト鋼レールの製造方法 |
| FR2707763B1 (fr) * | 1993-07-16 | 1995-08-11 | Commissariat Energie Atomique | Matériau composite à indice de réfraction élevé, procédé de fabrication de ce matériau composite et matériau optiquement actif comprenant ce matériau composite. |
| JP2825736B2 (ja) * | 1993-07-30 | 1998-11-18 | 京セラ株式会社 | 誘電体磁器組成物および半導体素子収容用パッケージ |
| ATE233939T1 (de) * | 1993-10-04 | 2003-03-15 | 3M Innovative Properties Co | Vernetztes acrylatbeschichtungsmaterial zur herstellung von kondensatordielektrika und sauerstoffbarrieren |
| US5440446A (en) * | 1993-10-04 | 1995-08-08 | Catalina Coatings, Inc. | Acrylate coating material |
| US5464667A (en) * | 1994-08-16 | 1995-11-07 | Minnesota Mining And Manufacturing Company | Jet plasma process and apparatus |
| DE4438359C2 (de) * | 1994-10-27 | 2001-10-04 | Schott Glas | Behälter aus Kunststoff mit einer Sperrbeschichtung |
| US6083628A (en) * | 1994-11-04 | 2000-07-04 | Sigma Laboratories Of Arizona, Inc. | Hybrid polymer film |
| US5703436A (en) | 1994-12-13 | 1997-12-30 | The Trustees Of Princeton University | Transparent contacts for organic devices |
| US5607789A (en) * | 1995-01-23 | 1997-03-04 | Duracell Inc. | Light transparent multilayer moisture barrier for electrochemical cell tester and cell employing same |
| US5530581A (en) * | 1995-05-31 | 1996-06-25 | Eic Laboratories, Inc. | Protective overlayer material and electro-optical coating using same |
| CN1106937C (zh) * | 1995-06-26 | 2003-04-30 | 美国3M公司 | 带有附加涂层或附加层的多层聚合物薄膜 |
| FR2738772B1 (fr) * | 1995-09-15 | 1997-10-24 | Saint Gobain Vitrage | Vitrage feuillete d'isolation acoustique |
| WO1997016053A1 (de) | 1995-10-20 | 1997-05-01 | Robert Bosch Gmbh | Elektrolumineszierendes schichtsystem |
| US5686360A (en) | 1995-11-30 | 1997-11-11 | Motorola | Passivation of organic devices |
| US5925438A (en) * | 1996-06-17 | 1999-07-20 | Dai Nippon Printing Co., Ltd. | Antireflection film |
| US6132882A (en) * | 1996-12-16 | 2000-10-17 | 3M Innovative Properties Company | Damped glass and plastic laminates |
| KR100495338B1 (ko) | 1997-01-27 | 2005-06-14 | 피터 디. 하랜드 | 광학 기판으로부터의 반사를 감소시키기 위한 코팅막, 반사 감소 방법 및 장치 |
| US6203898B1 (en) * | 1997-08-29 | 2001-03-20 | 3M Innovatave Properties Company | Article comprising a substrate having a silicone coating |
| MC2461A1 (fr) * | 1997-09-26 | 1998-12-18 | Exsymol Sa | Dispositifs ophtalmiques et implantables recouverts d'un revêtement et procédés pour la production de ces derniers |
| US6224948B1 (en) * | 1997-09-29 | 2001-05-01 | Battelle Memorial Institute | Plasma enhanced chemical deposition with low vapor pressure compounds |
| JP3159148B2 (ja) * | 1997-10-31 | 2001-04-23 | 日本電気株式会社 | 冷陰極管及びバックライト装置 |
| EP0915105B1 (en) | 1997-11-07 | 2003-04-09 | Rohm And Haas Company | Plastic substrates for electronic display applications |
| US6045864A (en) * | 1997-12-01 | 2000-04-04 | 3M Innovative Properties Company | Vapor coating method |
| US6808658B2 (en) | 1998-01-13 | 2004-10-26 | 3M Innovative Properties Company | Method for making texture multilayer optical films |
| EP1548045B1 (en) * | 1998-01-13 | 2009-06-03 | Minnesota Mining And Manufacturing Company | Modified copolyesters |
| US6004660A (en) | 1998-03-12 | 1999-12-21 | E.I. Du Pont De Nemours And Company | Oxygen barrier composite film structure |
| DE19929184A1 (de) * | 1998-06-26 | 1999-12-30 | Mclaughlin James A | Vorrichtung und Verfahren für das Aufbringen von diamantartigem Kohlenstoff (DLC) oder anderen im Vakuum abscheidbaren Materialien auf ein Substrat |
| US6022812A (en) * | 1998-07-07 | 2000-02-08 | Alliedsignal Inc. | Vapor deposition routes to nanoporous silica |
| US6146225A (en) | 1998-07-30 | 2000-11-14 | Agilent Technologies, Inc. | Transparent, flexible permeability barrier for organic electroluminescent devices |
| US6335479B1 (en) * | 1998-10-13 | 2002-01-01 | Dai Nippon Printing Co., Ltd. | Protective sheet for solar battery module, method of fabricating the same and solar battery module |
| EP1127381B1 (en) | 1998-11-02 | 2015-09-23 | 3M Innovative Properties Company | Transparent conductive oxides for plastic flat panel displays |
| US6268695B1 (en) | 1998-12-16 | 2001-07-31 | Battelle Memorial Institute | Environmental barrier material for organic light emitting device and method of making |
| WO2000036665A1 (en) | 1998-12-16 | 2000-06-22 | Battelle Memorial Institute | Environmental barrier material for organic light emitting device and method of making |
| EP1666561A1 (en) * | 1998-12-28 | 2006-06-07 | Idemitsu Kosan Company Limited | Organic electroluminescent element |
| US6503564B1 (en) * | 1999-02-26 | 2003-01-07 | 3M Innovative Properties Company | Method of coating microstructured substrates with polymeric layer(s), allowing preservation of surface feature profile |
| US6358570B1 (en) * | 1999-03-31 | 2002-03-19 | Battelle Memorial Institute | Vacuum deposition and curing of oligomers and resins |
| KR20020011392A (ko) * | 1999-04-28 | 2002-02-08 | 메리 이. 보울러 | 산소 및 수분 열화에 대한 내성이 개선된 가요성 유기전자 장치 |
| EP1222034A1 (en) | 1999-07-09 | 2002-07-17 | Shipley Company LLC | Method of forming a thin metal layer on an insulating substrate |
| EP1216211A1 (en) | 1999-09-02 | 2002-06-26 | Owens Corning | Abrasion-resistant water-based sol gel coatings for fibrous substrates |
| US6660339B1 (en) | 1999-09-07 | 2003-12-09 | The Procter & Gamble Company | Process for hydrophobic treatment of water vapor permeable substrates |
| US6413645B1 (en) * | 2000-04-20 | 2002-07-02 | Battelle Memorial Institute | Ultrabarrier substrates |
| US6573652B1 (en) * | 1999-10-25 | 2003-06-03 | Battelle Memorial Institute | Encapsulated display devices |
| US6623861B2 (en) * | 2001-04-16 | 2003-09-23 | Battelle Memorial Institute | Multilayer plastic substrates |
| US6811867B1 (en) | 2000-02-10 | 2004-11-02 | 3M Innovative Properties Company | Color stable pigmented polymeric films |
| US6288842B1 (en) * | 2000-02-22 | 2001-09-11 | 3M Innovative Properties | Sheeting with composite image that floats |
| DE60106311T2 (de) | 2000-03-02 | 2006-02-09 | Merck Patent Gmbh | Mehrschichtiger reflektierender Film oder Pigment mit von Blickwinkel abhängigen Reflektionseigenschaften |
| US6492026B1 (en) | 2000-04-20 | 2002-12-10 | Battelle Memorial Institute | Smoothing and barrier layers on high Tg substrates |
| US6797396B1 (en) * | 2000-06-09 | 2004-09-28 | 3M Innovative Properties Company | Wrinkle resistant infrared reflecting film and non-planar laminate articles made therefrom |
| US7238401B1 (en) | 2000-06-09 | 2007-07-03 | 3M Innovative Properties Company | Glazing element and laminate for use in the same |
| US6867539B1 (en) * | 2000-07-12 | 2005-03-15 | 3M Innovative Properties Company | Encapsulated organic electronic devices and method for making same |
| US6743488B2 (en) * | 2001-05-09 | 2004-06-01 | Cpfilms Inc. | Transparent conductive stratiform coating of indium tin oxide |
| JP2003053881A (ja) | 2001-08-10 | 2003-02-26 | Sumitomo Bakelite Co Ltd | 水蒸気バリア性プラスチックフィルム |
| JP3766831B2 (ja) | 2001-08-14 | 2006-04-19 | パック，ビョング，ジン | 子供の知的能力を発達させる練習用箸 |
| US7344786B2 (en) * | 2001-10-29 | 2008-03-18 | Fujifilm Corporation | Magnetic recording medium including a smooth coating layer on one side of the support |
| US6888305B2 (en) * | 2001-11-06 | 2005-05-03 | Universal Display Corporation | Encapsulation structure that acts as a multilayer mirror |
| US20030108749A1 (en) * | 2001-12-06 | 2003-06-12 | Sunder Ram | Plastic substrates with polysiloxane coating for TFT fabrication |
| US6765351B2 (en) * | 2001-12-20 | 2004-07-20 | The Trustees Of Princeton University | Organic optoelectronic device structures |
| JP2003191370A (ja) | 2001-12-26 | 2003-07-08 | Sumitomo Bakelite Co Ltd | 水蒸気バリア性プラスチックフィルム及びこれを用いたエレクトロルミネッセンス用ディスプレイ基板 |
| US7189447B2 (en) * | 2002-01-04 | 2007-03-13 | 3M Innovative Properties Company | Laminates |
| US6936131B2 (en) * | 2002-01-31 | 2005-08-30 | 3M Innovative Properties Company | Encapsulation of organic electronic devices using adsorbent loaded adhesives |
| US20030183245A1 (en) * | 2002-04-01 | 2003-10-02 | Min-Shyan Sheu | Surface silanization |
| US6835950B2 (en) * | 2002-04-12 | 2004-12-28 | Universal Display Corporation | Organic electronic devices with pressure sensitive adhesive layer |
| US8808457B2 (en) * | 2002-04-15 | 2014-08-19 | Samsung Display Co., Ltd. | Apparatus for depositing a multilayer coating on discrete sheets |
| KR100475849B1 (ko) * | 2002-04-17 | 2005-03-10 | 한국전자통신연구원 | 습식 공정에 의하여 형성된 엔캡슐레이션 박막을 갖춘유기 전기발광 소자 및 그 제조 방법 |
| JP2003338367A (ja) * | 2002-05-21 | 2003-11-28 | Seiko Instruments Inc | Ｅｌ素子封止板、ｅｌ表示装置、及びその製造方法 |
| JP4800247B2 (ja) * | 2002-06-17 | 2011-10-26 | 積水化学工業株式会社 | 有機エレクトロルミネッセンス素子封止用接着剤、有機エレクトロルミネッセンス素子封止用粘着テープ、有機エレクトロルミネッセンス素子封止用両面粘着テープ、有機エレクトロルミネッセンス素子の封止方法、及び、有機エレクトロルミネッセンス素子 |
| US6929864B2 (en) * | 2002-08-17 | 2005-08-16 | 3M Innovative Properties Company | Extensible, visible light-transmissive and infrared-reflective film and methods of making and using the film |
| US7215473B2 (en) * | 2002-08-17 | 2007-05-08 | 3M Innovative Properties Company | Enhanced heat mirror films |
| US6818291B2 (en) | 2002-08-17 | 2004-11-16 | 3M Innovative Properties Company | Durable transparent EMI shielding film |
| US6933051B2 (en) * | 2002-08-17 | 2005-08-23 | 3M Innovative Properties Company | Flexible electrically conductive film |
| US7015640B2 (en) * | 2002-09-11 | 2006-03-21 | General Electric Company | Diffusion barrier coatings having graded compositions and devices incorporating the same |
| JP3845061B2 (ja) * | 2002-10-24 | 2006-11-15 | 株式会社半導体プロセス研究所 | 半導体装置及びその製造方法 |
| US20040114101A1 (en) * | 2002-12-13 | 2004-06-17 | Ocular Sciences, Inc. | Contact lenses with color shifting properties |
| US6975067B2 (en) | 2002-12-19 | 2005-12-13 | 3M Innovative Properties Company | Organic electroluminescent device and encapsulation method |
| US20040121146A1 (en) * | 2002-12-20 | 2004-06-24 | Xiao-Ming He | Composite barrier films and method |
| US7018713B2 (en) * | 2003-04-02 | 2006-03-28 | 3M Innovative Properties Company | Flexible high-temperature ultrabarrier |
| JP4653964B2 (ja) * | 2003-04-08 | 2011-03-16 | 株式会社栗田製作所 | Ｄｌｃ膜の成膜方法およびｄｌｃ成膜物 |
| EP1645657A4 (en) | 2003-07-16 | 2008-10-08 | Konica Minolta Holdings Inc | THIN FILM FORMING METHOD AND BASE WITH THIN FILM FORMED ACCORDING TO SAID METHOD |
| US20050023974A1 (en) * | 2003-08-01 | 2005-02-03 | Universal Display Corporation | Protected organic electronic devices and methods for making the same |
| US7297414B2 (en) * | 2003-09-30 | 2007-11-20 | Fujifilm Corporation | Gas barrier film and method for producing the same |
| JP4342895B2 (ja) * | 2003-10-06 | 2009-10-14 | 東京エレクトロン株式会社 | 熱処理方法及び熱処理装置 |
| ATE425810T1 (de) * | 2003-10-30 | 2009-04-15 | Showa Denko Kk | Zusammensetzung zur herstellung eines transparenten films |
| US6991826B2 (en) * | 2004-04-20 | 2006-01-31 | 3M Innovative Properties Company | Antisoiling coatings for antireflective substrates |
| US20060087230A1 (en) * | 2004-10-22 | 2006-04-27 | Eastman Kodak Company | Desiccant film in top-emitting OLED |
| JP2006175633A (ja) * | 2004-12-21 | 2006-07-06 | Konica Minolta Holdings Inc | ガスバリア性薄膜積層体、及びガスバリア性樹脂基材、及び有機ｅｌデバイス |
| JP5596250B2 (ja) | 2005-03-02 | 2014-09-24 | スリーエム イノベイティブ プロパティズ カンパニー | 湿気反応性組成物及び有機ｅｌ素子 |
| US7410261B2 (en) * | 2005-05-20 | 2008-08-12 | 3M Innovative Properties Company | Multicolor illuminator system |
| US20070020451A1 (en) * | 2005-07-20 | 2007-01-25 | 3M Innovative Properties Company | Moisture barrier coatings |
| JP2007059313A (ja) * | 2005-08-26 | 2007-03-08 | Showa Denko Kk | 発光デバイスおよびその用途 |
| JP2007073459A (ja) * | 2005-09-09 | 2007-03-22 | Seiko Epson Corp | 有機エレクトロルミネッセンス装置、その製造方法、及び電子機器 |
| JP2007081350A (ja) | 2005-09-16 | 2007-03-29 | Tdk Corp | 積層基板及び薄膜デバイスの製造方法 |
| JP2007087852A (ja) * | 2005-09-26 | 2007-04-05 | Konica Minolta Holdings Inc | 有機エレクトロルミネッセンス素子およびその製造方法 |
| KR20140121888A (ko) | 2005-12-29 | 2014-10-16 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 코팅 공정을 위한 물질의 분무화 방법 |
| JP5213303B2 (ja) * | 2006-01-17 | 2013-06-19 | スリーエム イノベイティブ プロパティズ カンパニー | 光硬化性吸湿性組成物及び有機ｅｌ素子 |
| JP2007197517A (ja) * | 2006-01-24 | 2007-08-09 | Three M Innovative Properties Co | 接着性封止組成物、封止フィルム及び有機ｅｌ素子 |
| JP2007220402A (ja) | 2006-02-15 | 2007-08-30 | Konica Minolta Holdings Inc | 有機エレクトロルミネッセンス素子の封止方法、有機エレクトロルミネッセンス素子 |
| US20080006819A1 (en) * | 2006-06-19 | 2008-01-10 | 3M Innovative Properties Company | Moisture barrier coatings for organic light emitting diode devices |
| JP5801522B2 (ja) | 2006-08-31 | 2015-10-28 | スリーエム イノベイティブ プロパティズ カンパニー | 湿気反応性組成物及び有機ｅｌ素子 |
| WO2008083308A1 (en) * | 2006-12-28 | 2008-07-10 | 3M Innovative Properties Company | Nucleation layer for thin film metal layer formation |
| BRPI0720867A2 (pt) | 2006-12-29 | 2014-03-04 | 3M Innovative Properties Company. | Método para fabricação de filmes inorgânicos ou híbridos inorgânicos/orgânicos |
| CN101573471A (zh) | 2006-12-29 | 2009-11-04 | 3M创新有限公司 | 固化含有金属烷氧化物的膜的方法 |
| US8241713B2 (en) * | 2007-02-21 | 2012-08-14 | 3M Innovative Properties Company | Moisture barrier coatings for organic light emitting diode devices |
| JP5400795B2 (ja) * | 2008-11-21 | 2014-01-29 | 国立大学法人長岡技術科学大学 | 基板処理方法及び基板処理装置 |
| WO2012003416A1 (en) * | 2010-07-02 | 2012-01-05 | 3M Innovative Properties Company | Barrier assembly |
-
2008
- 2008-12-19 CN CN201410505586.7A patent/CN104327758A/zh active Pending
- 2008-12-19 BR BRPI0819548-0A patent/BRPI0819548A2/pt not_active IP Right Cessation
- 2008-12-19 JP JP2010540815A patent/JP2011508062A/ja active Pending
- 2008-12-19 KR KR1020107016545A patent/KR101563025B1/ko not_active Expired - Fee Related
- 2008-12-19 EP EP08868220.8A patent/EP2235131A4/en not_active Withdrawn
- 2008-12-19 US US12/810,115 patent/US8846169B2/en active Active
- 2008-12-19 WO PCT/US2008/087668 patent/WO2009086095A2/en not_active Ceased
- 2008-12-19 CN CN2008801270782A patent/CN101945965A/zh active Pending
-
2015
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114539760A (zh) * | 2022-04-01 | 2022-05-27 | 太原科技大学 | 一种a/c型foled封装材料及制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011508062A (ja) | 2011-03-10 |
| EP2235131A2 (en) | 2010-10-06 |
| KR101563025B1 (ko) | 2015-10-23 |
| CN101945965A (zh) | 2011-01-12 |
| JP2015091989A (ja) | 2015-05-14 |
| US8846169B2 (en) | 2014-09-30 |
| US20100272933A1 (en) | 2010-10-28 |
| WO2009086095A3 (en) | 2009-10-01 |
| WO2009086095A2 (en) | 2009-07-09 |
| BRPI0819548A2 (pt) | 2015-05-19 |
| EP2235131A4 (en) | 2013-10-02 |
| KR20100112142A (ko) | 2010-10-18 |
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