CN103852713B - 半导体装置 - Google Patents

半导体装置 Download PDF

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Publication number
CN103852713B
CN103852713B CN201310628016.2A CN201310628016A CN103852713B CN 103852713 B CN103852713 B CN 103852713B CN 201310628016 A CN201310628016 A CN 201310628016A CN 103852713 B CN103852713 B CN 103852713B
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CN
China
Prior art keywords
flip
flop
data
comparator
semiconductor device
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Expired - Fee Related
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CN201310628016.2A
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English (en)
Chinese (zh)
Other versions
CN103852713A (zh
Inventor
伊藤幸
伊藤一幸
城田博史
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Renesas Electronics Corp
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Renesas Electronics Corp
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Publication of CN103852713A publication Critical patent/CN103852713A/zh
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Expired - Fee Related legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K3/00—Circuits for generating electric pulses; Monostable, bistable or multistable circuits
    • H03K3/02—Generators characterised by the type of circuit or by the means used for producing pulses
    • H03K3/027—Generators characterised by the type of circuit or by the means used for producing pulses by the use of logic circuits, with internal or external positive feedback
    • H03K3/037—Bistable circuits
    • H03K3/0375—Bistable circuits provided with means for increasing reliability; for protection; for ensuring a predetermined initial state when the supply voltage has been applied; for storing the actual state when the supply voltage fails
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/27—Testing of devices without physical removal from the circuit of which they form part, e.g. compensating for effects surrounding elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/31703—Comparison aspects, e.g. signature analysis, comparators
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/31725—Timing aspects, e.g. clock distribution, skew, propagation delay
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Test And Diagnosis Of Digital Computers (AREA)
  • Logic Circuits (AREA)
CN201310628016.2A 2012-11-30 2013-11-29 半导体装置 Expired - Fee Related CN103852713B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012262826A JP2014109453A (ja) 2012-11-30 2012-11-30 半導体装置
JP2012-262826 2012-11-30

Publications (2)

Publication Number Publication Date
CN103852713A CN103852713A (zh) 2014-06-11
CN103852713B true CN103852713B (zh) 2017-11-17

Family

ID=49546251

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310628016.2A Expired - Fee Related CN103852713B (zh) 2012-11-30 2013-11-29 半导体装置

Country Status (4)

Country Link
US (2) US9229046B2 (https=)
EP (1) EP2738941A1 (https=)
JP (1) JP2014109453A (https=)
CN (1) CN103852713B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6360387B2 (ja) * 2014-08-19 2018-07-18 ルネサスエレクトロニクス株式会社 プロセッサシステム、エンジン制御システム及び制御方法
KR102617240B1 (ko) * 2017-02-28 2023-12-27 에스케이하이닉스 주식회사 반도체 장치
WO2019106225A1 (en) * 2017-12-01 2019-06-06 Minima Processor Oy Method and arrangement for ensuring valid data at a second stage of a digital register circuit
US12182260B2 (en) * 2017-12-18 2024-12-31 Nuvoton Technology Corporation System and method for detecting fault injection attacks
JP2019113939A (ja) * 2017-12-21 2019-07-11 ルネサスエレクトロニクス株式会社 半導体装置
US12085611B2 (en) 2018-10-16 2024-09-10 Minima Processor Oy Applications of adaptive microelectronic circuits that are designed for testability

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1747070A (zh) * 2004-07-26 2006-03-15 因芬尼昂技术股份公司 半导体电路装置及测试半导体装置系统
CN101042939A (zh) * 2006-03-22 2007-09-26 恩益禧电子股份有限公司 半导体装置及其测试方法
CN101521499A (zh) * 2008-02-28 2009-09-02 索尼株式会社 相位检测器、相位比较器、以及时钟同步设备
CN101923897A (zh) * 2009-04-23 2010-12-22 瑞萨电子株式会社 半导体集成电路和用于半导体集成电路的测试方法

Family Cites Families (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63755A (ja) * 1986-06-20 1988-01-05 Fujitsu Ltd 半導体記憶装置
JP3077075B2 (ja) * 1993-09-22 2000-08-14 株式会社日立製作所 電力変換装置
EP0653708B1 (en) * 1993-10-15 2000-08-16 Hitachi, Ltd. Logic circuit having error detection function, redundant resource management method, and fault tolerant system using it
US5815512A (en) * 1994-05-26 1998-09-29 Mitsubishi Denki Kabushiki Kaisha Semiconductor memory testing device
JPH0875825A (ja) * 1994-09-09 1996-03-22 Fujitsu Ltd 試験回路及びその試験方法並びに試験回路を用いた試験方法
US5923830A (en) * 1997-05-07 1999-07-13 General Dynamics Information Systems, Inc. Non-interrupting power control for fault tolerant computer systems
TW428092B (en) * 1998-05-20 2001-04-01 Advantest Corp Semiconductor test system
US6981176B2 (en) * 1999-05-10 2005-12-27 Delphi Technologies, Inc. Secured microcontroller architecture
US6693436B1 (en) * 1999-12-23 2004-02-17 Intel Corporation Method and apparatus for testing an integrated circuit having an output-to-output relative signal
JP4174167B2 (ja) * 2000-04-04 2008-10-29 株式会社アドバンテスト 半導体集積回路の故障解析方法および故障解析装置
JP4488595B2 (ja) * 2000-06-08 2010-06-23 株式会社アドバンテスト テストパターン生成方法
JP2002107425A (ja) * 2000-09-29 2002-04-10 Hitachi Ltd 半導体集積回路
JP2002181893A (ja) * 2000-12-11 2002-06-26 Mitsubishi Electric Corp 半導体装置の検査方法および検査装置
JP2003035747A (ja) * 2001-07-19 2003-02-07 Mitsubishi Electric Corp 半導体検査システムおよび半導体検査方法
JP2003036697A (ja) * 2001-07-25 2003-02-07 Mitsubishi Electric Corp 半導体メモリのテスト回路および半導体メモリデバイス
JP2003234647A (ja) * 2002-02-13 2003-08-22 Allied Tereshisu Kk 半導体デバイス用誤動作抑制回路
WO2003076959A1 (fr) * 2002-03-08 2003-09-18 Advantest Corporation Dispositif testeur a semi-conducteur et procede de mesure de synchronisation pour ce dispositif
JP4628096B2 (ja) * 2002-06-10 2011-02-09 株式会社アドバンテスト 半導体試験装置
KR100545748B1 (ko) * 2002-08-09 2006-01-24 마쯔시다덴기산교 가부시키가이샤 반도체 집적회로 장치의 설계 방법 및 설계 장치
WO2004057354A1 (ja) * 2002-12-20 2004-07-08 Advantest Corporation 半導体試験装置
JP4232477B2 (ja) * 2003-02-13 2009-03-04 パナソニック株式会社 半導体集積回路の検証方法
WO2004102217A1 (ja) * 2003-05-15 2004-11-25 Advantest Corporation 試験装置
JP2005300308A (ja) * 2004-04-09 2005-10-27 Oki Electric Ind Co Ltd 半導体集積回路
WO2005124378A1 (ja) * 2004-06-17 2005-12-29 Advantest Corporation 試験装置及び試験方法
JP2006269477A (ja) * 2005-03-22 2006-10-05 Seiko Epson Corp 半導体集積回路
JP2006352304A (ja) * 2005-06-14 2006-12-28 Renesas Technology Corp 半導体集積回路
JP4762754B2 (ja) * 2006-02-17 2011-08-31 富士通セミコンダクター株式会社 半導体装置および電子装置
US7970565B2 (en) * 2006-02-27 2011-06-28 Advantest Corporation Measuring device, test device, electronic device, program, and recording medium
JP5173216B2 (ja) * 2006-04-18 2013-04-03 パナソニック株式会社 半導体集積回路システム、半導体集積回路、オペレーティングシステム及び半導体集積回路の制御方法
JP4684942B2 (ja) * 2006-05-10 2011-05-18 ルネサスエレクトロニクス株式会社 半導体装置及び観測用フリップフロップの配置方法
JP4984214B2 (ja) * 2006-05-11 2012-07-25 日産自動車株式会社 シリンダブロック用鉄系溶射薄膜及びシリンダブロック
JP2007309733A (ja) * 2006-05-17 2007-11-29 Matsushita Electric Ind Co Ltd 半導体集積回路および半導体集積回路の検査方法
JP2008028345A (ja) * 2006-07-25 2008-02-07 Matsushita Electric Ind Co Ltd 誤動作検知回路を含む半導体集積回路とその設計方法
JP2008042367A (ja) * 2006-08-03 2008-02-21 Renesas Technology Corp 半導体装置
US8270225B2 (en) * 2007-03-22 2012-09-18 Advantest Corporation Data receiving circuit
JP2008256491A (ja) 2007-04-04 2008-10-23 Matsushita Electric Ind Co Ltd 信号遅延検出用回路及びそれを用いた集積回路の検査方法
KR101085564B1 (ko) * 2007-04-27 2011-11-24 가부시키가이샤 어드밴티스트 시험 장치 및 시험 방법
JP4924223B2 (ja) * 2007-06-12 2012-04-25 富士通セミコンダクター株式会社 半導体装置
US7827454B2 (en) * 2007-07-17 2010-11-02 Renesas Electronics Corporation Semiconductor device
US8132136B2 (en) * 2007-08-06 2012-03-06 International Business Machines Corporation Dynamic critical path detector for digital logic circuit paths
JP2009048674A (ja) * 2007-08-14 2009-03-05 Nec Electronics Corp 半導体集積回路
JP5023983B2 (ja) * 2007-11-14 2012-09-12 横河電機株式会社 半導体試験装置
JP2009150726A (ja) * 2007-12-19 2009-07-09 Panasonic Corp 半導体装置
JP2009290857A (ja) * 2008-01-11 2009-12-10 Toshiba Corp 半導体装置
KR101138196B1 (ko) * 2008-01-23 2012-05-14 가부시키가이샤 어드밴티스트 시험 장치
US7834639B2 (en) * 2008-01-30 2010-11-16 Advantest Corporation Jitter injection circuit, pattern generator, test apparatus, and electronic device
JP5301299B2 (ja) * 2008-01-31 2013-09-25 株式会社半導体エネルギー研究所 半導体装置
US7923733B2 (en) * 2008-02-07 2011-04-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2009200739A (ja) * 2008-02-20 2009-09-03 Panasonic Corp 半導体集積回路
KR100951567B1 (ko) * 2008-02-29 2010-04-09 주식회사 하이닉스반도체 데이터 전달의 신뢰성을 보장하기 위한 반도체 메모리 장치
KR100929835B1 (ko) * 2008-02-29 2009-12-07 주식회사 하이닉스반도체 안정적인 초기 동작을 수행하는 반도체 메모리 장치
US8384406B2 (en) * 2008-04-14 2013-02-26 Advantest Corporation Semiconductor test apparatus and test method
JP5292925B2 (ja) * 2008-05-30 2013-09-18 富士通株式会社 半導体集積回路及びその制御方法、並びに情報処理装置
JP2010092306A (ja) * 2008-10-08 2010-04-22 Nec Electronics Corp データ処理装置
KR101547302B1 (ko) * 2009-02-09 2015-08-26 삼성전자주식회사 펄스 기반 플립플롭의 클럭 스큐 흡수특성을 고려한 셋업 시간 측정 방법
US8438518B2 (en) * 2009-03-03 2013-05-07 Nec Corporation Apparatus for designing semiconductor integrated circuit, method of designing semiconductor integrated circuit, and program for designing semiconductor integrated circuit
US8402328B2 (en) * 2009-07-24 2013-03-19 StarDFX Technologies, Inc. Apparatus and method for protecting soft errors
US8489947B2 (en) * 2010-02-15 2013-07-16 Mentor Graphics Corporation Circuit and method for simultaneously measuring multiple changes in delay
US8555124B2 (en) * 2010-06-07 2013-10-08 Arm Limited Apparatus and method for detecting an approaching error condition
US8222943B2 (en) * 2010-09-22 2012-07-17 Freescale Semiconductor, Inc. Master-slave flip-flop with timing error correction

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1747070A (zh) * 2004-07-26 2006-03-15 因芬尼昂技术股份公司 半导体电路装置及测试半导体装置系统
CN101042939A (zh) * 2006-03-22 2007-09-26 恩益禧电子股份有限公司 半导体装置及其测试方法
CN101521499A (zh) * 2008-02-28 2009-09-02 索尼株式会社 相位检测器、相位比较器、以及时钟同步设备
CN101923897A (zh) * 2009-04-23 2010-12-22 瑞萨电子株式会社 半导体集成电路和用于半导体集成电路的测试方法

Also Published As

Publication number Publication date
US9350333B2 (en) 2016-05-24
US9229046B2 (en) 2016-01-05
CN103852713A (zh) 2014-06-11
US20160087612A1 (en) 2016-03-24
EP2738941A1 (en) 2014-06-04
JP2014109453A (ja) 2014-06-12
US20140152334A1 (en) 2014-06-05

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