CN102800662A - 层叠型半导体装置及其制造方法 - Google Patents
层叠型半导体装置及其制造方法 Download PDFInfo
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- CN102800662A CN102800662A CN2012101700613A CN201210170061A CN102800662A CN 102800662 A CN102800662 A CN 102800662A CN 2012101700613 A CN2012101700613 A CN 2012101700613A CN 201210170061 A CN201210170061 A CN 201210170061A CN 102800662 A CN102800662 A CN 102800662A
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- Condensed Matter Physics & Semiconductors (AREA)
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Abstract
Description
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2011117906 | 2011-05-26 | ||
JP117906/2011 | 2011-05-26 |
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CN102800662A true CN102800662A (zh) | 2012-11-28 |
CN102800662B CN102800662B (zh) | 2015-04-01 |
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Application Number | Title | Priority Date | Filing Date |
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CN201210170061.3A Active CN102800662B (zh) | 2011-05-26 | 2012-05-28 | 层叠型半导体装置及其制造方法 |
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Country | Link |
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US (2) | US8710654B2 (zh) |
JP (1) | JP5814859B2 (zh) |
CN (1) | CN102800662B (zh) |
TW (1) | TWI499022B (zh) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104425464A (zh) * | 2013-09-09 | 2015-03-18 | 株式会社东芝 | 半导体装置 |
CN107808880A (zh) * | 2016-09-09 | 2018-03-16 | 东芝存储器株式会社 | 半导体装置的制造方法 |
CN108352333A (zh) * | 2015-10-29 | 2018-07-31 | 日立化成株式会社 | 半导体用粘接剂、半导体装置以及制造该半导体装置的方法 |
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US9224713B2 (en) | 2015-12-29 |
US8710654B2 (en) | 2014-04-29 |
JP2013008963A (ja) | 2013-01-10 |
TW201301464A (zh) | 2013-01-01 |
US20130134583A1 (en) | 2013-05-30 |
TWI499022B (zh) | 2015-09-01 |
US20140206144A1 (en) | 2014-07-24 |
CN102800662B (zh) | 2015-04-01 |
JP5814859B2 (ja) | 2015-11-17 |
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