CN101427379B - 具有双层钝化的晶体管及方法 - Google Patents

具有双层钝化的晶体管及方法 Download PDF

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Publication number
CN101427379B
CN101427379B CN2007800132282A CN200780013228A CN101427379B CN 101427379 B CN101427379 B CN 101427379B CN 2007800132282 A CN2007800132282 A CN 2007800132282A CN 200780013228 A CN200780013228 A CN 200780013228A CN 101427379 B CN101427379 B CN 101427379B
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forming
layer
alignment
semiconductor
passivation layer
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Chinese (zh)
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CN101427379A (zh
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布鲁斯·M·格林
哈尔丹·S·亨利
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NXP USA Inc
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Freescale Semiconductor Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/80—FETs having rectifying junction gate electrodes
    • H10D30/87—FETs having Schottky gate electrodes, e.g. metal-semiconductor FETs [MESFET]
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/708—Mark formation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7084—Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
    • H10D64/251—Source or drain electrodes for field-effect devices
    • H10D64/252—Source or drain electrodes for field-effect devices for vertical or pseudo-vertical devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
    • H10D62/8503—Nitride Group III-V materials, e.g. AlN or GaN
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/301—Marks applied to devices, e.g. for alignment or identification for alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/501—Marks applied to devices, e.g. for alignment or identification for use before dicing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/501—Marks applied to devices, e.g. for alignment or identification for use before dicing
    • H10W46/503—Located in scribe lines

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN2007800132282A 2006-04-13 2007-03-12 具有双层钝化的晶体管及方法 Active CN101427379B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/404,714 2006-04-13
US11/404,714 US8193591B2 (en) 2006-04-13 2006-04-13 Transistor and method with dual layer passivation
PCT/US2007/063775 WO2007121010A2 (en) 2006-04-13 2007-03-12 Transistor and method with dual layer passivation

Publications (2)

Publication Number Publication Date
CN101427379A CN101427379A (zh) 2009-05-06
CN101427379B true CN101427379B (zh) 2010-12-29

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CN2007800132282A Active CN101427379B (zh) 2006-04-13 2007-03-12 具有双层钝化的晶体管及方法

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Country Link
US (2) US8193591B2 (https=)
EP (1) EP2011155A4 (https=)
JP (1) JP5345521B2 (https=)
KR (1) KR20090007318A (https=)
CN (1) CN101427379B (https=)
WO (1) WO2007121010A2 (https=)

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US7935620B2 (en) 2007-12-05 2011-05-03 Freescale Semiconductor, Inc. Method for forming semiconductor devices with low leakage Schottky contacts
US8431962B2 (en) * 2007-12-07 2013-04-30 Northrop Grumman Systems Corporation Composite passivation process for nitride FET
US7632726B2 (en) * 2007-12-07 2009-12-15 Northrop Grumman Space & Mission Systems Corp. Method for fabricating a nitride FET including passivation layers
CN101789391B (zh) * 2009-01-23 2012-08-22 中芯国际集成电路制造(上海)有限公司 半导体装置及其制造方法
US8304271B2 (en) * 2009-05-20 2012-11-06 Jenn Hwa Huang Integrated circuit having a bulk acoustic wave device and a transistor
JP4794655B2 (ja) * 2009-06-09 2011-10-19 シャープ株式会社 電界効果トランジスタ
TWI484536B (zh) * 2011-06-30 2015-05-11 東芝股份有限公司 模板基板及其製造方法
US8653558B2 (en) 2011-10-14 2014-02-18 Freescale Semiconductor, Inc. Semiconductor device and method of making
US9601638B2 (en) 2011-10-19 2017-03-21 Nxp Usa, Inc. GaN-on-Si switch devices
US8754421B2 (en) 2012-02-24 2014-06-17 Raytheon Company Method for processing semiconductors using a combination of electron beam and optical lithography
US9111868B2 (en) 2012-06-26 2015-08-18 Freescale Semiconductor, Inc. Semiconductor device with selectively etched surface passivation
US10522670B2 (en) 2012-06-26 2019-12-31 Nxp Usa, Inc. Semiconductor device with selectively etched surface passivation
US10825924B2 (en) 2012-06-26 2020-11-03 Nxp Usa, Inc. Semiconductor device with selectively etched surface passivation
US8946776B2 (en) 2012-06-26 2015-02-03 Freescale Semiconductor, Inc. Semiconductor device with selectively etched surface passivation
JP2014138111A (ja) * 2013-01-17 2014-07-28 Fujitsu Ltd 半導体装置及びその製造方法、電源装置、高周波増幅器
US8946779B2 (en) * 2013-02-26 2015-02-03 Freescale Semiconductor, Inc. MISHFET and Schottky device integration
JP6197427B2 (ja) * 2013-07-17 2017-09-20 豊田合成株式会社 ショットキーバリアダイオード
JP6241100B2 (ja) * 2013-07-17 2017-12-06 豊田合成株式会社 Ｍｏｓｆｅｔ
US9685345B2 (en) * 2013-11-19 2017-06-20 Nxp Usa, Inc. Semiconductor devices with integrated Schottky diodes and methods of fabrication
KR102736227B1 (ko) 2016-07-29 2024-12-03 삼성전자주식회사 회로 기판 및 반도체 패키지
US10741496B2 (en) 2018-12-04 2020-08-11 Nxp Usa, Inc. Semiconductor devices with a protection layer and methods of fabrication
CN112750903B (zh) * 2019-10-29 2022-09-27 苏州能讯高能半导体有限公司 半导体器件及其制造方法
CN112687543B (zh) * 2020-12-09 2021-09-03 上海芯导电子科技股份有限公司 一种氮化镓器件的制备方法及终端结构

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Also Published As

Publication number Publication date
EP2011155A2 (en) 2009-01-07
WO2007121010A3 (en) 2009-01-15
CN101427379A (zh) 2009-05-06
US8193591B2 (en) 2012-06-05
KR20090007318A (ko) 2009-01-16
US9029986B2 (en) 2015-05-12
WO2007121010A2 (en) 2007-10-25
EP2011155A4 (en) 2009-09-16
JP2009533874A (ja) 2009-09-17
JP5345521B2 (ja) 2013-11-20
US20130015462A1 (en) 2013-01-17
US20070241419A1 (en) 2007-10-18

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