CN100350517C - 层压体及其用途 - Google Patents

层压体及其用途 Download PDF

Info

Publication number
CN100350517C
CN100350517C CNB018024491A CN01802449A CN100350517C CN 100350517 C CN100350517 C CN 100350517C CN B018024491 A CNB018024491 A CN B018024491A CN 01802449 A CN01802449 A CN 01802449A CN 100350517 C CN100350517 C CN 100350517C
Authority
CN
China
Prior art keywords
layer
insulating layer
etching
inorganic
laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB018024491A
Other languages
English (en)
Chinese (zh)
Other versions
CN1388975A (zh
Inventor
坂寄胜哉
河野茂树
甘崎裕子
田泽秀胤
池田和成
大野浩平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Publication of CN1388975A publication Critical patent/CN1388975A/zh
Application granted granted Critical
Publication of CN100350517C publication Critical patent/CN100350517C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • G11B5/147—Structure or manufacture of heads, e.g. inductive with cores being composed of metal sheets, i.e. laminated cores with cores composed of isolated magnetic layers, e.g. sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B2220/00—Record carriers by type
    • G11B2220/20—Disc-shaped record carriers
    • G11B2220/23—Disc-shaped record carriers characterised in that the disc has a specific layer structure
    • G11B2220/235—Multilayer discs, i.e. multiple recording layers accessed from the same side
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B2220/00—Record carriers by type
    • G11B2220/20—Disc-shaped record carriers
    • G11B2220/25—Disc-shaped record carriers characterised in that the disc is based on a specific recording technology
    • G11B2220/2508—Magnetic discs
    • G11B2220/2516—Hard disks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
  • Supporting Of Heads In Record-Carrier Devices (AREA)
  • Insulating Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
CNB018024491A 2000-06-21 2001-06-21 层压体及其用途 Expired - Fee Related CN100350517C (zh)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP186564/00 2000-06-21
JP2000186564 2000-06-21
JP2000232227 2000-07-31
JP232227/00 2000-07-31
JP2001030249 2001-02-06
JP30249/01 2001-02-06
JP30171/01 2001-02-06
JP2001030171 2001-02-06
PCT/JP2001/005319 WO2001099124A1 (en) 2000-06-21 2001-06-21 Laminate and use thereof

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN200710152752XA Division CN101143500B (zh) 2000-06-21 2001-06-21 层压体及其用途

Publications (2)

Publication Number Publication Date
CN1388975A CN1388975A (zh) 2003-01-01
CN100350517C true CN100350517C (zh) 2007-11-21

Family

ID=27481376

Family Applications (2)

Application Number Title Priority Date Filing Date
CNB018024491A Expired - Fee Related CN100350517C (zh) 2000-06-21 2001-06-21 层压体及其用途
CN200710152752XA Expired - Fee Related CN101143500B (zh) 2000-06-21 2001-06-21 层压体及其用途

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN200710152752XA Expired - Fee Related CN101143500B (zh) 2000-06-21 2001-06-21 层压体及其用途

Country Status (9)

Country Link
US (2) US20040043232A1 (https=)
JP (2) JP5318314B2 (https=)
KR (2) KR100817345B1 (https=)
CN (2) CN100350517C (https=)
AU (1) AU7458201A (https=)
DE (1) DE10192864T1 (https=)
SG (1) SG148026A1 (https=)
TW (4) TWI293044B (https=)
WO (1) WO2001099124A1 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1750927B (zh) * 2003-02-18 2012-02-08 三井化学株式会社 聚酰亚胺金属层积体
US6855404B2 (en) * 2003-03-13 2005-02-15 E. I. Du Pont De Nemours And Company Inorganic sheet laminate
JP2006244599A (ja) * 2005-03-03 2006-09-14 Nippon Steel Chem Co Ltd サスペンション用積層体およびその製造方法
US20080225438A1 (en) * 2005-03-03 2008-09-18 Nippon Steel Chemical Co., Ltd Laminate for Suspension and Method for Producing Same
US20080089072A1 (en) * 2006-10-11 2008-04-17 Alti-Electronics Co., Ltd. High Power Light Emitting Diode Package
DE102009012827A1 (de) * 2009-03-03 2010-10-07 Gebr. Schmid Gmbh & Co. Verfahren zur Texturierung von Siliziumwafern für Solarzellen und Behandlungsflüssigkeit dafür
TWI396482B (zh) * 2010-07-30 2013-05-11 光明電子股份有限公司 線路基板製程及線路基板結構
TWI521016B (zh) 2012-07-18 2016-02-11 財團法人工業技術研究院 蝕刻含聚亞醯胺之膜層的方法
KR102282268B1 (ko) * 2014-01-22 2021-07-26 우베 고산 가부시키가이샤 도체층의 형성 방법, 및 그것을 사용한 다층 배선 기판의 제조 방법
JP2017518640A (ja) * 2014-05-23 2017-07-06 マテリオン コーポレイション エアキャビティパッケージ
CN104485294A (zh) * 2014-12-12 2015-04-01 浙江中纳晶微电子科技有限公司 一种晶圆临时键合及分离方法
WO2018186262A1 (ja) * 2017-04-06 2018-10-11 大日本印刷株式会社 ポリイミドフィルム、積層体、及びディスプレイ用表面材
JP7088173B2 (ja) * 2017-04-10 2022-06-21 大日本印刷株式会社 フレキシブルディスプレイ用表面材

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5362550A (en) * 1992-02-19 1994-11-08 Fujitsu Limited Thin film circuit board and its manufacturing process

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52108496A (en) * 1976-03-09 1977-09-10 Showa Electric Wire & Cable Co Ltd Preparation of polyimide resins
JPS6384117A (ja) * 1986-09-29 1988-04-14 Fuji Xerox Co Ltd ポリイミド樹脂のエツチング方法
JPH0314294A (ja) * 1989-06-13 1991-01-22 Hitachi Ltd ポリイミド樹脂膜のパターン形成方法
CA2040994A1 (en) * 1990-05-08 1991-11-09 David D. Ngo Photoimageable polyimide coating
JPH05214101A (ja) * 1992-02-06 1993-08-24 Hitachi Ltd 熱可塑型ポリエステルイミドとそれを用いた電子部品および電子装置
CA2111294A1 (en) * 1992-12-16 1994-06-17 Hiroyuki Furutani Thermoplastic polyimide, polyamide acid, and thermally fusible laminated film for covering conductive wires
JP3451401B2 (ja) * 1992-12-16 2003-09-29 鐘淵化学工業株式会社 超電導線材被覆用熱融着性積層フィルム
KR100326655B1 (ko) * 1993-08-03 2002-06-29 후루타 다케시 카바레이필름또는fpc제작용베이스필름에사용되는폴리이미드적층체및그적층체의제조방법
JP3632791B2 (ja) * 1995-12-20 2005-03-23 株式会社カネカ 接着性絶縁フィルム及びその製造方法
WO1998008216A1 (fr) 1996-08-19 1998-02-26 Nippon Steel Chemical Co., Ltd. Stratifie pour suspension d'entrainement de disques durs et sa fabrication
US6218022B1 (en) 1996-09-20 2001-04-17 Toray Engineering Co., Ltd. Resin etching solution and process for etching polyimide resins
JP3722610B2 (ja) 1998-01-14 2005-11-30 株式会社リコー 半導体装置の製造方法
US6103456A (en) * 1998-07-22 2000-08-15 Siemens Aktiengesellschaft Prevention of photoresist poisoning from dielectric antireflective coating in semiconductor fabrication
JP2000123512A (ja) * 1998-10-20 2000-04-28 Ube Ind Ltd 磁気ヘッドサスペンションおよびその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5362550A (en) * 1992-02-19 1994-11-08 Fujitsu Limited Thin film circuit board and its manufacturing process

Also Published As

Publication number Publication date
JP5318314B2 (ja) 2013-10-16
CN1388975A (zh) 2003-01-01
JP2012210813A (ja) 2012-11-01
CN101143500A (zh) 2008-03-19
TWI293177B (https=) 2008-02-01
TWI293044B (https=) 2008-02-01
TW200427583A (en) 2004-12-16
CN101143500B (zh) 2012-02-29
SG148026A1 (en) 2008-12-31
AU7458201A (en) 2002-01-02
KR100795617B1 (ko) 2008-01-17
DE10192864T1 (de) 2002-09-19
US20110076855A1 (en) 2011-03-31
US20040043232A1 (en) 2004-03-04
WO2001099124A1 (en) 2001-12-27
US8252423B2 (en) 2012-08-28
KR100817345B1 (ko) 2008-03-26
TW200519973A (en) 2005-06-16
JP5278578B2 (ja) 2013-09-04
KR20070007212A (ko) 2007-01-12
TWI293467B (https=) 2008-02-11
TW200518118A (en) 2005-06-01
TWI293045B (https=) 2008-02-01
KR20020025989A (ko) 2002-04-04

Similar Documents

Publication Publication Date Title
CN1247698C (zh) 树脂组合物
JP5278578B2 (ja) 積層体およびその用途
CN1311719C (zh) 印刷线路板及其制造方法
CN1726259A (zh) 热塑性聚酰亚胺树脂薄膜、叠层体及由其构成的印刷电路布线板的制法
CN1324402C (zh) 感光性树脂组合物、使用该组合物的感光性薄膜及层压体
CN1297398C (zh) 层压体及其制造方法
CN1522387A (zh) 光敏性树脂组合物及用该组合物的光敏性干膜抗蚀剂、光敏性射线遮挡膜
CN1578728A (zh) 聚酰亚胺－金属层压体和聚酰胺酰亚胺－金属层压体
CN1159151C (zh) 软质基板
CN1638957A (zh) 贴附树脂的金属箔、粘合金属的层压板、使用它们的印刷电路板及其制造方法
CN1306025A (zh) 聚酰胺酸、由其制备的聚酰亚胺树脂和其在电路板中的用途
CN1914246A (zh) 热固性树脂组合物及其应用
US20180281361A1 (en) Laminate film for temporary bonding, methods for producing substrate workpiece and laminate substrate workpiece using the laminate film for temporary bonding, and method for producing semiconductor device using the same
CN1821337A (zh) 半导体装置用粘接剂组合物及半导体装置用粘接片材
CN1493616A (zh) 聚酰亚胺膜及用该聚酰亚胺膜的金属叠层板
CN1720136A (zh) 叠层体、印刷电路布线板及它们的制造方法
CN1231539C (zh) 低温粘合剂组合物
CN1692017A (zh) 柔性金属层状产品和耐热粘合剂组合物
CN1238428C (zh) 聚酰亚胺薄膜及其制造方法和其应用
JPWO2001099124A1 (ja) 積層体およびその用途
CN1836021A (zh) 半导体装置用粘结剂组合物及使用它的覆盖层薄膜、粘结剂片材、覆铜聚酰亚胺膜
CN1767721A (zh) 金属包覆基板及其制造方法
CN1764534A (zh) 双面金属层压板及其制备方法
JP2004209962A (ja) 金属積層体
CN1976980A (zh) 新型聚酰亚胺膜

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20071121

Termination date: 20170621

CF01 Termination of patent right due to non-payment of annual fee