ZA200709470B - Coating process for manufacture or reprocessing of sputter targets and X-ray anodes - Google Patents
Coating process for manufacture or reprocessing of sputter targets and X-ray anodesInfo
- Publication number
- ZA200709470B ZA200709470B ZA200709470A ZA200709470A ZA200709470B ZA 200709470 B ZA200709470 B ZA 200709470B ZA 200709470 A ZA200709470 A ZA 200709470A ZA 200709470 A ZA200709470 A ZA 200709470A ZA 200709470 B ZA200709470 B ZA 200709470B
- Authority
- ZA
- South Africa
- Prior art keywords
- reprocessing
- manufacture
- coating process
- sputter targets
- ray anodes
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J35/00—X-ray tubes
- H01J35/02—Details
- H01J35/04—Electrodes ; Mutual position thereof; Constructional adaptations therefor
- H01J35/08—Anodes; Anti cathodes
- H01J35/10—Rotary anodes; Arrangements for rotating anodes; Cooling rotary anodes
- H01J35/108—Substrates for and bonding of emissive target, e.g. composite structures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/02—Coating starting from inorganic powder by application of pressure only
- C23C24/04—Impact or kinetic deposition of particles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J35/00—X-ray tubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2235/00—X-ray tubes
- H01J2235/08—Targets (anodes) and X-ray converters
- H01J2235/081—Target material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2235/00—X-ray tubes
- H01J2235/08—Targets (anodes) and X-ray converters
- H01J2235/083—Bonding or fixing with the support or substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2235/00—X-ray tubes
- H01J2235/08—Targets (anodes) and X-ray converters
- H01J2235/085—Target treatment, e.g. ageing, heating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Composite Materials (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Powder Metallurgy (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US67805205P | 2005-05-05 | 2005-05-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
ZA200709470B true ZA200709470B (en) | 2009-06-24 |
Family
ID=36999989
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ZA200709470A ZA200709470B (en) | 2005-05-05 | 2007-11-02 | Coating process for manufacture or reprocessing of sputter targets and X-ray anodes |
Country Status (16)
Country | Link |
---|---|
US (1) | US7910051B2 (ko) |
EP (1) | EP1880036A2 (ko) |
JP (1) | JP4904341B2 (ko) |
KR (1) | KR101342823B1 (ko) |
CN (2) | CN101287857B (ko) |
AU (1) | AU2006243448B2 (ko) |
BR (1) | BRPI0611451A2 (ko) |
CA (1) | CA2607091C (ko) |
HK (1) | HK1123830A1 (ko) |
IL (1) | IL186909A0 (ko) |
MX (1) | MX2007013601A (ko) |
NO (1) | NO20076128L (ko) |
RU (1) | RU2418886C2 (ko) |
TW (1) | TWI403598B (ko) |
WO (1) | WO2006117145A2 (ko) |
ZA (1) | ZA200709470B (ko) |
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-
2006
- 2006-04-28 EP EP06742727A patent/EP1880036A2/en not_active Withdrawn
- 2006-04-28 RU RU2007144640/02A patent/RU2418886C2/ru active
- 2006-04-28 MX MX2007013601A patent/MX2007013601A/es active IP Right Grant
- 2006-04-28 WO PCT/EP2006/003969 patent/WO2006117145A2/en active Application Filing
- 2006-04-28 CA CA2607091A patent/CA2607091C/en active Active
- 2006-04-28 BR BRPI0611451-2A patent/BRPI0611451A2/pt not_active Application Discontinuation
- 2006-04-28 JP JP2008509344A patent/JP4904341B2/ja not_active Expired - Fee Related
- 2006-04-28 CN CN2006800153392A patent/CN101287857B/zh active Active
- 2006-04-28 AU AU2006243448A patent/AU2006243448B2/en not_active Ceased
- 2006-04-28 CN CN2008102137056A patent/CN101368262B/zh active Active
- 2006-05-04 TW TW095115825A patent/TWI403598B/zh active
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- 2007-11-02 ZA ZA200709470A patent/ZA200709470B/xx unknown
- 2007-11-05 US US11/935,099 patent/US7910051B2/en active Active
- 2007-11-20 KR KR1020077027010A patent/KR101342823B1/ko active IP Right Grant
- 2007-11-27 NO NO20076128A patent/NO20076128L/no not_active Application Discontinuation
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Also Published As
Publication number | Publication date |
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MX2007013601A (es) | 2008-03-18 |
CA2607091A1 (en) | 2006-11-09 |
AU2006243448B2 (en) | 2011-09-01 |
CA2607091C (en) | 2014-08-12 |
TW200710244A (en) | 2007-03-16 |
CN101287857A (zh) | 2008-10-15 |
BRPI0611451A2 (pt) | 2010-09-08 |
US7910051B2 (en) | 2011-03-22 |
CN101287857B (zh) | 2011-07-13 |
HK1123830A1 (en) | 2009-06-26 |
AU2006243448A1 (en) | 2006-11-09 |
CN101368262B (zh) | 2012-06-06 |
WO2006117145A2 (en) | 2006-11-09 |
US20080216602A1 (en) | 2008-09-11 |
NO20076128L (no) | 2008-01-29 |
WO2006117145A3 (en) | 2007-01-11 |
RU2418886C2 (ru) | 2011-05-20 |
CN101368262A (zh) | 2009-02-18 |
RU2007144640A (ru) | 2009-06-10 |
KR101342823B1 (ko) | 2013-12-17 |
IL186909A0 (en) | 2008-02-09 |
JP2008540823A (ja) | 2008-11-20 |
EP1880036A2 (en) | 2008-01-23 |
JP4904341B2 (ja) | 2012-03-28 |
TWI403598B (zh) | 2013-08-01 |
KR20080006624A (ko) | 2008-01-16 |
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