ATE325906T1 - Reparatur von tantalsputtertargets. - Google Patents

Reparatur von tantalsputtertargets.

Info

Publication number
ATE325906T1
ATE325906T1 AT02718966T AT02718966T ATE325906T1 AT E325906 T1 ATE325906 T1 AT E325906T1 AT 02718966 T AT02718966 T AT 02718966T AT 02718966 T AT02718966 T AT 02718966T AT E325906 T1 ATE325906 T1 AT E325906T1
Authority
AT
Austria
Prior art keywords
plate
refractory
powder
metal products
refractory metal
Prior art date
Application number
AT02718966T
Other languages
English (en)
Inventor
Paul Aimone
Prabhat Kumar
Peter R Jepson
Henning Uhlenhut
Howard V Goldberg
Original Assignee
Starck H C Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Starck H C Inc filed Critical Starck H C Inc
Application granted granted Critical
Publication of ATE325906T1 publication Critical patent/ATE325906T1/de

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3491Manufacturing of targets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/062Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/062Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
    • B22F2007/068Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts repairing articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00Aspects linked to processes or compositions used in powder metallurgy
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/25Process efficiency

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
  • Furnace Housings, Linings, Walls, And Ceilings (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Catalysts (AREA)
  • Arc-Extinguishing Devices That Are Switches (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)
  • Inorganic Insulating Materials (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
AT02718966T 2001-02-14 2002-02-14 Reparatur von tantalsputtertargets. ATE325906T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US26874201P 2001-02-14 2001-02-14

Publications (1)

Publication Number Publication Date
ATE325906T1 true ATE325906T1 (de) 2006-06-15

Family

ID=23024267

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02718966T ATE325906T1 (de) 2001-02-14 2002-02-14 Reparatur von tantalsputtertargets.

Country Status (25)

Country Link
US (1) US20020112955A1 (de)
EP (1) EP1362132B1 (de)
JP (1) JP2004523653A (de)
CN (1) CN1221684C (de)
AT (1) ATE325906T1 (de)
AU (1) AU2002250075B2 (de)
BG (1) BG64959B1 (de)
BR (1) BR0207202A (de)
CA (1) CA2437713A1 (de)
CZ (1) CZ20032186A3 (de)
DE (1) DE60211309T2 (de)
DK (1) DK1362132T3 (de)
ES (1) ES2261656T3 (de)
HK (1) HK1062902A1 (de)
HU (1) HUP0400730A2 (de)
IS (1) IS6911A (de)
MX (1) MXPA03007293A (de)
NO (1) NO20033567D0 (de)
NZ (1) NZ527503A (de)
PL (1) PL363521A1 (de)
PT (1) PT1362132E (de)
RU (1) RU2304633C2 (de)
SK (1) SK10062003A3 (de)
WO (1) WO2002064287A2 (de)
ZA (1) ZA200306259B (de)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005508444A (ja) * 2001-09-17 2005-03-31 ヘラエウス インコーポレーテッド 使用済みスパッタターゲットの再生
KR20040103920A (ko) * 2002-01-24 2004-12-09 에이치. 씨. 스타아크 아이앤씨 레이저 형성 및 용융에 의한 고융점 금속 및 합금 정련
US20040016635A1 (en) * 2002-07-19 2004-01-29 Ford Robert B. Monolithic sputtering target assembly
US20040065546A1 (en) * 2002-10-04 2004-04-08 Michaluk Christopher A. Method to recover spent components of a sputter target
US7504008B2 (en) * 2004-03-12 2009-03-17 Applied Materials, Inc. Refurbishment of sputtering targets
US20060021870A1 (en) * 2004-07-27 2006-02-02 Applied Materials, Inc. Profile detection and refurbishment of deposition targets
US20060081459A1 (en) * 2004-10-18 2006-04-20 Applied Materials, Inc. In-situ monitoring of target erosion
WO2006117144A1 (en) 2005-05-05 2006-11-09 H.C. Starck Gmbh Method for coating a substrate surface and coated product
BRPI0611451A2 (pt) * 2005-05-05 2010-09-08 Starck H C Gmbh processo de revestimento para fabricação ou reprocessamento de alvos de metalização e anodos de raios x
US9127362B2 (en) 2005-10-31 2015-09-08 Applied Materials, Inc. Process kit and target for substrate processing chamber
JPWO2007052743A1 (ja) * 2005-11-07 2009-04-30 株式会社東芝 スパッタリングターゲットおよびその製造方法
DE102005055255A1 (de) * 2005-11-19 2007-05-31 Applied Materials Gmbh & Co. Kg Verfahren zum Herstellen eines Targets
US20070125646A1 (en) 2005-11-25 2007-06-07 Applied Materials, Inc. Sputtering target for titanium sputtering chamber
US20080078268A1 (en) * 2006-10-03 2008-04-03 H.C. Starck Inc. Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof
US20080145688A1 (en) 2006-12-13 2008-06-19 H.C. Starck Inc. Method of joining tantalum clade steel structures
US8197894B2 (en) 2007-05-04 2012-06-12 H.C. Starck Gmbh Methods of forming sputtering targets
US8968536B2 (en) 2007-06-18 2015-03-03 Applied Materials, Inc. Sputtering target having increased life and sputtering uniformity
WO2009019645A2 (en) * 2007-08-08 2009-02-12 Philips Intellectual Property & Standards Gmbh Method and apparatus for applying material to a surface of an anode of an x-ray source, anode and x-ray source
US8699667B2 (en) 2007-10-02 2014-04-15 General Electric Company Apparatus for x-ray generation and method of making same
US7901552B2 (en) 2007-10-05 2011-03-08 Applied Materials, Inc. Sputtering target with grooves and intersecting channels
US8246903B2 (en) 2008-09-09 2012-08-21 H.C. Starck Inc. Dynamic dehydriding of refractory metal powders
US8043655B2 (en) * 2008-10-06 2011-10-25 H.C. Starck, Inc. Low-energy method of manufacturing bulk metallic structures with submicron grain sizes
FR2953747B1 (fr) * 2009-12-14 2012-03-23 Snecma Procede de reparation d'une aube en titane par rechargement laser et compression hip moderee
DE102010004241A1 (de) * 2010-01-08 2011-07-14 H.C. Starck GmbH, 38642 Verfahren zur Herstellung von Funktionsschichten auf der Oberfläche von Werkstücken, eine so hergestellte Funktionsschicht und ein Werkstück
US8703233B2 (en) 2011-09-29 2014-04-22 H.C. Starck Inc. Methods of manufacturing large-area sputtering targets by cold spray
JP6532219B2 (ja) * 2013-11-25 2019-06-19 株式会社フルヤ金属 スパッタリングターゲットの再生方法及び再生スパッタリングターゲット
AT14301U1 (de) * 2014-07-09 2015-07-15 Plansee Se Verfahren zur Herstellung eines Bauteils
CN104439239B (zh) * 2014-11-06 2017-05-03 金堆城钼业股份有限公司 一种重复利用中频感应烧结炉钨钼废发热体的方法
DE102015008921A1 (de) * 2015-07-15 2017-01-19 Evobeam GmbH Verfahren zur additiven Herstellung von Bauteilen
US10844475B2 (en) * 2015-12-28 2020-11-24 Jx Nippon Mining & Metals Corporation Method for manufacturing sputtering target
CN105618753A (zh) * 2016-03-03 2016-06-01 中研智能装备有限公司 一种轧辊等离子3d打印再制造设备及再制造方法
DE102016121951A1 (de) * 2016-11-15 2018-05-17 Cl Schutzrechtsverwaltungs Gmbh Vorrichtung zur additiven Herstellung dreidimensionaler Objekte
JP6650141B1 (ja) * 2019-01-10 2020-02-19 株式会社ティー・オール 使用済み成膜用ターゲットの充填式再生方法
US20220145446A1 (en) * 2019-02-22 2022-05-12 Oerlikon Surface Solutions Ag, Pfäffikon Method for producing targets for physical vapor deposition (pvd)
CN110523987B (zh) * 2019-09-27 2021-02-05 华中科技大学 一种用于致密材料制备的激光烧结同步压制增材制造系统
CN111940745B (zh) * 2019-12-30 2024-01-19 宁夏东方钽业股份有限公司 大松装冶金级钽粉的制造方法
CN112522698B (zh) * 2020-11-26 2023-04-25 江苏科技大学 一种超声振动辅助激光熔覆钨钽铌合金装置及方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69633823T2 (de) * 1995-05-18 2005-10-27 Asahi Glass Co., Ltd. Verfahren zur herstellung eines sputtertargets
DE19626732B4 (de) * 1996-07-03 2009-01-29 W.C. Heraeus Gmbh Vorrichtung und Verfahren zum Herstellen und Recyclen von Sputtertargets
US6348113B1 (en) * 1998-11-25 2002-02-19 Cabot Corporation High purity tantalum, products containing the same, and methods of making the same
DE19925330A1 (de) * 1999-06-02 2000-12-07 Leybold Materials Gmbh Verfahren zur Herstellung oder zum Recyceln von Sputtertargets

Also Published As

Publication number Publication date
CN1221684C (zh) 2005-10-05
BR0207202A (pt) 2004-01-27
EP1362132A4 (de) 2004-07-28
NZ527503A (en) 2004-07-30
RU2304633C2 (ru) 2007-08-20
NO20033567L (no) 2003-08-12
ZA200306259B (en) 2004-08-13
JP2004523653A (ja) 2004-08-05
HK1062902A1 (en) 2004-12-03
BG108059A (en) 2005-04-30
DE60211309D1 (de) 2006-06-14
ES2261656T3 (es) 2006-11-16
MXPA03007293A (es) 2005-09-08
US20020112955A1 (en) 2002-08-22
WO2002064287A2 (en) 2002-08-22
EP1362132A2 (de) 2003-11-19
CZ20032186A3 (cs) 2004-02-18
RU2003127947A (ru) 2005-04-10
DE60211309T2 (de) 2007-05-24
NO20033567D0 (no) 2003-08-12
WO2002064287A3 (en) 2002-10-10
CN1491294A (zh) 2004-04-21
DK1362132T3 (da) 2006-09-11
CA2437713A1 (en) 2002-08-22
HUP0400730A2 (en) 2004-08-30
IS6911A (is) 2003-08-13
AU2002250075B2 (en) 2007-03-29
SK10062003A3 (sk) 2004-03-02
PT1362132E (pt) 2006-09-29
EP1362132B1 (de) 2006-05-10
PL363521A1 (en) 2004-11-29
BG64959B1 (bg) 2006-10-31

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