WO2008081585A1 - スパッタリングターゲットとその製造方法 - Google Patents

スパッタリングターゲットとその製造方法 Download PDF

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Publication number
WO2008081585A1
WO2008081585A1 PCT/JP2007/001470 JP2007001470W WO2008081585A1 WO 2008081585 A1 WO2008081585 A1 WO 2008081585A1 JP 2007001470 W JP2007001470 W JP 2007001470W WO 2008081585 A1 WO2008081585 A1 WO 2008081585A1
Authority
WO
WIPO (PCT)
Prior art keywords
target layer
sputtering target
metal particles
production
ratio
Prior art date
Application number
PCT/JP2007/001470
Other languages
English (en)
French (fr)
Inventor
Michio Sato
Yasuo Kohsaka
Takashi Nakamura
Nobuaki Nakashima
Toshiya Sakamoto
Fumiyuki Kawashima
Original Assignee
Kabushiki Kaisha Toshiba
Toshiba Materials Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kabushiki Kaisha Toshiba, Toshiba Materials Co., Ltd. filed Critical Kabushiki Kaisha Toshiba
Priority to JP2008552023A priority Critical patent/JP5215192B2/ja
Publication of WO2008081585A1 publication Critical patent/WO2008081585A1/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/02—Coating starting from inorganic powder by application of pressure only
    • C23C24/04—Impact or kinetic deposition of particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Powder Metallurgy (AREA)

Abstract

　スパッタリングターゲット１は、基体２上に堆積させた金属粒子４を有するターゲット層３を具備する。ターゲット層３の厚さ方向の断面における金属粒子４の最大径をＸ、最小径をＹ、最小径Ｙに対する最大径Ｘの比（Ｘ／Ｙ）を金属粒子４の扁平率としたとき、ターゲット層３の厚さ方向の断面には扁平率が１．５以上の金属粒子が個数比率で９０％以上存在している。ターゲット層３は例えばコールドスプレー法で形成される。
PCT/JP2007/001470 2007-01-05 2007-12-26 スパッタリングターゲットとその製造方法 WO2008081585A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008552023A JP5215192B2 (ja) 2007-01-05 2007-12-26 スパッタリングターゲット

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007000461 2007-01-05
JP2007-000461 2007-01-05
JP2007257531 2007-10-01
JP2007-257531 2007-10-01

Publications (1)

Publication Number Publication Date
WO2008081585A1 true WO2008081585A1 (ja) 2008-07-10

Family

ID=39588274

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/001470 WO2008081585A1 (ja) 2007-01-05 2007-12-26 スパッタリングターゲットとその製造方法

Country Status (3)

Country Link
JP (2) JP5215192B2 (ja)
TW (1) TW200907087A (ja)
WO (1) WO2008081585A1 (ja)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010090477A (ja) * 2008-10-06 2010-04-22 Hc Starck Inc サブミクロン粒度を有するバルク金属構造体の製造法及びかかる方法により製造された構造体
EP2353186A2 (en) * 2008-10-31 2011-08-10 AQT Solar, Inc. Chalcogenide alloy sputter targets for photovoltaic applications and methods of manufacturing the same
JP2012161156A (ja) * 2011-01-31 2012-08-23 Toshiba Corp ガス絶縁開閉装置
JP2012172265A (ja) * 2011-02-22 2012-09-10 Heraeus Materials Technology Gmbh & Co Kg 管状スパッタターゲット
JP2013004360A (ja) * 2011-06-17 2013-01-07 Toshiba Corp ガス絶縁開閉装置用通電部材
WO2013054521A1 (ja) * 2011-10-14 2013-04-18 株式会社アルバック ターゲットアセンブリ及びその製造方法
US8961867B2 (en) 2008-09-09 2015-02-24 H.C. Starck Inc. Dynamic dehydriding of refractory metal powders
JP2015098652A (ja) * 2007-05-04 2015-05-28 エイチ．シー． スターク インコーポレイテッド 薄膜堆積の方法
US9095932B2 (en) 2006-12-13 2015-08-04 H.C. Starck Inc. Methods of joining metallic protective layers
US9108273B2 (en) 2011-09-29 2015-08-18 H.C. Starck Inc. Methods of manufacturing large-area sputtering targets using interlocking joints
KR20150124391A (ko) * 2014-04-28 2015-11-05 가부시끼가이샤 아라이도 마테리아루 스퍼터링 타깃용 재료
WO2016004447A1 (de) 2014-07-08 2016-01-14 Plansee Se Target und verfahren zur herstellung eines targets
WO2016187011A3 (en) * 2015-05-15 2016-12-29 Materion Corporation Methods for surface preparation of sputtering target
CZ306441B6 (cs) * 2014-12-05 2017-01-25 Safina, A.S. Způsob výroby kovového tělesa s homogenní, jemnozrnnou strukturou pomocí technologie Cold Spray, kovové těleso takto vyrobené, a způsob opravy použitých kovových odprášených těles
KR20190086010A (ko) 2016-12-28 2019-07-19 가부시키가이샤 코베루코 카겐 스퍼터링 타깃용 백킹 플레이트의 보수 방법, 보수 완료 백킹 플레이트 및 보수 완료 백킹 플레이트를 사용한 스퍼터링 타깃

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5979034B2 (ja) * 2013-02-14 2016-08-24 三菱マテリアル株式会社 保護膜形成用スパッタリングターゲット
JP7225170B2 (ja) * 2020-08-05 2023-02-20 松田産業株式会社 Ａｇ合金円筒形スパッタリングターゲット、スパッタリング装置及び電子デバイスの製造方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06158303A (ja) * 1992-11-20 1994-06-07 Mitsubishi Materials Corp スパッタリング用ターゲット及びその製造方法
JPH08246143A (ja) * 1995-03-08 1996-09-24 Sumitomo Metal Mining Co Ltd 酸化物焼結体
JPH10199830A (ja) * 1996-11-14 1998-07-31 Hitachi Metals Ltd Ａｌ系スパッタリング用タ−ゲット材およびその製造方法
WO2002040733A1 (fr) * 2000-11-17 2002-05-23 Nikko Materials Company, Limited Cible de pulverisation produisant peu de particules, plaque support ou appareil de pulverisation, et procede de pulverisation produisant peu de particules
JP2002339032A (ja) * 2001-04-11 2002-11-27 Crucible Materials Corp 二成分合金
JP2005002364A (ja) * 2003-06-09 2005-01-06 Mitsui Mining & Smelting Co Ltd スパッタリングターゲット及びその製造方法
JP2006161161A (ja) * 2004-12-03 2006-06-22 United Technol Corp <Utc> 真空コールドスプレープロセス
WO2006067937A1 (ja) * 2004-12-24 2006-06-29 Nippon Mining & Metals Co., Ltd. Ｓｂ－Ｔｅ系合金焼結体ターゲット及びその製造方法
WO2006117145A2 (en) * 2005-05-05 2006-11-09 H.C. Starck Gmbh Coating process for manufacture or reprocessing of sputter targets and x-ray anodes

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6030514A (en) * 1997-05-02 2000-02-29 Sony Corporation Method of reducing sputtering burn-in time, minimizing sputtered particulate, and target assembly therefor
JP3030287B1 (ja) * 1998-10-09 2000-04-10 株式会社協同インターナショナル 成膜装置のクリーニング方法、スパッタリングターゲットのクリーニング方法及びこれらに使用するクリーニング装置
JP4851700B2 (ja) * 2004-09-30 2012-01-11 株式会社東芝 真空成膜装置用部品及び真空成膜装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06158303A (ja) * 1992-11-20 1994-06-07 Mitsubishi Materials Corp スパッタリング用ターゲット及びその製造方法
JPH08246143A (ja) * 1995-03-08 1996-09-24 Sumitomo Metal Mining Co Ltd 酸化物焼結体
JPH10199830A (ja) * 1996-11-14 1998-07-31 Hitachi Metals Ltd Ａｌ系スパッタリング用タ−ゲット材およびその製造方法
WO2002040733A1 (fr) * 2000-11-17 2002-05-23 Nikko Materials Company, Limited Cible de pulverisation produisant peu de particules, plaque support ou appareil de pulverisation, et procede de pulverisation produisant peu de particules
JP2002339032A (ja) * 2001-04-11 2002-11-27 Crucible Materials Corp 二成分合金
JP2005002364A (ja) * 2003-06-09 2005-01-06 Mitsui Mining & Smelting Co Ltd スパッタリングターゲット及びその製造方法
JP2006161161A (ja) * 2004-12-03 2006-06-22 United Technol Corp <Utc> 真空コールドスプレープロセス
WO2006067937A1 (ja) * 2004-12-24 2006-06-29 Nippon Mining & Metals Co., Ltd. Ｓｂ－Ｔｅ系合金焼結体ターゲット及びその製造方法
WO2006117145A2 (en) * 2005-05-05 2006-11-09 H.C. Starck Gmbh Coating process for manufacture or reprocessing of sputter targets and x-ray anodes

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9095932B2 (en) 2006-12-13 2015-08-04 H.C. Starck Inc. Methods of joining metallic protective layers
US9783882B2 (en) 2007-05-04 2017-10-10 H.C. Starck Inc. Fine grained, non banded, refractory metal sputtering targets with a uniformly random crystallographic orientation, method for making such film, and thin film based devices and products made therefrom
JP2015098652A (ja) * 2007-05-04 2015-05-28 エイチ．シー． スターク インコーポレイテッド 薄膜堆積の方法
US8961867B2 (en) 2008-09-09 2015-02-24 H.C. Starck Inc. Dynamic dehydriding of refractory metal powders
JP2010090477A (ja) * 2008-10-06 2010-04-22 Hc Starck Inc サブミクロン粒度を有するバルク金属構造体の製造法及びかかる方法により製造された構造体
EP2353186A2 (en) * 2008-10-31 2011-08-10 AQT Solar, Inc. Chalcogenide alloy sputter targets for photovoltaic applications and methods of manufacturing the same
EP2353186A4 (en) * 2008-10-31 2014-03-26 Aqt Solar Inc SPUTTERTARGETS OF CHALCOGENID ALLOY FOR PHOTOVOLTAIC AND MANUFACTURING PROCESS THEREFOR
JP2012161156A (ja) * 2011-01-31 2012-08-23 Toshiba Corp ガス絶縁開閉装置
JP2012172265A (ja) * 2011-02-22 2012-09-10 Heraeus Materials Technology Gmbh & Co Kg 管状スパッタターゲット
US9334564B2 (en) 2011-02-22 2016-05-10 Heraeus Deutschland GmbH & Co. KG Tube-shaped sputtering target
JP2013004360A (ja) * 2011-06-17 2013-01-07 Toshiba Corp ガス絶縁開閉装置用通電部材
US9120183B2 (en) 2011-09-29 2015-09-01 H.C. Starck Inc. Methods of manufacturing large-area sputtering targets
US9293306B2 (en) 2011-09-29 2016-03-22 H.C. Starck, Inc. Methods of manufacturing large-area sputtering targets using interlocking joints
US9108273B2 (en) 2011-09-29 2015-08-18 H.C. Starck Inc. Methods of manufacturing large-area sputtering targets using interlocking joints
US9412568B2 (en) 2011-09-29 2016-08-09 H.C. Starck, Inc. Large-area sputtering targets
WO2013054521A1 (ja) * 2011-10-14 2013-04-18 株式会社アルバック ターゲットアセンブリ及びその製造方法
JPWO2013054521A1 (ja) * 2011-10-14 2015-03-30 株式会社アルバック ターゲットアセンブリ及びその製造方法
JP2015221937A (ja) * 2014-04-28 2015-12-10 株式会社アライドマテリアル スパッタリングターゲット用材料
KR20150124391A (ko) * 2014-04-28 2015-11-05 가부시끼가이샤 아라이도 마테리아루 스퍼터링 타깃용 재료
KR102198726B1 (ko) 2014-04-28 2021-01-05 가부시끼가이샤 아라이도 마테리아루 스퍼터링 타깃용 재료
WO2016004447A1 (de) 2014-07-08 2016-01-14 Plansee Se Target und verfahren zur herstellung eines targets
US11101116B2 (en) 2014-07-08 2021-08-24 Plansee Se Target and process for producing a target
CZ306441B6 (cs) * 2014-12-05 2017-01-25 Safina, A.S. Způsob výroby kovového tělesa s homogenní, jemnozrnnou strukturou pomocí technologie Cold Spray, kovové těleso takto vyrobené, a způsob opravy použitých kovových odprášených těles
WO2016187011A3 (en) * 2015-05-15 2016-12-29 Materion Corporation Methods for surface preparation of sputtering target
US10604836B2 (en) 2015-05-15 2020-03-31 Materion Corporation Methods for surface preparation of sputtering target
KR20190086010A (ko) 2016-12-28 2019-07-19 가부시키가이샤 코베루코 카겐 스퍼터링 타깃용 백킹 플레이트의 보수 방법, 보수 완료 백킹 플레이트 및 보수 완료 백킹 플레이트를 사용한 스퍼터링 타깃

Also Published As

Publication number Publication date
TW200907087A (en) 2009-02-16
JP5215192B2 (ja) 2013-06-19
TWI370850B (ja) 2012-08-21
JP5571152B2 (ja) 2014-08-13
JP2013032597A (ja) 2013-02-14
JPWO2008081585A1 (ja) 2010-04-30

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