WO2009115192A3 - Ni-p layer system and process for its preparation - Google Patents

Ni-p layer system and process for its preparation Download PDF

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Publication number
WO2009115192A3
WO2009115192A3 PCT/EP2009/001573 EP2009001573W WO2009115192A3 WO 2009115192 A3 WO2009115192 A3 WO 2009115192A3 EP 2009001573 W EP2009001573 W EP 2009001573W WO 2009115192 A3 WO2009115192 A3 WO 2009115192A3
Authority
WO
WIPO (PCT)
Prior art keywords
preparation
layer system
layer
thickness
electropolished
Prior art date
Application number
PCT/EP2009/001573
Other languages
French (fr)
Other versions
WO2009115192A2 (en
Inventor
Jürgen Barthelmes
Robert RÜTHER
Olaf Kurtz
Michael Danker
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Priority to JP2011500065A priority Critical patent/JP5354754B2/en
Priority to US12/919,664 priority patent/US8304658B2/en
Priority to CN2009801100057A priority patent/CN101978096B/en
Publication of WO2009115192A2 publication Critical patent/WO2009115192A2/en
Publication of WO2009115192A3 publication Critical patent/WO2009115192A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/623—Porosity of the layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/16—Polishing
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The invention relates to a layer system comprising on a substrate, the surface of which has been electropolished, (i) a Ni layer having a thickness ≤ 3.0 μm, (ii) a Ni-P layer having a thickness ≤ 1.0 μm, (iii) a Au layer having a thickness ≤ 1.0 μm.
PCT/EP2009/001573 2008-03-20 2009-03-05 Ni-p layer system and process for its preparation WO2009115192A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011500065A JP5354754B2 (en) 2008-03-20 2009-03-05 Ni-P layer system and preparation method thereof
US12/919,664 US8304658B2 (en) 2008-03-20 2009-03-05 Ni-P layer system and process for its preparation
CN2009801100057A CN101978096B (en) 2008-03-20 2009-03-05 Ni-p layer system and process for its preparation

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP08005350.7 2008-03-20
EP08005350.7A EP2103712B1 (en) 2008-03-20 2008-03-20 Ni-P layer system and process for its preparation

Publications (2)

Publication Number Publication Date
WO2009115192A2 WO2009115192A2 (en) 2009-09-24
WO2009115192A3 true WO2009115192A3 (en) 2009-12-10

Family

ID=39711960

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2009/001573 WO2009115192A2 (en) 2008-03-20 2009-03-05 Ni-p layer system and process for its preparation

Country Status (7)

Country Link
US (1) US8304658B2 (en)
EP (1) EP2103712B1 (en)
JP (1) JP5354754B2 (en)
KR (1) KR101561985B1 (en)
CN (1) CN101978096B (en)
TW (1) TWI441945B (en)
WO (1) WO2009115192A2 (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101776303B1 (en) * 2011-01-27 2017-09-07 엘지이노텍 주식회사 Gravure roll and manufacturing the same
CA2794722A1 (en) * 2011-11-02 2013-05-02 Robert Jones Amorphous nickel phosphorous alloys for oil and gas
CN102747393B (en) * 2012-07-18 2016-04-06 环保化工科技有限公司 Composite multi-layer nickel electrolytic coating and electro-plating method thereof
DE102012109057B3 (en) * 2012-09-26 2013-11-07 Harting Kgaa Method for producing an electrical contact element and electrical contact element
CN102978671B (en) * 2012-12-03 2016-04-13 恒汇电子科技有限公司 A kind of electro-plating method of smart card package frame
JP5708692B2 (en) * 2013-03-28 2015-04-30 Tdk株式会社 Junction structure for electronic device and electronic device
DE102013109400A1 (en) * 2013-08-29 2015-03-05 Harting Kgaa Contact element with gold coating
JP6024714B2 (en) * 2013-10-03 2016-11-16 トヨタ自動車株式会社 Nickel solution for film formation and film forming method using the same
CN103668369A (en) * 2014-01-08 2014-03-26 苏州道蒙恩电子科技有限公司 Electric plating method capable of improving anti-corrosion performance of metal element
JP6700852B2 (en) * 2016-02-25 2020-05-27 日本圧着端子製造株式会社 Electronic component, plating method, and plating apparatus
CN106480454B (en) * 2016-10-19 2018-12-07 南昌大学 A kind of double technique for preparing coating of the substrate inhibiting Lead-Free Solder Joint interface compound growth
CN107190289A (en) * 2017-06-14 2017-09-22 深圳市呈永鑫精密电路有限公司 A kind of pcb board of the high environment resistance of low magnetic and preparation method thereof
CN108315787A (en) * 2018-05-08 2018-07-24 大同新成新材料股份有限公司 A kind of technique of brush plating
CN108677230A (en) * 2018-06-05 2018-10-19 大同新成新材料股份有限公司 A kind of Ni-P Alloy Brush Plating technique
CN111394716A (en) * 2019-01-03 2020-07-10 泰科电子(上海)有限公司 Multi-coating stacked structure, preparation method and application thereof
CN111945139B (en) * 2020-07-27 2022-07-12 江苏富乐华半导体科技股份有限公司 Nickel plating method for copper-clad ceramic substrate
KR102522045B1 (en) * 2020-10-22 2023-04-14 전승언 Composition of electrolytic polishing liquid

Citations (3)

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Publication number Priority date Publication date Assignee Title
EP0410472A2 (en) * 1989-07-27 1991-01-30 Yazaki Corporation Electric contact
US20050048309A1 (en) * 2003-08-25 2005-03-03 Naoki Haketa Metal member coated with metal layers
US20070052105A1 (en) * 2005-09-07 2007-03-08 Rohm And Haas Electronic Materials Llc Metal duplex method

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JP2704230B2 (en) * 1989-04-24 1998-01-26 下関鍍金株式会社 How to prevent hydrogen embrittlement during electroplating
JPH036400A (en) * 1989-05-31 1991-01-11 Fujitsu Ltd Power supply method in continuous plating
CH681893A5 (en) 1990-10-26 1993-06-15 Thomas Allmendinger
JPH09252070A (en) * 1996-03-15 1997-09-22 Hitachi Cable Ltd Lead frame and semiconductor device using the frame
US6457234B1 (en) * 1999-05-14 2002-10-01 International Business Machines Corporation Process for manufacturing self-aligned corrosion stop for copper C4 and wirebond
SG87194A1 (en) * 2000-08-17 2002-03-19 Samsung Techwin Co Ltd Lead frame and method of manufacturing the lead frame
US20050178666A1 (en) * 2004-01-13 2005-08-18 Applied Materials, Inc. Methods for fabrication of a polishing article
JP5120584B2 (en) * 2006-01-23 2013-01-16 日本表面化学株式会社 Method for producing glossed metal member and composition liquid for production thereof
US20100028572A1 (en) * 2006-10-06 2010-02-04 Asahi Tech Co., Ltd. Corrosion-resistant member and process for producing the same
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Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
EP0410472A2 (en) * 1989-07-27 1991-01-30 Yazaki Corporation Electric contact
US20050048309A1 (en) * 2003-08-25 2005-03-03 Naoki Haketa Metal member coated with metal layers
US20070052105A1 (en) * 2005-09-07 2007-03-08 Rohm And Haas Electronic Materials Llc Metal duplex method

Also Published As

Publication number Publication date
EP2103712B1 (en) 2019-02-13
JP5354754B2 (en) 2013-11-27
US8304658B2 (en) 2012-11-06
TW201000673A (en) 2010-01-01
TWI441945B (en) 2014-06-21
KR20100126424A (en) 2010-12-01
US20100326713A1 (en) 2010-12-30
EP2103712A1 (en) 2009-09-23
CN101978096B (en) 2013-02-27
JP2011514447A (en) 2011-05-06
WO2009115192A2 (en) 2009-09-24
KR101561985B1 (en) 2015-10-20
CN101978096A (en) 2011-02-16

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