WO2009077538A3 - Process of assembly with buried marks - Google Patents

Process of assembly with buried marks Download PDF

Info

Publication number
WO2009077538A3
WO2009077538A3 PCT/EP2008/067652 EP2008067652W WO2009077538A3 WO 2009077538 A3 WO2009077538 A3 WO 2009077538A3 EP 2008067652 W EP2008067652 W EP 2008067652W WO 2009077538 A3 WO2009077538 A3 WO 2009077538A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
assembly
layer formed
buried
marks
Prior art date
Application number
PCT/EP2008/067652
Other languages
French (fr)
Other versions
WO2009077538A2 (en
Inventor
Bernard Aspar
Chrystelle Lagahe
Original Assignee
S.O.I.Tec Silicon On Insulator Technologies
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by S.O.I.Tec Silicon On Insulator Technologies filed Critical S.O.I.Tec Silicon On Insulator Technologies
Publication of WO2009077538A2 publication Critical patent/WO2009077538A2/en
Publication of WO2009077538A3 publication Critical patent/WO2009077538A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00—Assembling of devices or systems from individually processed components
    • B81C3/002—Aligning microparts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
    • H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/05—Aligning components to be assembled
    • B81C2203/051—Active alignment, e.g. using internal or external actuators, magnets, sensors, marks or marks detectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54493—Peripheral marks on wafers, e.g. orientation flats, notches, lot number
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

The invention relates to a process of forming an assembly of at least two substrates with at least one alignment mark, comprising the following steps: a) a step of forming of at least one alignment mark (10) on or in a first substrate (4) or a layer formed on this substrate, b) a first step of assembly of this first substrate, or of a layer formed on this first substrate, with a second substrate (2) or a layer formed on this second substrate, c) a step of thinning of at least a peripheral portion of at least one of the two substrates, in order to have at least one of said alignment marks appear.
PCT/EP2008/067652 2007-12-18 2008-12-16 Process of assembly with buried marks WO2009077538A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0759944A FR2925223B1 (en) 2007-12-18 2007-12-18 METHOD FOR ASSEMBLING WITH ENTERED LABELS
FR0759944 2007-12-18

Publications (2)

Publication Number Publication Date
WO2009077538A2 WO2009077538A2 (en) 2009-06-25
WO2009077538A3 true WO2009077538A3 (en) 2009-08-27

Family

ID=39616549

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/067652 WO2009077538A2 (en) 2007-12-18 2008-12-16 Process of assembly with buried marks

Country Status (2)

Country Link
FR (1) FR2925223B1 (en)
WO (1) WO2009077538A2 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8508289B2 (en) 2009-12-08 2013-08-13 Soitec Data-path cell on an SeOI substrate with a back control gate beneath the insulating layer
FR2957193B1 (en) 2010-03-03 2012-04-20 Soitec Silicon On Insulator SEOI SUBSTRATE DATA PATH CELL WITH REAR CONTROL GRID BURED UNDER THE INSULATING LAYER
FR2953641B1 (en) 2009-12-08 2012-02-10 S O I Tec Silicon On Insulator Tech HOMOGENEOUS TRANSISTOR CIRCUIT ON SEOI WITH REAR CONTROL CHANNEL BURED UNDER THE INSULATING LAYER
FR2953643B1 (en) 2009-12-08 2012-07-27 Soitec Silicon On Insulator MEMORY CELL FLASH ON SEOI HAVING A SECOND CHECK GRID ENTERREE UNDER THE INSULATING LAYER
FR2955195B1 (en) 2010-01-14 2012-03-09 Soitec Silicon On Insulator DEVICE FOR COMPARING DATA IN A MEMORY ADDRESSABLE BY CONTENT ON SEOI
FR2955204B1 (en) 2010-01-14 2012-07-20 Soitec Silicon On Insulator DRAM MEMORY CELL HAVING A VERTICAL BIPOLAR INJECTOR
FR2955203B1 (en) 2010-01-14 2012-03-23 Soitec Silicon On Insulator MEMORY CELL WITH THE CHANNEL CROSSING A DIELECTRIC LAYER ENTERREE
FR2955200B1 (en) 2010-01-14 2012-07-20 Soitec Silicon On Insulator DEVICE AND MANUFACTURING METHOD HAVING CONTACT BETWEEN SEMICONDUCTOR REGIONS THROUGH AN INSULATED INSULATED LAYER
FR2957186B1 (en) 2010-03-08 2012-09-28 Soitec Silicon On Insulator MEMORY CELL OF SRAM TYPE
FR2957449B1 (en) 2010-03-11 2022-07-15 S O I Tec Silicon On Insulator Tech READOUT MICRO-AMPLIFIER FOR MEMORY
FR2958441B1 (en) 2010-04-02 2012-07-13 Soitec Silicon On Insulator PSEUDO-INVERTER CIRCUIT ON SEOI
EP2375442A1 (en) * 2010-04-06 2011-10-12 S.O.I.Tec Silicon on Insulator Technologies Method for manufacturing a semiconductor substrate
EP2381470B1 (en) 2010-04-22 2012-08-22 Soitec Semiconductor device comprising a field-effect transistor in a silicon-on-insulator structure
EP2867177A1 (en) 2012-06-29 2015-05-06 Corning Incorporated Glass-ceramic substrates for semiconductor processing
FR3028257A1 (en) 2014-11-10 2016-05-13 Tronic's Microsystems METHOD FOR MANUFACTURING AN ELECTROMECHANICAL DEVICE AND CORRESPONDING DEVICE

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5869386A (en) * 1995-09-28 1999-02-09 Nec Corporation Method of fabricating a composite silicon-on-insulator substrate
EP1081748A2 (en) * 1999-08-30 2001-03-07 Lucent Technologies Inc. Etch stops and alignment marks for bonded wafers
FR2848725A1 (en) * 2002-12-17 2004-06-18 Commissariat Energie Atomique Formation of patterns aligned either side of thin film, for production of three-dimensional components and micro-systems such as memory numeric circuits

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5869386A (en) * 1995-09-28 1999-02-09 Nec Corporation Method of fabricating a composite silicon-on-insulator substrate
EP1081748A2 (en) * 1999-08-30 2001-03-07 Lucent Technologies Inc. Etch stops and alignment marks for bonded wafers
FR2848725A1 (en) * 2002-12-17 2004-06-18 Commissariat Energie Atomique Formation of patterns aligned either side of thin film, for production of three-dimensional components and micro-systems such as memory numeric circuits

Also Published As

Publication number Publication date
FR2925223B1 (en) 2010-02-19
FR2925223A1 (en) 2009-06-19
WO2009077538A2 (en) 2009-06-25

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