WO2010011009A9 - Metal substrate for an electronic component module, module comprising same, and method for manufacturing a metal substrate for an electronic component module - Google Patents

Metal substrate for an electronic component module, module comprising same, and method for manufacturing a metal substrate for an electronic component module Download PDF

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Publication number
WO2010011009A9
WO2010011009A9 PCT/KR2009/000936 KR2009000936W WO2010011009A9 WO 2010011009 A9 WO2010011009 A9 WO 2010011009A9 KR 2009000936 W KR2009000936 W KR 2009000936W WO 2010011009 A9 WO2010011009 A9 WO 2010011009A9
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
metal substrate
component module
module
manufacturing
Prior art date
Application number
PCT/KR2009/000936
Other languages
French (fr)
Korean (ko)
Other versions
WO2010011009A1 (en
Inventor
이환철
심영조
오용준
Original Assignee
코아셈(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 코아셈(주) filed Critical 코아셈(주)
Publication of WO2010011009A1 publication Critical patent/WO2010011009A1/en
Publication of WO2010011009A9 publication Critical patent/WO2010011009A9/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes

Abstract

The present invention relates to a metal substrate for an electronic component module manufactured by a plasma electrolytic oxidation, an electronic component module comprising same, and a method for manufacturing a metal substrate for an electronic component module. The metal substrate for an electronic component module according to the present invention includes a base metal, an oxide layer formed on at least one surface of the base metal through a plasma electrolytic oxidation, and which has a thickness of 1 to 200㎛, and a metal wiring layer formed on the oxide layer.
PCT/KR2009/000936 2008-07-25 2009-02-27 Metal substrate for an electronic component module, module comprising same, and method for manufacturing a metal substrate for an electronic component module WO2010011009A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2008-0072961 2008-07-25
KR20080072961 2008-07-25
KR10-2009-0016334 2009-02-26
KR1020090016334A KR100917841B1 (en) 2008-07-25 2009-02-26 Metal substrate for electronic components module and electronic components module using it and method of manufacturing metal substrate for electronic components module

Publications (2)

Publication Number Publication Date
WO2010011009A1 WO2010011009A1 (en) 2010-01-28
WO2010011009A9 true WO2010011009A9 (en) 2011-02-03

Family

ID=41355849

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/000936 WO2010011009A1 (en) 2008-07-25 2009-02-27 Metal substrate for an electronic component module, module comprising same, and method for manufacturing a metal substrate for an electronic component module

Country Status (2)

Country Link
KR (1) KR100917841B1 (en)
WO (1) WO2010011009A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101117160B1 (en) 2009-12-11 2012-03-09 (주)엠에스티테크놀로지 Metal base circuit board and method for manufacturing the same
KR101037334B1 (en) * 2010-07-12 2011-05-26 카이네틱스 주식회사 Fabricating method of printed circuit board using plasma electrolytic oxidation, printed circuit board and electronic device module
KR101766462B1 (en) * 2010-12-22 2017-08-08 엘지이노텍 주식회사 Printed circuit board
KR20140041385A (en) * 2010-12-23 2014-04-04 아노맥스 에스디엔 비에이치디 Integrated plated circuit heat sink and method of manufacture
KR101242218B1 (en) 2011-01-07 2013-03-11 에이텍 테크놀로지 코포레이션 Lighting device and method for forming the same
DE102014204116A1 (en) * 2014-03-06 2015-09-10 Osram Gmbh LED module with substrate body
US9882275B2 (en) 2015-10-30 2018-01-30 Essential Products, Inc. Antennas for handheld devices
US9896777B2 (en) * 2015-10-30 2018-02-20 Essential Products, Inc. Methods of manufacturing structures having concealed components
US10158164B2 (en) 2015-10-30 2018-12-18 Essential Products, Inc. Handheld mobile device with hidden antenna formed of metal injection molded substrate
AT17081U1 (en) * 2020-04-14 2021-05-15 Zkw Group Gmbh Process for the production of an insulation layer on an IMS circuit board
KR102361396B1 (en) * 2020-04-22 2022-02-10 (주)포인트엔지니어링 Anodic oxide structure and probe card comprising thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5534356A (en) * 1995-04-26 1996-07-09 Olin Corporation Anodized aluminum substrate having increased breakdown voltage
JP2003318316A (en) 2002-04-25 2003-11-07 Hitachi Metals Ltd Ceramic circuit substrate
JP4650066B2 (en) 2005-04-01 2011-03-16 セイコーエプソン株式会社 Substrate for transfer, method for manufacturing flexible wiring substrate, and method for manufacturing electronic device
JP3847770B1 (en) 2005-06-13 2006-11-22 慎介 望月 Ceramic-coated metal material and method for producing the same

Also Published As

Publication number Publication date
KR100917841B1 (en) 2009-09-18
WO2010011009A1 (en) 2010-01-28

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