WO2017031893A1 - 柔性显示面板及其制造方法和柔性显示装置 - Google Patents

柔性显示面板及其制造方法和柔性显示装置 Download PDF

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Publication number
WO2017031893A1
WO2017031893A1 PCT/CN2015/099265 CN2015099265W WO2017031893A1 WO 2017031893 A1 WO2017031893 A1 WO 2017031893A1 CN 2015099265 W CN2015099265 W CN 2015099265W WO 2017031893 A1 WO2017031893 A1 WO 2017031893A1
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Prior art keywords
display panel
flexible
flexible display
flexible substrate
connector
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PCT/CN2015/099265
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English (en)
French (fr)
Inventor
史世明
Original Assignee
京东方科技集团股份有限公司
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Priority to US15/322,465 priority Critical patent/US10306766B2/en
Publication of WO2017031893A1 publication Critical patent/WO2017031893A1/zh

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10022—Non-printed resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1003—Non-printed inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10174—Diode
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • Embodiments of the present invention generally relate to the field of flexible display, and more particularly, to a flexible display panel and method of fabricating the same, and a flexible display device including the same.
  • FIG. 1 shows the structure of a conventional flexible display panel 10.
  • a conventional flexible display panel generally includes a top film 11, a flexible substrate 14, a flexible circuit board (FPC) 19, and a base film 15, wherein the TFT device 13 and the OLED 12 are fabricated on the flexible substrate 14, and the driver chip (IC) 16 is mounted. It is disposed on a COF (Chip On Film) 18, and a connector 17 for connecting to a system board (not shown) is disposed on a flexible circuit board (FPC) 19 to pass the flexible substrate through the COF and / or FPC connected to the driver IC and system board to achieve the drive of the flexible display panel.
  • COF Chip On Film
  • the present invention provides a flexible display panel and a method of fabricating the same, and a flexible display device including the same.
  • a flexible display panel including a flexible substrate and a display
  • a driver for electrically connecting the flexible display panel to a system circuit board, the display device, the driver chip and the connector being disposed on the flexible substrate to pass the flexible A substrate physically and electrically connects the flexible display panel to the system circuit board.
  • the flexible display panel further includes a wiring structure directly formed on the flexible substrate for electrically connecting the display device, the driving chip, and the connector.
  • the flexible substrate is a monolithically formed flexible substrate.
  • the connector or both the connector and the driving chip, are disposed on a portion of the flexible substrate that can be bent toward the back surface of the flexible display panel.
  • the flexible substrate includes a first portion and a second portion, the display device is disposed on the first portion, the connector is disposed on the second portion, and the second portion is capable of being located along the first portion A first fold line between the portion and the second portion is bent toward the back side of the flexible display panel with respect to the first portion such that the connector and the display device are located on opposite sides of the flexible substrate.
  • the driving chip is disposed on the second portion such that the driving chip and the display device are located on opposite sides of the flexible substrate.
  • the flexible substrate includes a first portion and a second portion, the display device being disposed on the first portion, the second portion being engagable along a first portion between the first portion and the second portion a fold line is bent toward a back surface of the flexible display panel with respect to the first portion; the second portion further includes a first area and a second area, the connector is disposed on the second area, the second The region is bendable toward the back side of the flexible display panel relative to the first region along a second fold line between the first region and the second region.
  • the second fold line is perpendicular to the first fold line.
  • the flexible display panel further comprises a resistive, capacitive, inductive and/or diode element, the resistive, capacitive, inductive and/or diode element being disposed on the second portion.
  • the driving chip and/or the connector pass through a conductive paste, Wire bonding or soldering is attached to the flexible substrate.
  • the conductive paste includes an anisotropic conductive paste.
  • the driving chip is electrically connected to the display device and the connector by a conductive lead formed on a flexible substrate by a sputtering, coating film or printing process.
  • a conductive lead is disposed on the flexible substrate, and the connector has a pin connected to the conductive lead.
  • the pins are made of copper, and the surface of the pins is plated with gold or a nickel alloy, the pins including protrusions having a certain thickness.
  • the flexible substrate is formed with a plated connection pin for soldering the connector, the resistor, the capacitor, the inductor, and/or the diode element.
  • the connector has a magnet embedded therein for connecting the system board by magnetic attraction.
  • a flexible display device comprising the flexible display panel of any of the above embodiments is provided.
  • a method of manufacturing the above flexible display panel comprising:
  • the driver chip and/or the connector are fixed on the flexible substrate of the obtained panel structure, and the driver chip and/or the connector are electrically connected to the display device through the wiring structure.
  • a flexible substrate is used instead of the conventional COF or FPC, and the flexible display panel directly realizes the physical and electrical connection between the flexible display panel and the system circuit board (ie, the main board), thereby eliminating the manufacturing and bonding of the FPC.
  • the manufacturing steps increase system integration while reducing the process complexity of manufacturing the flexible display panel.
  • Figure 1 is a side view of a conventional flexible display panel
  • FIG. 2 is a side view of a flexible display panel in accordance with an embodiment of the present invention.
  • FIG. 3 is a top plan view of a flexible display panel in accordance with an embodiment of the present invention.
  • FIG. 4 is a top plan view of a flexible display panel in accordance with another embodiment of the present invention.
  • Figure 5 is a side elevational view of a flexible display panel in accordance with still another embodiment of the present invention.
  • Figure 6 is a side elevational view of a flexible display panel in accordance with yet another embodiment of the present invention.
  • FIG. 7(a)-(e) are schematic views of an exemplary method for manufacturing a flexible display panel according to the present invention.
  • FIG. 8 is a flow chart of an exemplary method for fabricating a flexible display panel in accordance with the present invention.
  • a flexible display panel including a flexible substrate, a display device, a driving chip, and a connector, wherein the connector is used to connect the flexible substrate to a system circuit board, the display A device, a driver chip, and a connector are all disposed on the flexible substrate to physically and electrically connect the flexible display panel to the system circuit board through the flexible substrate.
  • the flexible display panel 20 includes, in order from top to bottom, a top film 21, a display device 23 including a thin film transistor and a pixel, a flexible substrate 24, and a base film 25.
  • the top film may be a circular polarizer, a touch film, a water-oxygen barrier film, a scratch-resistant film, or other optical film
  • the bottom film may be a water-oxide barrier film, a film such as PET, PEN, PI, or the like. It is a heat-dissipating functional film such as graphite sheet or copper foil.
  • the flexible substrate 24 is a flexible substrate made of plastic, for example, a polyimide (PI) flexible substrate.
  • the flexible display panel further includes a driver chip 26 for providing a driving signal to the display device and a connector 27 for electrically and/or mechanically connecting the display panel to the system board (ie, System motherboard).
  • the flexible display panel 20 uses a flexible substrate instead of the conventional COF and/or FPC, that is, the flexible display panel 20 uses only one integrally formed flexible substrate 24.
  • the display device 23 is disposed on the flexible substrate 24, but also the driver chip 26 and the connector 27 are disposed on the flexible substrate 24, thereby eliminating the conventional use for realizing electrical connection between the display device, the driver chip, and the connector.
  • COF and / or FPC are disposed on the flexible substrate 24, thereby eliminating the conventional use for realizing electrical connection between the display device, the driver chip, and the connector.
  • the flexible substrate 24 of the display panel includes a first portion or central portion 241 and a second portion or peripheral portion 242, and the display device 23 and the driving chip 26 are disposed on the first portion 241 to form a display area of the flexible display panel.
  • the connector 27 is disposed on the second portion 242. When assembled, at least a portion of the second portion 242 can be bent toward the back side of the flexible display panel relative to the first portion 241 along the first fold line 28 between the first portion 241 and the second portion 242; for example, such bending causes the drive chip 26 and connector 27 are located on opposite sides of flexible substrate 24, as shown in FIG.
  • the flexible substrate 24' of the display panel includes a first portion 241' and a second portion 242'.
  • the display device 23 and the driving chip 26 are disposed on the first portion 241', and the second portion 242' can be along the first portion.
  • the first fold line 28' between the 241' and the second portion 242' is bent toward the back side of the flexible display panel with respect to the first portion 241'.
  • the second portion 242' further includes a first region 2421 and a second region 2422.
  • the connector 27 is disposed on the second region 2422, and the second region 2422 is capable of along the first region 2421.
  • the second fold line 29 between the second area 2422 and the first area 2411 is bent toward the back side of the flexible display panel to facilitate connection with the system board of the back side.
  • the second fold line 29 is perpendicular to the first fold line 28'.
  • the connector 27 is disposed on the second portion 242 or 242' of the flexible substrate 24 or 24', and when assembled, the connector 27 can be bent along the fold line toward the back surface of the flexible display substrate to make the connection
  • the device 27 can be more securely attached to the flexible display substrate and also facilitates the connection of the connector 27 to the system board.
  • the driving chip 26 and/or the connector 27 are fixed to the flexible substrate 24 by conductive glue, wire bonding or soldering.
  • the conductive paste is preferably an anisotropic conductive paste (ACF).
  • the flexible substrate 24 is provided with conductive leads 32, such as metal leads, on the bottom surface of the connector 27 is provided with pins (not shown) connected to the conductive leads 32, and the connector 27 is electrically connected to the drive through the conductive leads.
  • Chip 26 and/or display device 23 the connector 27 can be made of ceramic material.
  • the pins are made of copper, and the surface of the pins is plated with a conductive, corrosion-resistant metal material such as gold or a nickel alloy, and the pins have protrusions of a certain thickness.
  • a plated connection pin is formed in the position of the flexible substrate 24 where the connector or the external component is required to be connected, so that it is easily bonded to the solder, thereby being used for soldering the connector.
  • the driving chip 26 is fixed on the flexible substrate 24 by wire bonding, and the conductive leads 31 (such as metal leads) fabricated by sputtering, coating film or printing process are electrically connected to the display device 23 of the flexible display panel, and pass through the conductive leads. 32 is electrically connected to the connector 27.
  • the driver chip 26 and/or the connector 27 are fixed to the flexible substrate 24 using an ACF.
  • the upper surface of the connector 27 is flat, which can better conduct heat, and can conduct heat to the flexible substrate during hot pressing. 24 on the ACF between the connector 27, thereby allowing the ACF to flow easily and solidify.
  • FIG. 5 is a side view of a flexible display panel in accordance with another embodiment.
  • the driver chip 26 is disposed on the first portion 241 or 241' of the flexible substrate 24.
  • the driver chip 26 is disposed on the second portion 242 of the flexible substrate 24.
  • the driving chip 26 and the connector 27 are both disposed on the second portion. When assembled, both can be bent and placed on the back surface of the flexible display panel, thereby facilitating the manufacture of a display panel with a narrower bezel.
  • FIG. 6 is a side view of a flexible display panel in accordance with another embodiment.
  • the flexible display panel further includes other components 30 such as resistors, capacitors, inductors, and/or diode components, and other components such as resistors, capacitors, inductors, and/or diode components may be disposed in the The second part 242 is on. That is, they can be bent and placed on the back side of the flexible display panel when assembled, which is more advantageous for manufacturing a display panel with a narrower bezel.
  • a plated connection pin is formed in a position on the flexible substrate 24 where external components need to be connected for soldering components such as resistors, capacitors, inductors, and/or diodes.
  • the connector 27 may be embedded with a magnet (not shown) for connecting the system board by means of magnet adsorption.
  • FIGS. 7 and 8 are schematic and flow charts, respectively, of an exemplary method for fabricating the above flexible display panel.
  • the manufacturing method mainly includes the following steps:
  • the flexible material may include a plastic such as polyimide, and the coating operation may be performed by a process such as a slot die, and the carrier may be a glass carrier or a quartz carrier;
  • the panel related process includes wiring, circuit arrangement, display device including a TFT device and a pixel, and the like;
  • a wiring structure 04 is formed on another portion of the flexible substrate 02 instead of the conventional FPC, including the aforementioned conductive leads and the like;
  • the flexible substrate 02 is cut into a shape of a desired display panel by, for example, a laser, and the flexible substrate 02 is separated from the carrier 01 by, for example, a laser to obtain a display device and directly formed.
  • a component 06 such as a driver chip and a connector is fixed on the flexible substrate 02, for example, on the other portion, and the component 06 and the display device 03 are electrically connected by a wiring structure. connection;
  • the driving chip and/or the connector may be fixed on the flexible polyimide substrate by conductive glue, wire bonding or soldering.
  • the manufacturing method it is not necessary to provide a separate FPC or COF, and the flexible substrate is prevented from being connected to the FPC or the COF without additional external force (such as adhesion), thereby avoiding the possibility that the conventional flexible display panel may be manufactured.
  • the FPC and the flexible substrate are deformed during the hot pressing process, the alignment is not accurate, and the bonding area is easy to fall off, which effectively reduces the process complexity and improves the system integration.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种柔性显示面板及其制造方法和柔性显示装置，柔性显示面板（20）包括柔性基板（24）、显示器件（23）、驱动芯片（26）和连接器（27），其中，连接器（27）用于将柔性基板（24）连接至系统电路板，显示器件（23）、驱动芯片（26）和连接器（27）均设置在所述柔性基板（24）上，在柔性显示面板（20）中，使用柔性基板（24）替代传统的COF或FPC，直接通过柔性基板（24）实现柔性显示面板（20）与系统电路板的物理和电连接，从而省去制造和结合FPC的制造步骤，提高了系统集成度，同时降低了制造柔性显示面板（20）的工艺复杂度。

Description

柔性显示面板及其制造方法和柔性显示装置 技术领域
本发明的实施例一般地涉及柔性显示领域，并且更具体地，涉及柔性显示面板及其制造方法、以及包括该柔性显示面板的柔性显示装置。
背景技术
随着柔性显示屏技术的不断发展，其具有轻薄、抗冲击、可卷曲等诸多传统显示屏所不具有的特点，得到广泛研究和关注，也成为未来显示领域的发展方向之一。
图1示出了传统的柔性显示面板10的结构。传统的柔性显示面板通常包括顶膜11、柔性基板14、柔性电路板(FPC)19和底膜15，其中，将TFT器件13及OLED 12制作于柔性基板14上，将驱动芯片(IC)16设置在COF(Chip On Film，薄膜芯片)18上，并且将用于连接至系统电路板(未示出)的连接器17设置在柔性电路板(FPC)19上，以使得柔性基板通过COF和/或FPC连接驱动IC及系统电路板，实现柔性显示面板的驱动。然而，在制作传统的柔性显示面板的过程中，通常需要采用热压工艺将FPC结合到柔性基板上，而且在该热压过程中，塑料基板可能会产生变形，造成FPC与柔性基板的对位存在问题。另外，由于柔性基板的可弯曲特性，在弯曲过程中，也容易造成结合区域的脱落。
发明内容
为了解决现有技术中存在的上述问题和缺陷中的至少一个方面，本发明提出了一种柔性显示面板及其制造方法、以及包括该柔性显示面板的柔性显示装置。
根据本发明的一个方面，提供一种柔性显示面板，包括柔性基板、显示器 件、驱动芯片和连接器，所述连接器用于将所述柔性显示面板电连接至系统电路板，所述显示器件、驱动芯片和连接器均设置在所述柔性基板上，以通过所述柔性基板将所述柔性显示面板物理连接和电连接至所述系统电路板。
根据本发明的一个实施例，柔性显示面板还包括直接形成在柔性基板上的布线结构，该布线结构用于电连接显示器件、驱动芯片和连接器。
根据本发明的一个实施例，所述柔性基板是单块一体成型的柔性基板。
根据本发明的一个实施例，所述连接器，或者所述连接器和驱动芯片二者设置在所述柔性基板的能够向所述柔性显示面板的背面弯折的部分上。
根据本发明的一个实施例，所述柔性基板包括第一部分和第二部分，所述显示器件设置在第一部分上，所述连接器设置在第二部分上，所述第二部分能够沿位于第一部分和第二部分之间的第一折线相对于所述第一部分向所述柔性显示面板的背面弯折，使得所述连接器和所述显示器件位于柔性基板的相反两侧。
根据本发明的另一个实施例，所述驱动芯片设置在所述第二部分上，使得所述驱动芯片和所述显示器件位于柔性基板的相反两侧。
根据本发明的另一个实施例，所述柔性基板包括第一部分和第二部分，所述显示器件设置在第一部分上，所述第二部分能够沿位于第一部分和第二部分之间的第一折线相对于所述第一部分向所述柔性显示面板的背面弯折；所述第二部分进一步包括第一区域和第二区域，所述连接器设置在所述第二区域上，所述第二区域能够沿位于第一区域和第二区域之间的第二折线相对于所述第一区域向所述柔性显示面板的背面弯折。示例性地，所述第二折线垂直于所述第一折线。
根据本发明的另一个实施例，所述柔性显示面板还包括电阻、电容、电感和/或二极管元件，所述电阻、电容、电感和/或二极管元件设置在所述第二部分上。
根据本发明的另一个实施例，所述驱动芯片和/或所述连接器通过导电胶、 引线键合或焊接的方式固定在所述柔性基板上。例如，所述导电胶包括各向异性导电胶。
根据本发明的另一个实施例，所述驱动芯片通过溅射、涂膜或印刷工艺制作在柔性基板上的导电引线与所述显示器件和所述连接器电连接。
根据本发明的另一个实施例，所述柔性基板上设置导电引线，所述连接器具有与所述导电引线相连的管脚。例如，所述管脚由铜制成，并且所述管脚的表面镀金或镍合金，所述管脚包括具有一定厚度的凸起。
根据本发明的另一个实施例，所述柔性基板上形成有经过电镀处理的连接管脚，用于焊接连接器、电阻、电容、电感和/或二极管元件。
根据本发明的另一个实施例，所述连接器内嵌有磁铁，用于通过磁铁吸附的方式连接所述系统电路板。
根据本发明的另一个方面，提供一种柔性显示装置，包括上述任一实施例所述的柔性显示面板。
根据本发明的又一个方面，提供一种制造上述柔性显示面板的方法，包括：
在载板上进行柔性材料涂膜，以形成柔性基板；
进行半导体工艺以在柔性基板的一部分上形成显示器件；
在柔性基板的另一部分上形成与显示器件电连接的布线结构；
将柔性基板切割成需要的显示面板的形状，并且将柔性基板与载板分离，以获得包括显示器件和直接形成在柔性基板上的布线结构的面板结构；以及
将驱动芯片和/或连接器固定在所获得面板结构的柔性基板上，并通过布线结构将驱动芯片和/或连接器与显示器件电连接。
在本发明提供的柔性显示面板中，使用柔性基板替代传统的COF或FPC，直接通过柔性基板实现柔性显示面板与系统电路板(即主板)的物理和电连接，从而省去制造和结合FPC的制造步骤，提高了系统集成度，同时降低了制造该柔性显示面板的工艺复杂度。
通过下文中参照附图对本发明所作的描述，本发明的其它目的和优点将显 而易见，并可帮助对本发明有全面的理解。
附图说明
图1是传统的柔性显示面板的侧视图；
图2是根据本发明的一个实施例的柔性显示面板的侧视图；
图3是根据本发明的一个实施例的柔性显示面板的俯视图；
图4是根据本发明的另一个实施例的柔性显示面板的俯视图；
图5是根据本发明的再一个实施例的柔性显示面板的侧视图；
图6是根据本发明的又一个实施例的柔性显示面板的侧视图；
图7(a)-(e)是用于制造根据本发明的柔性显示面板的一种示例性方法的示意图；以及
图8是用于制造根据本发明的柔性显示面板的一种示例性方法的流程图。
具体实施方式
下面通过实施例，并结合附图，对本发明的技术方案作进一步具体的说明。在说明书中，相同或相似的附图标号指示相同或相似的部件。下述参照附图对本发明实施方式的说明旨在对本发明的总体发明构思进行解释，而不应当理解为对本发明的一种限制。
另外，在下面的详细描述中，为便于解释，阐述了许多具体的细节以提供对本披露实施例的全面理解。然而明显地，一个或多个实施例在没有这些具体细节的情况下也可以被实施。在其他情况下，公知的结构和装置以图示的方式体现以简化附图。
根据本发明的一个总体技术构思，提供一种柔性显示面板，包括柔性基板、显示器件、驱动芯片和连接器，其中，所述连接器用于将所述柔性基板连接至系统电路板，所述显示器件、驱动芯片和连接器均设置在所述柔性基板上，以通过所述柔性基板将所述柔性显示面板物理连接和电连接至所述系统电路板。
图2是根据本发明的一个实施例的柔性显示面板的侧视图。在图2所示的实施例中，柔性显示面板20从上至下依次包括顶膜21、包括薄膜晶体管和像素等结构的显示器件23、柔性基板24和底膜25。其中，顶膜可以为圆偏光片、触控膜、水氧阻隔膜、防刮伤膜、或其他光学薄膜等，底膜可以为水氧阻隔膜、PET、PEN、PI等膜材，也可以是石墨片、铜箔等散热功能膜材。柔性基板24为由塑料制成的柔性基板，例如，聚酰亚胺(PI)柔性基板。该柔性显示面板还包括驱动芯片26和连接器27，该驱动芯片26用于给显示器件提供驱动信号，该连接器27用于将所述显示面板电连接和/机械连接至系统电路板(即系统主板)。与图1所示的传统柔性显示面板10不同，柔性显示面板20使用柔性基板代替传统的COF和/或FPC，即，柔性显示面板20仅使用一块一体成型的柔性基板24。不仅显示器件23设置在柔性基板24上，而且驱动芯片26和连接器27也都设置在柔性基板24上，从而省去了传统上用于实现显示器件、驱动芯片和连接器之间的电连接的COF和/或FPC。
图3是根据一个实施例的柔性显示面板的俯视图。如图3所示，该显示面板的柔性基板24包括第一部分或中央部分241和第二部分或外围部分242，显示器件23和驱动芯片26设置在第一部分241上以形成柔性显示面板的显示区域；连接器27设置在第二部分242上。组装时，第二部分242的至少一部分能够沿第一部分241和第二部分242之间的第一折线28相对于第一部分241向柔性显示面板的背面弯折；例如，这种弯折使得驱动芯片26和连接器27位于柔性基板24的相反侧，如图2所示。
图4是根据另一个实施例的柔性显示面板的俯视图。如图4所示，该显示面板的柔性基板24’包括第一部分241’和第二部分242’，显示器件23和驱动芯片26设置在第一部分241’上，第二部分242’能够沿第一部分241’和第二部分242’之间的第一折线28’相对于第一部分241’向柔性显示面板的背面弯折。第二部分242’进一步包括第一区域2421和第二区域2422。在图4所示的实施例中，连接器27设置在第二区域2422上，第二区域2422能够沿第一区域2421 和第二区域2422之间的第二折线29相对于第一区域2411向柔性显示面板的背面弯折，从而方便与背面的系统电路板连接。在图4所示的实施例中，所述第二折线29垂直于所述第一折线28’。
在上述实施例中，将连接器27设置在柔性基板24或24’的第二部分242或242’上，在组装时，能够将连接器27沿折线向柔性显示基板的背面弯折，使连接器27能够更牢固地固定于柔性显示基板上，并且还便于连接器27与系统电路板的连接。
在上述柔性显示面板中，驱动芯片26和/或连接器27通过导电胶、引线键合(wire bonding)或焊接的方式固定在柔性基板24上。其中，导电胶优选为各向异性导电胶(ACF)。
作为一个示例，柔性基板24上设置导电引线32，如金属引线，在连接器27的底面上设置有与导电引线32相连的管脚(未示出)，连接器27通过导电引线电连接至驱动芯片26和/或显示器件23。其中，连接器27可以为陶瓷材质。优选地，所述管脚由铜制成，并且所述管脚的表面镀易导电、抗腐蚀的金属材料，例如金或镍合金，并且所述管脚具有一定厚度的凸起。或者，在柔性基板24上需要连接连接器或外部元器件的位置中形成有经过电镀处理的连接管脚，使之易于与焊锡结合，从而用于焊接连接器。
驱动芯片26通过引线键合的方式固定在柔性基板24上，通过溅射、涂膜或印刷工艺制作的导电引线31(如金属引线)与柔性显示面板的显示器件23电连接，并且通过导电引线32与连接器27电连接。
使用ACF将驱动芯片26和/或连接器27固定在柔性基板24上，如图所示，连接器27的上表面平整，可以较好地传导热量，在热压时，能够将热传导到柔性基板24与连接器27之间的ACF上，从而使ACF易于流动展开以及固化。
图5是根据另一实施例的柔性显示面板的侧视图。在图3和4所示的实施例中，驱动芯片26设置在柔性基板24的第一部分241或241’上。与之不同，如图5所示，驱动芯片26设置在柔性基板24的第二部分242上。在该实施例 中，驱动芯片26和连接器27均设置在所述第二部分上，在组装时，二者都可以弯折放置于柔性显示面板的背面，从而有利于制造更窄边框的显示面板。
图6是根据另一实施例的柔性显示面板的侧视图。如图6所示，所述柔性显示面板还包括电阻、电容、电感和/或二极管元件等其它元器件30，所述电阻、电容、电感和/或二极管元件等其它元器件可以设置在所述第二部分242上。即，在组装时，它们都可以弯折放置于柔性显示面板的背面，从而更有利于制造更窄边框的显示面板。作为一个示例，柔性基板24上需要连接外部元器件的位置中形成有经过电镀处理的连接管脚，用于焊接电阻、电容、电感和/或二极管等元器件。
此外，根据一个实施例，连接器27可以内嵌有磁铁(未示出)，用于通过磁铁吸附的方式连接系统电路板。
图7和图8分别是用于制造上述柔性显示面板的一个示例性方法的示意图和流程图。作为一个示例，如图7和8所示，该制造方法主要包括如下步骤：
S1：如图7(a)所示，在载板01上进行柔性材料涂膜，以形成柔性基板02；
其中，柔性材料可以包括聚酰亚胺等塑料，可以使用狭缝涂布(slot die)等工艺进行上述涂膜操作，该载板可以是玻璃载板或石英载板；
S2：如图7(b)所示，在柔性基板02的一部分上进行面板(panel)相关工艺，包括半导体工艺，以形成显示器件03；
其中，该面板相关工艺包括布线、电路布置、包括TFT器件和像素等的显示器件等的制作等；
S3：如图7(c)所示，在柔性基板02的另一部分上形成替代传统的FPC的布线结构04，包括前述导电引线等；
S4：如图7(d)所示，例如利用激光，将柔性基板02切割成需要的显示面板的形状，并且例如利用激光，将柔性基板02与载板01分离，获得包括显示器件和直接形成在柔性基板02上的布线结构04的面板结构05；
S5：如图7(e)所示，将驱动芯片和连接器等元器件06固定在柔性基板02上，例如固定在所述另一部分上，并通过布线结构将元器件06与显示器件03电连接；
其中，驱动芯片和/或连接器可以通过导电胶、引线键合或焊接的方式固定在柔性聚亚酰胺基板上。
在该制造方法中，不需要提供单独的FPC或COF，避免将柔性基板与FPC或COF相连接，没有额外的外力(如粘合力)，从而避免了传统的柔性显示面板制造过程中可能出现的FPC与柔性基板在热压过程中产生形变、对位不准、结合区域易脱落等问题，有效地降低了工艺复杂度，同时提高了系统集成度。
虽然结合附图对本发明进行了说明，但是附图中公开的实施例旨在对本发明的实施方式进行示例性说明，而不能理解为对本发明的一种限制。
虽然本发明总体构思的一些实施例已被显示和说明，本领域普通技术人员将理解，在不背离本发明的总体构思的原则和精神的情况下，可对这些实施例做出改变，本发明的范围以权利要求和它们的等同物限定。另外，权利要求的任何元件标号不应理解为限制本发明的范围。

Claims (20)

  1. 一种柔性显示面板，包括柔性基板、显示器件、驱动芯片和连接器，所述连接器用于将所述柔性显示面板电连接至系统电路板，所述显示器件、驱动芯片和连接器均设置在所述柔性基板上，以通过所述柔性基板将所述柔性显示面板物理连接和电连接至所述系统电路板。
  2. 根据权利要求1所述的柔性显示面板，还包括直接形成在柔性基板上的布线结构，该布线结构用于电连接显示器件、驱动芯片和连接器。
  3. 根据权利要求1所述的柔性显示面板，其中所述柔性基板是单块一体成型的柔性基板。
  4. 根据权利要求1所述的柔性显示面板，其中所述连接器，或者所述连接器和驱动芯片二者设置在所述柔性基板的能够向所述柔性显示面板的背面弯折的部分上。
  5. 根据权利要求1-4中任一项所述的柔性显示面板，其中，
    所述柔性基板包括第一部分和第二部分，所述显示器件设置在第一部分上，所述连接器设置在第二部分上，所述第二部分能够沿位于第一部分和第二部分之间的第一折线相对于所述第一部分向所述柔性显示面板的背面弯折，使得所述连接器和所述显示器件位于柔性基板的相反两侧。
  6. 根据权利要求5所述的柔性显示面板，其中所述驱动芯片设置在所述第二部分上，使得所述驱动芯片和所述显示器件位于柔性基板的相反两侧。
  7. 根据权利要求1-4中任一项所述的柔性显示面板，其中，
    所述柔性基板包括第一部分和第二部分，所述显示器件设置在第一部分上，所述第二部分能够沿位于第一部分和第二部分之间的第一折线相对于所述第一部分向所述柔性显示面板的背面弯折；
    所述第二部分进一步包括第一区域和第二区域，所述连接器设置在所述第二区域上，所述第二区域能够沿位于第一区域和第二区域之间的第二折线相对于所述第一区域向所述柔性显示面板的背面弯折。
  8. 根据权利要求1至4中任一项所述的柔性显示面板，其中，所述驱动芯片和/或所述连接器通过导电胶、引线键合或焊接的方式固定在所述柔性基板上。
  9. 根据权利要求8所述的柔性显示面板，其中所述导电胶包括各向异性导电胶。
  10. 根据权利要求5所述的柔性显示面板，其中，所述驱动芯片和/或所述连接器通过导电胶、引线键合或焊接的方式固定在所述柔性基板上。
  11. 根据权利要求7所述的柔性显示面板，其中，所述驱动芯片和/或所述连接器通过导电胶、引线键合或焊接的方式固定在所述柔性基板上。
  12. 根据权利要求1至4中任一项所述的柔性显示面板，其中，所述柔性基板上设置导电引线，所述连接器具有与所述导电引线相连的管脚。
  13. 根据权利要求12所述的柔性显示面板，其中，所述管脚由铜制成，并且所述管脚的表面镀金或镍合金，所述管脚包括具有一定厚度的凸起。
  14. 根据权利要求7所述的柔性显示面板，其中，所述驱动芯片设置在所 述第二部分上，并且经由通过溅射、涂膜或印刷工艺制作在柔性基板上的导电引线与所述连接器和所述显示器件电连接。
  15. 根据权利要求5所述的柔性显示面板，其中，所述柔性显示面板还包括电阻、电容、电感和/或二极管元件，所述电阻、电容、电感和/或二极管元件设置在所述第二部分上。
  16. 根据权利要求7所述的柔性显示面板，其特征在于，所述柔性显示面板还包括电阻、电容、电感和/或二极管元件，所述电阻、电容、电感和/或二极管元件设置在所述第二部分上。
  17. 根据权利要求1至4中任一项所述的柔性显示面板，其中，所述柔性基板上形成有经过电镀处理的连接管脚，用于焊接连接器、电阳、电容、电感和/或二极管元件。
  18. 根据权利要求1至4中任一项所述的柔性显示面板，其中，所述连接器内嵌有磁铁，用于通过磁铁吸附的方式连接所述系统电路板。
  19. 一种柔性显示装置，包括如权利要求1-18中任一项所述的柔性显示面板。
  20. 一种制造权利要求1-18中任一项所述的柔性显示面板的方法，包括：
    在载板上进行柔性材料涂膜，以形成柔性基板；
    进行半导体工艺以在柔性基板的一部分上形成显示器件；
    在柔性基板的另一部分上形成与显示器件电连接的布线结构；
    将柔性基板切割成需要的显示面板的形状，并且将柔性基板与载板分离，以获得包括显示器件和直接形成在柔性基板上的布线结构的面板结构；以及
    将驱动芯片和/或连接器固定在所获得面板结构的柔性基板上，并通过布线结构将驱动芯片和/或连接器与显示器件电连接。
PCT/CN2015/099265 2015-08-27 2015-12-28 柔性显示面板及其制造方法和柔性显示装置 WO2017031893A1 (zh)

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