WO2021081952A1 - 显示装置 - Google Patents

显示装置 Download PDF

Info

Publication number
WO2021081952A1
WO2021081952A1 PCT/CN2019/114879 CN2019114879W WO2021081952A1 WO 2021081952 A1 WO2021081952 A1 WO 2021081952A1 CN 2019114879 W CN2019114879 W CN 2019114879W WO 2021081952 A1 WO2021081952 A1 WO 2021081952A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
flexible circuit
layer
touch
display device
Prior art date
Application number
PCT/CN2019/114879
Other languages
English (en)
French (fr)
Inventor
张爽
黄小霞
汪江胜
吴建君
龚雪瑞
纪冰
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to CN201980002231.7A priority Critical patent/CN113133322B/zh
Priority to PCT/CN2019/114879 priority patent/WO2021081952A1/zh
Priority to US16/964,109 priority patent/US11665827B2/en
Publication of WO2021081952A1 publication Critical patent/WO2021081952A1/zh
Priority to US18/134,376 priority patent/US11997794B2/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/87—Arrangements for heating or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8794—Arrangements for heating and cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10537—Attached components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED

Definitions

  • the embodiment of the present disclosure relates to a flexible circuit board assembly and a display device.
  • Full screen refers to a display panel with a screen ratio of more than 90% and an ultra-narrow bezel design.
  • Flexible printed circuit boards Flexible Printed Circuit, FPC
  • FPC Flexible Printed Circuit
  • Flexible printed circuit boards are printed circuit boards made of flexible insulating substrates and have many advantages that rigid printed circuit boards do not have. For example, it can be bent, wound, and folded freely, can withstand millions of dynamic bending without damaging the wire, can be arranged arbitrarily according to the space layout requirements, and can move and expand in three-dimensional space, so as to achieve component assembly and wire connection Integration of electronic products; the use of FPC can greatly reduce the volume of electronic products, which is suitable for the development of electronic products in the direction of high density, miniaturization and high reliability.
  • An embodiment of the present disclosure provides a display device.
  • the display device includes a display substrate, a touch module and a ring structure.
  • the display substrate includes a first portion for display, a second portion located on the non-display side of the first portion of the display substrate, and a first bending portion connecting the first portion and the second portion, the A first driver is provided on the side of the second part away from the first part.
  • the touch module includes a touch layer and a touch flexible circuit board connected to the touch layer, and the touch flexible circuit board includes a flat portion located on a side of the second portion away from the first portion And a second bending part connecting the touch layer and the flat part.
  • the ring structure is located between the flat portion of the touch flexible circuit board and the second portion of the display substrate, and the first driver is located in the accommodating space enclosed by the ring structure.
  • the display device can prevent the flexible circuit board from being warped and deformed.
  • the ring structure is connected to the flat portion of the touch flexible circuit board.
  • the ring structure includes a connection layer, a buffer layer, and a heat transfer layer stacked in a direction perpendicular to the flat portion, the connection layer is connected to the flat portion, and the buffer layer is located on the flat portion. On the side of the connecting layer away from the flat portion, the heat transfer layer is located on the side of the buffer layer away from the flat portion.
  • connection layer includes an adhesive layer
  • the adhesive layer is adhered to the flat portion
  • the buffer layer includes an elastic material layer
  • the heat transfer layer includes a metal layer
  • the planar shape of the ring structure includes a polygonal ring, a circular ring, or an elliptical ring.
  • the thickness of the ring structure in a direction perpendicular to the flat portion is 0.1-0.5 mm.
  • the thickness of the ring structure in a direction perpendicular to the flat portion is greater than the height of the first driver.
  • the ring structure is an unclosed ring structure.
  • the touch flexible circuit board includes a single-layer flexible circuit board and a multilayer flexible circuit board that are connected to each other, and the single-layer flexible circuit board includes an AND of the second bent portion and the flat portion. Part of the second bending part connected, the multilayer flexible circuit board includes another part of the flat part, and the ring structure is located between the single-layer flexible circuit board and the second part of the display substrate between.
  • the first driver is a display driver chip.
  • the display device further includes a display flexible circuit board, which is connected to an end of the second part away from the first bending part, and in a direction perpendicular to the flat part, the display The flexible circuit board is located between the second part and the flat part.
  • the display device further includes a second driver located on a side of the multilayer flexible circuit board away from the display substrate.
  • the second driver is a touch driver chip.
  • the display substrate is an organic light emitting diode display substrate.
  • 1A is a schematic diagram of a three-dimensional structure of an organic light-emitting diode touch display device
  • FIG. 1B is a schematic cross-sectional structure diagram of the organic light emitting diode touch display device shown in FIG. 1A along the line A-A;
  • FIG. 2 is a schematic diagram of the three-dimensional structure of the touch flexible circuit board of the organic light emitting diode touch display device that is warped and deformed;
  • FIGS. 1A and 1B are schematic diagrams of the three-dimensional structure of the touch flexible circuit board of the organic light emitting diode touch display device shown in FIGS. 1A and 1B;
  • 3B is a schematic diagram of a three-dimensional structure of a touch flexible circuit board according to an embodiment of the present disclosure
  • FIG. 4A is a schematic diagram of a three-dimensional structure of a flexible circuit board assembly according to an embodiment of the present disclosure
  • FIG. 4B is a schematic cross-sectional structure diagram of the flexible circuit board assembly shown in FIG. 4A along the E-E line;
  • 5A is a schematic plan view of a flat structure of a flexible circuit board assembly according to an embodiment of the present disclosure
  • Figure 5B is a cross-sectional view of Figure 5A along line F-F;
  • Fig. 6A is a schematic plan view of a ring structure according to an embodiment of the present disclosure.
  • Fig. 6B is a top view of a ring structure according to an embodiment of the present disclosure.
  • Fig. 7A is a schematic plan view of another ring structure according to an embodiment of the present disclosure.
  • FIG. 7B is a schematic plan view of another ring structure according to an embodiment of the present disclosure.
  • FIG. 8A is a schematic diagram of another planar structure of a flexible circuit board assembly according to an embodiment of the present disclosure.
  • Fig. 8B is a schematic side view of the structure of Fig. 8A;
  • FIG. 9 is a schematic structural diagram of a display device according to an embodiment of the present disclosure.
  • 10A is a schematic diagram of the relative position of the ring structure and the first driver.
  • Fig. 10B is a schematic cross-sectional structure diagram of Fig. 10A along the line H-H.
  • FIG. 1A is a schematic diagram of a three-dimensional structure of an organic light emitting diode (OLED) touch display device
  • FIG. 1B is a schematic diagram of a cross-sectional structure of the OLED touch display device shown in FIG. 1A along the line A-A.
  • the OLED touch display device includes an OLED display substrate 10 and a touch module 20.
  • the display substrate 10 includes a first part 11 for display, a second part 12 located on the non-display side of the first part 11, and a first bending part 13 connecting the first part 11 and the second part 12.
  • the touch module 20 includes a touch layer 21 and a touch flexible circuit board 22 connected to each other.
  • the touch flexible circuit board 22 includes a flat portion 221 located on the side of the second portion 12 away from the first portion 11 and a second bent portion 222 connecting the touch layer 21 and the flat portion 221.
  • the second portion 12 of the display substrate 10 overlaps the flat portion 221 of the touch flexible circuit board 22.
  • the touch layer 21 is connected to the OLED display substrate 10 and is located on the display side of the OLED display substrate 10.
  • the OLED touch display device further includes a first driver 40 which is bound to a side of the second part 12 of the OLED display substrate 10 away from the first part 11.
  • the touch flexible circuit board 22 further includes an opening 2211 provided on the flat portion 221, and the opening 2211 corresponds to the first driver 40.
  • all the first drivers 40 fall within the range of the opening 2211.
  • the orthographic projection of the first driver 40 on the display substrate 10 falls within the range of the orthographic projection of the opening 2211 on the display substrate.
  • the opening 2211 is provided to prevent the first driver 40 and the touch flexible circuit board 22 from squeezing each other and causing the first driver or the touch flexible circuit board to be damaged.
  • FIG. 2 is a schematic diagram of a three-dimensional structure of the touch flexible circuit board of the OLED touch display device shown in FIGS. 1A and 1B that is warped and deformed near an opening.
  • the area C (the area within the dashed frame) of the touch flexible circuit board 22 next to the lower edge of the opening 2211 is close to the second bending portion 222 of the touch flexible circuit board 22, so the area C Bending stress will be generated in the internal part.
  • the area C is relatively thin, and its upper part is an opening 2211, which lacks solid structure support. Therefore, the area C is prone to warping deformation, and the resulting warping deformation is shown in FIG. 2 for example. Warping and deformation may cause the metal wires in the touch flexible circuit board to break and cause communication failures.
  • the embodiments of the present disclosure provide a flexible circuit board assembly and a display device.
  • the display device also includes the above-mentioned display substrate and touch control module.
  • the touch flexible circuit board in the touch module does not include openings.
  • the display device also includes a ring structure. The ring structure is located between the flat portion of the touch flexible circuit board and the second portion of the display substrate, and the first driver is located in the accommodating space enclosed by the ring structure.
  • the flexible circuit board assembly and the display device can prevent the flexible circuit board from being warped and deformed.
  • FIG. 3A is a schematic diagram of the three-dimensional structure of the touch flexible circuit board of the OLED touch display device shown in FIG. 1A and FIG. 1B
  • FIG. 3B is a schematic diagram of the three-dimensional structure of the touch flexible circuit board according to an embodiment of the present disclosure.
  • the opening 2211 is eliminated, and the touch flexible circuit board 23 as shown in FIG. 3B is formed. Eliminating the opening 2211 can not only increase the structural strength of the region C, thereby preventing warping and deformation of the region C, but also can save the touch flexible circuit board opening process and save the manufacturing cost.
  • the embodiment of the present disclosure also provides a further structure of the touch flexible circuit board to prevent the first driver 40 and the touch flexible circuit board 23 from interacting with each other when the touch flexible circuit board 23 is bent to the non-display side. Extrusion, the further structure of the touch flexible circuit board 23 will be described in detail below.
  • FIG. 4A is a schematic diagram of a three-dimensional structure of a flexible circuit board assembly according to an embodiment of the present disclosure
  • FIG. 4B is a schematic diagram of a cross-sectional structure of the flexible circuit board assembly shown in FIG. 4A along the line E-E.
  • the flexible circuit board assembly includes a touch flexible circuit board 23 and a ring structure 30.
  • the ring structure 30 is located on the surface of one side of the touch flexible circuit board 23, and the ring structure 30 protrudes from the surface.
  • An accommodating space 31 is formed inside the ring structure 30.
  • the position of the accommodating space 31 corresponds to the position of the opening 2211 in the OLED touch display device. That is, the accommodating space 31 corresponds to the first driver 40 in FIG. 1A, and along the direction perpendicular to the display substrate, all the first drivers 40 fall within the range of the accommodating space 31. Therefore, the accommodating space 31 can accommodate the first driver 40 to prevent the first driver 40 and the touch flexible circuit board 23 from squeezing each other.
  • the accommodating space 31 can accommodate the first driver 40 to prevent the first driver 40 and the touch flexible circuit board 23 from squeezing each other.
  • the accommodating space 31 is not limited to accommodating the first driver, and may also accommodate other components, and play a role in preventing the components and the touch flexible circuit board from being squeezed against each other.
  • An embodiment of the present disclosure also provides a flexible circuit board assembly, which is composed of the above-mentioned touch flexible circuit board 23 and the ring structure 30.
  • 5A is a schematic plan view of a flat structure of a flexible circuit board assembly according to an embodiment of the present disclosure
  • FIG. 5B is a cross-sectional view of FIG. 5A along the line F-F.
  • the ring structure 30 and the touch flexible circuit board 23 are connected together to form the flexible circuit board assembly.
  • the ring structure 30 can be directly bonded to the touch flexible circuit board 23. In this way, the flexible circuit board assembly has a simple structure and is convenient to assemble.
  • FIG. 6A is a schematic plan view of a ring structure according to an embodiment of the present disclosure
  • FIG. 6B is a top view of the ring structure.
  • the ring structure 30 in the direction G perpendicular to the touch flexible circuit board 23, the ring structure 30 includes a connection layer 301, a buffer layer 302 and a heat transfer layer 303 stacked in sequence.
  • the ring structure 30 is connected to one side surface of the touch flexible circuit board 23 through the connection layer 301, the buffer layer 302 is connected to the side surface of the connection layer 301 away from the touch flexible circuit board 23, and the heat transfer layer 303 and the buffer layer 302 are away from the touch surface.
  • One side surface of the control flexible circuit board 23 is connected.
  • the connecting layer 301 is a double-sided adhesive layer, one side surface of the double-sided adhesive layer is bonded to one side surface of the touch flexible circuit board, and the other side surface is bonded to the buffer layer 302.
  • the connection layer functions to connect the ring structure and the touch flexible circuit board.
  • the buffer layer 302 is an elastic material layer, and a side surface of the elastic material layer is connected to a side surface of the connection layer 301 away from the touch flexible circuit board 23.
  • the elastic material layer is a foam layer. Foam has excellent cushioning properties, which can prevent the drive from being squeezed and damaged by the flexible circuit board.
  • the heat transfer layer 303 is a metal layer, and a side surface of the metal layer is connected to a side surface of the buffer layer 302 away from the flexible circuit board.
  • the metal layer is a copper foil layer.
  • the copper foil has good thermal conductivity, which is conducive to the heat dissipation of the first drive.
  • the surface of the metal layer close to the buffer layer has a layer of glue to bond the metal layer and the buffer layer together; or the surface of the buffer layer close to the metal layer has a layer of glue to make the metal layer Bonded with the buffer layer.
  • the metal layer is bonded to the buffer layer, and the buffer layer is bonded to the connection layer, and the metal layer, the buffer layer and the connection layer are bonded in sequence to form a stable ring structure.
  • the planar shape of the ring structure and the accommodating space can be selected according to the shape of the corresponding driver.
  • the driver is rectangular
  • the planar shape of the ring structure is a rectangular ring shape
  • the planar shape of the accommodating space therein is a rectangle.
  • the shape of the ring structure and the accommodating space is not limited to this.
  • the planar shape of the ring structure may also be a polygonal ring, a circular ring or an elliptical ring. Therefore, the planar shape of the accommodating space formed may also be polygonal, circular or elliptical.
  • FIG. 6A is a closed ring structure, but the ring structure may also be an unclosed ring structure.
  • FIG. 7A is a schematic plan view of another ring structure according to an embodiment of the present disclosure
  • FIG. 7B is a plan view structure view of another ring structure according to an embodiment of the present disclosure.
  • the ring structure 30 is not closed and has a gap 304.
  • the number of notches 304 can also be multiple, which are respectively arranged on the ring structure at intervals.
  • the ring structure has two notches 304, which are arranged symmetrically up and down in the figure.
  • the ring structure may also be a non-closed ring structure in other forms, and the present disclosure does not limit the gap of the ring structure. Setting the gap is beneficial to increase air circulation, thereby further improving the heat dissipation efficiency of the driver by means of convection heat dissipation.
  • the depth of the accommodating space (that is, the thickness of the ring structure) needs to be selected according to the thickness of the driver.
  • the depth of the accommodating space is greater than the thickness of the driver, so that the top of the driver and the touch flexible circuit board do not contact each other, which can prevent the driver and the touch flexible circuit board from being squeezed.
  • the depth range of the accommodating space is 0.1-0.5 mm.
  • the touch flexible circuit board 23 may be a single-layer circuit board or a multi-layer circuit board, or one part is a single-layer circuit board and the other part is a multi-layer circuit board.
  • FIG. 8A is another schematic plan view of the structure of the flexible circuit board assembly according to an embodiment of the present disclosure
  • FIG. 8B is a schematic side view of the structure of FIG. 8A.
  • the touch flexible circuit board 23 includes a first part 233 and a second part 234 connected to each other, and the thickness of the first part 233 is not greater than the thickness of the second part 234.
  • the ring structure 30 is located on the first part 233.
  • the production cost of multilayer flexible circuit boards is high and the cycle is long.
  • a part of the multilayer flexible circuit board is replaced with a single-layer flexible circuit board, so that the touch flexible circuit board 23 is formed by a combination of a single-layer flexible circuit board and a multi-layer flexible circuit board.
  • the first part 233 of the touch flexible circuit board 23 is a single-layer flexible circuit board 233
  • the second part 234 is a multilayer flexible circuit board 234.
  • the single-layer flexible circuit board is composed of a substrate layer and a conductive layer.
  • the base material layer is, for example, a polyimide layer
  • the conductive layer is, for example, a copper foil layer.
  • the multi-layer flexible circuit board includes a substrate layer and a plurality of conductive layers and a plurality of insulating layers alternately stacked, and conductive holes are formed between the plurality of conductive layers and the plurality of insulating layers to electrically connect the plurality of circuit layers.
  • the single-layer flexible circuit board has a simple structure, so the manufacturing cost is much lower than that of the multilayer flexible circuit board.
  • the thickness of the single-layer flexible circuit board is smaller than the thickness of the multilayer flexible circuit board, so it has better bendability than the multilayer flexible circuit board. Since the single-layer flexible circuit board is simpler than the multi-layer flexible circuit board, replacing a part of the multi-layer flexible circuit board with a single-layer flexible circuit board can save the manufacturing cost of the flexible circuit board and improve the flexibility of the flexible circuit board.
  • the ring structure 30 is connected to the single-layer flexible circuit board 233 of the touch flexible circuit board 23 to strengthen the single-layer flexible circuit board to prevent warping and deformation.
  • FIG. 9 is a schematic structural diagram of a display device according to an embodiment of the present disclosure.
  • the display device includes a display substrate 10, a touch module 20 and a ring structure 30.
  • the display substrate 10 includes a first part 11 for display, a second part 12 located on the non-display side of the first part 11, and a first bending part 13 connecting the first part 11 and the second part 12.
  • the touch module 20 includes a touch layer 21 and a touch flexible circuit board 23 connected to each other.
  • the touch flexible circuit board 23 includes a flat portion 231 located on the side of the second portion 12 away from the first portion 11 and a second bent portion 232 connecting the touch layer 21 and the flat portion 231.
  • the ring structure 30 is located between the flat portion 231 of the touch flexible circuit board 23 and the second portion 12 of the display substrate 10. Along the direction B perpendicular to the display substrate 10, the second portion 12 of the display substrate 10 overlaps the flat portion 221 of the touch flexible circuit board 22.
  • the touch layer 21 is connected to the display substrate 10 and is located on the display side of the display substrate 10.
  • the display device further includes a first driver 40 which is bound to a side of the second part 12 of the display substrate 10 away from the first part 11, and the first driver 40 is located in the accommodating space 31 enclosed by the ring structure 30.
  • the touch flexible circuit board 23 and the ring structure 30 constitute the aforementioned flexible circuit board assembly.
  • the width of the lower frame of the display device can be significantly reduced, thereby greatly increasing the screen-to-body ratio of the display device, which is beneficial to Full screen design.
  • the first driver 40 is located in the accommodating space 31 enclosed by the ring structure 30, which can prevent the first driver 40 and the touch flexible circuit board 23 from being crushed and damaged by each other.
  • the touch flexible circuit board 23 eliminates the openings, which can prevent the flexible circuit board from being warped and deformed.
  • a ring structure 30 is added to the original opening position of the flexible circuit board, which can increase the strength there and further prevent warping and deformation of the flexible circuit board.
  • the ring structure 30 is adhered to the flat portion 231 of the touch flexible circuit board 23.
  • the ring structure 30 includes a connection layer 301, a buffer layer 302, and a heat transfer layer 303 that are sequentially stacked.
  • the ring structure 30 is connected to one side surface of the touch flexible circuit board 23 through the connection layer 301, the buffer layer 302 is connected to the side surface of the connection layer 301 away from the touch flexible circuit board 23, and the heat transfer layer 303 and the buffer layer 302 are away from the touch surface.
  • One side surface of the control flexible circuit board 23 is connected.
  • the touch flexible circuit board 23 includes a first part 233 and a second part 234 connected to each other, and the thickness of the first part 233 is not greater than the thickness of the second part 234.
  • the first part 233 is a single-layer flexible circuit board 233
  • the second part 234 is a multilayer flexible circuit board 234.
  • the single-layer flexible circuit board 233 is bent at the edge of the display substrate 10, and the ring structure 30 is located at the portion where the single-layer flexible circuit board 233 is bent to the non-display side of the display substrate 10.
  • the multilayer flexible circuit board 234 is located on the non-display side of the display substrate 10.
  • the touch flexible circuit board 23 is divided into a single-layer flexible circuit board 233 and a multi-layer flexible circuit board 234, and according to the shape in the display device, the touch flexible circuit board 23 It is divided into a flat part 231 and a second bent part 232.
  • the flat portion 231, the second bending portion 232, the single-layer flexible circuit board 233, and the multi-layer flexible circuit board 234 are not in a parallel relationship in structure, but have overlapping parts with each other.
  • the display device further includes a second flexible circuit board 50.
  • the second flexible circuit board 50 is connected to the display substrate 10.
  • the second flexible circuit board 50 is connected to the upper end of the second portion 12 of the display substrate 10, and along the up and down direction in the figure, the second flexible circuit board 50 is located above the first driver 40.
  • the second flexible circuit board 50 overlaps the flat portion 231 of the touch flexible circuit board 23, and the second flexible circuit board 13 is located on the second portion 12 of the display substrate 10 and the touch flexible circuit Between the flat portions 231 of the plate 23.
  • the second flexible circuit board 50 is a display flexible circuit board, and a plurality of components are bound to realize different functions of the display device.
  • the second flexible circuit board 50 is bound with a data driving circuit and a scan driving circuit for providing data signals and scan signals for the first driver.
  • the lower end of the second flexible circuit board 50 has a projection line L1 on the flat portion 231 of the touch flexible circuit board 23, and the second bent portion 232 of the touch flexible circuit board 23 includes Bending end line L2.
  • the bending end line L2 is the interface between the second bending portion 232 and the flat portion 231 of the touch flexible circuit board 23 in the figure.
  • FIG. 10A is a schematic diagram of the relative position of the ring structure and the first driver
  • FIG. 10B is a schematic diagram of the cross-sectional structure of FIG. 10A along the line H-H.
  • S1 is the distance from the upper edge of the ring structure 30 to the projection line L1.
  • S1 should be larger than the upward glue overflow size of the double-sided tape in FIG. 10A.
  • the shape tolerance of the touch flexible circuit board and the fitting tolerance of the ring structure should also be considered when calculating S1.
  • the size range of S1 is 0.8-1.5mm.
  • the S2 dimension is the distance from the lower edge of the ring structure to the bending end line L2.
  • S2 should be larger than the downward overflow size of the double-sided adhesive in FIG. 10A, and the shape tolerance of the touch flexible circuit board and the fitting tolerance of the ring structure should also be considered when calculating S2.
  • the size range of S2 is 0.8-1.5mm.
  • the S3 size is the distance from the left side of the accommodating space of the ring structure to the left side of the first driver.
  • S3 should be larger than the overflow size of the double-sided tape to the right in Figure 10A.
  • the shape tolerance of the touch flexible circuit board, the fitting tolerance of the ring structure, and the binding position tolerance of the first driver should also be considered when calculating S3.
  • the distances between the four sides of the accommodating space and the four sides of the first driver are equal, which are all S3.
  • the size range of S3 is 1-2mm.
  • the S4 size is the distance from the left side of the ring structure to the left side of the touch flexible circuit board. Similarly, S4 should be larger than the overflow size of the double-sided adhesive to the left in FIG. 10A, and the shape tolerance of the touch flexible circuit board and the fitting tolerance of the ring structure should also be considered when calculating S4. For example, the size range of S4 is 0.8-1.5mm.
  • the S5 dimension is the depth of the accommodating space (that is, the thickness of the ring structure).
  • the ring structure is composed of copper foil, foam and double-sided tape
  • S5 is the sum of the thickness of the copper foil, the thickness of the foam and the thickness of the double-sided tape.
  • the depth S5 of the accommodating space of the ring structure can be designed according to the thickness of the first driver, and S5 is greater than the thickness of the first driver.
  • the thickness of copper foil has specifications of 0.03mm
  • the thickness of foam has specifications of 0.1mm, 0.15mm, 0.2mm, etc.
  • the thickness of double-sided tape has specifications of 0.03mm, 0.04mm, 0.05mm, etc.
  • the thickness of the first driver has specifications such as 0.19mm, 0.25mm, etc.
  • the first drive with a thickness of 0.19mm
  • the thickness of the ring structure is 0.21mm, which is greater than the thickness of the first driver.
  • the ring structure can also be made of materials of other specifications, as long as the depth of the accommodating space is greater than the thickness of the first driver.
  • the depth of the accommodating space of the ring structure is greater than the height of the first driver, which can ensure that the top of the first driver and the touch flexible circuit board do not contact each other.
  • the first driver is not in contact with the touch flexible circuit board assembly, which can prevent the first driver and the touch flexible circuit board from squeezing each other.
  • the display substrate is an organic light emitting diode (OLED) display substrate
  • the first driver 40 is a display driving chip
  • the first driver 40 is directly bound on the OLED display substrate for driving the OLED display substrate for display.
  • the display device provided by the embodiment of the present disclosure further includes a second driver 60.
  • the second driver 60 is bound to the second part 12 of the touch flexible circuit board 23 and is located on the side of the second part 12 away from the display substrate 10.
  • the second driver 60 is connected to the touch layer 21 through the touch flexible circuit board 23.
  • the second driver 6 is a touch drive chip for driving the touch module 20 of the display device to realize the touch function.
  • the second driver 60 and the touch flexible circuit board 23 form a chip on film (COF).
  • COF chip on film
  • the touch driving chip 60 is bound on the multi-layer flexible circuit board 234 of the touch flexible circuit board 23.
  • the multilayer flexible circuit board 234 can also be bound to other components, which is not limited in the present disclosure.
  • the display device provided by the embodiments of the present disclosure can be implemented as, for example, any product with display function such as liquid crystal panels, electronic paper, organic light-emitting diode panels, mobile phones, tablet computers, televisions, monitors, notebook computers, digital photo frames, navigators, etc. part.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Nonlinear Science (AREA)
  • Human Computer Interaction (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Structure Of Printed Boards (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种显示装置，包括显示基板、触控模组和环形结构。显示基板包括用于显示的第一部，位于显示基板的第一部的非显示侧的第二部以及连接第一部和所述第二部的第一弯折部，第二部的远离第一部的一侧设置有第一驱动器。触控模组包括触控层和与触控层连接的触控柔性电路板，触控柔性电路板包括位于第二部的远离第一部的一侧的平坦部以及连接触控层和平坦部的第二弯折部。环形结构位于触控柔性电路板的平坦部与显示基板的第二部之间，且第一驱动器位于环形结构围成的容置空间内。该显示装置可防止柔性电路板产生翘曲变形。

Description

显示装置 技术领域
本公开的实施例涉及一种柔性电路板组件及显示装置。
背景技术
近年来随着显示技术的快速发展，全面屏成为消费市场的热点。全面屏是指屏占比在90％以上，拥有超窄边框设计的显示面板。柔性印刷电路板(Flexible Printed Circuit，FPC)有利于减小显示屏边框的宽度，从而提升屏占比，目前已经广泛应用于各种电子产品中。
柔性印刷电路板是用柔性的绝缘基材制成的印刷电路板，具有许多硬性印刷电路板不具备的优点。例如它可以自由弯曲、卷绕、折叠，可以承受数百万次的动态弯曲而不损坏导线，可依照空间布局要求任意安排，并在三维空间任意移动和伸缩，从而达到元器件装配和导线连接的一体化；利用FPC可大大缩小电子产品的体积，适用电子产品向高密度、小型化、高可靠方向发展的需要。
发明内容
本公开的实施例提供一种显示装置。该显示装置包括显示基板、触控模组以及环形结构。显示基板包括用于显示的第一部，位于所述显示基板的第一部的非显示侧的第二部以及连接所述第一部和所述第二部的第一弯折部，所述第二部的远离所述第一部的一侧设置有第一驱动器。触控模组包括触控层和与所述触控层连接的触控柔性电路板，所述触控柔性电路板包括位于所述第二部的远离所述第一部的一侧的平坦部以及连接所述触控层和所述平坦部的第二弯折部。环形结构位于所述触控柔性电路板的平坦部与所述显示基板的第二部之间，且所述第一驱动器位于所述环形结构围成的容置空间内。该显示装置可防止柔性电路板产生翘曲变形。
在一些示例中，所述环形结构与所述触控柔性电路板的平坦部连接。
在一些示例中，所述环形结构包括在垂直于所述平坦部的方向上层叠设 置的连接层、缓冲层和传热层，所述连接层与所述平坦部连接，所述缓冲层位于所述连接层的远离所述平坦部的一侧，所述传热层位于所述缓冲层的远离所述平坦部的一侧。
在一些示例中，所述连接层包括胶层，所述胶层粘接在所述平坦部上，所述缓冲层包括弹性材料层，所述传热层包括金属层。
在一些示例中，所述环形结构的平面形状包括多边形环、圆环或椭圆环。
在一些示例中，所述环形结构的在垂直于所述平坦部的方向上的厚度为0.1-0.5mm。
在一些示例中，所述环形结构在垂直于所述平坦部的方向上的厚度大于所述第一驱动器的高度。
在一些示例中，所述环形结构为不封闭的环形结构。
在一些示例中，所述触控柔性电路板包括相互连接的单层柔性电路板和多层柔性电路板，所述单层柔性电路板包括所述第二弯折部和所述平坦部的与所述第二弯折部相连的一部分，所述多层柔性电路板包括所述平坦部的另一部分，且所述环形结构位于所述单层柔性电路板与所述显示基板的第二部之间。
在一些示例中，所述第一驱动器为显示驱动芯片。
在一些示例中，所述显示装置还包括显示柔性电路板，与所述第二部的远离所述第一弯折部的端部连接，且在垂直于所述平坦部的方向，所述显示柔性电路板位于所述第二部与所述平坦部之间。
在一些示例中，所述显示装置还包括第二驱动器，位于所述多层柔性电路板远离所述显示基板的一侧。
在一些示例中，所述第二驱动器为触控驱动芯片。
在一些示例中，所述显示基板为有机发光二极管显示基板。
附图说明
为了更清楚地说明本公开实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本公开的一些实施例，而非对本公开的限制。
图1A为一种有机发光二极管触控显示装置的立体结构示意图；
图1B为图1A所示的有机发光二极管触控显示装置沿A-A线的剖面结构示意图；
图2为有机发光二极管触控显示装置的触控柔性电路板产生翘曲变形的立体结构示意图；
图3A为图1A和图1B所示的有机发光二极管触控显示装置的触控柔性电路板的立体结构示意图；
图3B为根据本公开一实施例的触控柔性电路板的立体结构示意图；
图4A为根据本公开一实施例的柔性电路板组件的立体结构示意图；
图4B为图4A所示的柔性电路板组件沿E-E线的剖面结构示意图；
图5A为根据本公开一实施例的柔性电路板组件展平状态的平面结构示意图；
图5B为图5A沿F-F线的剖视图；
图6A为根据本公开一实施例的环形结构的平面结构示意图；
图6B为根据本公开一实施例的环形结构的俯视图；
图7A为根据本公开一实施例的又一种环形结构的平面结构示意图；
图7B为根据本公开一实施例的又一种环形结构的平面结构示意图；
图8A为根据本公开一实施例的柔性电路板组件的又一平面结构示意图；
图8B为图8A的侧视结构示意图；
图9为根据本公开一实施例的显示装置的结构示意图；
图10A为环形结构与第一驱动器的相对位置示意图；以及
图10B为图10A沿H-H线的剖面结构示意图。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例的附图，对本公开实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。基于所描述的本公开的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本公开保护的范围。
除非另外定义，本公开使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第 二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
图1A为一种有机发光二极管(OLED)触控显示装置的立体结构示意图，图1B为图1A所示的OLED触控显示装置沿A-A线的剖面结构示意图。如图1A和图1B所示，OLED触控显示装置包括OLED显示基板10和触控模组20。显示基板10包括用于显示的第一部11、位于第一部11的非显示侧的第二部12以及连接第一部11和第二部12的第一弯折部13。触控模组20包括相互连接的触控层21和触控柔性电路板22。触控柔性电路板22包括位于第二部12远离第一部11一侧的平坦部221以及连接触控层21和平坦部221的第二弯折部222。沿垂直于显示基板10的方向B，显示基板10的第二部12与触控柔性电路板22的平坦部221交叠。例如，触控层21与OLED显示基板10连接且位于OLED显示基板10的显示侧。OLED触控显示装置还包括第一驱动器40，绑定在OLED显示基板10的第二部12的远离第一部11的一侧。触控柔性电路板22还包括在平坦部221上设置的开孔2211，开孔2211与第一驱动器40对应。例如，沿垂直于显示基板的方向B，第一驱动器40全部落入开孔2211的范围内。例如，第一驱动器40在显示基板10上的正投影落入开孔2211在显示基板上的正投影的范围内。设置开孔2211是为了防止第一驱动器40与触控柔性电路板22相互挤压而导致第一驱动器或触控柔性电路板被损坏。
图2为图1A和图1B所示的OLED触控显示装置的触控柔性电路板在靠近开孔处产生翘曲变形的立体结构示意图。如图1B和图2所示，触控柔性电路板22紧邻开孔2211的下边缘的区域C(虚线框内的区域)靠近触控柔性电路板22的第二弯折部222，因此区域C的内部会产生弯折应力。另外，区域C较薄，并且其上部为开孔2211，缺少实体结构支撑，因此在区域C处容易产生翘曲变形，产生的翘曲变形例如图2所示。翘曲变形可能会导致 触控柔性电路板中的金属导线断裂从而导致通讯故障。
对此，本公开的实施例提供一种柔性电路板组件及显示装置。该显示装置也包括上述显示基板和触控模组。但是，触控模组中的触控柔性电路板不包括开孔。另外，该显示装置还包括环形结构。环形结构位于触控柔性电路板的平坦部与显示基板的第二部之间，且第一驱动器位于环形结构围成的容置空间内。该柔性电路板组件及显示装置可防止柔性电路板产生翘曲变形。下面结合附图对本公开的实施例进行详细说明。需要说明的是，不同的附图中相同的附图标记用于指代已描述的具有相同结构的元件。
图3A为图1A和图1B所示的OLED触控显示装置的触控柔性电路板的立体结构示意图，图3B为根据本公开一实施例的触控柔性电路板的立体结构示意图。在图3A所示的触控柔性电路板22的基础上，取消开孔2211，即形成了如图3B所示的触控柔性电路板23。取消开孔2211不但可以增大区域C的结构强度，从而起到防止区域C产生翘曲变形的作用，而且可以省去触控柔性电路板开孔工艺，节省制作成本。取消开孔2211后，本公开的实施例还提供触控柔性电路板的进一步结构，以防止当触控柔性电路板23弯折到非显示侧时第一驱动器40与触控柔性电路板23相互挤压，下面对触控柔性电路板23的进一步结构做详细描述。
本公开一实施例提供一种柔性电路板组件。图4A为根据本公开一实施例的柔性电路板组件的立体结构示意图，图4B为图4A所示的柔性电路板组件沿E-E线的剖面结构示意图。如图4A和图4B所示，柔性电路板组件包括触控柔性电路板23和环形结构30，环形结构30位于触控柔性电路板23的一侧的表面，并且环形结构30从该表面突出以在环形结构30的内侧形成容置空间31。在包括了该柔性电路板组件的触控显示装置中，例如在把图1A所示的触控显示装置中的触控柔性电路板22替换为该柔性电路板组件形成的触控显示装置中，容置空间31的位置对应OLED触控显示装置中的开孔2211的位置。即，容置空间31与图1A中的第一驱动器40对应，且沿垂直于显示基板的方向，第一驱动器40全部落入容置空间31的范围内。因此，容置空间31可以容纳第一驱动器40以防止第一驱动器40与触控柔性电路板23相互挤压。通过在触控柔性电路板上增加具有容置空间的环形结构，可以防止触控柔性电路板产生翘曲变形，并且可以防止第一驱动器与触控柔性电 路板相互挤压。
需要说明的是，容置空间31不限于容纳第一驱动器，也可以容纳其他元器件，并起到防止元器件与触控柔性电路板相互挤压的作用。
本公开一实施例还提供一种柔性电路板组件，由上述的触控柔性电路板23和环形结构30组成。图5A为根据本公开一实施例的柔性电路板组件展平状态的平面结构示意图，图5B为图5A沿F-F线的剖视图。如图5A和5B所示，环形结构30与触控柔性电路板23连接在一起组成了该柔性电路板组件。例如，环形结构30可以直接粘接在触控柔性电路板23上。如此，柔性电路板组件结构简单，组装方便。
图6A为根据本公开一实施例的环形结构的平面结构示意图，图6B为该环形结构的俯视图。如图6B所示，在垂直于触控柔性电路板23的方向G上，环形结构30包括依次层叠设置的连接层301、缓冲层302和传热层303。环形结构30通过连接层301连接在触控柔性电路板23的一侧表面，缓冲层302与连接层301远离触控柔性电路板23的一侧表面连接，传热层303与缓冲层302远离触控柔性电路板23的一侧表面连接。
在一些示例中，连接层301为双面胶层，双面胶层的一侧表面与触控柔性电路板的一侧表面粘接，另一侧表面与缓冲层302粘接。连接层起连接环形结构与触控柔性电路板的作用。
在一些示例中，缓冲层302为弹性材料层，弹性材料层的一侧表面与连接层301远离触控柔性电路板23的一侧表面连接。例如，弹性材料层为泡棉层。泡棉具有优良的缓冲性能，可以防止驱动器受到柔性电路板挤压而被损坏。
在一些示例中，传热层303为金属层，金属层的一侧表面与缓冲层302远离柔性电路板的一侧表面连接。例如，金属层为铜箔层。铜箔导热性好，有利于第一驱动器散热。
在一些示例中，金属层靠近缓冲层一侧的表面具有一层胶，以使金属层与缓冲层粘接在一起；或缓冲层靠近金属层一侧的表面具有一层胶，以使金属层与缓冲层粘接在一起。如此，金属层与缓冲层粘接，并且缓冲层与连接层粘接，金属层、缓冲层和连接层依次粘接组成了结构稳固的环形结构。
在一些示例中，环形结构和容置空间的平面形状可以根据对应的驱动器 的形状来选择。例如，驱动器为矩形，相应地环形结构的平面形状为矩形环状，其内的容置空间的平面形状为矩形。当然，环形结构和容置空间的形状不限于此，例如，环形结构的平面形状还可以是多边形环、圆环或椭圆环。因此，所形成的容置空间的平面形状还可以是多边形、圆形或椭圆形。
图6A所示的环形结构为封闭的环形结构，但是环形结构也可以为不封闭的环形结构。图7A为根据本公开一实施例的又一种环形结构的平面结构示意图，图7B为根据本公开一实施例的又一种环形结构的平面结构示意图。如图7A所示，环形结构30不封闭，具有缺口304。当然，缺口304的数量也可以为多个，分别间隔地设置在环形结构上。例如，如图7B所示，环形结构具有两个缺口304，在图中上下对称设置。环形结构还可以为其他形式的不封闭的环形结构，本公开对环形结构的缺口不做限定。设置缺口有利于增加空气流通，从而通过对流散热的方式进一步提高驱动器的散热效率。
在一些示例中，容置空间的深度(即环形结构的厚度)需根据驱动器的厚度来选择。例如，容置空间的深度大于驱动器的厚度，以使驱动器的顶部与触控柔性电路板不相互接触，如此可以防止驱动器与触控柔性电路板相互挤压。例如，容置空间的深度范围为0.1-0.5mm。
例如，触控柔性电路板23可以为单层电路板，也可以为多层电路板，或者一部分为单层电路板，另一部分为多层电路板。图8A为根据本公开一实施例的柔性电路板组件的又一平面结构示意图，图8B为图8A的侧视结构示意图。如图8A和8B所示，触控柔性电路板23包括相互连接的第一部分233和第二部分234，且第一部分233的厚度不大于第二部分234的厚度。例如，环形结构30位于第一部分233上。
多层柔性电路板制作成本高、周期长。为了节省制作成本，在一些示例中，将一部分多层柔性电路板替换为单层柔性电路板，使触控柔性电路板23由单层柔性电路板和多层柔性电路板组合形成。
例如，在图8A和8B所示的柔性电路板组件中，触控柔性电路板23的第一部分233为单层柔性电路板233，第二部分234为多层柔性电路板234。
单层柔性电路板由基材层和导电层构成。基材层例如为聚酰亚胺层，导电层例如为铜箔层。多层柔性电路板包括基材层以及交替层叠的多个导电层和多个绝缘层，多个导电层和多个绝缘层之间包括导电孔，用以将多个电路 层电连接。
单层柔性电路板结构简单，因此制作成本远低于多层柔性电路板。单层柔性电路板的厚度小于多层柔性电路板的厚度，因此具有比多层柔性电路板更好的弯折性。由于单层柔性电路板比多层柔性电路板简单，使用单层柔性电路板替换一部分多层柔性电路板，可以节省柔性电路板的制作成本，并且可提高柔性电路板的弯折性。
在一些示例中，如图8A、图8B所示，环形结构30连接在触控柔性电路板23的单层柔性电路板233上，起到加固单层柔性电路板从而防止翘曲变形的作用。
本公开一实施例提供一种显示装置。图9为根据本公开一实施例的显示装置的结构示意图。如图9所示，该显示装置包括显示基板10、触控模组20以及环形结构30。显示基板10包括用于显示的第一部11、位于第一部11的非显示侧的第二部12以及连接第一部11和第二部12的第一弯折部13。触控模组20包括相互连接的触控层21和触控柔性电路板23。触控柔性电路板23包括位于第二部12远离第一部11一侧的平坦部231以及连接触控层21和平坦部231的第二弯折部232。环形结构30位于触控柔性电路板23的平坦部231与显示基板10的第二部12之间。沿垂直于显示基板10的方向B，显示基板10的第二部12与触控柔性电路板22的平坦部221交叠。例如，触控层21与显示基板10连接且位于显示基板10的显示侧。显示装置还包括第一驱动器40，绑定在显示基板10的第二部12的远离第一部11的一侧，且第一驱动器40位于环形结构30围成的容置空间31内。例如，触控柔性电路板23和环形结构30组成上述的柔性电路板组件。
通过把第一驱动器绑定在显示基板10的第二部12的远离第一部11的一侧，可以显著地减小显示装置下边框的宽度，从而大幅提高显示装置的屏占比，有利于全面屏设计。第一驱动器40位于环形结构30围成的容置空间31内，可以防止第一驱动器40与触控柔性电路板23相互挤压破坏。另外，触控柔性电路板23相比触控柔性电路板22取消了开孔，可以防止柔性电路板产生翘曲变形。在柔性电路板的原开孔位置增加了环形结构30，可以增加该处的强度，进一步防止柔性电路板产生翘曲变形。
例如，如图9所示，环形结构30粘接在触控柔性电路板23的平坦部231 上。
例如，环形结构30包括依次层叠设置的连接层301、缓冲层302和传热层303。环形结构30通过连接层301连接在触控柔性电路板23的一侧表面，缓冲层302与连接层301远离触控柔性电路板23的一侧表面连接，传热层303与缓冲层302远离触控柔性电路板23的一侧表面连接。
例如，触控柔性电路板23包括相互连接的第一部分233和第二部分234，且第一部分233的厚度不大于第二部分234的厚度。例如，第一部分233为单层柔性电路板233，第二部分234为多层柔性电路板234。单层柔性电路板233在显示基板10的边缘处弯折，且环形结构30位于单层柔性电路板233弯折到显示基板10的非显示侧的部分。例如，多层柔性电路板234位于显示基板10的非显示侧。
需要说明的是，根据电路板的层数，触控柔性电路板23被划分为单层柔性电路板233和多层柔性电路板234，而根据在显示装置中的形状，触控柔性电路板23被划分为平坦部231和第二弯折部232。平坦部231、第二弯折部232、单层柔性电路板233及多层柔性电路板234在结构上非并列关系，而是相互之间具有重合的部分。
在一些示例中，如图9所示，该显示装置还包括第二柔性电路板50。第二柔性电路板50与显示基板10连接。例如，第二柔性电路板50与显示基板10的第二部12的上端连接，且沿图中的上下方向，第二柔性电路板50位于第一驱动器40的上方。沿垂直于显示基板的方向B，第二柔性电路板50与触控柔性电路板23的平坦部231交叠，且第二柔性电路板13位于显示基板10的第二部12与触控柔性电路板23的平坦部231之间。第二柔性电路板50为显示柔性电路板，绑定有多个元器件，用以实现显示装置的不同功能。例如，第二柔性电路板50绑定有数据驱动电路和扫描驱动电路，用于为第一驱动器提供数据信号和扫描信号。
在一些示例中，如图9所示，第二柔性电路板50的下端在触控柔性电路板23的平坦部231上具有投影线L1，触控柔性电路板23的第二弯折部232包括弯折结束线L2。例如，弯折结束线L2为图中触控柔性电路板23的第二弯折部232与平坦部231的交界面。
图10A为环形结构与第一驱动器的相对位置示意图，图10B为图10A 沿H-H线的剖面结构示意图。如图10A所示，以第二柔性电路板50的下端在触控柔性电路板23的平坦部231上的投影线L1为基准，S1为环形结构30上边缘到投影线L1的距离。考虑到环形结构的双面胶粘贴到触控柔性电路板上后，会有一定程度的溢胶，因此，S1应大于双面胶在图10A中向上的溢胶尺寸。另外，计算S1时还要考虑到触控柔性电路板的外形公差以及环形结构的贴合公差。例如，S1的尺寸范围为0.8-1.5mm。以弯折结束线L2为基准，S2尺寸为环形结构下边缘到弯折结束线L2的距离。同样地，S2应大于双面胶在图10A中向下的溢胶尺寸，计算S2时还要考虑到触控柔性电路板的外形公差以及环形结构的贴合公差。例如，S2的尺寸范围为0.8-1.5mm。
如图10A所示，S3尺寸为环形结构的容置空间的左侧边到第一驱动器的左侧边的距离。S3应大于双面胶在图10A中向右的溢胶尺寸。另外，计算S3时还要考虑到触控柔性电路板的外形公差、环形结构的贴合公差以及第一驱动器的绑定位置公差。例如，容置空间的四个侧边与第一驱动器的四个侧边的距离相等，均为S3。例如，S3的尺寸范围为1-2mm。
S4尺寸为环形结构的左侧边到触控柔性电路板的左侧边的距离。同样地，S4应大于双面胶在图10A中向左的溢胶尺寸，计算S4时还要考虑到触控柔性电路板的外形公差以及环形结构的贴合公差。例如，S4的尺寸范围为0.8-1.5mm。
S5尺寸为容置空间的深度(即环形结构的厚度)。例如，环形结构由铜箔、泡棉以及双面胶组成，S5为铜箔厚度、泡棉厚度以及双面胶厚度之和。
环形结构的容置空间的深度S5可以根据第一驱动器的厚度进行设计，并且S5大于第一驱动器的厚度。通过选用不同规格的双面胶、泡棉和铜箔，可以满足环形结构的容置空间的深度S5的不同尺寸要求。例如，铜箔的厚度具有0.03mm规格，泡棉的厚度具有0.1mm,0.15mm,0.2mm等规格，双面胶的厚度具有0.03mm,0.04mm,0.05mm等规格。第一驱动器的厚度具有0.19mm，0.25mm等规格。例如，对于厚度为0.19mm的第一驱动器，可以选用厚度为0.03mm的铜箔，厚度为0.15mm的泡棉以及厚度为0.03mm的双面胶来制作环形结构，组成的环形结构的厚度为0.21mm，大于第一驱动器的厚度。当然，环形结构也可以选用其他规格的原材料制作，只要满足容 置空间的深度大于第一驱动器的厚度即可。
环形结构的容置空间的深度大于第一驱动器的高度，可以保证第一驱动器的顶部与触控柔性电路板不相互接触。第一驱动器与触控柔性电路板组件不接触，可以防止第一驱动器与触控柔性电路板相互挤压。
在一些示例中，显示基板为有机发光二极管(OLED)显示基板，第一驱动器40为显示驱动芯片，第一驱动器40直接绑定在OLED显示基板上，用于驱动OLED显示基板进行显示。
在一些示例中，如图9所示，本公开实施例提供的显示装置还包括第二驱动器60。第二驱动器60绑定在触控柔性电路板23的第二部12上，且位于第二部12远离显示基板10的一侧。第二驱动器60通过触控柔性电路板23与触控层21连接。例如，第二驱动器6为触控驱动芯片，用于驱动显示装置的触控模组20以实现触控功能。例如，第二驱动器60和触控柔性电路板23组成覆晶薄膜(Chip On Film,COF)。
在一些示例中，触控驱动芯片60绑定在触控柔性电路板23的多层柔性电路板234上。多层柔性电路板234还可以绑定其他元器件，本公开对此不做限定。
本公开的实施例提供的显示装置例如可以实现为液晶面板、电子纸、有机发光二极管面板、手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。
有以下几点需要说明：
(1)本公开实施例附图只涉及到与本公开实施例涉及到的结构，其他结构可参考通常设计。
(2)在不冲突的情况下，本公开的实施例及实施例中的特征可以相互组合以得到新的实施例。
以上，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以权利要求的保护范围为准。

Claims (14)

  1. 一种显示装置，包括：
    显示基板，包括用于显示的第一部，位于所述显示基板的第一部的非显示侧的第二部以及连接所述第一部和所述第二部的第一弯折部，所述第二部的远离所述第一部的一侧设置有第一驱动器；
    触控模组，包括触控层和与所述触控层连接的触控柔性电路板，所述触控柔性电路板包括位于所述第二部的远离所述第一部的一侧的平坦部以及连接所述触控层和所述平坦部的第二弯折部；以及
    环形结构，位于所述触控柔性电路板的平坦部与所述显示基板的第二部之间，且所述第一驱动器位于所述环形结构围成的容置空间内。
  2. 根据权利要求1所述的显示装置，其中，所述环形结构与所述触控柔性电路板的平坦部连接。
  3. 根据权利要求1或2所述的显示装置，
    其中，所述环形结构包括在垂直于所述平坦部的方向上层叠设置的连接层、缓冲层和传热层，所述连接层与所述平坦部连接，所述缓冲层位于所述连接层的远离所述平坦部的一侧，所述传热层位于所述缓冲层的远离所述平坦部的一侧。
  4. 根据权利要求3所述的显示装置，
    其中，所述连接层包括胶层，所述胶层粘接在所述平坦部上，所述缓冲层包括弹性材料层，所述传热层包括金属层。
  5. 根据权利要求1-4任一项所述的显示装置，
    其中，所述环形结构的平面形状包括多边形环、圆环或椭圆环。
  6. 根据权利要求1-5任一项所述的显示装置，
    其中，所述环形结构的在垂直于所述平坦部的方向上的厚度为0.1-0.5mm。
  7. 根据权利要求1-6所述的显示装置，
    其中，所述环形结构在垂直于所述平坦部的方向上的厚度大于所述第一驱动器的高度。
  8. 根据权利要求1-7任一项所述的显示装置，
    其中，所述环形结构为不封闭的环形结构。
  9. 根据权利要求1-8任一项所述的显示装置，
    其中，所述触控柔性电路板包括相互连接的单层柔性电路板和多层柔性电路板，所述单层柔性电路板包括所述第二弯折部和所述平坦部的与所述第二弯折部相连的一部分，所述多层柔性电路板包括所述平坦部的另一部分，且所述环形结构位于所述单层柔性电路板与所述显示基板的第二部之间。
  10. 根据权利要求1-9任一项所述的显示装置，
    其中，所述第一驱动器为显示驱动芯片。
  11. 根据权利要求1-10任一项所述的显示装置，还包括显示柔性电路板，与所述第二部的远离所述第一弯折部的端部连接，且在垂直于所述平坦部的方向，所述显示柔性电路板位于所述第二部与所述平坦部之间。
  12. 根据权利要求1-11任一项所述的显示装置，还包括第二驱动器，位于所述多层柔性电路板远离所述显示基板的一侧。
  13. 根据权利要求12所述的显示装置，其中，所述第二驱动器为触控驱动芯片。
  14. 根据权利要求1-13任一项所述的显示装置，其中，所述显示基板为有机发光二极管显示基板。
PCT/CN2019/114879 2019-10-31 2019-10-31 显示装置 WO2021081952A1 (zh)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201980002231.7A CN113133322B (zh) 2019-10-31 2019-10-31 显示装置
PCT/CN2019/114879 WO2021081952A1 (zh) 2019-10-31 2019-10-31 显示装置
US16/964,109 US11665827B2 (en) 2019-10-31 2019-10-31 Display device
US18/134,376 US11997794B2 (en) 2023-04-13 Display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2019/114879 WO2021081952A1 (zh) 2019-10-31 2019-10-31 显示装置

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US16/964,109 A-371-Of-International US11665827B2 (en) 2019-10-31 2019-10-31 Display device
US18/134,376 Continuation US11997794B2 (en) 2023-04-13 Display device

Publications (1)

Publication Number Publication Date
WO2021081952A1 true WO2021081952A1 (zh) 2021-05-06

Family

ID=75715745

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/114879 WO2021081952A1 (zh) 2019-10-31 2019-10-31 显示装置

Country Status (3)

Country Link
US (1) US11665827B2 (zh)
CN (1) CN113133322B (zh)
WO (1) WO2021081952A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113221779A (zh) * 2021-05-19 2021-08-06 业泓科技(成都)有限公司 显示模组及电子设备

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130321382A1 (en) * 2012-05-31 2013-12-05 Japan Display East Inc. Liquid crystal display device
CN204884440U (zh) * 2015-08-27 2015-12-16 京东方科技集团股份有限公司 柔性显示面板和柔性显示装置
CN107728365A (zh) * 2017-10-31 2018-02-23 武汉华星光电技术有限公司 窄边框显示面板及显示装置
CN108682369A (zh) * 2018-05-22 2018-10-19 Oppo广东移动通信有限公司 一种显示面板及全面屏显示装置
CN109032417A (zh) * 2018-08-09 2018-12-18 武汉华星光电半导体显示技术有限公司 显示模组及电子装置
CN110007497A (zh) * 2019-05-05 2019-07-12 Oppo广东移动通信有限公司 显示模组和电子装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180075733A (ko) * 2016-12-26 2018-07-05 엘지디스플레이 주식회사 플렉서블 표시장치

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130321382A1 (en) * 2012-05-31 2013-12-05 Japan Display East Inc. Liquid crystal display device
CN204884440U (zh) * 2015-08-27 2015-12-16 京东方科技集团股份有限公司 柔性显示面板和柔性显示装置
CN107728365A (zh) * 2017-10-31 2018-02-23 武汉华星光电技术有限公司 窄边框显示面板及显示装置
CN108682369A (zh) * 2018-05-22 2018-10-19 Oppo广东移动通信有限公司 一种显示面板及全面屏显示装置
CN109032417A (zh) * 2018-08-09 2018-12-18 武汉华星光电半导体显示技术有限公司 显示模组及电子装置
CN110007497A (zh) * 2019-05-05 2019-07-12 Oppo广东移动通信有限公司 显示模组和电子装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113221779A (zh) * 2021-05-19 2021-08-06 业泓科技(成都)有限公司 显示模组及电子设备
CN113221779B (zh) * 2021-05-19 2023-12-12 业泓科技(成都)有限公司 显示模组及电子设备

Also Published As

Publication number Publication date
CN113133322A (zh) 2021-07-16
CN113133322B (zh) 2024-04-19
US11665827B2 (en) 2023-05-30
US20220377903A1 (en) 2022-11-24
US20230254978A1 (en) 2023-08-10

Similar Documents

Publication Publication Date Title
US11233208B2 (en) Flexible display screen with groove to accommodate a chip
WO2019228361A1 (zh) 显示装置及柔性电路板
WO2020216090A1 (zh) 支撑结构及其制造方法、显示装置及其装配方法
JP2020505629A (ja) ディスプレイ画面組立品、ディスプレイ画面組立品を組み立てるための方法、および電子デバイス
WO2021227668A1 (zh) 显示模组及显示装置
US8941599B2 (en) Touch panel-attached display device and antistatic structure
CN109116649B (zh) 显示面板及显示装置
US11917859B2 (en) Display module and display device
US10917970B2 (en) Display panel and display
WO2021103213A1 (zh) 柔性显示模组和柔性显示装置
JP2020505630A (ja) ディスプレイ画面組立品、ディスプレイ画面組立品を組み立てるための方法、および電子デバイス
CN111430421A (zh) 显示装置及其制造方法
WO2020073655A1 (zh) 柔性显示面板及终端设备
TW201635102A (zh) 觸控顯示裝置
WO2018119572A1 (zh) 显示装置及电子装置及显示装置的制造方法
TWI440927B (zh) 顯示裝置及其背光模組
WO2021081952A1 (zh) 显示装置
TWI485477B (zh) 顯示裝置
US10614988B2 (en) Package structure of display panel, connecting board, package method and display device
WO2021248548A1 (zh) 微型发光二极管显示面板及其制作方法、显示装置
WO2020125412A1 (zh) 终端设备的显示模组及终端设备
WO2019210765A1 (zh) 光源、背光模组及其制造方法、及显示装置
WO2019206023A1 (zh) 一种显示面板、其制作方法及显示装置
US11997794B2 (en) Display device
WO2022062217A1 (zh) 触摸屏及具有其的触摸显示装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19950622

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19950622

Country of ref document: EP

Kind code of ref document: A1

122 Ep: pct application non-entry in european phase

Ref document number: 19950622

Country of ref document: EP

Kind code of ref document: A1

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 07.02.2023)