WO2012031533A1 - LED灯泡及能够4π出光的LED发光条 - Google Patents

LED灯泡及能够4π出光的LED发光条 Download PDF

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Publication number
WO2012031533A1
WO2012031533A1 PCT/CN2011/079234 CN2011079234W WO2012031533A1 WO 2012031533 A1 WO2012031533 A1 WO 2012031533A1 CN 2011079234 W CN2011079234 W CN 2011079234W WO 2012031533 A1 WO2012031533 A1 WO 2012031533A1
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WIPO (PCT)
Prior art keywords
led
light
chip
transparent
led chip
Prior art date
Application number
PCT/CN2011/079234
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English (en)
French (fr)
Inventor
葛世潮
刘化斌
葛铁汉
Original Assignee
浙江锐迪生光电有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=45810116&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2012031533(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from CN2010102787600A external-priority patent/CN101968181B/zh
Priority claimed from CN2010206174061U external-priority patent/CN201944638U/zh
Priority claimed from CN2010106100927A external-priority patent/CN102109115B/zh
Priority claimed from CN2010206852040U external-priority patent/CN201944605U/zh
Priority claimed from CN201120148206U external-priority patent/CN202132734U/zh
Priority claimed from CN2011201481956U external-priority patent/CN202281057U/zh
Priority claimed from CN2011203196519U external-priority patent/CN202281062U/zh
Priority to EP11823056.4A priority Critical patent/EP2535640B2/en
Application filed by 浙江锐迪生光电有限公司 filed Critical 浙江锐迪生光电有限公司
Priority to AU2011300999A priority patent/AU2011300999B2/en
Priority to JP2013500328A priority patent/JP5689524B2/ja
Priority to KR1020137008659A priority patent/KR101510462B1/ko
Priority to SG2013017678A priority patent/SG188483A1/en
Priority to DK11823056.4T priority patent/DK2535640T4/da
Priority to ES11823056T priority patent/ES2531050T5/es
Priority to RU2013114922/12A priority patent/RU2546469C2/ru
Priority to CA2810658A priority patent/CA2810658C/en
Priority to PL11823056T priority patent/PL2535640T5/pl
Priority to BR112013005707-6A priority patent/BR112013005707B1/pt
Priority to US13/408,936 priority patent/US9261242B2/en
Publication of WO2012031533A1 publication Critical patent/WO2012031533A1/zh
Priority to HK12113243.4A priority patent/HK1174089A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/30—Driver circuits
    • H05B45/357—Driver circuits specially adapted for retrofit LED light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/66—Details of globes or covers forming part of the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0035—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources the fastening means being capable of simultaneously attaching of an other part, e.g. a housing portion or an optical component
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/005—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Definitions

  • the present invention relates to the field of lighting technologies, and in particular, to an LED light bar and an LED using the same
  • bulb-shaped LED bulbs that can replace incandescent lamps are mostly composed of one or more power LEDs, a metal-based circuit board (MPCB), a heat sink with a series of fins, and a switch.
  • the power supply and the constant current device drive, a connector, an anti-glare bulb and an electrical connector.
  • the luminous efficiency of such lamps has reached the level of fluorescent energy-saving lamps that are currently being used in large quantities, and the overall lamp efficiency is 40-70 lm/W, but the efficiency of white LED lamp beads has reached 130 lm/W, LED bulbs. The efficiency of the lamp has yet to be further improved.
  • the main problem with the existing LED bulbs is that the cost and price are too high, which is several times that of fluorescent energy-saving lamps of the same luminous flux, which is difficult to promote.
  • the high cost is not mainly the LED chip itself, but because of the high cost of the aluminum alloy heat sink and the driver including the transformer switching power supply and the constant current device, and the LED package; the switching power supply with the transformer and the constant current device drive not only cost High, and low efficiency, this driver contains components such as triodes, transformers, electrolytic capacitors and other short-lived components, so that its life cannot be matched with LEDs. Its nominal average life is generally less than 25,000 hours, and the life of LED itself should be reached. 50000-100000 hours.
  • the LED lamp of the prior art alternative incandescent lamp has lower overall lamp efficiency, too high cost and long life; if the LED bulb replaces the incandescent lamp and the fluorescent energy-saving lamp which is being used in large quantities, it becomes universal The mainstream of lighting, its efficiency needs to be further improved, the cost should be greatly reduced, the service life should be longer, the volumetric weight and incandescent lamps are similar.
  • the LED's illumination is derived from the PN junction of the LED. It is originally a 4 ⁇ illuminator. In order to concentrate or connect with a metal heat sink, the PN junction has a reflective layer, a reflective bowl or a heat sink, which is originally 4 ⁇ .
  • the illuminating illuminant is made into an illuminant of 2 ⁇ or less than 2 ⁇ ; this causes the 2 ⁇ light that is incident on one side of the heat sink to be reflected, multi-reflected, and absorbed, and then emitted, and the 2 ⁇ light that is incident on the illuminating surface also has Part of the light that is returned to the heat sink due to total reflection also passes through the opposite After the shot, multiple reflections and various absorptions can be emitted, thus greatly reducing the light-emitting rate of the PN junction, that is, reducing the efficiency of the LED.
  • the internal quantum efficiency of LED PN junction luminescence is close to 90%, while the external quantum efficiency is only about 30%; the internal quantum efficiency is 90%, that is, only 10% of the injected electrons in the PN junction are missing and not produced. Photons, 90% of injected electrons, each electron produces a photon; however, the external quantum efficiency is only about 30%, and the fact that the 4 ⁇ luminescence is transformed into a 2 ⁇ illuminant is one of the important reasons. If the PN junction of the LED can be emitted 4 ⁇ , the luminous efficiency of the LED will be greatly improved.
  • US Announcement Patent 2007/0139949 which uses a plurality of small chips in series on a transparent transparent heat-conducting substrate such as sapphire, diamond, GaN or opaque heat-conducting substrate such as copper or SiC, and then uses heat-conducting lead wires and brackets to connect.
  • the lamp head dissipates heat, and a bulb which is not vacuum sealed, air in the bulb and communicates with the surrounding atmosphere, forms an incandescent lamp-shaped LED bulb; the thermally conductive transparent substrate sapphire, diamond, etc. described in the patent are very expensive and difficult to use.
  • Copper and SiC are opaque and can't emit light 4 ⁇ ; its heat dissipation path is a heat-conducting substrate of the chip, a heat-conducting lead, a heat-conducting bracket, a lamp cap, and the heat-conducting path is finally connected to the lamp cap. It is difficult to be thermally connected, and the heat-dissipating effect is limited. If there is an LED driver in the lamp cap, Then, the heat conduction path is interrupted; if the bulb is vacuum sealed, the heat dissipation path also fails; therefore, it is also difficult to produce a practical lamp having sufficient output light flux.
  • the mainstream of the prior art LED bulbs is a low-voltage, high-current power LED, a LED chip with a PN junction, operating current as large as 0.35A or even a few, and 1W to several W or more of electrical power concentrated in 1
  • the external quantum efficiency is only about 30%, plus the energy difference between the injected electrons and the photons it produces, the energy difference between the photons generated by the PN junction and the last emitted photons, about 70%.
  • the electric power will be converted into heat. How to dissipate this large amount of heat has been a key problem in the birth of such power LEDs; LEDs are semiconductor devices whose junction temperature rises, which will result in PN junctions.
  • the prior art LED bulbs mainly use metal passive heat sinks with heat sink fins, and there are a large number of metal heat sinks with such fins, and how to increase the convective heat exchange with air.
  • the metal heat sink is mainly made of alloy aluminum, which is bulky, heavy and costly, and is a key factor for the high cost of the prior art LED bulb.
  • the LED is placed in a sealed bulb filled with a light-transmissive heat-conducting liquid, such as water, oil, ethylene glycol or other inert liquid.
  • a light-transmissive heat-conducting liquid such as water, oil, ethylene glycol or other inert liquid.
  • the thermal conductivity of liquids is much lower than that of metals.
  • the thermal conductivity of water is about 0.7 W/(rr K)
  • the metal is 50-415 W/(m.K).
  • the aluminum alloy used for the radiator of LED bulbs is 96.
  • the LED bulb of the Chinese patent 201010176451.2 is filled with a negative ion nitrogen heat-dissipating heat; for example, the LED bulb of 200910250434.6 dissipates heat with a mixture of nitrogen and argon gas sealed in the bulb; these methods have not been practical yet.
  • other types of lamps such as cold cathode fluorescent lamps, use a high thermal conductivity gas or a hydrogen-hydrogen mixture, such as Chinese patent 200710148853.X, but because of the large volume of the cold cathode fluorescent tube, it occupies almost the entire bubble.
  • metal halide lamps also have a gas filled with nitrogen and helium in the bulb, such as Chinese patent 200580039670.3; incandescent lamps also have nitrogen-filled helium and other gases. But these are different types of lights with LED lights.
  • the prior art LED bulbs have a driving problem of how to convert high voltage mains into low voltage and large current.
  • most of the prior art LED bulbs are DC type low-voltage and high-current power LEDs, operating at voltages of several to ten volts, and electricity.
  • the current is 0.35A to a few A; while the existing general-purpose incandescent and fluorescent energy-saving lamps are directly powered by 1 10-230V AC.
  • a driver with an AC/DC converter is required. , convert high-voltage alternating current into low-voltage and high-current direct current.
  • Such a driver usually includes a switching power supply and a constant current circuit with components such as a triode, a transformer, and an electrolytic capacitor. Since the volume of the LED lamp replacing the incandescent lamp is not too large, the size of the driver should be as small as possible, and the transformer should be as small as possible. , and the input and output voltage difference is very large, which makes the electrical conversion efficiency low, generally 70-80%, which reduces the luminous efficiency of the whole lamp; meanwhile, because of its low efficiency, its own heat is large, plus From the heat generated by the LED, the temperature of the driver is easily increased, which not only further reduces the efficiency of the driver, but also shortens the life of the driver.
  • the driver includes temperature-sensitive components such as transistors, transformers and electrolytic capacitors.
  • Elevation will significantly reduce their efficiency, longevity and reliability, which makes the life of a prior art LED bulb not primarily determined by the LED, but rather by the driver.
  • the driver circuit of the switching power supply with a transformer and the constant current circuit is complicated, requires high components, and is therefore costly, and is another key factor for the high cost of the prior art LED bulb.
  • ACLED AC LED
  • Chinese patents 200510020493.6, 200610099185.1 and US patents 7515248, 7535028 and AX3221, etc. which serially connect a series of small current LED chips. It is similar to a bridge rectifier circuit, mounted on an MPCB, and can be directly operated by AC mains with a heat sink.
  • the drive circuit is very simple. However, the current efficiency of such LEDs is relatively low, and it needs to be in close thermal connection with a metal heat sink that must be exposed to the air.
  • the ACLED has high voltage alternating current, and the metal heat sink is easy to be charged and unsafe.
  • Prior art HVLEDs high voltage LEDs
  • Prior art HVLEDs high voltage LEDs
  • Chinese patent 201020159200.9 also have the same safety issues.
  • the LED is a point light source, and the light of about 100 lm is concentrated on an area of about 1 mm 2 , and its brightness is as high as several tens of millions of nits. If the human eye looks directly at it, it will produce strong glare and stay in the field of view. The next black shadow will seriously affect your vision in a short time. Therefore, for household lamps, an anti-glare bulb or other means of dispersing light must be added; in order to obtain a good light perception, the light diffusing layer of the anti-glare bulb needs to have sufficient thickness, but this also reduces The transmittance of the bulb is usually about 15% of the light lost. This in turn reduces the luminous efficiency of the entire lamp.
  • the prior art LED lamps should widely replace incandescent lamps and fluorescent energy-saving lamps for general illumination, and the luminous efficiency needs to be further improved, the cost needs to be greatly reduced, the service life needs to be further improved, and the volume and weight should be close.
  • Incandescent lamp Summary of the invention
  • an object of the present invention to provide an LED light-emitting strip capable of efficiently emitting 4 ⁇ light.
  • One of the objects of the present invention is to provide a high efficiency LED chip with high efficiency of 4 ⁇ light output.
  • Another object of the present invention is to provide a high-efficiency LED bulb with a low cost LED chip 4 ⁇ light output.
  • an LED light bulb comprising: an LED bulb case, a stem with an exhaust pipe and a bracket, an LED light bar with at least one LED chip 4 emitting light, a driver, an electrical connector, wherein The LED bulb shell and the stem are vacuum sealed to form a vacuum sealed chamber, the vacuum sealed chamber is filled with a low viscosity coefficient high thermal conductivity gas, and the bracket and the LED light strip fixed on the bracket are accommodated in the The LED light-emitting strip is electrically connected to the driver and the electrical connector in sequence, and the electrical connector is electrically connected to the external power source to illuminate the LED light-emitting strip.
  • an LED light strip for emitting light from an LED chip 4 comprising a transparent substrate and at least one string on the transparent substrate, connected in series in the same PN junction direction.
  • an LED light strip for emitting light from an LED chip 4 is provided, the LED light strip comprising a transparent substrate and at least one string on the transparent substrate, connected in series in the same PN junction direction.
  • An LED chip having a transparent chip substrate, wherein the LED chip electrode is led out by an electrode extraction device of an LED chip disposed at both ends of the transparent substrate, wherein a part of the LED chip is a blue LED chip and another part thereof a red LED chip, the LED chip and a luminescent powder layer disposed around the transparent substrate on which the LED chip is mounted, for converting part of blue light emitted by the blue LED chip into yellow light, another part of blue light and The yellow light and the red light are mixed into white light, high color rendering index white light or other colors of light.
  • an LED light strip for emitting light from an LED chip 4
  • the LED light strip comprising a transparent substrate and at least one string on the transparent substrate, connected in series in the same PN junction direction.
  • An LED chip having a transparent chip substrate, wherein the LED chip electrode is led out by an electrode lead-out device of an LED chip disposed at both ends of the transparent substrate, and the outermost surface of the LED chip and the transparent substrate is transparent or transparent Powder tube encapsulation.
  • an LED light strip for emitting light from an LED chip 4
  • the LED light strip comprising a transparent substrate and at least one string on the transparent substrate, connected in series in the same PN junction direction.
  • An LED chip having a transparent chip substrate, wherein the LED chip electrode is led out by an electrode extraction device of an LED chip disposed at two ends of the transparent substrate, wherein the LED chip is a transparent high voltage LED chip, wherein each of the LED chips
  • the high voltage LED chips include at least two LED PN junctions connected in series.
  • the high-efficiency LED bulb of the LED chip of the present invention includes a light-transmitting bulb, a stem with an exhaust pipe, an electric lead wire and a bracket, an LED light bar with at least one LED chip 4 ⁇ , a driver, and a driver.
  • An electrical connector, a connector of the bulb and the electrical connector; the light-transmissive bulb and the stem are vacuum-sealed to form a vacuum sealed cavity, and the vacuum sealed cavity is filled with a gas having a low viscosity coefficient and a high thermal conductivity;
  • the shell, the LED strip, the driver, the electrical connector and the connecting member are electrically connected to each other to form a whole lamp; the LED strip is fixed on the stem, and the electrode is connected to the driver and the electrical connector via the electric lead of the stem to Connect the external power supply, turn on the external power supply, and light the LED light bar.
  • the LED light-transmitting bulb and the stem are vacuum-sealed to A corresponding bracket and an LED light strip fixed thereto are housed therein, and a driver and an electrical connector are disposed outside the vacuum sealed chamber.
  • the vacuum sealed cavity formed by the light-transmitting bulb and the core column is filled with a gas with a low viscosity coefficient and a high thermal conductivity, such as helium gas, hydrogen gas or a mixed gas of helium gas and hydrogen gas, and the gas pressure is 50-1520 at room temperature. T rr. It can be seen that any static gas is a good thermal insulator.
  • the heat dissipation of the gas mainly depends on convection, that is, the gas with low viscosity coefficient is selected.
  • the helium gas is the lowest viscosity coefficient in the gas, only 116 ⁇ (hydrogen is 173 ⁇ , air is 922 ⁇ ).
  • the LED light bar is small in volume, and it is easier to form effective gas convection; thus, the heat generated by the operation of the LED light bar can be effectively passed through the gas. Convection and heat conduction are then dissipated through the bulb.
  • the LED strip is protected by an inert gas such as helium or other low viscosity coefficient gas and vacuum sealed, completely free from the influence of moisture in the surrounding environment, so that the LED strip and the LED chip therein have a longer life.
  • the LED light strip of the LED chip 4 ⁇ emits light, and comprises a transparent substrate.
  • the transparent substrate has at least one string of LED chips connected in series in the same direction, the LED chip is a transparent chip of the chip substrate, and the LED chip is made of transparent glue.
  • silica gel, modified resin or epoxy resin is fixed on a transparent substrate, and the LED chip 4 ⁇ emits light, and the luminous efficiency is high; the LED electrodes are led out by the lead wires at both ends of the transparent substrate.
  • the transparent substrate of the LED light bar is made of glass, hard glass, quartz glass, transparent ceramic or plastic; the electrical lead wires at both ends of the LED light strip are fixed on the transparent substrate with high temperature glue, plastic, silver paddle or low melting glass. Both ends.
  • the at least one string of LED chips are separately fixed on the transparent substrate, and the chips can be arranged close to each other or separated by a certain distance, for example, the distance between the chips is greater than 0.01 mm.
  • the heat dispersion generated when the LED works is easy to dissipate heat, the temperature rise of the LED is small, and the service life is long; the illuminating dispersion of the LED reduces the glare of the LED.
  • the series connected chips mounted on the transparent substrate may be the same or different luminescent colors
  • the LED chip is, for example, the same blue light, ultraviolet light or other monochromatic light; it can also be red, blue or green three primary colors or multiple primary colors to obtain white light or mixed light of different colors; use different numbers of multiple luminescent colors
  • the LED can get a white light with a high color rendering index.
  • the transparent substrate of the LED light-emitting strip is mounted on the chip side and the chip may have a transparent medium layer with high transmittance and high refractive index, such as silica gel, plastic or epoxy resin, to improve the light emission rate. And protect the LED chip and its electrical connection line.
  • a transparent medium layer with high transmittance and high refractive index such as silica gel, plastic or epoxy resin
  • the illuminating strip and its chip need a uniform luminescent powder layer.
  • the luminescent powder may be coated on the outer surface of the transparent substrate and the periphery of the chip.
  • the luminescent powder layer may be coated on the luminescent strip transparent substrate and its mounting chip side and the peripheral outer surface of the transparent dielectric layer on the chip.
  • the transparent strip substrate and the chip thereof may be coated with a transparent dielectric layer and then coated with a uniform layer of luminescent powder.
  • the transparent strip substrate and the chip thereof may be coated with a uniform layer of luminescent powder and then coated with a layer of transparent medium.
  • the luminescent powder layer is made by mixing luminescent powder with a transparent medium; the transparent medium is a high transmittance, high refractive index, high thermal conductivity medium, such as silica gel, epoxy resin, plastic, transparent plastic, transparent lacquer and Organic polymer materials, etc.
  • the luminescent powder is pre-mixed with a transparent medium to form a uniform luminescent film, which is then wrapped around the transparent substrate and the transparent dielectric layer on the chip.
  • the luminescent powder layer prepared by mixing the luminescent powder and the transparent medium can also be formed into a transparent medium illuminating powder tube and placed on the transparent substrate and the chip; the transparent medium is, for example, silica gel, epoxy resin, plastic, glass, etc. .
  • the luminescent powder may also be coated on the inner or outer wall of a glass tube to form a glass luminescent powder tube, and then a transparent substrate on which at least one string of LED chips are mounted is placed in the glass luminescent powder tube.
  • the transparent medium illuminating powder tube and the glass illuminating powder tube and the transparent substrate and the chip may be filled with a medium having high transmittance, high thermal conductivity and high refractive index, such as silica gel, epoxy resin, plastic, etc.
  • a medium having high transmittance, high thermal conductivity and high refractive index such as silica gel, epoxy resin, plastic, etc.
  • the electric lead wires at both ends of the transparent substrate are fixed or sealed.
  • the luminescent powder may also be coated on the inner wall of the transparent blister.
  • the LED chip 4 ⁇ emits at least one string of LED light strips, and the LED chips in series may also be high voltage LED chips that emit light from the LED chip 4 ⁇ .
  • the high voltage LED chip includes at least two serial connections for each high voltage LED chip. LED PN junction, at least one electrical connection line between each PN junction; each high voltage LED chip has at least one metal electrode for soldering wire at each end; each high voltage LED chip and high voltage LED chip and high voltage LED electricity There is at least one connecting line between the lead wires.
  • each high-voltage LED chip has a plurality of LED PN junctions, the number of chips required for the light-emitting strips is greatly reduced, which simplifies the solid-crystal bonding process of the light-emitting strips and improves the yield of the light-emitting strips. Meanwhile, the plurality of LEDs The PN junction does not require a large area of opaque metal splicing tray, which improves the light exit rate of the chip, that is, improves the luminous efficiency.
  • the LED light strips of the above various LED chips 4 ⁇ are not only usable for manufacturing the present invention.
  • LED bulbs can also be used as stand-alone lighting elements.
  • the at least one string of LED chips connected in series in the same direction has a sufficient number, so that the total driving voltage of the at least one LED strip used in series or series-parallel connection is close to the external AC mains or external DC power supply voltage, for example, the alternating current used. 20%-100% of the peak or external DC supply voltage, the driver does not require a transformer, the circuit is simple, efficient, and low cost.
  • the LED light strips of the at least one LED chip 4 ⁇ can be connected in series or in series and parallel, and can be connected to work in two-way AC or one-way DC.
  • the arrangement of the at least one light bar is in the form of a V shape, a W shape, a column shape, a cone shape, a plane shape or the like.
  • the light strips of the at least one strip are arranged to cross each other, that is, any two of the strips are not in the same plane. on.
  • the light-emitting strips of the LED light-emitting strips are arranged to intersect each other on a diagonal of each face of the virtual multi-faced cylinder or the multi-faceted cylinder.
  • At least one LED light bar may be turned on in the positive direction, and at least one reverse conduction in the other direction, and the forward and reverse directions of the alternating current are alternately turned on and on; or at least 5 LED light bars may be formed to form a similar bridge.
  • the rectifying circuit like the existing ACLED, alternately conducts the light in the forward and reverse directions of the alternating current.
  • the light-emitting strip is sealed in a vacuum-sealed light-transmitting bulb, and the high working voltage is isolated in the bulb, and the AC mains can be directly used, or only a current limiting circuit in which the resistor and capacitor are connected in parallel, or a PTC resistor, etc. . It is safe and reliable, and overcomes the shortcomings of existing ACLED and HVLED heat sinks that are easy to carry high voltage and are not safe.
  • the at least one LED light bar When the at least one LED light bar is connected to work in one-way DC, it can be operated by an external DC power source or an AC power source; when the external AC power source is used, the driver can be connected by a capacitor and a resistor in parallel with a step-down current limiting circuit and rectification filtering. Circuit configuration, rectifier circuit or rectifier circuit can also be used to add PTC resistors in series; driver circuit is simple, low cost, no triode, no transformer No high frequency radiation, no electrolytic capacitors; simpler non-isolated drivers with inductors and constant current sources without transformers.
  • the light-transmissive bulb is transparent, or is a milky white, frosted, colored bulb, and may also be a bulb having a portion of a reflective layer or a series of small prisms and small lenses.
  • the shape of the light-transmissive bulb may be other existing bulbs such as A-type, G-type, R-type, PAR-type, type, candle type, P type, PS type, BR type, ER type or BRL type.
  • One of the blister shells One of the blister shells.
  • the electrical connector is one of electrical connectors of an existing bulb such as E40, E27, E26, E14, GU, BX, BA, EP, EX, GY, GX, GR, GZ, G, and the like.
  • High luminous efficiency Using a vacuum-sealed low-viscosity gas convection heat dissipation, solving the heat dissipation problem of the 4 ⁇ light-emitting LED chip, the chip 4 ⁇ emits light, and the light-emitting rate is increased by more than 65%; the high-voltage LED light-emitting strip connected in series by a plurality of LED chips has high efficiency of the driver circuit More than 95%; the whole lamp efficiency can reach more than 130 lm/W, which is double the existing LED bulb, twice the fluorescent energy-saving lamp and 10 times that of the incandescent lamp. If a high-voltage LED chip that emits light from the LED chip 4 ⁇ is used, the luminous efficiency can be further improved.
  • the whole lamp does not have any short-lived components.
  • the LED is vacuum-sealed and filled with inert gas helium. It is completely unaffected by the surrounding water vapor, and the chip is dispersed and installed at low current and low temperature.
  • the service life of LED bulbs may reach the long life of 50,000-100,000 hours of LED itself.
  • the high-voltage LED strip and its high operating voltage are sealed in a vacuum-sealed bulb, which is safe and reliable, solving the safety problems of the prior art ACLED and HVLED.
  • the LED whole lamp does not use a metal radiator and a transformer.
  • the weight of the lamp is reduced by more than 2/3, and its weight is lighter than that of the fluorescent energy-saving lamp, which is close to the incandescent lamp. Its volume is also close to incandescent lamps.
  • the glare is light. Multiple small current LED chips are distributed to reduce the glare of LED chips Light.
  • the LED bulb of the LED chip of the present invention is expected to become the mainstream of the LED general illumination lamp.
  • Incandescent and fluorescent energy-saving lamps can be directly replaced for lighting.
  • FIG. 1 is a schematic view showing the structure of a high efficiency LED bulb in which an LED chip 4 ⁇ emits light according to an embodiment of the present invention.
  • FIG. 2 is a schematic view showing the structure of a high efficiency LED bulb in which an LED chip 4 ⁇ emits light according to another embodiment of the present invention.
  • FIG 3 is a schematic structural view of a high efficiency LED bulb in which an LED chip 4 ⁇ emits light according to still another embodiment of the present invention.
  • FIG. 4 is a schematic structural view of a high efficiency LED bulb in which an LED chip 4 ⁇ emits light according to still another embodiment of the present invention.
  • Fig. 5 is a structural schematic view of a high efficiency LED bulb in which an LED chip 4 ⁇ emits light according to still another embodiment of the present invention.
  • Fig. 6 is a front elevational view showing the structure of an LED illuminating strip of a high efficiency LED bulb in which an LED chip 4 ⁇ emits light according to an embodiment of the present invention.
  • Fig. 7 is a view showing the configuration of an embodiment of an LED light-emitting strip cut along line A-A in Fig. 6.
  • Figure 8 is a schematic view showing the structure of still another embodiment of the LED light-emitting strip cut along the line A-A in Figure 6;
  • Fig. 9 is a view showing the configuration of still another embodiment of the LED light-emitting strip cut along the line A-A in Fig. 6.
  • Fig. 10 is a view showing the structure of still another embodiment of the LED light-emitting strip cut along the line A-A in Fig. 6.
  • Figure 11 is a schematic view showing the structure of still another embodiment of the LED light-emitting strip cut along line A-A in Figure 6.
  • Figure 12 is a schematic view showing the structure of still another embodiment of the LED light-emitting strip cut along the line A-A in Figure 6.
  • Figure 13 is a schematic view showing the structure of still another embodiment of the LED light-emitting strip cut along the line A-A in Figure 6.
  • Fig. 14 is a front elevational view showing the structure of an LED illuminating strip of a high efficiency LED bulb in which the LED chip 4 ⁇ emits light according to an embodiment of the present invention.
  • Fig. 15 is a view showing the configuration of an embodiment of an LED light-emitting strip cut along the line B_B in Fig. 14.
  • Fig. 16 is a front elevational view showing the structure of an LED illuminating strip of a high voltage LED chip in which an LED chip 4 ⁇ emits light according to an embodiment of the present invention.
  • Figure 17 is a schematic illustration of still another arrangement of LED illuminating strips of a high efficiency LED bulb with LED chip 4 ⁇ emitting light in accordance with one embodiment of the present invention.
  • Fig. 18 is a view showing still another arrangement of LED light-emitting strips of a high-efficiency LED light bulb in which the LED chip 4 ⁇ emits light according to an embodiment of the present invention.
  • Fig. 19 is a view showing still another arrangement of LED light-emitting strips of a high-efficiency LED light bulb in which the LED chip 4 ⁇ emits light according to an embodiment of the present invention.
  • FIG. 20 is a schematic illustration of still another arrangement of LED illuminating strips of a high efficiency LED bulb with LED chips 4 ⁇ emitted in accordance with one embodiment of the present invention.
  • the reference numerals used in the drawings are briefly described below:
  • high-voltage LED chip illuminating strip 34 high-voltage LED chip; 35 LED PN junction; 36 PN Electrical connection between the junction; 37 the wire tray at both ends of the high voltage LED chip; 38 electrical connection between the high voltage LED chip and the electrical lead line; 39 cone axis; 40 LED light strips of different illuminating colors; Virtual polyhedron.
  • FIG. 1 is a schematic view showing the structure of a high efficiency LED bulb in which an LED chip 4 ⁇ emits light according to an embodiment of the present invention.
  • the high-efficiency LED bulb with the light output of the LED chip 4 ⁇ includes a light-transmitting LED bulb shell 1, a stem 5 with an exhaust pipe 2 and a bracket, an LED strip 6 with at least one LED chip 4 ⁇ , and a driver 7.
  • the light-transmitting LED bulb case 1, the stem 5, the LED strip 6, the driver 7, the electrical connector 8 and the connector 9 are connected to each other as an LED bulb 10.
  • the LED light-emitting strip 6 is fixed on the stem 5 by the electric lead wire 3 and the wire 11, and the electrode of the LED light-emitting strip passes through the electric lead wire 3 of the stem 5 and/or the metal wire 11 and the driver 7, (
  • the electrical connection line 12, the electrical connector 8, and the external power source, which are provided if necessary, are sequentially connected to each other.
  • the LED light bar 6 can be illuminated.
  • the light-transmitting LED bulb shell 1 and the stem 5 are vacuum-sealed to form a vacuum sealed cavity 13, and the cavity 13 is filled with a gas having a low viscosity coefficient and a high thermal conductivity, which can generate heat generated when the LED light strip 6 is operated.
  • the convection and conduction of the gas are then dissipated through the light-transmissive LED bulb housing 1.
  • the stem 5 includes an exhaust pipe 2, a flare tube la, and a bracket 42 (the bracket 42 includes an electric lead wire 3, a strut 4, and a wire 11).
  • the bracket 42 includes an electric lead wire 3, a strut 4, and a wire 11.
  • the high temperature heat treatment is used at the joint position of the LED bulb shell 1 and the stem 5
  • the two are sealed to form a vacuum sealed cavity 13 in the same process as the conventional incandescent lamp.
  • the LED light strip 6 and the post 4 of the stem 5, one end of the electrical lead 3 and the light strip 6 are The wire/connecting wire 11 is sealed together in the vacuum sealing cavity 13; then the vacuum sealing cavity 13 is evacuated through the exhaust pipe 2, and then filled with a low viscosity coefficient high thermal conductivity gas, and then the exhaust pipe 2
  • the seal is sealed at the sealing position 2a, and the low viscosity coefficient high thermal conductivity gas is sealed in the vacuum sealed chamber 13.
  • a low viscosity coefficient high thermal conductivity gas in the vacuum sealed cavity 13 for example, helium gas, hydrogen gas, or a mixed gas of helium gas and hydrogen gas, and the gas pressure is any value between 50-1520 Torr at room temperature.
  • Helium is the gas with the smallest viscosity coefficient in gas. It is only 116 ⁇ (173 ⁇ for hydrogen, 922 ⁇ for air, and 8937 ⁇ for water). It is easy to form effective convection heat dissipation and take away the heat generated when the LED light bar works. The LED light bar works normally.
  • the vacuum sealed cavity 13 includes only the LED light-emitting strip 6 and the pillar 4 of the stem 5, one end of the electrical lead wire 3 and the connecting wire/wire 11 between the light-emitting strips 6, and the LED light-emitting
  • the electrodes at both ends of the strip are electrically connected to the driver 7, the electrical connection line 12 and the electrical connector 8 outside the vacuum sealed cavity 13 via the electrical lead-out line 3 on the stem, and the electrical connector 8 is used for connection.
  • a power source illuminates the LED light bar 6.
  • the LED light-emitting strip 6 is protected by an inert gas such as helium or other low-viscosity gas and is vacuum-sealed, so that it is completely unaffected by moisture in the surrounding environment, and the life of the LED is longer.
  • an inert gas such as helium or other low-viscosity gas
  • the LED light bar 6 has at least one string and PN junctions connected in series in the same direction.
  • the LED chip has a sufficient number, so that the total driving voltage of the at least one LED light bar used in series or series-parallel connection is close to the external alternating current voltage or the external DC power supply voltage, for example, the alternating current peak or the DC power supply voltage used. 20%-100%. Therefore, the high-voltage LED light-emitting strip of the LED chip 4 ⁇ is formed, and the driver does not need a transformer, and the circuit is simple, high in efficiency, and low in cost.
  • the at least one LED lighting strip 6 can be connected in series or in series and parallel so as to work in two-way AC or one-way DC.
  • Figure 1 shows an example where two LED strips are connected in series to work in a unidirectional DC.
  • the external power source may be a DC power source or an AC power source; when the external AC power source is used, the driver 7 may be a capacitor
  • the step-down current limiting circuit and the rectifying and filtering circuit are connected in parallel with the resistor, and the rectifying filter circuit or the rectifying circuit may be used in combination with the PTC resistor in series, without a triode, a transformerless or an electroless capacitor; or a switching power supply without a transformer and Constant current device, low drive cost.
  • At least one LED illuminating strip 6 When the at least one LED illuminating strip 6 is connected to work in a bidirectional AC, at least one LED illuminating strip 6 may be forwardly turned on, and at least one other LED illuminating strip 6 may be reversely turned on, and the alternating current is alternately turned on and off in sequence. Glowing.
  • at least five LED illuminating strips 6 may be arranged to form a bridge-like rectifying circuit, that is, four four-arm alternating currents are alternately turned on and off in turn, and one is connected to the four arms diagonally. The alternating current is turned on and off in both the forward and reverse directions.
  • the bidirectional AC When the bidirectional AC is working, it can work directly with AC mains, or the driver ⁇ is only a current limiting resistor and a PTC resistor connected in series.
  • the LED light strip of the LED chip 4 ⁇ can be a high-voltage LED light strip and its working environment with high working voltage is sealed in the vacuum sealed LED bulb shell, thus making it safe and reliable.
  • the light-transmissive bulb 1 is a transparent, or milky, frosted, colored bulb.
  • a blister having a portion of a small prism and a small lens as a part having a reflective layer or a portion as needed.
  • the shape of the light-transmitting bulb 1 may be A-type, G-type, R-type, PAR-type, T-type, S-type, candle type, P type, PS type, BR type, ER type, One of the bulbs of the BRL type or other existing bulbs.
  • the electrical connector 8 is one of electrical connectors of an existing bulb such as E40, E27, E26, E14, GU, B22, BX, BA, EP, EX, GY, GX, GR, GZ, G, etc. Suitable for installation on different lamp holders or lamps.
  • Figure 1 shows an example of an E-type lamp cap.
  • FIG. 2 is a schematic structural view of a high efficiency LED light bulb in which an LED chip 4 ⁇ emits light according to another embodiment of the present invention.
  • the LED light bulb case 1 hereinafter referred to as the bubble case 1 or the lamp Shadows are generated, and the LED strips are arranged to cross each other, that is, any two of the LED strips are not in the same plane.
  • the LED light bar 6 has two LED light strips 6a and 6b, and the lower ends of the two light strips 6a and 6b (near the end of the exhaust pipe 2) are in the same horizontal plane in FIG. 2 (or Set at the same height level), their upper ends are installed one after the other.
  • FIG. 3 is a schematic structural view of a high efficiency LED bulb in which an LED chip 4 ⁇ emits light according to still another embodiment of the present invention.
  • the bulb 1 is of the PAR type, and has a light reflecting layer 14 on the inner wall of the bulb 1, and the LED strip 6 is fixed to the wire 11 and the electric lead 3 on the stem 5.
  • the bottom of the bulb 1 is provided with a light reflecting plate 11 ⁇ 2 for reflecting the light of the LED light bar 6 toward the bottom to improve the light emission efficiency.
  • the blister 1 is a T-shaped blister; at least one LED illuminating strip 6 is directly fixed on the electrical lead wires 3 and 3a of the stem 5, and the electric lead-out wire 3a connected to the upper end of the LED illuminating strip 6 is curved.
  • the light emitted by the LED light bar 6 is prevented from generating a projection shadow on the bulb 1 via an electric lead wire parallel thereto.
  • the inner wall of the bulb 1 is provided with a luminescent powder layer 26a, and the LED illuminating strip is an LED illuminating strip without a luminescent powder layer; the electrical connector 8 is directly connected to the blister 1.
  • the electric lead wire 3a can be regarded as a bracket for bending the LED light bar 6.
  • Fig. 5 is a structural schematic view of a high efficiency LED bulb in which an LED chip 4 ⁇ emits light according to still another embodiment of the present invention.
  • the bulb 1 is an R-shaped reflecting bulb, and the light reflecting layer 14 on the inner wall of the bulb 1; four LED strips 6 connected in series are used for the electric lead wire 3 and the wire on the stem.
  • the wire 11 on the 11a and the strut 4 is attached and fixed to the stem 5.
  • Fig. 6 is a front elevational view showing the LED lighting strip 6 used in a high efficiency LED bulb in which the LED chip 4 ⁇ emits light according to an embodiment of the present invention.
  • the LED light bar 6 includes a transparent substrate 15 on which at least one string of LED chips 16 connected in series in the same direction of the PN, electrical connection lines 17 disposed between the LED chips 16, and transparent substrate 15 are disposed on the transparent substrate 15.
  • the two ends are the LED electrode lead wire 18 and its fixing device 19; the one end 20 of the electrode lead wire 18 facing the LED chip 16 is exposed, so that the connecting wire 21 and the LED chip 16 are electrically connected.
  • the transparent substrate L5 is made of glass, hard glass, quartz glass, transparent ceramic or plastic. to make.
  • the fixing means 19 of the electrical lead 18 of the two ends of the LED strip 6 is made of high-grade glue, plastic, silver paste or low-melting glass.
  • the vacuum sealed LED bulb shell and the stem are used to form a vacuum sealed cavity, and the vacuum sealed cavity is filled with a low viscosity coefficient high thermal conductivity gas for rapid heat dissipation, so the present invention does not need to be as existing In the technology, the LED strip can only use a very expensive transparent substrate such as sapphire or diamond to withstand the high temperature generated by the LED strip. Therefore, the transparent substrate of the LED light-emitting strip 6 of the present invention can be made of a relatively inexpensive material such as glass, hard glass, quartz glass, transparent ceramic or plastic, thereby reducing the manufacturing cost of the LED light-emitting strip 6.
  • the serially connected chips 16 mounted on the transparent substrate 15 may be LED chips of the same or different illuminating colors, for example, the same blue light, ultraviolet light or other monochromatic light; or different illuminating colors to obtain different Color mixed light or white light; use different numbers of LEDs with multiple illuminating colors to obtain white light of different color temperature with high color rendering index.
  • Fig. 7 is a schematic cross-sectional view showing the LED light-emitting strip 6 cut along the line A-A shown in Fig. 6.
  • the LED chip 16 is fixed on the transparent substrate 15 with a transparent adhesive 22, and the chip substrate of the LED chip 16 is transparent.
  • the light emitted by the PN junction 24 of the LED chip 16 may be directly emitted from a portion of the light in the direction of the electrical connection line 17, and the other portion of the light is totally reflected toward the transparent substrate 15 and the light originally directed toward the transparent substrate 15 Then, it is emitted through the transparent substrate 15 of the chip substrate and the light-emitting strip.
  • FIG. 7 is a schematic cross-sectional view showing the LED light-emitting strip 6 cut along the line A-A shown in Fig. 6.
  • the transparent adhesive 22 is, for example, an epoxy resin, a modified resin, or a silica gel.
  • Fig. 8 is a cross-sectional structural view showing still another embodiment of the LED light-emitting strip 6 cut along the line A-A shown in Fig. 6.
  • the LED chip 16 and the transparent substrate 15 on which the LED chip 16 is mounted have a high refractive index, high light transmittance, and high thermal conductivity transparent dielectric layer 25 on one surface thereof to improve the light emission rate of the LED chip 16 in the connection line direction. And protecting the chip 16 and its electrical connection line 17.
  • the transparent medium is, for example, silica gel, epoxy resin, plastic or the like.
  • a luminescent powder layer is required in addition to the LED illuminating strip 6 shown in Fig. 6, 7 or 8.
  • the luminescent powder layer may be in close contact with the surface of the LED illuminating strip 6, or coated on the LED On the inner or outer wall of the transparent medium tube outside the strip 6, or mixing the luminescent powder in the transparent medium tube wall (for example, into a luminescent powder tube), or on the inner wall of the blister 1, as shown in Fig. 4 Powder layer 26a 0
  • Fig. 9 is a schematic cross-sectional view showing an embodiment of an LED light-emitting strip having a luminescent powder layer.
  • an outer surface of the periphery of the LED chip 16 and the transparent substrate 15 is coated with a uniform luminescent powder layer 26. That is, a uniform layer of luminescent powder 26 is applied to the outer surface of the LED illuminating strip shown in FIG.
  • the luminescent powder layer 26 is made of a mixture of luminescent powder and a transparent medium; the transparent medium is, for example, silica gel, epoxy resin, plastic, transparent plastic, transparent lacquer, high molecular polymer or the like.
  • Fig. 10 is a cross-sectional structural view showing still another embodiment of an LED light-emitting strip having a luminescent powder layer.
  • one side of the LED chip 16 and the transparent substrate 15 on which the chip is mounted is coated with a transparent dielectric layer 25 (as shown in Fig. 8), and then a uniform layer of luminescent powder 26 is wrapped.
  • Fig. 11 is a cross-sectional structural view showing still another embodiment of an LED light-emitting strip having a luminescent powder layer.
  • the transparent substrate 15 and the transparent dielectric layer 25 on which the LED chip 16 is mounted are coated with a transparent dielectric layer 25a and then coated with a uniform luminescent layer 26.
  • Fig. 12 is a cross-sectional structural view showing still another embodiment of an LED light-emitting strip having a luminescent powder layer.
  • a layer of transparent dielectric 25 is wrapped around the chip 16 and the transparent substrate 15, and then a uniform luminescent layer 26 is wrapped.
  • Fig. 13 is a cross-sectional structural view showing still another embodiment of an LED light-emitting strip having a luminescent powder layer.
  • a uniform layer of phosphor powder 26 is wrapped around the LED chip 16 and the transparent substrate 15, and then a layer of transparent dielectric 25 is wrapped.
  • a transparent tube may be added to the LED light bar 6 shown in FIG. 6 for protecting the LED chip.
  • the LED light bar can also add a luminescent powder layer.
  • Fig. 14 is a front elevational view showing an embodiment of an LED light-emitting strip provided with an outer transparent tube.
  • the LED light bar 27 includes an outer transparent tube 28, and the transparent substrate 15 on which the LED chip 16 is mounted is sealed in the transparent tube 28.
  • the electrodes of the LED chip 16 are electrically led out from both ends of the transparent tube 28. Line 29 is withdrawn and electrical lead 29 is sealed from transparent tube 28 at sealing location 30.
  • the LED chip 16 is an LED chip of two different illuminating colors. For example, the LED chip 16 is blue-emitting, and the LED chip 16a is red-emitting.
  • the LED chips 16a of different colors can be used to change the illuminating color temperature and color rendering index.
  • Fig. 15 is a view showing the structure of the LED light-emitting strip 27 of the LED chip 4 ⁇ cut along the line B-B of Fig. 14.
  • the LED chip 16 and its transparent substrate 15 are provided with a transparent tube 28 made of glass, plastic or silica gel or the like.
  • the luminescent strip 27 requires a luminescent powder layer
  • the luminescent powder may be coated on the inner or outer wall of the transparent tube 28.
  • Fig. 15 shows an example in which the luminescent powder layer 32 is coated on the inner wall of the transparent tube 28.
  • the luminescent powder may also be mixed in the transparent medium of the transparent tube 28, that is, the luminescent powder is mixed with a transparent medium glass, a plastic, a silica gel or the like to form a transparent luminescent powder tube, so that the transparent tube 28 is inside. There is no need to apply the luminescent powder layer 32 on the outer wall.
  • the transparent tube 28 and the LED chip and the transparent substrate 15 thereof may be filled with a material having a high thermal conductivity, a high refractive index, and a high transmittance, such as transparent silica gel, epoxy resin, and plastic.
  • the light emitted by the LED chip emits light 4 ⁇ . Since the refractive index of the glass substrate, the transparent adhesive and the glass tube are similar, the light loss of the LED emitted light at the interface of each medium is small, so the light output of the LED chip is high, that is, the light emission efficient.
  • Fig. 16 is a front elevational view showing the structure of still another embodiment of the LED light-emitting strip of the LED chip of the present invention.
  • the chip substrate of the LED chip of the LED strip 33 of the LED chip 4 ⁇ is transparent.
  • the LED chip is a high voltage LED chip, and each high voltage LED chip 34 includes at least two LED PN junctions 35 connected in series, and at least one electrical connection line 36 is connected between each PN junction; each high voltage LED chip Each of the two ends has at least one metal electrode 37 for soldering the wire; at least one electrical connection line 38 is disposed between each of the high voltage LED chips and between the high voltage LED chip and the high voltage LED light strip.
  • At least one high voltage LED chip 34 of the LED lighting strip 33 shown in FIG. 16 may be of the same or different illuminating color, and like the LED lighting strips described in FIGS. 6 and 14, the chip may also have a transparent dielectric layer on one side. A luminescent powder layer may also be disposed around the illuminating strip 33.
  • the LED light strips 6, 27 and 33 of the above-mentioned LED chip 4 ⁇ can be used for manufacturing the LED bulb shown in Figs. 1, 2, 3, 4 and 5, or can be used alone as a light-emitting element.
  • the position of the at least one LED strip can be as needed to arrange, for example, arranged in a column, a V shape, a W shape, a cone shape, a plane, etc., as shown in Figs. 1, 2, 3, 4, and 5, as shown in Figs. 17, 18, 19, and 20 Arranging, when it is required to prevent the light emitted by one LED light bar from being blocked by the blocking of the other LED light bar, the LED light strips of the at least one LED light bar are arranged to cross each other, as shown in FIG. 18 The plurality of LED strips are arranged on a diagonal of each side of the virtual multi-faced cylinder or the multi-faceted cylinder.
  • Figure 18 shows four LED strips arranged in a square cylinder and on the diagonal of the four faces shown by the dashed line 41 of Figure 18.
  • the illuminating strips 6, 27 and 33 used may be of the same or different illuminating colors to obtain lamps of different luminescent colors, different color temperatures and different color rendering indices.
  • the light-emitting strips 6, 27 or 33 of the four LED chips which emit blue light and are coated with a luminescent powder layer which can be excited by blue to generate yellow light are arranged in a conical shape around the tapered axis 39 therebetween.
  • a LED light bar 40 emitting other colors, for example, a red light emitting light, and changing the relative luminous flux of the two, thereby obtaining a white light LED bulb with different color temperature and color rendering index.

Description

LEI)灯泡及能够 4 π出光的 LED发光条 技术领域
本发明涉及照明技术领域， 尤其涉及 LED发光条以及使用其的 LED
背景技术
现有技术中， 可替代白炽灯的灯泡形 LED球泡灯大多由一个或多个 功率型 LED、 一块金属基电路板 （MPCB ) 、 一个带有一系列散热鳍片 的散热器、 一个包括有开关电源和恒流装置的驱动器、 一个连接件、 一 个防炫光泡壳和一个电连接器组成。 目前， 这类灯的发光效率已经达到 目前正在大量使用的荧光节能灯的水平， 其整灯效率为 40-70 lm/W, 但 白光 LED灯珠的效率已经达到 130 lm/W, LED球泡灯的效率还有待进 一步提高。 现有这类 LED球泡灯的主要问题是成本和价格太高， 为相同 光通量的荧光节能灯的几倍， 难于推广。 其高成本主要不是 LED芯片本 身， 而是因为高成本的铝合金散热器和包括有变压器开关电源和恒流装 置的驱动器以及 LED封装； 这种带变压器的开关电源和恒流装置的驱动 器不仅成本高， 而且效率低， 这种驱动器包含有三极管、 变压器、 电解 电容器等寿命不长的元件， 使其寿命不能与 LED匹配， 其标称平均寿命 一般小于 25000小时， 而 LED本身的寿命应该可以达到 50000-100000小 时。 即现有技术的替代白炽灯的 LED球泡灯的整灯效率还较低、 成本太 高、 寿命欠长； 若 LED球泡灯要替代白炽灯和现正大量使用的荧光节能 灯、 成为通用照明的主流， 其效率需要进一步提高、 成本要大幅度下 降、 使用寿命应该更长、 体积重量和白炽灯差不多。
LED的发光来源于 LED的 PN结， 它原本是 4π发光体， 现有技术 的 LED 为了聚光或与金属散热器连接， PN 结的一面有反射层、 反射碗 或散热器， 即原本是 4π发光的发光体被制成 2π或小于 2π的发光体； 这 就使射向散热器一面的 2π的光要经过反射、 多次反射和各种吸收后才能 出射， 射向出光面的 2π光也有部分因全反射回向散热器的光也要经过反 射、 多次反射和各种吸收后才能出射， 因而大大降低了 PN结发光的出光 率， 即降低了 LED的效率。 目前'， LED的 PN结发光的内量子效率已经 接近 90%, 而外量子效率却只有约 30%; 内量子效率 90%、 即在 PN结 中仅有 10%的注入电子漏掉、 没有产生光子， 90%的注入电子、 每个电 子都产生一个光子； 然而外量子效率却仅仅只有约 30%， 其中、 原本是 4π发光的 ΡΝ结被变成 2π发光体是其重要的原因之一。 若能让 LED的 PN结 4π出光， 必将大大提高 LED的发光效率。
对此， 以前也有人作过研究， 例如中国专利 200510089384.X, 它把 单个 LED 芯片悬空状置于透光物质中， 使芯片 4π发光； 但它没有解决 芯片的散热问题， 芯片没有支撑板悬空放置、 芯片上的电引出线可靠性 很差， 只能用单个小功率芯片、 难于制成可靠的有足够输出光通量的 灯。 又如美国公告专利 2007/0139949, 它用多个小芯片串联安装在昂贵 的蓝宝石、 钻石、 GaN 等透明导热基板上或铜、 SiC 等不透明导热基板 上， 再用导热的引出线和支架、 连接灯头散热， 外加一个不真空密封、 泡壳内为空气并与周围大气相通的泡壳， 形成一个白炽灯形的 LED 灯 泡； 该专利所述的导热透明基板蓝宝石、 钻石等十分昂贵、 难实用， 铜 和 SiC等不透明、 不能 4π出光； 它的散热途径是芯片一导热基板一导热 引线一导热支架一灯头， 导热途径最后到灯头， 难于热连接， 散热效果 有限， 若灯头内有 LED 的驱动器， 则导热途径中断失效； 若灯泡真空密 封， 则所述散热途径也失效； 因而也难于制成有实用意义的有足够输出 光通量的灯。
现有技术的 LED球泡灯的主流是用低压大电流的功率型 LED, —个 LED芯片一个 PN结， 工作电流大到 0.35A甚至几 A， 1W至几 W或更 大的电功率集中在 1 至几平方毫米的芯片上， 而其外量子效率仅仅只有 约 30%， 加上注入电子和它产生的光子的能量差、 PN结产生的光子和最 后出射的光子的能量差， 有约 70%的电功率将转变成热， 如何把这大量 的热散发掉、 在这类功率型 LED 诞生的同时就一直是它的关键难题之 ； LED 是半导体器件， 其 PN 结的结温升高、 将导致发光效率迅速下 降、 甚至烧毁 PN结； 直到今天、 散热问题仍然是这类用低压大电流功率 型 LED照明、 包括 LED球泡灯的关键难题之一。 为了解决散热问题， 现有技术的 LED球泡灯主要是用带有散热鳍片 的金属无源散热器， 对于这类散热器的材料、 形状和如何增加与空气的 对流热交换等已有大量的研究和专利， 例如中国专利 200510062323.4 和 美国专利 6787999、 7144135 等等。 所述金属散热器主要由合金铝制成， 体积大、 重量重、 成本高， 是现有技术 LED球泡灯的高成本的关键因素 除了上述金属散热器外， 也有研究用液体散热的， 例如中国专利 200810093378.5、 200910100681.8和 200910101643.4, 把 LED放在充有 透光导热液体的密封泡壳中， 所述液体例如为水、 油、 乙二醇或其它惰 性液体。 液体的导热系数比金属低很多， 例如水的导热系数约为 0.7 W/(rr K)， 而金属为 50~415W/(m .K)， LED球泡灯的散热器常用的铝合 金为 96-226 W/(m»K)， 可见液体的热传导远低于金属； 另一方面， 液体 的粘滞系数很大， 例如水的粘度为 8937μΡ， 不容易形成对流； 因此、 液 体的热传导和对流散热的效果都不好； 此外， 用液体散热还有液体会电 解、 液体侵蚀 LED、 液体可能相变在 LED表面形成气相层导致散热失效 甚至爆炸、 泡壳破裂后液体污染和重量重等问题， 因而不容易实用和推 广。
除了用上述金属 （固体） 和液体散热外， 也有人研究用气体散热。 例如中国专利 201010176451.2的 LED灯泡用密封泡壳中充负离子氮气散 热； 又例如 200910250434.6的 LED灯泡用密封在泡壳内的氮氩混合气散 热； 这些方法、 至今尚未见有实用的。 除了这些 LED灯泡外， 其它种类 的灯、 例如冷阴极荧光灯， 有用高导热率气体氦或氦氢混合气散热的， 例如中国专利 200710148853.X, 但因冷阴极荧光灯管体积大、 几乎占据 整个泡壳， 难于形成有限的对流， 而传导散热效果有限， 至今未见有实 用的； 又如金卤灯也有泡壳内充氮氦等气体的， 例如中国专利 200580039670.3； 白炽灯也有充氮氦等气体的； 但这些都是与 LED 灯不 同类型的灯。
现有技术的 LED球泡灯除了上述散热问题外， 还有一个如何把高压 市电转换成低压大电流的驱动问题。 如前所述、 现有技术的 LED球泡灯 大多是直流低压大电流工作的功率型 LED, 工作电压为几至十几伏、 电 流为 0.35A 至几 A; 而现有通用照明的白炽灯和荧光节能灯都是直接用 1 10-230V 的交流市电的， 要直接替换它们就需要一个包含有 AC/DC 变 换器的驱动器， 把高压交流电变换成低压大电流的直流电。 这种驱动器 通常包括有一个带有三极管、 变压器和电解电容器等元件的开关电源和 恒流电路， 由于替代白炽灯的 LED灯的体积不能太大， 驱动器的体积要 尽量小， 变压器也要尽量小， 而输入和输出电压差很大， 这就使得其电 变换效率低， 一般为 70-80%， 这就降低了整灯的发光效率； 同时， 因为 其效率低， 自身发热量大， 加上来自 LED 发的热， 所述驱动器的温度容 易升高， 这不仅会进一步降低驱动器的效率， 而且会縮短驱动器的寿 命， 所述驱动器包含有三极管、 变压器和电解电容器等对温度敏感的元 件， 温度升高， 会明显降低它们的效率、 寿命和可靠性， 这使得现有技 术的 LED 球泡灯的寿命主要不是决定于 LED, 而是决定于驱动器。 此 夕卜， 所述带有变压器的开关电源和恒流电路的驱动器电路复杂、 对元件 要求高， 因而成本高， 是现有技术的 LED球泡灯的高成本的另一关键因 素。
为了避免使用这种驱动器， 一种称为 ACLED (交流 LED) 的技术正 在发展中， 例如中国专利 200510020493.6、 200610099185.1 和美国专利 7515248、 7535028和产品 AX3221等， 它把一系列小电流的 LED芯片串 接成类似于桥式整流电路、 安装在一个 MPCB 上， 再加上散热器就可直 接用交流市电工作， 其驱动电路很简单。 但目前这类 LED 的效率还比较 低， 同时它需要与一个必须暴露在空气中的金属散热器密切热连接， 而 ACLED 上有高压交流电， 金属散热器容易带电、 不安全。 现有技术的 HVLED (高压 LED) 、 例如中国专利 201020159200.9、 也存在相同的安 全问题。
此外， LED是一种点光源， 100 lm左右的光集中在约 lmm2的面积 上， 其光亮度高达几千万尼特， 若人眼直视它， 会产生强烈的炫光、 在 视野中留下一个黑影， 短时间内会严重影响视力。 因此， 对于家用类 灯、 必须加上防炫光泡壳或其它分散光的装置； 为了得到良好的光感 觉， 防炫光泡壳的光漫射层需要有足够的厚度， 但这同时也降低了泡壳 的透过率， 通常它要损失 15%左右的光。 这又降低了整灯的发光效率。 综上所述， 现有技术的 LED灯要广泛替代白炽灯和荧光节能灯用于 通用照明， 其发光效率需要进一步提高、 成本需要大幅度下降、 使用寿 命需要进一步提高、 体积和重量要应接近白炽灯。 发明内容
本发明的目的旨在解决现有技术中存在的上述问题和缺陷的至少一 个方面。
相应地， 本发明的目的之一是提供能够高效率地 4π 出光的 LED 发 光条。
本发明的目的之一是提供一种高效率的 LED 芯片 4π 出光的高效率
LED灯泡
本发明的另一的目的是提供一种低成本的 LED 芯片 4π 出光的高效 率 LED灯泡。
本发明的还一目的是提供一种长寿命的 LED芯片 4π 出光的高效率 LED灯泡。
本发明的又一目的是提供一种体积和重量接近白炽灯的 LED芯片 4π 出光的高效率 LED灯泡。
根据本发明的一个方面， 提供了一种 LED 灯泡， 包括： LED 灯泡 壳、 带有排气管和支架的芯柱、 至少一个 LED芯片 4 出光的 LED发光 条、 驱动器、 电连接器， 其中所述 LED灯泡壳与芯柱真空密封以形成真 空密封腔体， 所述真空密封腔体内充有低粘滞系数高导热率气体， 支架 和固定在支架上的所述的 LED发光条容纳在所述真空密封腔体内， 所述 LED 发光条与所述驱动器、 电连接器依次电连接， 所述电连接器用于与 外电源电连接以点亮 LED发光条。
根据本发明的另一方面， 提供了一种 LED芯片 4 π出光的 LED发光 条， 所述 LED 发光条包括透明基板和在所述透明基板上的至少一串、 以 相同 PN结方向串联连接的 LED芯片， 所述 LED芯片具有透明的芯片基 板， 所述 LED 芯片电极由设置在透明基板的两端的 LED 芯片的电极引 出装置引出， 其中所述透明基板由软玻璃、 硬玻璃、 石英玻璃、 透明陶 瓷或塑料制成。 根据本发明的另一方面， 提供了一种 LED芯片 4 π出光的 LED发光 条， 所述 LED 发光条包括透明基板和在所述透明基板上的至少一串、 以 相同 PN结方向串联连接的 LED芯片， 所述 LED芯片具有透明的芯片基 板， 所述 LED 芯片电极由设置在透明基板的两端的 LED 芯片的电极引 出装置引出， 其中所述 LED 芯片的一部分为蓝光 LED 芯片而其的另一 部分为红光 LED芯片， 所述 LED芯片和安装所述 LED芯片的透明基板 的四周设置的发光粉层， 用于将所述蓝光 LED芯片发出的部分蓝光转变 为黄光， 另一部分蓝光和所述黄光及红光混合成白光、 高显色指数白光 或其它颜色的光。
根据本发明的另一方面， 提供了一种 LED芯片 4 π出光的 LED发光 条， 所述 LED 发光条包括透明基板和在所述透明基板上的至少一串、 以 相同 PN结方向串联连接的 LED芯片， 所述 LED芯片具有透明的芯片基 板， 所述 LED 芯片电极由设置在透明基板的两端的 LED 芯片的电极引 出装置引出， 所述 LED芯片和透明基板的最外面由透明管或透明发光粉 管包封。
根据本发明的另一方面， 提供了一种 LED芯片 4 π出光的 LED发光 条， 所述 LED 发光条包括透明基板和在所述透明基板上的至少一串、 以 相同 PN结方向串联连接的 LED芯片， 所述 LED芯片具有透明的芯片基 板， 所述 LED 芯片电极由设置在透明基板的两端的 LED 芯片的电极引 出装置引出， 其中 LED 芯片为芯片基板是透明的高压 LED 芯片， 所述 每个高压 LED芯片包括至少两个串联连接的 LED P-N结。
本发明的 LED芯片 4π出光的高效率 LED灯泡包括一个透光泡壳， 一个带有排气管、 电引出线和支架的芯柱， 至少一条 LED芯片 4π 出光 的 LED发光条， 一个驱动器， 一个电连接器， 一个泡壳和电连接器的连 接件； 透光泡壳和芯柱真空密封形成一真空密封腔体， 在真空密封腔体 内充有低粘滞系数高导热率气体； 所述泡壳、 LED 发光条、 驱动器、 电 连接器和连接件相互电连接成一个整灯； LED 发光条被固定在芯柱上， 其电极经芯柱的电引出线与驱动器、 电连接器相连， 以连接外电源， 接 通外电源、 即可点亮 LED发光条。
由上述可知， 本发明的实施例中， LED 透光灯泡与芯柱真空密封以 将相应的支架和固定于其上的 LED 发光条容纳在其中， 而驱动器和电连 接器设置在所述的真空密封腔体外。
所述透光泡壳和芯柱构成的真空密封腔体内充有低粘滞系数高导热 率气体， 例如氦气、 氢气或氦气与氢气的混合气体， 其气体压力为在室 温下 50-1520 T rr。 可知， 任何静止气体都是良绝热体， 气体的散热主要 依靠对流， 即要选择粘滞系数低的气体， 氦气是气体中粘滞系数最低 的， 仅为 116μΡ (氢气为 173μΡ， 空气为 922μΡ， 水为 8937μΡ)， 容易形 成有效散热的对流； 另一方面所述 LED发光条体积小， 更容易形成有效 的气体对流； 从而可以有效地把 LED 发光条工作时产生的热经所述气体 的对流和热传导再经泡壳散发掉。 另外， LED 发光条被氦气等惰性气体 或其它低粘滞系数气体保护并真空密封， 完全不受周围环境中的水汽等 的影响， 使 LED发光条以及其中的 LED芯片的寿命更长。
所述 LED芯片 4π出光的 LED发光条、 包括一个透明基板， 透明基 板上有至少一串、 相同方向串联的 LED 芯片， 所述 LED 芯片为芯片基 板是透明的芯片， LED 芯片被用透明胶、 例如硅胶、 改性树脂或环氧树 脂等固定在透明基板上， LED 芯片 4π 出光， 发光效率高； LED 电极由 透明基板两端的引出线引出。
所述 LED发光条的透明基板由玻璃、 硬玻璃、 石英玻璃、 透明陶瓷 或塑料等制成； LED 发光条两端的电引出线被用高温胶、 塑料、 银桨或 低熔点玻璃固定在透明基板两端。
所述至少一串 LED芯片相互分立固定在透明基板上， 各芯片可依次 靠近排列、 也可分开一定距离安装， 例如芯片之间的距离大于 0.01mm,
LED 工作时产生的热分散分布， 容易散热， LED 的温升小， 使用寿命 长； LED的发光分散分布、 减小了 LED的眩光。
所述安装在透明基板上的串联的芯片可以是相同或不同发光色的
LED 芯片， 例如为相同的蓝光、 紫外光或其它单色光； 也可以是红、 蓝、 绿三基色或多基色的， 以得到白光或不同色的混合光； 选用不同数 量的多种发光色的 LED可得到高显色指数的白光。
所述 LED发光条的透明基板的安装芯片一面和芯片上可有高透光率 高折射率的透明介质层， 例如硅胶、 塑料或环氧树脂， 以提高光出射率 和保护 LED芯片及其电连接线。
当 LED芯片为发蓝光或紫外光、 并需要用发光粉将其转变成白光或 其它色的光时， 所述发光条及其芯片外还需要有一均匀的发光粉层。
所述发光粉可涂覆在透明基板和芯片的四周的外表面上。
所述发光粉层可涂覆在发光条透明基板及其安装芯片一面和芯片上 的透明介质层的四周外表面上。
所述发光条透明基板及其芯片四周可先涂覆一层透明介质层、 然后 再涂覆一层均匀的发光粉层。
所述发光条透明基板及其芯片四周可先涂覆一层均匀的发光粉层、 然后再涂覆一层透明介质层。
所述发光粉层由发光粉与透明介质混合制成； 所述透明介质为高透 光率、 高折射率、 高导热率介质， 例如为硅胶、 环氧树脂、 塑料、 透明 胶、 透明漆和有机高分子材料等。
所述发光粉与透明介质预先混合制成均匀的发光膜， 然后包裹在所 述透明基板和芯片上的透明介质层的四周。
所述发光粉与透明介质混合制成的发光粉层也可制成透明介质发光 粉管、 放置于所述透明基板和芯片外； 所述透明介质例如为硅胶、 环氧 树脂、 塑料和玻璃等。
所述发光粉也可涂覆在一玻璃管的内或外壁上， 制成玻璃发光粉 管， 然后把安装有至少一串 LED芯片的透明基板放置于在所述玻璃发光 粉管中。
所述透明介质发光粉管和玻璃发光粉管与透明基板和芯片之间可充 有高透光率、 高导热率、 高折射率介质， 例如硅胶、 环氧树脂、 塑料 等， 其两端可与透明基板两端的电引出线固定或密封。
所述发光粉也可涂覆在透明泡壳的内壁上。
所述的 LED芯片 4π出光的 LED发光条的至少一串、 串联的 LED芯 片还可为 LED芯片 4π出光的高压 LED芯片， 所述高压 LED芯片为每个 高压 LED芯片包括有至少两个串联连接的 LED PN结， 各 PN结之间有 至少一条电连接线； 每个高压 LED芯片的两端各有至少一个用于焊接打 线的金属电极； 各高压 LED芯片之间以及高压 LED芯片与高压 LED电 引出线之间有至少一条连接线。 由于每个高压 LED芯片有多个 LED PN 结， 发光条所需的芯片数量大大减少， 简化了发光条的固晶打线工艺、 提高了发光条生产的成品率； 同时， 所述多个 LED PN 结上无需大面积 的不透明金属悍接盘， 提高了芯片的光出射率， 即提高了发光效率。
上述各种 LED芯片 4π出光的 LED发光条不仅可用于制造本发明的
LED灯泡， 也可作为独立的发光元件使用。
所述至少一串、 相同方向串联的 LED芯片有足够的数量， 使所用的 至少一条 LED 发光条串联或串并联连接后的总驱动电压接近外交流市电 或外 DC 电源电压， 例如为所用交流电峰值或外 DC 电源电压的 20%- 100%, 驱动器无需变压器， 电路简单、 效率高、 成本低。
所述至少一条 LED芯片 4π出光的 LED发光条可相互串联或串并联 连接， 可连接成双向 AC工作或单向 DC工作。
所述的至少一条发光条的排列的方式为 V形、 W形， 柱形、 锥形、 平面等形式。
为了避免一发光条所发的光经另一条发光条的阻挡在泡壳上产生暗 影， 所述至少一条发光条的各发光条相互交叉排列， 即各发光条中的任 何两条都不在同一平面上。
所述 LED发光条的各发光条相互交叉被设置成处于虚拟的多面柱体 或多面台柱体的各面的对角线上。
双向 AC工作时， 可以是至少一条 LED发光条正方向导通、 另外地 至少一条反向导通， 交流电的正反向依次交替导通发光； 也可有至少 5 条 LED 发光条、 构成类似桥式整流电路、 就如现有的 ACLED, 交流电 的正反向依次交替导通发光。 所述发光条被密封在真空密封的透光泡壳 内， 高工作电压被隔离在泡壳内， 可直接使用交流市电， 或仅需串接电 阻电容并联的限流电路、 或 PTC 电阻等。 其安全、 可靠， 克服了现有 ACLED和 HVLED的散热器容易带高压电、 不安全的缺点。
所述至少一条 LED发光条连接成单向 DC工作时， 可用外 DC电源 或交流电源工作； 在用外交流电源时、 所述驱动器可以由一电容和电阻 并联的降压限流电路和整流滤波电路构成， 也可用整流滤波电路或整流 电路加串联的 PTC 电阻； 驱动器电路简单、 成本低、 无三极管、 无变压 器、 无高频辐射、 也可不用电解电容器； 也可以用不带变压器的较简单 的带电感和恒流源的非隔离式驱动器。
所述透光泡壳为透明的、 或为乳白、 磨沙、 有色的泡壳， 也可为部 分有反射层的， 或部分有一系列小棱镜、 小透镜的泡壳。
所述透光泡壳的形状可为 A-型、 G-型、 R-型、 PAR-型、 型、 烛 型、 P型、 PS型、 BR型、 ER型或 BRL型等其它现有灯泡的泡壳中的一 种。
所述电连接器为 E40、 E27、 E26、 E14、 GU、 BX、 BA、 EP、 EX、 GY、 GX、 GR、 GZ、 G型等现有灯泡的电连接器中的一种。
本发明与现有技术相比， 其优点是：
发光效率高。 用真空密封的低粘滞系数气体对流散热、 解决了 4π出 光 LED芯片的散热问题， 芯片 4π出光， 出光率提高 65%以上； 用多个 LED芯片串联连接的高压 LED发光条， 驱动器电路效率高达 95%以上； 整灯效率可达 130 lm/W以上， 是现有 LED球泡灯的一倍， 荧光节能灯 的 2倍， 白炽灯的 10倍。 若用 LED芯片 4π出光的高压 LED芯片， 则 可进一步提高发光效率。
成本低。 LED 工作时产生的热、 经真空密封的泡壳内的低粘滞系数 高热导率气体的对流和传导再经泡壳散热， 完全不用金属散热器； 用高 压 LED发光条， 无需用高成本的带有变压器的 AC/DC变换器； 整灯成 本降低 2/3 以上。 若用 LED芯片 4π出光的高压 LED芯片， 则可进一步 降低成本。
寿命长。 整灯没有任何寿命短的元器件， LED 在真空密封并充有惰 性气体氦气的泡壳中， 完全不受周围环境的水汽等的影响， 加上芯片分 散安装、 在小电流低温度下工作， LED灯泡的使用寿命可能达到 LED本 身的 5-10万小时的长寿命。
安全可靠。 高压 LED 发光条及其高工作电压被密封在真空密封的泡 壳内， 安全可靠， 解决了现有技术 ACLED和 HVLED的安全问题。
重量轻体积小。 LED整灯不用金属散热器和变压器， 灯重量减轻 2/3 以上， 其重量比荧光节能灯还轻， 接近白炽灯。 其体积也接近白炽灯。
眩光轻。 多个小电流 LED 芯片分散分布， 减轻了 LED 芯片的眩 光。
随着 LED芯片内量子效率的进一步提高和芯片价格的不断下降， 本 发明的 LED芯片 ½出光的 LED灯泡有望成为 LED通用照明灯的主流。
可直接替换白炽灯和荧光节能灯用于照明。 附图说明
本发明的这些和 /或其他方面和优点从下面结合附图对优选实施例的 描述中将变得明显和容易理解， 其中：
图 1 为根据本发明的一个实施例的 LED芯片 4π出光的高效率 LED 灯泡的结构示意图。
图 2为根据本发明的另一实施例的 LED芯片 4π出光的高效率 LED 灯泡的结构示意图。
图 3为根据本发明的还一实施例的 LED芯片 4π出光的高效率 LED 灯泡的结构示意图。
图 4为根据本发明的又一实施例的 LED芯片 4π出光的高效率 LED 灯泡的结构示意图。
图 5为根据本发明的又一实施例的 LED芯片 4π出光的高效率 LED 灯泡的结构示意图。
图 6为根据本发明的一个实施例的 LED芯片 4π出光的高效率 LED 灯泡的 LED发光条的结构正视示意图。
图 7为沿图 6中的线 A— A切割的 LED发光条的一个实施例的结构 示意图。
图 8为沿图 6中的线 A—A切割的 LED发光条的又一个实施例的结 构示意图
图 9为沿图 6中的线 A— A切割的 LED发光条的又一个实施例的结 构示意图。
图 10为沿图 6中的线 A— A切割的 LED发光条的又一个实施例的 结构示意图。
图 11 为沿图 6中的线 A— A切割的 LED发光条的又一个实施例的 结构示意图。 图 12为沿图 6中的线 A— A切割的 LED发光条的又一个实施例的 结构示意图。
图 13 为沿图 6中的线 A— A切割的 LED发光条的又一个实施例的 结构示意图。
图 14为根据本发明的一个实施例的 LED芯片 4π出光的高效率 LED 灯泡的 LED发光条的结构正视示意图。
图 15为沿图 14中的线 B_B切割的 LED发光条的一个实施例的结 构示意图。
图 16 为根据本发明的一个实施例的 LED芯片 4π出光的高压 LED 芯片的 LED发光条的结构正视示意图。
图 17为根据本发明的一个实施例的 LED芯片 4π出光的高效率 LED 灯泡的 LED发光条的又一种排列方式的示意图。
图 18为根据本发明的一个实施例的 LED芯片 4π出光的高效率 LED 灯泡的 LED发光条的又一种排列方式的示意图。
图 19为根据本发明的一个实施例的 LED芯片 4π出光的高效率 LED 灯泡的 LED发光条的又一种排列方式的示意图。
图 20为根据本发明的一个实施例的 LED芯片 4π出光的高效率 LED 灯泡的 LED发光条的又一种排列方式的示意图。 下述对附图中使用的参考标号进行了简单说明：
1 透光 LED灯泡壳； la 芯柱的喇叭管； 2 排气管； 2a排气管的封 口位置； 3 电引出线； 3a 弯曲的电引出线； 4 支柱； 42支架； 5 芯柱； 6、 6a、 6b LED发光条； 7 驱动器； 8 电连接器； 9 连接件； 10 LED灯 泡； 11、 11a 芯柱上的金属丝； 12 电连接线； 13 真空密封腔体； 14 光 反射层； 14a光反射板； 15透明基板； 16、 16a LED芯片； 17芯片之间 的电连接线； 18电极引出线； 19电引出线的固定装置； 20电引出线的焊 接端； 21电连接线； 22透明胶； 23出射光； 24 PN结； 25、 25a透明介 质层； 26、 26a发光粉层； .27带透明管或发光粉管的发光条； 28透明管 或发光粉管； 29 电引出线； 30 密封位置； 31 透明介质； 32 发光粉层； 3. 高压 LED芯片的发光条； 34高压 LED芯片； 35 LED PN结； 36 PN 结之间的电连接线； 37高压 LED芯片两端的打线盘； 38 高压 LED芯片 之间和与电引出线之间的电连接线； 39 锥轴； 40 不同发光色的 LED 发 光条； 41 虚拟多面体。 具体实施方式
下面通过实施例， 并结合附图 1-20， 对本发明的技术方案作进一步 具体的说明。 在说明书中， 相同或相似的附图标号指示相同或相似的部 件。 下述参照附图对本发明实施方式的说明旨在对本发明的总体发明构 思进行解释， 而不应当理解为对本发明的一种限制。
图 1 为根据本发明的一个实施例的 LED芯片 4π出光的高效率 LED 灯泡的结构示意图。 所述 LED芯片 4π出光的高效率 LED灯泡包括一个 透光 LED灯泡壳 1， 一个带有排气管 2和支架的芯柱 5， 至少一条 LED 芯片 4π出光的 LED发光条 6， 一个驱动器 7， 一个电连接器 8， 一个泡 壳和电连接器的连接件 9。 所述透光 LED灯泡壳 1、 芯柱 5、 LED发光 条 6、 驱动器 7、 电连接器 8和连接件 9 相互连接而成一个整体， 作为 LED灯泡 10。 所述 LED发光条 6被用电引出线 3和金属丝 11 固定在芯 柱 5上， 所述 LED发光条的电极经芯柱 5的电引出线 3和 /或金属线 11 与驱动器 7、 （如果需要时设置的） 电连接线 12、 电连接器 8以及外电源 依次相互连接。 接通外电源、 即可点亮 LED发光条 6。 透光 LED灯泡壳 1和芯柱 5真空密封， 构成一个真空密封腔体 13， 所述腔体 13内充有低 粘滞系数高导热率气体， 可把 LED发光条 6工作时产生的热经所述气体 的对流和传导再经透光 LED灯泡壳 1散发掉。
应当理解， 在图 1 中支柱 4、 电引出线 3和金属线 11用作用于固定 LED发光条 6的支架 42。 在本发明的实施例中， 芯柱 5包括组合成一体 的排气管 2、 喇叭管 la、 支架 42 (该支架 42包括电引出线 3、 支柱 4和 金属丝 11 )。 如上所述， 在芯柱 5与 LED灯泡壳 1真空密封时， 具体地 是喇叭管 la与 LED灯泡壳 1 在它们的接合位置处进行真空密封。 如本 领域技术人员所理解地， 本实施例中的芯柱与现有技术中的芯柱的各部 件布置方式基本相同， 因此在此不再进行详细描述。
具体地， 在 LED灯泡壳 1和芯柱 5接合位置处利用高温加热处理把 二者熔封， 构成一个真空密封腔体 13， 其工艺与传统的白炽灯的熔封工 艺相同， 把 LED发光条 6和芯柱 5的支柱 4、 电引出线 3的一端和发光 条 6之间的金属丝 /连接线 11一起密封在真空密封腔体 13 内； 然后经排 气管 2把真空密封腔体 13抽真空后充入低粘滞系数高导热率气体， 再把 排气管 2在封口位置 2a处熔封， 把所述低粘滞系数高导热率气体密封在 真空密封腔体 13 内。 所述真空密封腔体 13 内的低粘滞系数高导热率气 体， 例如为氦气、 氢气、 或氦气与氢气的混合气体， 其气压为在室温下 50-1520 Torr之间的任一值。 氦气是气体中粘滞系数最小的气体， 仅为 116μΡ (氢气为 173μΡ, 空气为 922μΡ， 水为 8937μΡ)， 容易形成有效的 对流散热、 把 LED 发光条工作时产生的热量带走， 以保证 LED 发光条 的正常工作。
由上述可知， 所述真空密封腔体 13内仅包括 LED发光条 6和芯柱 5 的支柱 4、 电引出线 3的一端和发光条 6之间的连接线 /金属丝 11， 所述 LED发光条的两端的电极经芯柱上的电引出线 3与所述真空密封腔体 13 外的驱动器 7、 电连接线 12、 电连接器 8相互依次电连接， 该电连接器 8 用于连接外电源以点亮所述 LED发光条 6。
所述 LED发光条 6被氦气等惰性气体或其它低粘滞系数气体保护且 被真空密封， 因此完全不受周围环境中的水汽等的影响， 使 LED 的寿命 更长。
所述 LED 发光条 6 上有至少一串、 PN 结相同方向地串联连接的
LED芯片， 所述 LED芯片有足够的数量， 使所使用的至少一条 LED发 光条串联或串并联连接后的总驱动电压接近外交流电电压或外 DC 电源 电压， 例如为所用交流电峰值或 DC电源电压的 20%-100%。 故， 由此构 成 LED 芯片 4π 出光的高压 LED 发光条， 驱动器无需变压器， 电路简 单、 效率高、 成本低。
所述至少一条 LED发光条 6可串联或串并联连接， 从而可双向 AC 工作或单向 DC 工作。 图 1 所示为有两条 LED 发光条串联连接成单向 DC工作的例子。
在所述至少一条 LED发光条 6连接成单向 DC工作时， 其外电源可 为 DC电源或 AC电源； 在用外交流电源时、 所述驱动器 7可以由一电容 和电阻并联的降压限流电路和整流滤波电路构成， 也可用整流滤波电路 或整流电路加串联的 PTC 电阻， 无三极管、 无变压器、 也可无电解电容 器； 也可用不带变压器的开关电源和恒流装置， 驱动器成本低。
在所述至少一条 LED发光条 6连接成双向 AC工作时， 可以是至少 一条 LED发光条 6正向导通、 且至少一条另外的 LED发光条 6反向导 通， 交流电的正反向依次交替导通发光。 当然， 也可设置有至少 5 条 LED 发光条 6、 构成类似桥式整流电路， 即 4 条四臂交流电的正反向依 次交替导通发光， 加上一条连接在所述四臂对角上、 交流电正反向都导 通发光。
所述双向 AC 工作时， 可直接用交流市电工作， 或所述驱动器 Ί 仅 为串联连接的限流电阻、 PTC电阻。
所述 LED芯片 4π出光的 LED发光条， 可以为高压 LED发光条且其 高工作电压的工作环境被密封在真空密封的 LED灯泡壳内， 因此， 使得 其安全、 可靠。
所述透光泡壳 1 为透明的、 或为乳白、 磨沙、 有色的泡壳。 当然， 也可以根据需要为部分有反射层的， 或部分有一系列小棱镜、 小透镜的 泡壳。
所述透光泡壳 1 的形状可为 A-型、 G-型、 R-型、 PAR-型、 T-型、 S- 型、 烛型、 P型、 PS型、 BR型、 ER型、 BRL型或其它现有灯泡的泡壳 中的一种。
所述电连接器 8 为 E40、 E27、 E26、 E14、 GU、 B22、 BX、 BA、 EP、 EX、 GY、 GX、 GR、 GZ、 G 型等现有灯泡的电连接器中的一种， 以适合于安装在不同灯座或灯具上。 图 1所示为 E型灯头的例子。
请注意， 在本发明的下述各实施例中使用的与图 1 中示出的参考标 号相同的参考标号， 表示与图 1 显示的实施例中相同的元件或具有相同 功能的元件。 为了简便起见， 不再在下述各实施例中再次对它们进行描 述， 除非它们具有不同的结构或功能。
图 2为根据本发明的另一实施例的 LED芯片 4π出光的高效率 LED 灯泡的结构示意图。 在图 2中， 为了避免一条 LED发光条所发的光经另 一条 LED发光条的阻挡在 LED灯泡壳 1 (以下简称为泡壳 1 ) 或灯具上 产生阴影， 所述各 LED 发光条相互交叉排列， 即各 LED 发光条中的任 何两条都不在同一平面上。 在本实施例中， LED发光条 6具有两条 LED 发光条 6a和 6b， 所述两条发光条 6a和 6b的下端 （靠近排气管 2的一 端） 在图 2 中的同一水平平面 （或设置在同一高度水平） 上， 它们的上 端则被一前一后安装。
图 3为根据本发明的又一实施例的 LED芯片 4π出光的高效率 LED 灯泡的结构示意图。 在其中， 所述泡壳 1 为 PAR型， 在泡壳 1 内壁上具 有光反射层 14， LED发光条 6被固定在芯柱 5上的金属丝 11 和电引出 线 3上。 为提高光出射率， 泡壳 1 的底部设置有光反射板 1½， 用于把 LED发光条 6的射向底部的光反射向前方、 以提高光出射效率。
图 4为根据本发明的又一实施例的 LED芯片 4π出光的高效率 LED 灯泡的结构示意图。 在其中， 所述泡壳 1为 T型泡壳； 至少一条 LED发 光条 6被直接固定在芯柱 5的电引出线 3和 3a上， 与 LED发光条 6上 端连接的电引出线 3a为弯曲的， 以避免 LED发光条 6所发的光经与它 平行的电引出线在泡壳 1 上产生投影暗影。 所述泡壳 1 的内壁上设置有 发光粉层 26a， 所述 LED发光条为不带有发光粉层的 LED发光条； 电连 接器 8与泡壳 1直接连接。 其中需要说明的是， 电引出线 3a可以看作是 用于 LED发光条 6的弯曲的支架。
图 5为根据本发明的又一实施例的 LED芯片 4π出光的高效率 LED 灯泡的结构示意图。 在其中， 所述泡壳 1 为 R型反射泡壳， 在泡壳 1 的 内壁上的光反射层 14; 4条串联连接的 LED发光条 6被用电引出线 3、 芯柱上的金属丝 11a和支柱 4上的金属丝 11连接和固定在芯柱 5上。
图 6为根据本发明的一个实施例的用在 LED芯片 4π出光的高效率 LED灯泡中的 LED发光条 6的正视结构示意图。 所述 LED发光条 6包 括透明基板 15， 在透明基板 15上设置有至少一串、 以 PN相同方向串联 连接的 LED芯片 16， 该 LED芯片 16之间设置的电连接线 17， 透明基 板 15的两端为 LED电极引出线 18及其固定装置 19; 电极引出线 18的 面向 LED芯片 16的一端 20裸露、 以供连接线 21与 LED芯片 16电连 接。
所述透明基板 L5 由玻璃、 硬玻璃、 石英玻璃、 透明陶瓷或塑料等制 成。 LED 发光条 6 的两端的电引出线 18 的固定装置 19 由高^ I胶、 塑 料、 银浆或低熔点玻璃制成。 鉴于本发明的 LED灯泡采用真空密封 LED 灯泡壳与芯柱形成真空密封腔体， 且在该真空密封腔体内充有低粘滞系 数高导热率气体进行快速散热， 所以本发明不需要如现有技术中的 LED 发光条那样仅能采用蓝宝石、 钻石等十分昂贵的透明基板用于承受 LED 发光条产生的高温。 故， 本发明的 LED 发光条 6 的透明基板可以由玻 璃、 硬玻璃、 石英玻璃、 透明陶瓷或塑料等较为廉价的材料制成， 从而 降低了 LED发光条 6的制作成本。
所述安装在透明基板 15 上的串联连接的芯片 16可以是相同或不同 发光色的 LED芯片， 例如为相同的蓝光、 紫外光或其它单色光； 也可以 是不同发光色的， 以得到不同色的混合光或白光； 选用不同数量的多种 发光色的 LED可得到高显色指数的不同色温的白光。
图 7为沿着图 6所示的线 A-A切割的 LED发光条 6的剖面结构示意 图。 如图 7所示， LED芯片 16被用透明胶 22固定在透明基板 15上， 所 述 LED芯片 16的芯片基板是透明的。 所述 LED芯片 16的 PN结 24所 发的光， 朝向电连接线 17方向的光的一部分可以直接出射， 另一部分光 经全反射向透明基板 15 方向的光和原本向透明基板 15 方向的光则经芯 片基板和发光条的透明基板 15 出射。 如图 7 中所示， 从出射光 23 可 知， 所述 LED芯片 16能够 4π出光， 从而大大减少了 ΡΝ结所发的光在 LED芯片 16内的反射、 多次反射、 和吸收所造成的光损失， 进而大大提 高了 LED 芯片的出光率、 提高了外量子效率。 也就是提高了 LED 芯片 的发光效率。 所述透明胶 22例如为环氧树脂、 改性树脂或硅胶等。
图 8为沿图 6所示的线 A-A切割的 LED发光条 6的又一个实施例的 剖面结构示意图。 其中， 所述 LED芯片 16和安装 LED芯片 16的透明 基板 15的一面上有高折射率、 高光透过率、 高导热率透明介质层 25， 以 提高 LED芯片 16的连接线方向的光出射率和保护芯片 16及其的电连接 线 17。 所述透明介质例如为硅胶、 环氧树脂、 塑料等。
当 LED芯片为发蓝光或紫外光、 并需要用发光粉将其转变成白光或 其它发光色时， 图 6、 7 或 8 所示的 LED 发光条 6 外还需要有发光粉 层。 所述发光粉层可以紧贴在 LED发光条 6表面， 或涂覆在 LED发光 条 6 外的透明介质管的内或外壁上， 或把发光粉混合在透明介质管壁内 (例如制成发光粉管）， 也可涂覆在泡壳 1 的内壁上， 如图 4的荧光粉层 26a0
图 9 为具有发光粉层的 LED 发光条的一个实施例的剖面结构示意 图。 在其中， LED芯片 16和透明基板 15的四周的外表面上涂覆有一层 均匀的发光粉层 26。 也就是在图 7所示的 LED发光条的外表面上涂覆上 一层均匀的发光粉层 26。
所述发光粉层 26 由发光粉和透明介质混合制成； 所述透明介质例如 为硅胶、 环氧树脂、 塑料、 透明胶、 透明漆、 高分子聚合物等。
图 10 为具有发光粉层的 LED 发光条的又一个实施例的剖面结构示 意图。 在图 10中， LED芯片 16和透明基板 15的安装芯片的一面上先涂 覆一层透明介质层 25 (如图 8 所示）， 然后再包裹一层均匀的发光粉层 26。
图 11 为具有发光粉层的 LED 发光条的又一个实施例的剖面结构示 意图。 在图 11 中， 所述透明基板 15和其安装 LED芯片 16—面的透明 介质层 25 的四周先涂覆上一层透明介质层 25a， 然后再包裹一层均匀的 发光粉层 26。
图 12 为具有发光粉层的 LED 发光条的又一个实施例的剖面结构示 意图。 在图 12 中， 芯片 16 和透明基板 15 四周先包裹一层透明介质层 25， 然后再包裹一层均匀的发光层 26。
图 13 为具有发光粉层的 LED 发光条的又一个实施例的剖面结构示 意图。 在图 13中， LED芯片 16和透明基板 15四周先包裹一层均匀的发 光粉层 26， 然后再包裹一层透明介质层 25。
此外， 图 6所示的 LED发光条 6外还可增设有一透明管， 用于保护 LED芯片。 当然所述 LED发光条还可以增设发光粉层。 图 14为设置了 外透明管的 LED 发光条的一个实施例的正视结构示意图。 如图 14 所 示， 所述 LED发光条 27包括有一个外透明管 28， 安装有 LED芯片 16 的透明基板 15被密封在透明管 28 内， LED芯片 16的电极由透明管 28 两端的电引出线 29 引出， 电引出线 29 与透明管 28 在密封位置 30密 封。 在图 14中， 所述的 LED芯片 16为两种不同发光色的 LED芯片， 例如， LED芯片 16为发蓝光的， LED芯片 16a为发红光的， 所述不同色 的 LED芯片 16a可用于改变发光色温和显色指数。
图 15为沿着图 14中的线 B-B切割的 LED芯片 4π出光的 LED发光 条 27的结构示意图。 在图 15中， LED芯片 16及其透明基板 15增设有 一透明管 28， 所述透明管由玻璃、 塑料或硅胶等制成。 当发光条 27需要 有发光粉层时， 发光粉可涂覆在所述透明管 28 的内或外壁上。 图 15 示 出了发光粉层 32涂覆在透明管 28的内壁上的例子。
如图 15 所示， 发光粉也可混合在所述透明管 28 的透明介质中， 即 发光粉与透明介质玻璃、 塑料、 硅胶等混合后制成透明发光粉管， 这 样， 透明管 28的内或外壁上就无需再涂覆发光粉层 32。
如图 15所示， 透明管 28与 LED芯片及其透明基板 15之间还可充 有高导热率、 高折射率、 高透光率材料 31， 例如透明硅胶、 环氧树脂和 塑料等。 LED芯片所发的光 4π出光， 由于所述玻璃基板、 透明胶和玻璃 管的光折射率相近， LED 出射光在各介质界面上的光损失很少， 因而 LED芯片的出光率高、 即发光效率高。
图 16为本发明的 LED芯片 4π出光的 LED发光条的又一个实施例 的结构正视示意图。 如图 16所示， 所述 LED芯片 4π出光的 LED发光 条 33 的 LED芯片的芯片基板是透明的。 所述 LED芯片为高压 LED芯 片， 且每个高压 LED 芯片 34 包括有至少两个串联连接的 LED PN 结 35 , 各 PN结之间有至少一条电连接线 36进行连接； 每个高压 LED芯片 的两端各有至少一个用于焊接打线的金属电极 37; 各高压 LED芯片之间 以及高压 LED芯片与高压 LED发光条电引出线 18之间设置至少一条电 连接线 38。
图 16所示的 LED发光条 33的至少一个高压 LED芯片 34可以是相 同或不相同发光色的， 它和图 6和 14所述的 LED发光条一样、 其芯片 一面也可有透明介质层， 且其的发光条 33四周也可设置有发光粉层。
可以理解， 上述 LED芯片 4π出光的 LED发光条 6、 27和 33可用 于制造如图 1、 2、 3、 4和 5所示的 LED灯泡， 也可单独作为一种发光 元件使用。
在用于制造 LED灯泡时， 所述至少一条 LED 发光条的位置可按需 要安排， 例如排列成柱形、 V 形、 W 形、 锥形和平面等， 如图 1、 2、 3、 4和 5所示的排列， 也可如图 17、 18、 19和 20所示的安排， 在需要 避免一条 LED 发光条所发的光经另一条 LED 发光条的阻挡在泡壳上产 生暗影时， 所述至少一条 LED 发光条的各 LED 发光条相互交叉排列， 如图 18 所示， 所述多条 LED 发光条被排列成在虚拟的多面柱体或多面 台柱体的各面的对角线上。 或者说多条 LED 发光条整体上设置成多面柱 体或多面台柱体的实体形式， 各 LED 发光条都不在同一平面上。 图 18 所示为 4条 LED发光条排列成方柱体形式， 且分别处于图 18的虚线 41 所示的四个面的对角线上。
所用的发光条 6、 27和 33可以是相同或不同发光色的， 以得到不同 发光色的、 不同色温和不同显色指数的灯。 例如如图 17所示， 4条 LED 芯片发蓝光的和涂覆有可被蓝激发产生黄光的发光粉层的发光条 6、 27 或 33， 围绕它们之间的锥轴 39 排列成锥形， 同时还有一条发其它色的 LED发光条 40, 所述 LED发光条 40例如为发红光的， 改变两者的相对 光通量、 即可获得不同色温和显色指数的白光 LED灯泡。
虽然本总体发明构思的一些实施例己被显示和说明， 本领域普通技 术人员将理解， 在不背离本总体发明构思的原则和精神的情况下， 可对 这些实施例做出改变， 本发明的范围以权利要求和它们的等同物限定。

Claims

权 利 要 求
1. 一种 LED灯泡， 包括：
LED灯泡壳、 带有排气管和支架的芯柱、 至少一个 LED芯片 4 π出 光的 LED 发光条、 驱动器、 电连接器， 其中所述 LED 灯泡壳与芯柱真 空密封以形成真空密封腔体， 所述真空密封腔体内充有低粘滞系数高导 热率气体， 支架和固定在支架上的所述 LED发光条容纳在所述真空密封 腔体内， 所述 LED发光条与所述驱动器、 电连接器依次电连接， 所述电 连接器用于与外电源电连接以点亮 LED发光条。
2. 根据权利要求 1所述的 LED灯泡， 其中， 所述 LED灯泡壳是透 光的， 且直接或通过连接件与所述电连接器连接。
3. 根据权利要求 1所述的 LED灯泡， 其中， 所述芯柱的支架包括电 引出线、 支柱和用于固定所述 LED 发光条的金属丝， 所述 LED 发光条 的两端的电极经所述电引出线与所述真空密封腔体外的驱动器、 电连接 器依次电连接。
4. 根据权利要求 1所述的 LED灯泡， 其中， 所述低粘滞系数高导热 率气体包括氦气、 氢气或氦气与氢气的混合气体， 且在室温下所述低粘 滞系数高导热率气体的气体压力为 50-1520 Torr。
5. 根据权利要求 1所述的 LED灯泡， 其中， 所述至少一条 LED发 光条中的每一条 LED发光条具有至少一串以 PN结相同方向串联连接的
LED芯片， 所述 LED芯片有足够的数量， 使所述 LED发光条串联或串 并联连接后， 其总驱动电压接近外驱动电压。
6. 根据权利要求 5所述的 LED灯泡， 其中， 所述总驱动电压为交流 电峰值或 DC电源电压的 20%-100%。
7. 根据权利要求 1所述的 LED灯泡， 其中， 所述 LED发光条为至 少两条 LED发光条， 且被连接成双向 AC工作， 其中至少一条 LED发光 条正方向导通且至少一条另外的 LED 发光条反向导通， 交流电的正反向 依次使得所述 LED发光条交替导通发光。
8. 根据权利要求 1 所述的 LED灯泡， 其中， 所述的至少一条 LED 发光条连接成单向 DC工作。
9. 根据权利要求 1 所述的 LED灯泡， 其中， 所述 LED发光条被相 互串联或串并联连接； 发光条的排列的方式为 V形、 W形、 柱形、 锥形 或平面形式。
10. 根据权利要求 1所述的 LED灯泡， 其中， 所述 LED发光条的各 LED发光条相互交叉排列， 使得各 LED发光条中的任何两条都不在同一 平面上， 以避免所述一条 LED 发光条所发的光经另一条 LED 发光条的 阻挡在 LED灯泡壳上产生暗影。
11. 根据权利要求 1或 10所述的 LED灯泡， 其中， 所述 LED发光 条的各 LED 发光条相互交叉被设置成处于虚拟的多面柱体或多面台柱体 的各面的对角线上。
12. 根据权利要求 1所述的 LED灯泡， 其中， 所述 LED灯泡壳为透 明、 乳白、 磨沙或有色的泡壳、 或者为部分有反射层的或部分有一系列 小棱镜、 小透镜的泡壳； 所述 LED灯泡壳的形状为 A-型、 G-型、 R-型、 PAR-型、 型、 烛型、 P型、 PS型、 BR型、 ER型或 BRL型。
13. 根据权利要求 1所述的 LED灯泡， 其中， 所述 LED灯泡壳的靠 近所述电连接器的一端还设置有光反射板。
14. 根据权利要求 1 所述的 LED 灯泡， 其中， 所述电连接器为
E40、 E27、 E26、 E14、 GU、 BX、 BA、 EP、 EX、 GY、 GX、 GR、 GZ、
G型灯泡的电连接器中的一种。
15. 根据权利要求 1所述的 LED灯泡， 其中， 所述 LED芯片 4 π出 光的 LED 发光条包括透明基板和在安装在所述透明基板上的至少一串、 以相同 PN结方向串联连接的 LED芯片， 所述 LED芯片具有透明的芯片 基板。
16. 根据权利要求 15所述的 LED发光条， 还包括设置在所述透明基 板的两端的 LED芯片的电极引出装置。
17. 根据权利要求 15所述的 LED发光条， 其中， 所述 LED芯片通 过透明胶相互分立地固定在所述透明基板上， 所述 LED 发光条的透明基 板由软玻璃、 硬玻璃、 石英玻璃、 透明陶瓷或塑料制成。
18. 根据权利要求 16所述的 LED发光条， 还包括将电极引出装置固 定在所述透明基板的两端的固定装置， 所述固定装置由高温胶、 塑料、 银浆或低熔点玻璃制成。
19. 根据权利要求 15所述的 LED发光条， 其中， 所述 LED芯片为 相同或不同发光色的 LED芯片。
20. 根据权利要求 15所述的 LED发光条， 其中， 所述 LED芯片为 蓝光或紫外光 LED芯片、 红蓝绿三基色 LED芯片或多基色 LED芯片。
21. 根据权利要求 15所述的 LED发光条， 其中， 所述 LED芯片的 一部分为蓝光 LED芯片而其的另一部分为红光 LED芯片。
22. 根据权利要求 20或 21所述的 LED发光条， 还包括： 所述 LED 芯片和安装所述 LED芯片的透明基板的四周设置的发光粉层。
23. 根据权利要求 20或 21所述的 LED发光条， 还包括： 在所述透 明基板的安装了 LED 芯片的表面和所述 LED 芯片上设置的第一透明介 质层。
24. 根据权利要求 23所述的 LED发光条， 还包括： 在所述透明介质 层和安装所述 LED芯片的透明基板的四周设置的发光粉层。
25. 根据权利要求 23所述的 LED发光条， 还包括： 在所述第一透明 介质层和安装所述 LED芯片的透明基板的四周依次设置的另一透明介质 层和发光粉层。
26. 根据权利要求 20 或 21 所述的 LED 发光条， 还包括： 在所述 LED芯片和安装了 LED芯片的透明基板的四周依次设置的透明介质层和 发光粉层。
27. 根据权利要求 20 或 21 所述的 LED 发光条， 还包括： 在所述 LED芯片和安装所述 LED芯片的透明基板的四周依次设置的发光粉层和 透明介质层。
28. 根据权利要求 .22-27 中任一项所述的 LED发光条， 其中， 所述 发光粉层由发光粉和透明介质混合制成， 所述透明介质包括硅胶、 环氧 树脂、 塑料、 透明胶、 透明漆和聚合物中的任一种或其的组合。
29. 根据权利要求 15所述的 LED发光条， 其中， 所述 LED芯片和 透明基板的最外面由透明管包封。
30. 根据权利要求 29所述的 LED发光条， 其中， 所述透明管的内壁 或外壁上设置有发光粉层。
3 1 . 根据权利要求 29 所述的 LED 发光条， 其中， 所述透明管为玻 璃、 塑料或硅胶。
32. 根据权利要求 15所述的 LED发光条， 其中， 所述 LED芯片和 透明基板的最外面由透明发光粉管包封。
33. 根据权利要求 29所述的 LED发光条， 其中， 所述透明管与所述
LED 芯片和透明基板之间还包括高透光率、 高导热率、 高折射率介质， 所述高透光率、 高导热率、 高折射率介质包括透明硅胶、 环氧树脂或塑 料。
34. 根据权利要求 22或 23所述的 LED发光条， 其中所述 LED芯片 为高压 LED芯片， 每个高压 LED芯片包括至少两个串联连接的 LED PN o
35. 一种 LED芯片 4 π出光的 LED发光条， 所述 LED发光条包括透 明基板和在所述透明基板上的至少一串、 以相同 PN 结方向串联连接的 LED芯片， 所述 LED芯片具有透明的芯片基板， 所述 LED芯片电极由 设置在透明基板的两端的 LED芯片的电极引出装置引出， 其中所述透明 基板由软玻璃、 硬玻璃、 石英玻璃、 透明陶瓷或塑料制成。
36. 一种 LED芯片 4 π出光的 LED发光条， 所述 LED发光条包括透 明基板和在所述透明基板上的至少一串、 以相同 PN 结方向串联连接的 LED芯片， 所述 LED芯片具有透明的芯片基板， 所述 LED芯片电极由 设置在透明基板的两端的 LED芯片的电极引出装置引出， 其中所述 LED 芯片的一部分为蓝光 LED 芯片而其的另一部分为红光 LED 芯片， 所述 LED芯片和安装所述 LED芯片的透明基板的四周设置有发光粉层， 用于 将所述 LED芯片发出的部分蓝光转变成黄光， 另一部分蓝光和所述黄光 及红光混合成白光、 高显色指数白光或其它颜色的光。
37. 一种 LED芯片 4 π出光的 LED发光条， 所述 LED发光条包括透 明基板和在所述透明基板上的至少一串、 以相同 PN 结方向串联连接的 LED芯片， 所述 LED芯片具有透明的芯片基板， 所述 LED芯片电极由 设置在透明基板的两端的 LED 芯片的电极引出装置引出， 所述 LED 芯 片和透明基板的最外面由透明管或透明发光粉管包封。
38. 根据权利要求 37所述的 LED芯片 4 π出光的 LED发光条， 其 中所述透明管的内壁或外壁上设置有发光粉层。
39. 一种 LED芯片 4！出光的 LED发光条， 所述 LED发光条包括透 明基板和在所述透明基板上的至少一串、 以相同 PN 结方向串联连接的 LED芯片， 所述 LED芯片具有透明的芯片基板， 所述 LED芯片电极由 设置在透明基板的两端的 LED 芯片的电极引出装置引出， 其中 LED 芯 片为芯片基板是透明的高压 LED 芯片， 所述每个高压 LED 芯片包括至 少两个串联连接的 LED P-N结。
40. 根据权利要求 39所述的 LED芯片 4 π出光的 LED发光条， 其 中各 LED PN结之间有至少一条电连接线， 每个高压 LED芯片的两端各 有至少一个用于悍接打线的金属电极； 各高压 LED 芯片之间以及高压 LED芯片与高压 LED发光条的电引出线之间有至少一条电连接线。
PCT/CN2011/079234 2010-09-08 2011-09-01 LED灯泡及能够4π出光的LED发光条 WO2012031533A1 (zh)

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KR1020137008659A KR101510462B1 (ko) 2010-09-08 2011-09-01 Ｌｅｄ 램프 벌브 및 4π 출광 가능한 ｌｅｄ 발광봉
SG2013017678A SG188483A1 (en) 2010-09-08 2011-09-01 Led light bulb and led light-emitting strip being capable of emitting 4pi light
DK11823056.4T DK2535640T4 (da) 2010-09-08 2011-09-01 LED-pære og LED-belysningsliste til udsendelse af lys over 4 PI
BR112013005707-6A BR112013005707B1 (pt) 2010-09-08 2011-09-01 Lâmpada de led
EP11823056.4A EP2535640B2 (en) 2010-09-08 2011-09-01 Led lamp bulb and led lighting bar capable of emitting light over 4 pi
CA2810658A CA2810658C (en) 2010-09-08 2011-09-01 Led light bulb and led light-emitting strip being capable of emitting 4.pi. light
RU2013114922/12A RU2546469C2 (ru) 2010-09-08 2011-09-01 Светодиодная лампа
ES11823056T ES2531050T5 (es) 2010-09-08 2011-09-01 Bombilla LED y barra de iluminación LED capaz de emitir luz por encima de 4 PI
PL11823056T PL2535640T5 (pl) 2010-09-08 2011-09-01 Żarówka lampy LED i pasek LED emitujący światło z możliwością emitowania światła w zakresie kątowym ponad 4 PI
AU2011300999A AU2011300999B2 (en) 2010-09-08 2011-09-01 LED lamp bulb and LED lighting bar capable of emitting light over 4pi
JP2013500328A JP5689524B2 (ja) 2010-09-08 2011-09-01 ＬＥＤ電球及び４π出光可能なＬＥＤ発光ストリップ
US13/408,936 US9261242B2 (en) 2010-09-08 2012-02-29 LED light bulb and LED light-emitting strip being capable of emitting 4TT light
HK12113243.4A HK1174089A1 (zh) 2010-09-08 2012-12-21 燈泡及能夠 π出光的 發光條

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CN2010102787600A CN101968181B (zh) 2010-09-08 2010-09-08 一种高效率led灯泡
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CN2010206174061U CN201944638U (zh) 2010-11-22 2010-11-22 一种可直接替换白炽灯用于感应灯的led灯泡
CN201020685204.0 2010-12-29
CN2010206852040U CN201944605U (zh) 2010-12-29 2010-12-29 一种P-N结4π出光的高压LED构成的LED灯泡
CN2010106100927A CN102109115B (zh) 2010-12-29 2010-12-29 一种P-N结4π出光的高压LED及LED灯泡
CN201010610092.7 2010-12-29
CN2011201481956U CN202281057U (zh) 2011-05-11 2011-05-11 一种LED芯片4π出光的高效率LED发光管
CN201120148206U CN202132734U (zh) 2011-05-11 2011-05-11 一种高显色指数高效率led灯泡
CN201120148195.6 2011-05-11
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CN2011203196519U CN202281062U (zh) 2011-08-29 2011-08-29 一种LED芯片4π出光的高显色指数LED灯泡
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PL2535640T5 (pl) 2021-01-25
PL2535640T3 (pl) 2015-04-30
PT2535640E (pt) 2015-02-27
BR112013005707A2 (pt) 2017-03-14
CA2810658A1 (en) 2012-03-15
DE202011110805U1 (de) 2016-07-14
HK1174089A1 (zh) 2013-05-31
EP2535640A4 (en) 2013-11-20
AU2011300999A1 (en) 2013-05-02
US9261242B2 (en) 2016-02-16
CA2810658C (en) 2015-02-10
BR112013005707B1 (pt) 2021-03-30
MY163977A (en) 2017-11-15
DK2535640T4 (da) 2020-09-28
EP2535640B1 (en) 2015-02-18
US20130058080A1 (en) 2013-03-07
ES2531050T5 (es) 2021-05-04
RU2013114922A (ru) 2014-10-20
EP2535640A1 (en) 2012-12-19
KR101510462B1 (ko) 2015-04-08
AU2011300999B2 (en) 2014-12-18
JP2013522850A (ja) 2013-06-13
DK2535640T3 (en) 2015-03-30
ES2531050T3 (es) 2015-03-10
SG188483A1 (en) 2013-04-30
JP5689524B2 (ja) 2015-03-25

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