WO2015081804A1 - 一种螺旋形led灯丝及应用该螺旋形led灯丝的灯泡 - Google Patents

一种螺旋形led灯丝及应用该螺旋形led灯丝的灯泡 Download PDF

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Publication number
WO2015081804A1
WO2015081804A1 PCT/CN2014/092330 CN2014092330W WO2015081804A1 WO 2015081804 A1 WO2015081804 A1 WO 2015081804A1 CN 2014092330 W CN2014092330 W CN 2014092330W WO 2015081804 A1 WO2015081804 A1 WO 2015081804A1
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Prior art keywords
spiral
substrate
led
led filament
bulb
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PCT/CN2014/092330
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English (en)
French (fr)
Inventor
张晓峰
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张晓峰
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Publication date
Priority claimed from CN201310639668.6A external-priority patent/CN103700652A/zh
Priority claimed from CN201320777826.XU external-priority patent/CN203656627U/zh
Application filed by 张晓峰 filed Critical 张晓峰
Priority to PL14867456T priority Critical patent/PL3065174T3/pl
Priority to US15/039,739 priority patent/US10066791B2/en
Priority to EP14867456.7A priority patent/EP3065174B1/en
Priority to ES14867456T priority patent/ES2732705T3/es
Priority to JP2016536876A priority patent/JP2016539480A/ja
Publication of WO2015081804A1 publication Critical patent/WO2015081804A1/zh

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/237—Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/005—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to an LED package filament and a bulb, in particular to a spiral LED package light strip instead of an incandescent tungsten filament, and a bulb using the spiral filament, belonging to the field of general illumination and decorative illumination.
  • the LED package forms are generally as follows: Lamp-LED (vertical LED), SMD-LED (surface mount LED), Side-LED (side-emitting LED), TOP-LED (top-emitting LED) High-Power-LED (High Power LED), Flip Chip-LED (Flip Chip LED), the above-mentioned several package forms are basically point-type package forms, and the disadvantage is that the light perception is discontinuous during application. Insufficient light design, can not be multi-angle, multi-level lighting.
  • bulb-shaped LED lamps mostly consist of multiple LEDs, a metal-based circuit board (MPCB), a heat sink with a series of heat-dissipating fins, and a The switching power supply and the constant current device driver and its outer casing, an anti-glare bulb and an electrical connector are formed.
  • MPCB metal-based circuit board
  • the illumination angle of such lamps is limited by the heat sink, and the illumination angle affects many applications in application.
  • the other is an LED filament bulb lamp, which is a method of solid-crystal bonding a plurality of LED chips on a linear strip-shaped transparent substrate, and coating a phosphor luminescent material around the periphery to form a 4 ⁇ solid angle illuminating. Then, at least one straight strip of LED filament is connected to the stem conductor in the bulb, and after sealing, the circuit driver is used to complete the whole lamp.
  • the light-emitting form of the lamp is close to that of a tungsten filament lamp, but the current manufacturing process is relatively complicated and the production efficiency is underground.
  • the whole lamp illumination angle claims 4 rows of illumination, because the strip-shaped linear LED package has no light at both ends, although it can be arranged by a certain rotation angle, the effect improvement is limited. It is easy to cause the dark area of the light at the top of the bulb, and the light distribution curve cannot meet the requirements.
  • the technical problem to be solved by the present invention is to provide a spiral LED package filament for the above problems, so that the LED can be multi-angle and multi-level stereo illumination on the spiral body, providing a more comprehensive illumination source and providing a spiral.
  • the LED bulb of the LED filament enables the LED to be multi-angle and multi-layered in the spiral body to provide a more comprehensive illumination source.
  • a spiral LED package filament comprising a substrate, wherein the substrate is provided with at least one set of LED chips connected in series or in parallel, and the surface of the substrate and the LED chip is coated with a dielectric layer having a function of protecting or emitting light, and the electrodes of the LED chip are The electrode lead wires at the two ends of the substrate are taken out, and the substrate is formed into a three-dimensional spiral shape.
  • the filament substrate is a conical spiral or an isosceles.
  • the LED chip is fixed on the substrate with a transparent adhesive and/or a conductive paste.
  • the transparent adhesive and/or conductive adhesive are one of a silica gel, a modified resin adhesive, an epoxy resin adhesive, a silver adhesive, and a copper adhesive.
  • the material of the substrate is one of metal, plexiglass, plastic, and silica gel having secondary molding ability.
  • the illuminating colors of the LED chips are identical, partially identical or completely different.
  • the material of the dielectric layer is one of silica gel, epoxy resin glue and LED luminescent powder.
  • the electrical lead wires at the two ends of the spiral LED package filament are fixed on both ends of the substrate by glue, ceramic glue, low melting point glass, silver paste or plastic, and the connecting members of the electrode lead wires and the two ends of the substrate are provided with connecting members.
  • a bulb for applying the spiral LED filament comprises a light-transmitting bulb, wherein the light-transmissive bulb is provided with a core column with a column column rod, an electric lead wire and a core column exhaust pipe, characterized in that: at least one piece The spiral LED filament is fixed on the stem, and the electrode lead wire is connected to the electrical connector through a driver, and the light-transmitting bulb and the stem are sealed.
  • a bulb plastic component is disposed between the light transmissive bulb and the electrical connector.
  • the spiral LED filament comprises a substrate, and the substrate is provided with at least one set of LED chips connected in series or in parallel.
  • the surface of the substrate and the LED chip is coated with a dielectric layer having a function of protecting or emitting light, and the electrodes of the LED chip are composed of two substrates.
  • the electrode lead wires of the ends are taken out, and the substrate is formed into a three-dimensional spiral shape.
  • the filament substrate is a conical spiral or an isosceles.
  • the LED chip is fixed on the substrate with a transparent adhesive and/or a conductive adhesive;
  • the transparent adhesive and/or the conductive adhesive is one of a silica gel, a modified resin adhesive, an epoxy resin adhesive, a silver adhesive, and a copper adhesive.
  • the material of the substrate is one of metal, plexiglass, plastic, and silica gel having secondary molding ability.
  • the illuminating colors of the LED chips are identical, partially identical or completely different.
  • the material of the dielectric layer is one of silica gel, epoxy resin glue and LED luminescent powder.
  • the electrode lead wires at both ends of the spiral LED filament are fixed on both ends of the substrate by glue, ceramic glue, low-melting glass, silver paste or plastic, and a connecting member is arranged at the joint between the electrode lead wire and the substrate.
  • the at least one spiral LED filament may be connected to work in two-phase AC or one-way DC; when the at least one spiral LED filament is connected to work in one-way DC, it may be operated by an external DC power source or an AC power source.
  • the light-transmissive bulb is transparent, or is a milky white, frosted, colored bulb, and may also be a bulb partially having a reflective layer or partially having a series of small prisms and small lenses.
  • the shape of the light transmissive bulb may be one of A-type, G-type, R-type, PAR-type, T-type, candle type or other existing bulbs.
  • the electrical connector is one of electrical connectors of existing bulbs such as E40, E27, E26, E14, GU, and the like.
  • the invention has the beneficial effects that the discontinuous light perception of the dot package is overcome in comparison with the prior art, and the shortcoming of the light distribution design of the linear package in application is overcome, and the LED can be multi-angled on the spiral body. Multi-level stereo illumination.
  • the invention can improve the light distribution design of the lamp during the application process, and at the same time simplify the application process.
  • FIG. 1 is a schematic structural view of an embodiment of a spiral LED package filament according to the present invention.
  • Figure 1-1 is a front view of Figure 1.
  • Figure 1-2 is a side view of Figure 1.
  • FIG. 2 is a schematic structural view of still another embodiment of a spiral LED package filament according to the present invention.
  • Figure 2-1 is a front view of Figure 2.
  • Figure 2-2 is a side view of Figure 2.
  • FIG. 3 is a top plan internal structure view of FIG. 1.
  • 3A is a cross-sectional view taken along line A of FIG. 3.
  • FIG. 4 is a schematic view showing the structure of a bulb using a spiral LED filament according to the present invention.
  • Fig. 5 is a structural schematic view showing still another embodiment of a bulb using a spiral LED filament according to the present invention.
  • Fig. 6 is a schematic view showing the structure of still another embodiment of a bulb using a spiral LED filament according to the present invention.
  • Figure 7 is a schematic view showing the structure of still another embodiment of a bulb using a spiral LED filament according to the present invention.
  • Figure 8 is a schematic view showing the structure of still another embodiment of a bulb using a spiral LED filament according to the present invention.
  • Figure 9 is a schematic view showing the structure of still another embodiment of a bulb using a spiral LED filament according to the present invention.
  • the spiral LED filament of the present invention comprises a substrate 2, and the substrate 2 is provided with a plurality of LED chips 5, which are made of transparent glue, conductive adhesive such as silica gel, modified resin or epoxy resin. Or silver glue or copper glue is fixed on the substrate 2, and each LED chip is connected in series or in parallel through the chip electrical connection line 6.
  • the surface of the substrate and the LED chip is coated with a dielectric layer 3 having a function of protecting or emitting light.
  • the electrodes of the LED chip 5 are taken out by the electrode lead wires 1 at both ends of the substrate 2.
  • the electrode lead wires 1 and the substrate 2 are fixed on both ends of the substrate 2 by glue, ceramic glue, low-melting glass, silver paste or plastic, and the electrode lead wires 1 and the substrate 2 Connecting members 4 are provided at the joints at both ends.
  • the substrate 2 of the spiral LED package filament is not limited to metal, plexiglass, PVC, plastic or silica gel.
  • the substrate 2 has two manufacturing methods. One is firstly packaged by a planar LED chip. After the package is completed, the packaged filament is stretched, pressed, molded, anchored, etc., and then formed into a spiral body. As shown in Figure 1. The other is to first form a spiral and then perform a three-dimensional LED package.
  • the illuminating colors of the series or parallel LED chips 5 mounted on the substrate 2 are identical, partially identical or not at all with.
  • the LED chips are LED chips of the same or different illuminating colors, for example, the same blue light, ultraviolet light or other monochromatic light; or different illuminating colors to obtain mixed light of different colors; and different numbers of multiple luminescent colors are selected.
  • the LED also gives a white light with a high color rendering index.
  • FIG. 1-1 and 1-2 are front and side views of Fig. 1 showing the structure of an embodiment of a spiral LED package filament in which the relationship between the members is seen from different angles.
  • 3 is a top plan internal structural view of a structure 1 of a spiral LED package filament according to the present invention.
  • 3A is a cross-sectional view taken along line A of FIG. 3.
  • the dielectric layer 3 is a dielectric layer having a protective or illuminating function coated on the surface of the substrate and the chip of the spiral LED package filament, and the material thereof is silica gel or epoxy resin, and may also be a luminescent powder of LED.
  • FIG. 1 is a schematic structural view of an embodiment of a spiral LED package filament according to the present invention. It is characterized in that the filament is a conical spiral.
  • FIG. 2 is a schematic structural view of still another embodiment of a spiral LED package filament according to the present invention. It is characterized in that the filaments are up and down (or left and right) as an isosceles spiral. The way to accomplish this is to first perform a linear linear LED package, and after the package is completed, it is spirally shaped by a mold.
  • 2-1 and 2-2 are front and side views of the first embodiment of the present invention, showing the structure of a spiral LED package filament according to still another embodiment of the present invention. .
  • the bulb for applying the spiral LED filament of the present invention comprises a light transmissive bulb 21, and the core bulb support rod 23, the electric lead wire 24 and the core are arranged in the light transmissive bulb 21.
  • the stem of the column exhaust pipe 26, at least one spiral LED filament is fixed on the stem support rod 23 by a fixing wire 25, and the electrode lead wire 1 passes through the electric lead wire 24, the driver 29, the driver electrical lead 28 and the electric
  • the connector 30 is connected to connect the external power source, and the external power source is turned on to illuminate the spiral LED filament 22; the light-transmitting bulb 21 and the core post rod 23, the electric lead wire 24, and the stem exhaust pipe 26 The stem is sealed.
  • the substrate 2 of the spiral LED package filament is not limited to metal, plexiglass, PVC, plastic or silica gel.
  • the substrate 2 has two manufacturing methods. One is firstly packaged by a planar LED chip. After the package is completed, the packaged filament is subjected to stretching, pressing, mold forming, anchoring, etc. to form a three-dimensional shape into a spiral body. The other is to first form a spiral, and then perform a three-dimensional LED package, which is formed by the stem support and positioned on the stem.
  • a bulb plastic component 27 is disposed between the light transmissive bulb 21 and the electrical connector 30.
  • the material of the light-transmissive bulb 21 is transparent, or is a milky white, frosted, colored bulb, and may also be a bulb partially having a reflective layer or partially having a series of small prisms and small lenses.
  • the shape of the light-transmitting bulb 1 is one of A-type, G-type, R-type, PAR-type, T-type, candle type or other existing bulbs.
  • the electrical connector 10 is one of the electrical connectors of an existing bulb such as E40, E27, E26, E14, GU, and the like.
  • the spiral LED filament 2 can be connected for bidirectional AC operation or unidirectional DC operation.
  • the spiral LED filament 2 When the spiral LED filament 2 is connected to work in one-way DC, it can be operated by an external DC power source or an AC power source; when an external AC power source is used, the driver can be connected by a capacitor and a resistor in parallel with a step-down current limiting circuit and rectification filtering.
  • the circuit structure has simple driver circuit, low cost, no electrolytic capacitor, no triode, no transformer, no high frequency radiation, and can also be a switching power supply and a constant current device.
  • the shape of the LED filament is a conical spiral, and the bulb of the bulb is E-shaped.
  • the shape of the spiral LED filament 22 is different from that of FIG.
  • the shape of the spiral LED filament 22 is different from that of FIGS. 4 and 5.
  • the light-transmissive bulb 21 is a kind of a series of shapes of an antique lamp, also called a classical lamp, and the bulb plastic component 27 is omitted, and the spiral LED filament 22 has an isosceles shape.
  • the spiral LED filament 22 has an isosceles shape and is laterally arranged.
  • the LED filament is composed of two spiral LED filaments 22 to form a double helix.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

一种螺旋形LED灯丝（22），包括基板（2），所述基板（2）上设有至少一组串联或并联的LED芯片（5），基板（2）和LED芯片（5）表面涂覆有一层具有保护或发光功能的介质层（3），LED芯片（5）的电极由基板（2）两端的电极引出线（1）引出，所述基板（2）被整形成三维螺旋形状；所述基板（2）为锥形螺旋体或等圆螺旋体。一种应用上述螺旋形LED灯丝（22）的灯泡，包括透光泡壳（21），该透光泡壳（21）内设有带芯柱支架杆（23）、电引出线（24）和芯柱排气管（26）的芯柱，至少一条螺旋形LED灯丝（22）被固定在芯柱上，其电极引出线（1）通过驱动器（29）与电连接器（30）相连，所述透光泡壳（21）和芯柱进行密封。

Description

一种螺旋形LED灯丝及应用该螺旋形LED灯丝的灯泡 技术领域
本发明涉及的是一种LED封装灯丝及灯泡，特别是一种螺旋形LED封装发光条替代白炽灯钨丝，及应用该螺旋形灯丝的灯泡，属于通用照明及装饰照明领域。
背景技术
现有技术中，LED的封装形式通常有如下几种：Lamp-LED(垂直LED)、SMD-LED(表面贴装LED)、Side-LED(侧发光LED)、TOP-LED(顶部发光LED)、High-Power-LED(高功率LED)、Flip Chip-LED(覆晶LED)，以上所述的几种封装形式基本上是点式的封装形式，其缺点是在应用时光感不连续，配光设计不足，无法多角度、多层次发光。
目前，灯泡形LED灯有两种主要的解决方案，其一：灯泡形LED灯大多由多个LED、一块金属基电路板(MPCB)、一个带有一系列散热鳍片的散热器、一个包括有开关电源和恒流装置的驱动器及其外壳、一个防炫光泡壳和一个电连接器组成。目前，这类灯发光角度受到散热器的限制，在应用时发光角度影响了很多应用场合。
另外一种是LED灯丝球泡灯，它是一种将复数颗LED芯片固晶打线在一种直线条状透明基板上，并在其周边包覆荧光粉发光材料，形成4π立体角发光。然后将至少一根直线条状的LED灯丝连接在球泡内的芯柱导线上，封口排气后加上电路驱动器完成整灯。该灯的发光形式接近于钨丝灯，但目前制作工艺比较复杂，生产效率地下。虽然其整灯发光角度宣称4排发光，但是因为条状线性LED封装两端无出光，虽然可以通过一定的旋转角度排列，但效果改善有限。容易造成球泡顶部的发光暗区，配光曲线不能符合要求。
发明内容
本发明要解决的技术问题是：针对上述存在的问题提供一种螺旋形LED封装灯丝，使其LED能在螺旋体上多角度、多层次立体发光，提供更加全面的照明光源，同时提供一种螺旋形LED灯丝的灯泡，使LED在螺旋体上能多角度、多层次立体发光，提供更加全面的照明光源。
本发明采用的技术方案是：
一种螺旋形LED封装灯丝，包括基板，所述基板上设有至少一组串联或并联的LED芯片，基板和LED芯片表面涂覆有一层具有保护或发光功能的介质层，LED芯片的电极由基板二端的电极引出线引出，所述基板被整形成三维螺旋形状。
所述灯丝基板为锥形螺旋体或等圆螺旋体。
所述LED芯片用透明胶和/或导电胶固定在基板上。
所述透明胶和/导电胶为硅胶、改性树脂胶、环氧树脂胶、银胶和粘铜胶中的一种。
所述基板的材料为具有二次成型能力的金属、有机玻璃、塑料和硅胶中的一种。
所述LED芯片的发光色完全相同、部分相同或完全不同。
所述介质层的材料为硅胶、环氧树脂胶和LED发光粉胶中的一种。
所述螺旋形LED封装灯丝两端的电引出线通过胶水、陶瓷胶、低熔点玻璃、银浆或塑料固定在基板两端，电极引出线与基板两端连接处设有连接构件。
一种应用该螺旋形LED灯丝的灯泡，包括透光泡壳，该透光泡壳内设有带芯柱支架杆、电引出线和芯柱排气管的芯柱，其特征在于：至少一条螺旋形LED灯丝被固定在芯柱上，其电极引出线通过驱动器与电连接器相连，所述透光泡壳和芯柱进行密封。
所述透光泡壳和电连接器之间设有灯泡塑料组件。
所述螺旋形LED灯丝包括基板，所述基板上设有至少一组串联或并联的LED芯片，基板和LED芯片表面涂覆有一层具有保护或发光功能的介质层，LED芯片的电极由基板两端的电极引出线引出，所述基板被整形成三维螺旋形状。
所述灯丝基板为锥形螺旋体或等圆螺旋体。
所述LED芯片用透明胶和/或导电胶固定在基板上；所述透明胶和/或导电胶为硅胶、改性树脂胶、环氧树脂胶、银胶和粘铜胶中的一种。
所述基板的材料为具有二次成型能力的金属、有机玻璃、塑料和硅胶中的一种。
所述LED芯片的发光色完全相同、部分相同或完全不同。
所述介质层的材料为硅胶、环氧树脂胶和LED发光粉胶中的一种。
所述螺旋形LED灯丝两端的电极引出线通过胶水、陶瓷胶、低熔点玻璃、银浆或塑料固定在基板两端，电极引出线与基板两端连接处设有连接构件。
所述至少一条螺旋形LED灯丝可连接成双相AC工作或单向DC工作；所述至少一条螺旋形LED灯丝连接成单向DC工作时，可用外DC电源或交流电源工作。
所述透光泡壳为透明的、或为乳白、磨沙、有色的泡壳，也可为部分有反射层的，或部分有一系列小棱镜、小透镜的泡壳。
所述透光泡壳的形状可为A-型、G-型、R-型、PAR-型、T-型、烛型或其它现有灯泡的泡壳中的一种。
所述电连接器为E40、E27、E26、E14、GU等现有灯泡的电连接器中的一种。
本发明的有益效果是：与现有技术相比，克服了点式封装在应用时不连续的光感，克服了直线形封装在应用时配光设计的不足，LED在螺旋体上可多角度、多层次立体发光。本发明能在应用过程中改善灯具的配光设计，同时可简化应用工艺。
附图说明
图1为本发明一种螺旋形LED封装灯丝的一个实施例的结构示意图。
图1-1为图1的前视图。
图1-2为图1的侧视图。
图2为本发明一种螺旋形LED封装灯丝的又一个实施例的结构示意图。
图2-1为图2的前视图。
图2-2为图2的侧视图。
图3为图1的顶视内部结构图。
图3A为图3的A处剖面图。
图4为本发明使用螺旋形LED灯丝的灯泡结构示意图。
图5为本发明使用螺旋形LED灯丝的灯泡的又一个实施例的结构示意图。
图6为本发明使用螺旋形LED灯丝的灯泡的又一个实施例的结构示意图。
图7为本发明使用螺旋形LED灯丝的灯泡的又一个实施例的结构示意图。
图8为本发明使用螺旋形LED灯丝的灯泡的又一个实施例的结构示意图。
图9为本发明使用螺旋形LED灯丝的灯泡的又一个实施例的结构示意图。
附图标记：1、电极引出线；2、基板；3、介质层；4、连接构件；5、芯片；6、芯片电连接线；21、透光泡壳；22、螺旋形LED灯丝；23、芯柱支架杆；24、电引出线；25、固定用金属丝；26、芯柱排气管；27、灯泡塑料组件；28、驱动器电引线；29、驱动器；30、电连接器。
具体实施方式
下面将结合附图对本发明作详细介绍。
如图1所示，本发明的螺旋形LED灯丝包括有一个基板2，该基板2上设有复数颗LED芯片5，该LED芯片用透明胶、导电胶例如硅胶、改性树脂或环氧树脂、或银胶、铜胶固定在基板2上，各LED芯片通过芯片电连接线6相互串联或并联，基板和LED芯片表面涂覆有一层具有保护或发光功能的介质层3。LED芯片5的电极由基板2两端的电极引出线1引出，电极引出线1和基板2通过胶水、陶瓷胶、低熔点玻璃、银浆或塑料固定在基板2两端，电极引出线1与基板2两端连接处设有连接构件4。
所述螺旋形LED封装灯丝的基板2，其材料不限于金属、有机玻璃、PVC、塑料或硅胶。所述基板2有两种制作方法，一种是首先通过平面LED芯片封装，封装完成后，对封装完成的灯丝进行拉伸、推压、模具成型、锚固等方式进行二次三维成型成螺旋体，如图1所示。另一种是首先成型螺旋体，然后进行三维立体LED封装。
所述安装在基板2上的串联或并联的LED芯片5的发光色完全相同、部分相同或完全不 同。LED芯片是相同或不同发光色的LED芯片，例如为相同的蓝光、紫外光或其它单色光；也可以是不同发光色的，以得到不同色的混合光；选用不同数量的多种发光色的LED还可得到高显色指数的白光。
图1-1和图1-2是图1的前视图和侧视图，为发明一种螺旋形LED封装灯丝的一个实施例的结构，从不同的角度看出各构件之间的关系。
图3为本发明的一种螺旋形LED封装灯丝的结构示意图1的顶视内部结构图。图3A为图3的A处剖面图。其中介质层3是涂覆在所述螺旋LED封装灯丝的基板和芯片表面的具有保护或发光功能的介质层，其材料是硅胶或环氧树脂，同时也可以是LED的发光粉胶。
实例例1：图1为本发明的一种螺旋形LED封装灯丝的一个实施例的结构示意图。其特征在于灯丝为锥形螺旋体。
实施例2：图2为本发明的一种螺旋形LED封装灯丝的又一个实施例的结构示意图。其特征在于灯丝上下(或左右)为等圆螺旋体。其完成方式在于先进行直线线状的LED封装，封装完成后通过模具对其进行螺旋形整型。
图2-1和图2-2是图1的前视图和侧视图，为本发明一种螺旋形的LED封装灯丝的又一个实施例的结构，从不同的角度看出各构件之间的关系。
如图4所示，本发明所述应用该螺旋形LED灯丝的灯泡，包括有一个透光泡壳21，该透光泡壳21内设有带芯柱支架杆23、电引出线24和芯柱排气管26的芯柱，至少一条螺旋形LED灯丝用固定用金属丝25固定在芯柱支架杆23上，其电极引出线1经电引出线24、驱动器29、驱动器电引线28与电连接器30相连，以连接外电源，接通外电源，即可点亮螺旋LED灯丝22；透光泡壳21和由芯柱支架杆23、电引出线24、芯柱排气管26组成的芯柱进行密封。
所述螺旋形LED封装灯丝的基板2，其材料不限于金属、有机玻璃、PVC、塑料或硅胶。所述基板2有两种制作方法，一种是首先通过平面LED芯片封装，封装完成后，对封装完成的灯丝进行拉伸、推压、模具成型、锚固等方式进行二次三维成型成螺旋体。另一种是首先成型螺旋体，然后进行三维立体LED封装，成形后由芯柱支撑定位在芯柱上。
所述透光泡壳21和电连接器30之间设有灯泡塑料组件27。
所述透光泡壳21的材质为透明的、或为乳白、磨沙、有色的泡壳，也可为部分有反射层的，或部分有一系列小棱镜、小透镜的泡壳。所述透光泡壳1的形状为A-型、G-型、R-型、PAR-型、T-型、烛型或其它现有灯泡的泡壳中的一种。所述电连接器10为E40、E27、E26、E14、GU等现有灯泡的电连接器中的一种。
所述螺旋形LED灯丝2可连接成双向AC工作或单向DC工作。所述螺旋形LED灯丝2连接成单向DC工作时，可用外DC电源或交流电源工作；在用外交流电源时、所述驱动器可以由一电容和电阻并联的降压限流电路和整流滤波电路构成，驱动器电路简单、成本低、无电解电容器、无三极管、无变压器、无高频辐射；也可以是开关电源和恒流装置。
图4为本发明的一个实施例的结构示意图，如图4所示，LED灯丝的形状为锥形螺旋体，灯泡的灯头为E型。如图5所示，所述的螺旋LED灯丝22的形状区别于图1。如图6所示，所述的螺旋LED灯丝22的形状区别于图4、图5。如图7所示，所述的透光泡壳21为仿古灯也称古典灯的系列外形的一种，同时省去灯泡塑料组件27，螺旋LED灯丝22的形状为等圆螺旋体。如图8所示，所述的螺旋LED灯丝22的形状为等圆螺旋体，同时是横向布置。如图9所示，所述的LED灯丝由二根螺旋LED灯丝22组成，形成双螺旋体。
本发明要求保护的范围不限于本文中介绍的各实施例，凡基于本发明申请专利范围和说明书内容所作的各种形式的变换和代换、皆属本发明专利涵盖的范围。

Claims (18)

  1. 一种螺旋形LED灯丝，包括基板(2)，其特征在于：所述基板(2)上设有至少一组串联或并联的LED芯片(5)，基板(2)和LED芯片(5)表面涂覆有一层具有保护或发光功能的介质层(3)，LED芯片(5)的电极由基板(2)两端的电极引出线(1)引出，所述基板(2)被整形成三维螺旋形状。
  2. 根据权利要求1所述螺旋形LED灯丝，其特征在于：所述灯丝基板(2)为锥形螺旋体或等圆螺旋体。
  3. 根据权利要求1或2所述螺旋形LED灯丝，其特征在于：所述LED芯片(5)用透明胶和/或导电胶固定在基板(2)上。
  4. 根据权利要求3所述螺旋形LED灯丝，其特征在于：所述透明胶和/或导电胶为硅胶、改性树脂胶、环氧树脂胶、银胶和粘铜胶中的一种。
  5. 根据权利要求1或2所述螺旋形LED灯丝，其特征在于：所述基板(2)的材料为具有二次成型能力的金属、有机玻璃、塑料和硅胶中的一种。
  6. 根据权利要求1或2所述螺旋形LED灯丝，其特征在于：所述LED芯片(5)的发光色完全相同、部分相同或完全不同。
  7. 根据权利要求1或2所述螺旋形LED灯丝，其特征在于：所述介质层(3)的材料为硅胶、环氧树脂胶和LED发光粉胶中的一种。
  8. 根据权利要求1所述螺旋形LED灯丝，其特征在于：所述螺旋形LED封装灯丝两端的电极引出线(1)通过胶水、陶瓷胶、低熔点玻璃、银浆或塑料固定在基板(2)两端，电极引出线(1)与基板(2)两端连接处设有连接构件(4)。
  9. 一种应用权利要求1或2螺旋形LED灯丝的灯泡，包括透光泡壳(21)，该透光泡壳(21)内设有带芯柱支架杆(23)、电引出线(24)和芯柱排气管(26)的芯柱，其特征在于：至少一条螺旋形LED灯丝(22)被固定在芯柱上，其电极引出线(1)通过驱动器(29)与电连接器(30)相连，所述透光泡壳(21)和芯柱进行密封。
  10. 根据权利要求9所述的螺旋形LED灯丝的灯泡，其特征在于：所述透光泡壳(21)和电连接器(30)之间设有灯泡塑料组件(27)。
  11. 根据权利要求9或10所述的螺旋形LED灯丝的灯泡，其特征在于：所述螺旋形LED灯丝包括基板(2)，所述基板(2)上设有至少一组串联或并联的LED芯片(5)，基板(2)和LED芯片(5)表面涂覆有一层具有保护或发光功能的介质层(3)，LED芯片(5)的电极由基板(2)两端的电极引出线(1)引出，所述基板(2)被整形成三维螺旋形状。
  12. 根据权利要求11所述的螺旋形LED灯丝的灯泡，其特征在于：所述灯丝基板(2)为锥形螺旋体或等圆螺旋体。
  13. 根据权利要求11或12所述的螺旋形LED灯丝的灯泡，其特征在于：所述LED芯片(5)用透明胶和/或导电胶固定在基板(2)上；所述透明胶和/或导电胶为硅胶、改性树脂胶、环氧树脂胶、银胶和粘铜胶中的一种。
  14. 根据权利要求11或12所述的螺旋形LED灯丝的灯泡，其特征在于：所述基板(2)的材料为具有二次成型能力的金属、有机玻璃、塑料和硅胶中的一种。
  15. 根据权利要求11或12所述的螺旋形LED灯丝的灯泡，其特征在于：所述LED芯片(5)的发光色完全相同、部分相同或完全不同。
  16. 根据权利要求11或12所述的螺旋形LED灯丝的灯泡，其特征在于：所述介质层(3)的材料为硅胶、环氧树脂胶和LED发光粉胶中的一种。
  17. 根据权利要求11或12所述的螺旋形LED灯丝的灯泡，其特征在于所述螺旋形LED灯丝两端的电极引出线(1)通过胶水、陶瓷胶、低熔点玻璃、银浆或塑料固定在基板2)两端，电极引出线(1)与基板(2)两端连接处设有连接构件(4)。
  18. 根据权利要求9所述的螺旋形LED灯丝的灯泡，其特征在于：所述至少一条螺旋形LED灯丝(22)可连接成双相AC工作或单向DC工作；所述至少一条螺旋形LED灯丝(22)连接成单向DC工作时，可用外DC电源或交流电源工作。
PCT/CN2014/092330 2013-12-02 2014-11-27 一种螺旋形led灯丝及应用该螺旋形led灯丝的灯泡 WO2015081804A1 (zh)

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JP2016539480A (ja) 2016-12-15
EP3065174A1 (en) 2016-09-07
EP3065174A4 (en) 2017-05-03
ES2732705T3 (es) 2019-11-25
PL3065174T3 (pl) 2019-09-30
EP3065174B1 (en) 2019-06-12
TR201909301T4 (tr) 2019-07-22
US10066791B2 (en) 2018-09-04

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