CN106151904A - 一种可卷绕灯丝的led灯及其制备工艺 - Google Patents

一种可卷绕灯丝的led灯及其制备工艺 Download PDF

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CN106151904A
CN106151904A CN201610711495.8A CN201610711495A CN106151904A CN 106151904 A CN106151904 A CN 106151904A CN 201610711495 A CN201610711495 A CN 201610711495A CN 106151904 A CN106151904 A CN 106151904A
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led
substrate
lamp bar
shell
cell
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胡溢文
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Suzhou Industrial Park Guest House and Xin Electric Co., Ltd.
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胡溢文
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Priority to EP16913941.7A priority patent/EP3460313A4/en
Priority to PCT/CN2016/100284 priority patent/WO2018035921A1/zh
Publication of CN106151904A publication Critical patent/CN106151904A/zh
Priority to US16/240,790 priority patent/US20190137047A1/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28575—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising AIIIBV compounds
    • H01L21/28587—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising AIIIBV compounds characterised by the sectional shape, e.g. T, inverted T
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/30—Elongate light sources, e.g. fluorescent tubes curved
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/70—Light sources with three-dimensionally disposed light-generating elements on flexible or deformable supports or substrates, e.g. for changing the light source into a desired form
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other

Abstract

本发明涉及LED灯技术领域，具体地说是一种可卷绕灯丝的LED灯及其制备工艺。一种可卷绕灯丝的LED灯，包括泡壳、支架、电连接器、驱动器，其特征在于：所述的支架外连接泡壳，并且支架与泡壳形成真空密封腔体，支架上采用电引出线连接灯条；所述的灯条为长条形结构，并且灯条上设有基板，基板上均布设有若干连接线路，连接线路为断开连接，连接线路上设有LED芯片，基板上设有荧光胶体。同现有技术相比，提供一种可卷绕灯丝的LED灯及其制备工艺，特殊的灯条结构及工艺，提高LED灯的效率及感官舒适度。

Description

一种可卷绕灯丝的LED灯及其制备工艺
技术领域
本发明涉及LED灯技术领域，具体地说是一种可卷绕灯丝的LED灯及其制备工艺。
背景技术
在现有的灯丝灯条灯技术中，虽然单条灯丝能360°出光，但组装成整灯后由于多条灯丝及支架干涉，会有无数阴影（俗称鬼影）。并且4Π灯丝技术中，由于使用透明基板会导致蓝光外泄，工艺复杂，成本高（芯片采用降功率，提高光效，降低温度的工作原理，基板加工工艺复杂等技术问题。
弯曲灯丝如申请号201510712329.5采用按所需图形生产基板，并且为保证两面有光，需双面固晶，在圆弧及反向芯片固晶时需调整基板方向。导致成品率低及生产工艺复杂，效率低，并一种基板只能做出一种图形产品。
现有产品由于电源外置防水防尘性能不佳，综上所述，本发明目的旨在解决现有技术中存在的上述问题和缺陷的至少一个方面。
发明内容
本发明为克服现有技术的不足，提供一种可卷绕灯丝的LED灯及其制备工艺，特殊的灯条结构及工艺，提高LED灯的效率及感官舒适度。
为实现上述目的，设计一种可卷绕灯丝的LED灯，包括泡壳、支架、电连接器、驱动器，其特征在于：所述的支架外连接泡壳，并且支架与泡壳形成真空密封腔体，支架上采用电引出线连接灯条；所述的灯条为长条形结构，并且灯条上设有基板，基板上均布设有若干连接线路，连接线路为断开连接，连接线路上设有LED芯片，基板上设有荧光胶体。
所述的电引出线的一端通过电极连接灯条，电引出线的另一端通过连接线连接驱动器的电压输出端，驱动器的电压输入端连接电连接器，所述的电连接器位于支架的下端。
所述的灯条为平板时进行固晶、焊接、点胶、烘烤完成后再后期按要求成型的长条形结构，灯条的形状为横向卷绕结构、竖向卷绕结构、直线结构、圆弧结构、三角结构、椭圆结构、梯形结构、方形结构、心形结构、菱形结构中的一种结构。
所述的真空密封腔体内填充与空气热膨胀系数不一致的对流散热气体，所述的对流散热气体为氦气、氩气、氢气、氖气中的一种或两种或多种混合气体。
所述的基板采用倒装或者正装倒置连接LED芯片，LED芯片通过焊料连接到连接线路上。
所述的基板为细长形薄片结构，并且基板由金属或者柔性线路板制得；基板的厚度小于0.6mm，基板的宽度小于10mm。
所述的泡壳的截面为圆形、扇形、椭圆形、三角形、梯形中的一种。
所述的LED芯片为蓝光、红光、黄光、绿光、紫外光、红外光中的一种，并且LED芯片采用荧光粉激发。
一种可卷绕灯丝的LED灯的制备工艺，制备工艺如下：
（1）将基板固定在灯条上；
（2）基板上采用倒装或者正装倒置的工艺将LED芯片连接到基板上，采用共晶焊或者锡膏回流焊或者银胶电的手法进行；
（3）在基板和LED芯片的顶部涂覆荧光胶体；
（4）将灯条弯绕成所需要的形状；
（5）将灯条、泡壳、支架组装成灯泡，并在灯泡腔体中填充散热保护气体；
（6）组装驱动器、电连接器制得LED灯产品。
本发明同现有技术相比，提供一种可卷绕灯丝的LED灯及其制备工艺，特殊的灯条结构及工艺，提高LED灯的效率及感官舒适度。
附图说明
图1为本发明结构示意图。
图2为灯条结构示意图。
图3为灯条结构侧视图。
图4至图8为LED灯的其他实施列结构示意图。
参见图1至图3，1为基板，2为泡壳，3为对流散热气体，4为电引出线，5为支架，6为电连接器，7为电极，8为连接线路，9为LED芯片，10为荧光胶体。
具体实施方式
下面根据附图对本发明做进一步的说明。
如图1至图3所示，支架5外连接泡壳2，并且支架5与泡壳2形成真空密封腔体，支架5上采用电引出线4连接灯条；所述的灯条为长条形结构，并且灯条上设有基板1，基板1上均布设有若干连接线路8，连接线路8为断开连接，连接线路8上设有LED芯片9，基板1上设有荧光胶体10。
电引出线4的一端通过电极7连接灯条，电引出线4的另一端通过连接线连接驱动器的电压输出端，驱动器的电压输入端连接电连接器6，所述的电连接器6位于支架5的下端。
真空密封腔体内填充与空气热膨胀系数不一致的对流散热气体3，所述的对流散热气体3为氦气、氩气、氢气、氖气中的一种或两种或多种混合气体。
基板1采用倒装或者正装倒置连接LED芯片9，LED芯片9通过焊料连接到连接线路8上。
基板1为细长形薄片结构，并且基板1由金属或者柔性线路板制得；基板1的厚度小于0.6mm，基板1的宽度小于10mm。
LED芯片9为蓝光、红光、黄光、绿光、紫外光、红外光中的一种，并且LED芯片9采用荧光粉激发。
如图4至图8所示，灯条为平板时进行固晶、焊接、点胶、烘烤完成后再后期按要求成型的长条形结构，灯条的形状为横向卷绕结构、竖向卷绕结构、直线结构、圆弧结构、三角结构、椭圆结构、梯形结构、方形结构、心形结构、菱形结构中的一种结构。泡壳2的截面为圆形、扇形、椭圆形、三角形、梯形中的一种。
一种可卷绕灯丝的LED灯的制备工艺，制备工艺如下：
（1）将基板固定在灯条上；
（2）基板上采用倒装或者正装倒置的工艺将LED芯片连接到基板上，采用共晶焊或者锡膏回流焊或者银胶电的手法进行；
（3）在基板和LED芯片的顶部涂覆荧光胶体；
（4）将灯条弯绕成所需要的形状；
（5）将灯条、泡壳、支架组装成灯泡，并在灯泡腔体中填充散热保护气体；
（6）组装驱动器、电连接器制得LED灯产品。
本发明的灯条1由于基板8有缝连接的，这样灯条1就可以弯绕成各种不同直径、长度、高度、长短形状的发光体，从而达到360°无阴影的效果，并且支架5与泡壳2组合形成密封腔体，省去了芯柱的结构，降低了成本，密封腔体内填充与空气热膨胀系数不一致的对流散热气体3，采用热膨胀系数不一样的气体，随着灯泡内温度变化在泡壳内形成对流的散热方案，利用光源及电源发出的热量，使密封腔体内形成气体流动和循环，带走光源及电源上的热量，整个制造工艺简单，LED灯的形状、重量及感光度最为接近现有的白炽灯泡，提高了LED灯的效率及感官舒适度。

Claims (9)

1.一种可卷绕灯丝的LED灯，包括泡壳、支架、电连接器、驱动器，其特征在于：所述的支架（5）外连接泡壳（2），并且支架（5）与泡壳（2）形成真空密封腔体，支架（5）上采用电引出线（4）连接灯条；所述的灯条为长条形结构，并且灯条上设有基板（1），基板（1）上均布设有若干连接线路（8），连接线路（8）为断开连接，连接线路（8）上设有LED芯片（9），基板（1）上设有荧光胶体（10）。
2.根据权利要求1所述的一种可卷绕灯丝的LED灯，其特征在于：所述的电引出线（4）的一端通过电极（7）连接灯条，电引出线（4）的另一端通过连接线连接驱动器的电压输出端，驱动器的电压输入端连接电连接器（6），所述的电连接器（6）位于支架（5）的下端。
3.根据权利要求1所述的一种可卷绕灯丝的LED灯，其特征在于：所述的灯条为平板时进行固晶、焊接、点胶、烘烤完成后再后期按要求成型的长条形结构，灯条的形状为横向卷绕结构、竖向卷绕结构、直线结构、圆弧结构、三角结构、椭圆结构、梯形结构、方形结构、心形结构、菱形结构中的一种结构。
4.根据权利要求1所述的一种可卷绕灯丝的LED灯，其特征在于：所述的真空密封腔体内填充与空气热膨胀系数不一致的对流散热气体（3），所述的对流散热气体（3）为氦气、氩气、氢气、氖气中的一种或两种或多种混合气体。
5.根据权利要求1所述的一种可卷绕灯丝的LED灯，其特征在于：所述的基板（1）采用倒装或者正装倒置连接LED芯片（9），LED芯片（9）通过焊料连接到连接线路（8）上。
6.根据权利要求1所述的一种可卷绕灯丝的LED灯，其特征在于：所述的基板（1）为细长形薄片结构，并且基板（1）由金属或者柔性线路板制得；基板（1）的厚度小于0.6mm，基板（1）的宽度小于10mm。
7.根据权利要求1所述的一种可卷绕灯丝的LED灯，其特征在于：所述的泡壳（2）的截面为圆形、扇形、椭圆形、三角形、梯形中的一种。
8.根据权利要求1所述的一种可卷绕灯丝的LED灯，其特征在于：所述的LED芯片（9）为蓝光、红光、黄光、绿光、紫外光、红外光中的一种，并且LED芯片（9）采用荧光粉激发。
9.一种可卷绕灯丝的LED灯的制备工艺，其特征在于：所述的制备工艺如下：
（1）将基板固定在灯条上；
（2）基板上采用倒装或者正装倒置的工艺将LED芯片连接到基板上，采用共晶焊或者锡膏回流焊或者银胶电的手法进行；
（3）在基板和LED芯片的顶部涂覆荧光胶体；
（4）将灯条弯绕成所需要的形状；
（5）将灯条、泡壳、支架组装成灯泡，并在灯泡腔体中填充散热保护气体；
（6）组装驱动器、电连接器制得LED灯产品。
CN201610711495.8A 2016-08-24 2016-08-24 一种可卷绕灯丝的led灯及其制备工艺 Pending CN106151904A (zh)

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